Abstract: A one-transistor type DRAM including a floating body storage element connected between a bit line and a source line and controlled by a word line comprises a plurality of source lines and word lines arranged in a row direction, a plurality of bit lines arranged in a column direction, a plurality of clamp bit lines and reference bit lines arranged in a column direction, a cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a clamp cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a reference cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, and a sense amplifier and a write driving unit connected to the bit line and configured to receive a clamp voltage and a reference voltage.

Abstract: A method for detecting disturb phenomena between neighboring blocks in non-volatile memory includes, sequentially erasing and writing test data (pattern) to each block of a plurality of blocks under test in the non-volatile memory at a first time point, dividing the plurality of blocks under test into a first block group and a second block group based on ordinal number included in each block of the plurality of blocks under test, reading data from each block of the first block group at a second time point, and comparing the data with the test data written at the first time point to generate a first detecting result, and determining applicability of each block of the first block group based on the first detecting result.

Abstract: A memory including an array of memory cells and a control circuit. The control circuit is configured to control partial array self refreshes and to switch from one partial array self refresh to another partial array self refresh. Data in memory cells that are refreshed via the one partial array self refresh and refreshed via the other partial array self refresh is retained in the memory cells from before a first switch from the one partial array self refresh to the other partial array self refresh to after the first switch.

Abstract: Disclosed is a programming method for a nonvolatile memory device. The method includes; charging word-line signal lines to a pass voltage during a pass voltage charge operation, simultaneously executing an initial precharge operation for strings including program-inhibited cells during the pass voltage charge operation, and applying the pass voltage to word lines from the word-line signal lines in response to a block-selection enabling signal.

Abstract: A sense amplifier comprises: a differential amplifier circuit configured to generate an amplified signal depending on a difference in voltage between bit lines; an output circuit receiving the amplified signal; and a load. The differential amplifier circuit comprises: a first output node supplying the amplified signal to the output circuit; and a second output node symmetrically placed with respect to the first output node and connected to the load. The output circuit comprises an output terminal for outputting an output signal generated based on the amplified signal. In response to a control signal, the load switches between a first capacitance value with which an offset voltage at the output terminal becomes a first voltage and a second capacitance value with which the offset voltage becomes a second voltage.

Abstract: There are provided are a plurality of memory mats, a sub-word driver that accesses a normal memory cell irrespective of whether a row address to which access is requested is a defective address, a sub-word driver that accesses a redundant memory cell belonging to a memory mat different from the normal memory cell indicated by the row address, when the row address is a defective address. According to the present invention, the normal memory cell and a redundant memory cell belong to memory mats different to each other, and thus the normal memory cell can be accessed concurrently with determining operation of the repair determining circuit.

Abstract: A resistive sense memory apparatus includes a first semiconductor transistor having a first contact electrically connected to a first source line and a second contact electrically connected to a first resistive sense memory element and a second semiconductor transistor having a first contact electrically connected to a second source line and a second contact electrically connected to a second resistive sense memory element. A bit line is electrically connected to the first resistive sense memory element and the second resistive sense memory element.

Abstract: A F-RAM memory device containing a current mirror sense amp. A F-RAM memory device containing a current mirror sense amp coupled to a negative voltage generator. A method of reading data from and restoring data back into F-RAM cells in a 2T2C F-RAM device containing a current mirror sense amp. A method of reading data from and restoring data back into F-RAM cells in a 1T1C F-RAM device.

Abstract: A memory capable of suppressing reduction of data determination accuracy is provided. This memory includes a memory cell connected to a bit line for holding data and a bipolar transistor whose base is connected to the bit line. In data reading, the memory reads the data by amplifying a current, corresponding to the data of the memory cell, appearing on the bit line with the bipolar transistor.

Abstract: A sensing circuit of a phase change memory. The sensing circuit comprises a data current source and a reference current source, a storage memory device and a reference memory device, a storage switch and a reference switch, an auxiliary current source and a comparator. First terminals of the storage memory device and the reference memory device are respectively coupled to the data current source and the reference current source. The storage switch and the reference switch are respectively coupled to second terminals of the storage memory device and the reference memory device. The auxiliary current source is dynamically coupled to the first terminals of the storage memory device and the reference memory device. The comparator is coupled to the first terminals of the storage memory device and the reference memory device.

Abstract: There is provided a semiconductor memory device including: a source strobe signal generating unit configured to generate a source strobe signal having a first or a second activation width corresponding to a normal mode and a bank grouping mode; a final strobe signal generating unit configured to, in the normal mode, expand the first activation width and generate a final strobe signal having the expanded first activation width, and in the bank grouping mode, maintain the second activation width and generate the final strobe signal having the second activation width; and a sense amplifying unit configured to sense, amplify and output data applied through a data line in response to the final strobe signal.

Abstract: To provide a data fetch circuit, which reliably cuts off transmission of a high impedance state of a data strobe signal even if a manufacture condition or an operation condition is changed, and a control method thereof. The data fetch circuit includes an RL measuring part 10 measuring a latency measurement value RLB from an input of a read instruction signal RD to a valid edge of a data strobe signal DQS and an RL count comparing part 30 outputting a BL count start signal BST giving an instruction of a cancel of the cut-off of the data strobe signal DQS after standing by during the time based on the latency measurement value RLB in accordance with an input of a delay read instruction signal RDD.

Abstract: Provided is a nonvolatile semiconductor memory device which reads out a memory cell at high speed. A minute current source (105) is connected to a clamp NMOS transistor (103) for clamping a drain voltage of a memory cell (101), and a minute current is caused to flow through the clamp NMOS transistor (103). When the current does not flow through the memory cell (101), by causing the minute current to flow through the clamp NMOS transistor (103), the drain voltage of the memory cell (101) is prevented from rising. A bias voltage (BIAS) to be input to the clamp NMOS transistor (103) can be set high and the drain voltage of the memory cell (101) can also be high, and hence a current value of the memory cell (101) becomes larger and speed of sensing a current of a sense amplifier circuit (104) is improved.

Abstract: A page buffer circuit comprises a sense unit, a latch unit, and a bit line voltage control unit. The sense unit is configured to couple a bit line and a sense node in response to a sense control signal in response to the sense control signal. The latch unit includes a plurality of latch circuits configured to latch data programmed or to be programmed. The bit line voltage control unit is configured to classify program states of memory cells, coupled to the selected bit line, into first to nth groups by performing first to nth verification operations after a first program operation of a program operation and is configured to control a voltage level of the sense control signal in order to transfer a bit line voltage to the selected bit line.

Abstract: A semiconductor memory device includes first and second edge drivers configured to generate sensing control signals, a memory cell array between first and second edge drivers, and pluralities of unit sense amplifiers detecting data from the memory cell array in response to the sensing control signals.

Abstract: A sense amplifier includes a first sensing element and a second sensing element redundant to the first sensing element. The sense amplifier further comprises a switch circuit configured to switch between the first and second sensing elements when an offset of the sense amplifier is greater than a prescribed amount.

Abstract: A F-RAM memory device containing a current mirror sense amp. A F-RAM memory device containing a current mirror sense amp coupled to a negative voltage generator. A method of reading data from and restoring data back into F-RAM cells in a 2T2C F-RAM device containing a current mirror sense amp. A method of reading data from and restoring data back into F-RAM cells in a 1T1C F-RAM device.

Abstract: A sense amplifier having an amplifier stage with decreased gain is described. The sense amplifier includes a first input/output (“I/O”) node and a second complementary I/O node. The sense amplifier includes two amplifier stages, each for amplifying a signal on one of the I/O nodes. The first amplifier stage, having a first conductivity-type, amplifies one of the I/O node towards a first voltage. The second amplifier stage, having a second conductivity-type, amplifies the other I/O node towards a second voltage. The sense amplifier also includes a resistance circuit coupled to the second amplifier stage to reduce the gain of the second amplifier stage thereby reducing the rate of amplification of the signal on the corresponding I/O node.

Abstract: A semiconductor memory device and a sense amplifier thereof are provided. The semiconductor memory device includes a memory cell array and a plurality of sense amplifiers. The memory cell array includes a memory cell array block having a plurality of memory cells. Each of the plurality of sense amplifiers is configured to apply, based on a restore signal, a first voltage to a corresponding bit line to restore a first data value in a selected memory cell of the plurality of memory cells if a read value in the selected memory cell is the first data value and apply a second voltage based on the restore signal to the corresponding bit line to prevent a second data value from being restored in the selected memory cell if the read value in the selected memory cell is the second data value.

Abstract: A SRAM cell structure includes a first N type switch, a second N type switch, a first storage node, and a second storage node. The first N type switch has a control terminal connected to a word line and a first terminal connected to a bit line. The second N type switch has a control terminal connected to the word line and a first terminal connected to an inverted bit line. The first storage node has a first terminal connected to a second terminal of the first N type switch. The second storage node has a first terminal connected to a second terminal of the second N type switch.

Abstract: Techniques and corresponding circuitry for deriving a supply a bias voltage for a memory cell array from a received reference voltage is presented. The circuit includes a voltage determination circuit, which is connected to receive the reference voltage and generate from it the bias voltage, a temperature sensing circuit, and a calibration circuit. The calibration circuit is connected to receive the bias voltage and to receive a temperature indication from the temperature sensing circuit and determine from the bias voltage and temperature indication a compensation factor that is supplied to the voltage determination circuit, which adjusts the bias voltage based upon the compensation factor.

Abstract: A memory device is provided for performing writing operations on memory cells while maintaining a stability thereof. A memory array is provided including a plurality of memory cells. Additionally, segmented write bitlines are provided for performing writing operations on the memory cells while maintaining a stability thereof.

Abstract: An apparatus for controlling an activation of semiconductor integrated circuit includes: an active control unit configured to generate active control signal for determining activation of banks; and a plurality of active signal generating units configured to input the active control signal commonly, and generate active signals for activating the banks to according to the active control signal. According to this structure, it is possible to reduce current consumption to a minimum in a refresh mode, to easily arrange signal lines, and thus to effectively use extra space.

Abstract: A high voltage regulator may include a first regulating unit, a second regulating unit, and an output node. The first regulating unit regulates the program voltage in a voltage-level-up interval of a program voltage of a memory cell. The second regulating unit regulates the program voltage in a voltage-level-down interval of the program voltage. The output node outputs the regulated program voltage.

Abstract: A refresh control apparatus is provided which is capable of dispersing a peak current at an all-bank refresh mode and reducing the characteristic difference between the banks. The refresh control apparatus includes an internal refresh counter for outputting row address signals to select word lines when a refresh command is inputted from an external circuit, a row decoder for outputting row decoding signals to select all banks in response bank active signals and the row address signals, an enable signal control unit for sequentially outputting at a time interval sense amplifier enable signals in response to the bank active signals and the refresh command, and a sense amplifier for sequentially refreshing all of the banks at a time interval in response to the sense amplifier enable signals.

Abstract: A semiconductor memory device having high integration, low power consumption and high operation speed. The memory device includes a sense amplifier circuit having plural pull-down circuits and a pull-up circuit. A transistor constituting one of the plural pull-down circuits has a larger constant than that of a transistor constituting the other pull-down circuits, for example, a channel length and a channel width. The pull-down circuit having the larger constant transistor is activated earlier than the other pull-down circuits and the pull-up circuit, which are activated to conduct reading. The data line and the earlier driven pull-down circuit are connected by an NMOS transistor and the NMOS transistor is activated or inactivated to control the activation or inactivation of the pull-down circuit.

Abstract: A semiconductor memory device having a hierarchical bit line structure includes memory cells and an amplification circuit for amplifying a signal read from one of the memory cells via a bit line. A cell N-well region in which the P-channel transistors of the memory cell are formed and an amplification-circuit N-well region in which the P-channel transistors of the amplification circuit are formed are formed continuously.

Abstract: An output enable signal generating circuit for a semiconductor memory apparatus includes an output control unit configured to receive CAS latency information and to generate an output control signal having enable timing according to a DLL on/off mode, and an output enable signal output unit configured to receive the output control signal and to output an output enable signal in response to a read command and a DLL clock signal.

Abstract: A sense amplifier controlling circuit for controlling a sense amplifier in a semiconductor memory, which amplifies differential electric potential of a pair of bit lines to which memory cells are connected by sequentially operating a CMOS flip-flop and a preamplifier performing an amplification operation different from each other, controls the sense amplifier, and activate the preamplifier at an early operation stage of the CMOS flip-flop and the preamplifier independently of activation of the CMOS flip-flop during the amplification operation of the CMOS flip-flop.

Abstract: A semiconductor memory device and a method of generating an internal voltage in the semiconductor memory device are provided. The semiconductor memory device includes a controller configured to activate a sensing enable signal when an active command is applied from outside, inactivate the sensing enable signal when a precharge command is applied, and output the sensing enable signal, and an array internal voltage generator configured to output an active array power supply voltage as an array power supply voltage when the sensing enable signal is activated, output an external array power supply voltage and a standby array power supply voltage as the array power supply voltage when the sensing enable signal is inactivated, and output the standby array power supply voltage alone as the array power supply voltage when the sensing enable signal is inactivated for at least a specific period.

Abstract: A method of reducing read disturb in NVM cells by using a first drain voltage to read the array cells and using a second, lower drain voltage, to read the reference cells. Drain voltages on global bitlines (GBLs) for both the array and the reference cells may be substantially the same as one another to maintain main path capacitance matching, while drain voltages on local bitlines (LBLs) for the reference cells may be lower than the drain voltage on local bitlines (LBLs) for the array cells to reduce second bit effect. Reducing the drain voltage of the reference cell at its drain port may be performed using a clamping device or a voltage drop device.

Abstract: In one embodiment, a semiconductor memory device includes a plurality of pairs of bit lines, each of said pairs including a first bit line, a second bit line, a memory cell coupled to said first bit line, a sense amplifier determining the logical value stored in the memory cell according to a potential difference between the first and the second bit line, a reference voltage generation circuit, and a reference voltage supply switch coupling an output of the reference voltage generation circuit to the second bit line.

Abstract: Sense logic, and associated signaling, for dynamic thyristor-based memory cells is described. A first supply voltage level is greater than a second supply voltage level. In an embodiment, cross-coupled inverters of a sense amplifier are operatively coupled between a ground node and the second supply for sensing voltage. The first supply voltage is pass gate coupled to a first sense node and a second sense node. The pass gating is responsive to sample signaling. A first supply transistor is gated by a transfer bus. A second supply transistor is gated by a sense reference voltage that is between the first supply voltage level and the second supply voltage level. Each of the first supply transistor and the second supply transistor is back body biased with a write voltage level that is between the second supply voltage level and the ground voltage level.

Abstract: An integrated circuit device having a display memory which stores data for at least one frame from among image information displayed in a display panel which has a plurality of scan lines and a plurality of data lines, the display memory including a plurality of wordlines, a plurality of bitlines, a plurality of memory cells, and a wordline control circuit; and the wordline control circuit selecting an identical wordline N times (N is an integer larger than one) from among the wordlines in one horizontal scan period of the display panel.

Abstract: Systems, devices and methods are disclosed, such as a system and method of sensing the voltage on bit lines that, when respective memory cells coupled to the bit lines are being read that compensates for variations in the lengths of the bit lines between the memory cells being read and respective bit line sensing circuits. The system and method may determine the length of the bit lines between the memory cells and the sensing circuits based on a memory address, such as a block address. The system and method then uses the determined length to adjust either a precharge voltage applied to the bit lines or the duration during which the bit lines are discharged by respective memory cells before respective voltages on the bit lines are latched.

Abstract: A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input/output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current.

Abstract: In one embodiment, a memory includes: an array of memory cells arranged according to word lines and columns, each column corresponding to bit lines; a sense amplifier adapted to couple to the bit lines to sense a binary content of selected cells from the array of memory cells, the sense amplifier sensing the binary content responsive to a sense command; an x-decoder configured to assert a selected one of the word lines in response to decoding an address as triggered by a clock edge, wherein the assertion of the selected word line switches on corresponding access transistors to develop voltages on the bit lines; and a bit line replica circuit adapted to replicate the development of the bit lines, the bit line replica circuit including a replica access transistor coupled between a replica bit line and a replica memory cell wherein the replica access transistor is switched on responsive to the clock edge such that the replica memory cell pulls the replica bit line to ground, the bit line replica circuit also inc

Abstract: A circuit and method for a sense amplifier for sensing the charge stored when a select signal couples a memory cell to the sense amplifier. A pull up voltage and a pull down voltage are instantaneously supplied to the sense amplifier to sense the small signal differential input on the complementary bit lines and to simultaneously restore the value stored in the memory cell. A differential output signal generator circuit is provided to instantaneously supply the pull up and pull down voltages. In another preferred embodiment the signal generator provides the pull up and pull down voltages at a first level and subsequently increases the pull up voltage to a voltage greater than the positive supply voltage and decreases the pull down voltage. A method of sensing is disclosed wherein the sense and restore actions are performed instantaneously to provide memory cell sensing with greater tolerance of device mismatches.

Abstract: A circuit for controlling a sense amplifier of a semiconductor memory apparatus including a sense amplifier control unit that controls an enable point of a sense amplifier control signal which is generated by an active command and a precharge command, according to whether a refresh signal is enabled. A sense amplifier driver that generates a sense amplifier driving signal in response to input of the sense amplifier control signal and a bit line equalization signal.

Abstract: A reading circuit for a semiconductor memory, comprising: a circuital branch adapted to be electrically coupled to a bit line which is connected to a memory cell to be read; an evaluation circuit adapted to sense a cell electric current flowing through the bit line during a sensing phase of a reading operation of the data stored into the memory cell, the evaluation circuit comprising a negative feedback control loop adapted to control the potential of the bit line during the sensing phase, the control loop comprising a differential amplifier having an inverting input terminal operatively connected to the bit line, a non-inverting input terminal fed by a first reference potential, and a feedback circuital path connected between an output of the differential amplifier and the inverting input, wherein the feedback circuital path is adapted to conduct a measure current corresponding to the cell electric current, and comprises current/voltage conversion means for converting the measure current into a corresponding

Abstract: A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.

Abstract: A sensing circuit for a semiconductor memory, includes, a detecting amplifier including a first circuital branch is run through by a first current corresponding to the sum of a second current as a function of a comparison current and a cell current. The cell current is a function of a state of a memory cell to be read in a predetermined biasing condition. A second circuital branch is coupled as a current mirror configuration with the first circuital branch. The second circuital branch is run through by a third current proportional to the first current. A third circuital branch coupled to the second branch sinks a fourth current as a function of the comparison current. A fourth circuital branch coupled to is run through by a residual current equal to the difference between the third and the fourth current. The residual current assumes different values depending on the fact that the cell current is lower, equal or higher than the comparison current.

Abstract: A semiconductor device has a memory cell, decoders, a redundancy circuit and a mode setting circuit. The memory cell array has word lines including a redundant word line, bit lines and memory cells. A row decoder selects the word lines in response to a row address. Further, the row address decoder selects the redundant word line when a replacement signal is received. A column decoder selects the bit lines in response to a column address. A row address redundancy circuit stores a redundant row address. The row address redundancy circuit provides the replacement signal when the redundant row address corresponds to the received address. The mode setting circuit receives a mode signal having a normal mode and a test mode. The mode setting circuit outputs the replacement signal to the row decoder when the mode signal is in the normal mode, and prohibits an output of the replacement signal.

Abstract: In an embodiment of the present invention, a hierarchical differential sensing approach is effectuated wherein an array of 1T DRAM cells are organized in rows and columns in which the rows represent words and the columns represent bits of the word, each bit column having more than one pair of balanced, true and complement local bit lines, the local bit lines being connected to a pair of balanced, true and complement global bit lines by way of CMOS transistor switches.

Abstract: A sense amplifier control circuit for a memory device is provided. The sense amplifier control circuit for a memory device including: a level detection unit configured to generate a level detection signal by detecting a core voltage level in an active operation interval; and a control unit configured to generate a pulse signal to control a sensing start time of a bit line detection signal by varying a delay time according to the level detection signal.

Abstract: A memory controller outputs an additional writing instruction to one of a plurality of non-volatile memories arbitrarily selected via a writing instruction output unit when a signal which rejects a writing operation is not outputted from writing controllers of the plurality of non-volatile memories for a certain period of time, and outputs a temporary writing instruction to another non-volatile memory at least once via the writing instruction output unit by the time when the additional writing operation is completed in the arbitrary non-volatile memory.

Abstract: A semiconductor memory device includes first and second cell arrays which have memory cells arrayed in row and column directions, first and second bit lines which are connected to the memory cells arrayed in the column direction, and first and second sense amplifiers which are connected to the first, second bit lines, respectively. The device also includes first and second dummy cell arrays which have dummy cells arrayed in the row and column directions, a dummy word line which is connected to the dummy cells arrayed in the row direction, first and second dummy bit lines which are connected to the dummy cells arrayed in the column direction and receive an output from the dummy word line, and first and second sense amplifier activation circuits which activate the first, second sense amplifiers in accordance with first and second control signals output from the first and second dummy bit lines, respectively.

Abstract: A trial programming process is performed for a first set of one or more non-volatile storage elements to test usage of the non-volatile storage system. Based on this trial programming, a programming signal is calibrated by adjusting its initial magnitude. The calibrated programming signal is then used to program a second set of non-volatile storage elements (which may or may not include the first set).

Abstract: A memory array in a memory device is coupled to an analog I/O data interface that enables analog voltage levels to be written to the memory array. The I/O interface is comprised of a plurality of analog data paths that each includes a capacitor for storing charge corresponding to a target voltage to which a selected memory cell, coupled to its respective data path, is to be programmed. A plurality of comparators can be included in the I/O interface, with each such comparator coupled to a respective bit line. Such a comparator can compare a threshold voltage of a selected memory cell to its target voltage and inhibits further programming when the threshold voltage equals or exceeds the target voltage.

Abstract: In one or more of the disclosed embodiments, the number of times toggle operations of a data bus are performed at the time of a data transmission in a semiconductor storage apparatus is reduced, thereby reducing the power consumption. For example, a semiconductor storage apparatus according to one embodiment of the present invention comprises a DRF bus, a DR11F bus, a GDRF bus and a GDR11F bus. The DRF bus and DR11F bus, and the GDRF bus and GDR11F bus, are placed in parallel for the purpose of reducing the number of times toggle operations of a data bus are performed at the time of a data transmission. The DR11F bus is added to make the DRF11F bus perform a toggle operation only when the DRF buses on both sides are made to perform a toggle operation if the data transmission were performed in a conventional system.