Abstract: A circuit for outputting temperature data of a semiconductor memory apparatus includes a temperature detecting circuit that generates a temperature voltage corresponding to a change in temperature and outputs the temperature voltage, an A/D converter that converts the temperature voltage into a first temperature code and outputs it, and a temperature data correcting unit that outputs a second temperature code obtained by correcting an error of the first temperature code using a correction code.

Abstract: Data not stored in the DRAM array of a SDRAM module, such as the output of a temperature sensor, are read from the SDRAM in a synchronous read cycle that is seamlessly interspersed with SDRAM read and write cycles directed to data in the DRAM array. Control information, including a non-DRAM indicator in the case of data not stored in a DRAM array, are maintained for all read cycles. Returned data stored in a DRAM array and data not stored in a DRAM array are buffered together. When extracting read data from the buffer, data not stored in a DRAM array are identified by the non-DRAM indicator and directed to circuits within the controller. When data not stored in the DRAM array indicates the temperature of the SDRAM die, the controller may adjust the refresh rate in response to the temperature.

Abstract: A temperature invariant reference voltage and a temperature variant physical quantity, such as a voltage or current, are generated. The temperature variant physical quantity changes in response to a temperature of the integrated circuit. A temperature sensor circuit generates a voltage that is linearly dependent on the temperature. A level generator circuit generates 2n?1 voltage levels from the reference voltage. A comparator circuit, such as an analog-to-digital circuit, compares the voltage from the temperature sensor to the 2n?1 voltage levels to determine which level is closest. An n-bit digital output of the resulting level is proportional to the temperature of the integrated circuit.

Abstract: A temperature sensor generates a digital representation of the temperature of the integrated circuit. A logic circuit reads the digital temperature and generates a multiple bit digital representation of an operational voltage and a multiple bit digital representation of a timing signal, both being functions of the integrated circuit temperature. A voltage generator converts the digital representation of the operational voltage to an analog voltage that biases portions of the integrated circuit requiring temperature compensated voltages. In one embodiment, the temperature compensated voltages bias memory cells. A timing generator converts the multiple bit digital representation of the timing signal to a logic signal.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal management using an on-die thermal sensor. In some embodiments, an integrated circuit (e.g., a memory controller) includes temperature collection logic and control logic. The temperature collection logic receives and stores temperature data from a plurality of remote memory devices each having an on-die thermal sensor. In some embodiments, the control logic controls a thermal throttle based, at least in part, on the temperature data. Other embodiments are described and claimed.

Abstract: A memory hub control block may be configured to decode a command packet received from a host and determine whether the command packet has designated the memory hub. If the command packet does not designate the memory hub control block, the memory hub control block may transmit a temperature information request signal to at least one of a plurality of semiconductor memory devices coupled to the memory hub, and receive temperature information from one of the plurality of semiconductor memory devices.

Abstract: A semiconductor memory and a refresh cycle control method that reduce a standby current by properly changing a refresh cycle according to the temperature of the semiconductor memory. A temperature detection section detects the temperature of the semiconductor memory. A cycle change control section sends a cycle change signal for changing a refresh cycle when the temperature of the semiconductor memory reaches a predetermined cycle change temperature. A refresh timing signal generation section generates a refresh timing signal and changes the cycle of the refresh timing signal in response to the cycle change signal. A constant current generation circuit generates an electric current for generating the refresh timing signal. A low-temperature constant current setting circuit designates the level of the electric current generated in the case that the temperature of the semiconductor memory is lower than or equal to the cycle change temperature.

Abstract: A sense amplifier enable signal generator has two stages. Each stage offsets transistor performance variation in the other stage to produce an enable signal output relatively immune from the effects associated with transistor mismatches. In one embodiment, a memory device comprises a plurality of memory cells, sense amplifier circuitry and the enable signal generator. The sense amplifier circuitry is coupled to one or more of the memory cells and senses the state of the one or more memory cells when enabled. The enable signal generator has first and second stages and generates an enable signal applied to the sense amplifier circuitry. The enable signal generator counteracts delay variation when generating the enable signal so that operation of the enable signal generator is substantially unaffected by transistor performance variation in either stage of the enable signal generator.

Abstract: A memory system is provided that manages thermal conditions at a memory device level transparent to a memory controller. The memory systems comprises a memory hub device integrated in a memory module, a set of memory devices coupled to the memory hub device, and a first set of thermal sensors integrated in the set of memory devices. A thermal management control unit integrated in the memory hub device monitors a temperature of the set of memory devices sensed by the first set of thermal sensors. The memory hub device reduces a memory access rate to the set of memory devices in response to a predetermined thermal threshold being exceeded thereby reducing power used by the set of memory devices which in turn decreases the temperature of the set of memory devices.

Abstract: A semiconductor memory device having internal circuits responsive to temperature data, in order to compensate an output characteristic change of the internal circuits and reduce power consumption depending on temperature change, and method thereof are disclosed. The semiconductor memory device may include a temperature sensing circuit and an internal circuit. The temperature sensing circuit may generate and output temperature data in response to ambient temperature of the semiconductor memory device. The internal circuit may adjust an output level of an output signal in response to the temperature data from the temperature sensing circuit.

Abstract: A method adapts circuit components of a memory module to changing operating conditions within a predefined range. According to one embodiment, a memory module provides a sensor arrangement and a communication bus. Sub-ranges are defined for at least one operating condition, in which the circuit components can work with a fixed setup. During operation, the current state of the at least one operating condition is sensed using the sensing arrangement. The sensed state of the operating condition is mapped to one of the predefined ranges and an associated set of control signals is transmitted over the communication bus. The control signals transmitted over the communication bus are used to adapt at least one circuit component to the current operating conditions.

Abstract: A solid state semiconductor storage device with temperature control function comprises a non-volatile memory unit, a temperature sensing element, and a control unit. The temperature sensing element is used for sensing the operation temperature of the solid state semiconductor storage device so as to provide a temperature sensing signal to the control unit. According to the temperature sensing signal, the control unit controls the operation mode of the solid state semiconductor storage device for achieving the function of temperature control.

Abstract: A circuit is disclosed which generates such a bias voltage that when this bias voltage is received by a large plurality of devices of a semiconductor chip, power consumption is reduced in the stand-by mode at any particular operating temperature. The disclosed circuit contains at least one monitor FET, which is kept in its off-state, and which has common properties with the large plurality of FET devices. The temperature dependent leakage current of the monitor FET is sensed, and used to generate the bias voltage in proportion to the leakage current. This bias voltage is received by the large plurality FET devices on their gate electrodes, or on their body terminals.

Abstract: A method for throttling a bus, e.g. a memory bus, may be used to compensate for potential inaccuracy of feedback information received for monitored characteristics, e.g. temperature, reported by sensors configured in monitored devices, e.g. memory devices, accessed through the bus. For example, in case of a memory bus, a memory controller may be configured to throttle the memory bus in a way that maximizes system performance while ensuring that the memory devices keep operating within their thermal limits. Readings obtained from the memory, or from close proximity to the memory, may indicate whether the temperature of the memory has crossed over one or more designated trip points, and one or more algorithms may be executed to perform throttling according to the readings and based on fixed and dynamic throttling modes.

Abstract: Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.

Abstract: A semiconductor device temperature sensor produces a reference level for temperature detection from two or more reference levels of different temperatures to detect a temperature. The temperature sensor is applied for detecting the temperature of a semiconductor storage device having a memory unit which requires a refresh action. A refresh cycle control circuit provided in the semiconductor storage device controls the cycle of the refresh action for the memory unit in response to an output of the temperature sensor.

Abstract: A semiconductor memory device is provided for minutely changing a refresh interval according to a detected temperature and thereby lowering its power consumption. A temperature detector detects a temperature of a chip and outputs the corresponding temperature signal. A reference temperature signal output unit outputs the corresponding reference temperature signal with each of different reference temperatures to be compared with the chip temperature according to a selection signal. A temperature comparison unit compares the chip temperature with the reference temperature through the temperature signal and the reference temperature signal. A selection signal output unit outputs the selection signal according to the compared result of the temperature comparison unit. A refresh interval control unit changes the refresh interval according to the compared result of the temperature comparison unit.

Abstract: A circuit comprises at least one memory cell adapted to store data in terms of values of an electrical characteristic thereof, which exhibits a variability with temperature according to a first variation law; a voltage generator is provided for generating a voltage to be supplied to the at least one memory cell for retrieving the data stored therein, the voltage generator including first means adapted to cause the generated voltage take a value in a set of target values including at least one target value, corresponding to an operation to be performed on the memory cell. The voltage generator comprises second means for causing the value taken by the generated voltage vary with temperature according to a prescribed second variation law exploiting a compensation circuit element having said electrical characteristic.

Abstract: An integrated semiconductor memory that has at least one temperature measuring element and repeatedly carries out a temperature measurement during the operation of the semiconductor memory, wherein the semiconductor memory repeats the temperature measurement at instants corresponding to a measuring frequency of the temperature measuring element. According to an embodiment of the invention, the measuring frequency of the temperature measuring element is variable and the temperature measuring element is driven in such a way that the measuring frequency changes in a manner dependent on the temporal development of measured values of the repeated temperature measurements.

Abstract: A temperature sensing device can be embedded in a memory circuit in order to sense the temperature of the memory circuit. One oscillator generates a temperature variable signal that increases frequency as the temperature of the oscillator increases and decreases frequency when the temperature of the oscillator decreases. A temperature invariant oscillator generates a fixed width signal that is controlled by an oscillator read logic and indicates a temperature sense cycle. An n-bit counter is clocked by the temperature variable signal while the fixed width signal enables/inhibits the counter. The faster the counter counts, the larger the count value at the end of the sense cycle indicated by the fixed width signal. A larger count value indicates a warmer temperature. A smaller count value indicates a colder temperature.

Abstract: Data regarding physical parameters and security and commands to send such data can be communicated between a memory device and a memory controller using a memory bus connected between the two. In one embodiment, the invention includes receiving a first command at a memory device on a memory bus, the first command being other than a read or write command, and receiving a second command together with the first command, the second command to be initiated using lines that are not used by the first command.

Abstract: The temperature for multiple devices of a memory module are determined. In one example a memory module includes a printed circuit board, a plurality of memory chips on the printed circuit board, each chip containing a plurality of memory cells and a thermal sensor, and a multiplexer on the printed circuit board, independent of the memory chips, coupled to each of the thermal sensors. A current source is coupled to the multiplexer to provide a current to each one of the thermal sensors, and a voltage detector is coupled to the multiplexer to detect a voltage from each of the thermal sensors when a current is applied. A temperature circuit is coupled to the voltage detector to determine a temperature for each memory chip based on the detected voltage.

Abstract: The nonvolatile semiconductor memory device according the this invention has a plurality of memory cells arranged in a matrix form and each having a floating gate; at least one first diode connected between drains of said plurality of memory cells and a ground terminal; and at least one second diode connected between sources of said plurality of memory cells and said ground terminal, wherein said first diode and said second diode have a same temperature characteristic. Said first diode and said second diode may be of parasitic diodes, Zener diodes or devices with avalanche breakdown voltages.

Abstract: Method for controlling voltage in a non-volatile memory system is provided. The method includes selecting a first input value for a voltage generator system operating in one of a plurality of modes, the first input value controlling a temperature dependent component of a voltage applied to a memory cell; and selecting a second input value for the voltage generator system operating in one of the plurality of modes, the second input value controlling a temperature independent component of the voltage applied to the memory cell. The temperature dependent component of the voltage applied to the memory cell and the temperature independent component of the voltage applied to the memory cell are controlled independently in response to the first input value and the second input value.

Abstract: A programming method which controls the amount of a write current applied TO Phase-change Random Access Memory (PRAM), and a write driver circuit realizing the programming method. The programming method includes maintaining a ratio of a resistance of the PCM in the higher resistance state to a resistance of the phase change material (PCM) in the lower resistance state constant or substantially constant independent of an ambient temperature. The ratio may be maintained by increasing, decreasing or keeping the same a reset current and/or a set current.

Abstract: A semiconductor memory device is provided for minutely changing a refresh interval according to a detected temperature and thereby lowering its power consumption. A temperature detector detects a temperature of a chip and outputs the corresponding temperature signal. A reference temperature signal output unit outputs the corresponding reference temperature signal with each of different reference temperatures to be compared with the chip temperature according to a selection signal. A temperature comparison unit compares the chip temperature with the reference temperature through the temperature signal and the reference temperature signal. A selection signal output unit outputs the selection signal according to the compared result of the temperature comparison unit. A refresh interval control unit changes the refresh interval according to the compared result of the temperature comparison unit.

Abstract: An apparatus, system, and method are disclosed for modifying memory device timing and voltage. A detection module detects a change of memory device stress. A timing modification module modifies the memory device timing in response to the change of the memory device stress. In addition, a voltage modification module modifies the memory device voltage in response to the change of the memory device stress. In one embodiment, a processor pause module pauses the operation of a processor module while the timing modification module modifies the memory device timing and the voltage modification module modifies the memory device voltage.

Abstract: Temperature-compensation is provided during a sense operation of a non-volatile storage element. A gate voltage of a transistor which couples a bit line associated with the non-volatile storage element to a sense module is temperature-compensated so that it is higher when temperature is higher to compensate for variations with temperature of the bit line voltage. The bit line voltage, in turn, varies due to variations in temperature of a threshold voltage of the non-volatile storage element. The sense module determines a programming condition of the non-volatile storage element, which may be provided in a NAND string, by sensing a voltage. The sense operation may be a read operation, verify operation, or erase-verify operation, for instance. Further, the threshold voltage of the non-volatile storage element may be positive or negative. In another aspect, a source voltage is temperature compensated.

Abstract: System for a non-volatile memory system is provided. The non-volatile memory system includes a voltage generator system operating in one of a plurality of modes for generating a voltage applied to a memory cell of the non-volatile memory system. For one of the plurality of modes, a first input value is selected for controlling a temperature dependent component of the voltage and a second input value is selected for controlling a temperature independent component of the voltage. The temperature dependent component of the voltage and the temperature independent component of the voltage are controlled independently in response to the first input value and the second input value.

Abstract: A temperature sensor generates a digital representation of the temperature of the integrated circuit. A logic circuit reads the digital temperature and generates a multiple bit digital representation of an operational voltage and a multiple bit digital representation of a timing signal, both being functions of the integrated circuit temperature. A voltage generator converts the digital representation of the operational voltage to an analog voltage that biases portions of the integrated circuit requiring temperature compensated voltages. In one embodiment, the temperature compensated voltages bias memory cells. A timing generator converts the multiple bit digital representation of the timing signal to a logic signal.

Abstract: Regulating a program voltage value during multilevel memory device programming includes utilizing a program path duplicate in an output pump regulator circuit. Further, the output pump regulator circuit is utilized to provide a regulated program voltage for memory cell programming, the regulated program voltage correcting for a program path voltage drop.

Abstract: A logic device operates with reduced leakage current. Controllability is achieved by using a reference voltage to control the amount of leakage reduction. A method of temperature dependent reference voltage generation is given which maintains virtual supply in acceptable range to provide sufficient noise margin in logic devices including memory cells.

Abstract: A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.

Abstract: In one embodiment, a memory controller is coupled to a memory subsystem and controls accesses to the memory subsystem. In addition, a temperature sensor is positioned to detect a temperature associated with the memory subsystem. In this embodiment, the memory controller is configured to selectively insert one or more idle clock cycles between a first memory access and a second memory access depending upon the sensed temperature. In a further embodiment, a sensor is positioned to detect a power condition associated with the memory subsystem. In this embodiment, the memory controller is configured to selectively insert one or more idle clock cycles between a first memory access and a second memory access depending upon the detected power condition.

Abstract: A magnetic memory element is written to by heating the memory element and applying at least one magnetic field to the memory element.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for the dynamic power control of a memory device thermal sensor. In some embodiments a memory device includes an on-die thermal sensor and enable logic to dynamically enable or disable the on-die thermal sensor. In some embodiments, the on-die thermal sensor senses thermal data responsive to a thermal data sense indication. The thermal data sense indication may be received subsequent to the expiration of a delay period.

Abstract: A memory device is disclosed. A reference device of the memory includes a trimmable current source and a fixed current source. Currents provided by each source are summed to provide a reference current to a sense amplifier. The sense amplifier senses the state of a bit cell by comparing a current from the bit cell, representative of a logic value, to the reference current. By basing the reference current on both a fixed and a trimmable current source, the reference device can be trimmed to compensate for process and operating characteristics of the device, while maintaining a minimum reference current in the event of a disturb mechanism that results in loss of the current provided by the trimmable current source.

Abstract: A memory device includes a temperature sensor configured to generate a temperature detection signal responsive to a temperature of the memory device and a self-refresh control circuit configured to control a refresh of the memory device responsive to the temperature detection signal. The device further includes a temperature-detection-error sensing circuit configured to assert a temperature-detection-error signal responsive to an error in the temperature detection signal. The temperature-detection-error sensing circuit may be configured to provide the asserted temperature-detection-error signal at a temperature-detection-error sensing pad configured to be coupled to an external device and/or the device may further include a temperature sensor control circuit configured to control the temperature detection signal responsive to the temperature-detection-error signal. Related operating and testing methods may be provided.

Abstract: A method for operating a volatile random access memory as a detector, with predetermined information being stored in at least one area of the volatile random access memory. The method includes interrupting a supply voltage for the at least one area of the random access memory during a time period, reading information from the at least one area of the random access memory, and checking the extent to which the predetermined information and the information that has been read match or whether the predetermined information and the information which has been read have a predetermined relationship.

Abstract: A semiconductor memory device includes a mode register, an additional function executer, and an additional function controller. The mode register activates an additional function control signal when a mode register set code indicates that an additional function is to be executed concurrently with a refresh operation. The additional function controller controls the additional function executer to carry out the additional function concurrently with the refresh operation when the additional function control signal is activated.

Abstract: An apparatus for generating a power up signal for a semiconductor memory chip includes a temperature information providing unit that outputs a control voltage corresponding to predetermined temperature information. A power up signal generating unit generates the power up signal based at least on one of an external voltage or the control voltage.

Abstract: A memory device includes a phase change memory cell and a circuit. The circuit is for programming the memory cell to a selected one of more than two states by applying a temperature controlled set pulse to the memory cell.

Abstract: An integrated semiconductor memory device includes a temperature sensor circuit to generate a temperature-dependent control signal, a reference circuit to generate a temperature-independent reference signal, a comparator circuit and a voltage generator circuit. The comparator circuit generates a first level or second level of an activation signal in a manner dependent on the comparison of the control signal and the reference signal which are both fed to it on an input side. The voltage generator circuit generates a first control signal or a second control signal in a manner dependent on the level of the activation signal. The integrated semiconductor memory enables the generation of two control signals for a selection transistor of a memory cell in a manner dependent on whether the temperature sensor circuit detects a temperature in a first temperature range or in a second temperature range.

Abstract: Reading and verify operations are performed on non-volatile storage elements using temperature-compensated read voltages for unselected word lines, and/or for select gates such as drain or source side select gates of a NAND string. In one approach, while a read or verify voltage is applied to a selected word line, temperature-compensated read voltages are applied to unselected word lines and select gates. Word lines which directly neighbor the selected word line can receive a voltage which is not temperature compensated, or which is temperature-compensated to a reduced degree. The read or verify voltage applied to the selected word line can also be temperature-compensated. The temperature compensation may also account for word line position.

Abstract: Reading and verify operations are performed on non-volatile storage elements using temperature-compensated read voltages for unselected word lines, and/or for select gates such as drain or source side select gates of a NAND string. In one approach, while a read or verify voltage is applied to a selected word line, temperature-compensated read voltages are applied to unselected word lines and select gates. Word lines which directly neighbor the selected word line can receive a voltage which is not temperature compensated, or which is temperature-compensated to a reduced degree. The read or verify voltage applied to the selected word line can also be temperature-compensated. The temperature compensation may also account for word line position.

Abstract: Switching operations, such as those used in memory devices, are enhanced using a semiconductor device having a thyristor adapted to switch between conducting and blocking states and operate at low power. According to an example embodiment of the present invention, thyristor characteristics are managed over a broad temperature range using a control circuit for coupling a signal, such as a DC voltage signal, to a portion of a thyristor for controlling temperature-related operation thereof, e.g., for controlling bipolar gains. In one implementation, a control port adaptively adjusts a signal coupled to the thyristor as a function of temperature, such that at relatively low temperatures unwanted increases in holding current (IH) are prevented. In another implementation, the control port couples the signal at relatively high temperature operation for controlling the forward blocking voltage (VFB) in such a manner that a blocking state of the thyristor is held.

Abstract: Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.

Abstract: A refresh control circuit includes a temperature detecting unit that detects the temperature and generates a temperature detecting voltage, a control unit that generates a plurality of control signals, a digital converting unit that converts the temperature detecting voltage into a plurality of bits of digital code and outputs a plurality of bits of digital code according to the control of a plurality of control signals, and a refresh signal generating unit that generates a refresh signal with a period corresponding to the input of a plurality of bits of digital code.

Abstract: A semiconductor memory and a refresh cycle control method that reduce a standby current by properly changing a refresh cycle according to the temperature of the semiconductor memory. A temperature detection section detects the temperature of the semiconductor memory. A cycle change control section sends a cycle change signal for changing a refresh cycle when the temperature of the semiconductor memory reaches a predetermined cycle change temperature. A refresh timing signal generation section generates a refresh timing signal and changes the cycle of the refresh timing signal in response to the cycle change signal. A constant current generation circuit generates an electric current for generating the refresh timing signal. A low-temperature constant current setting circuit designates the level of the electric current generated in the case that the temperature of the semiconductor memory is lower than or equal to the cycle change temperature.

Abstract: A self-refresh module includes an oscillator configured to provide a first signal having a first frequency, a trimming divider configured to trim the first signal to provide a second signal having a second frequency, and a temperature sensor configured to sense a temperature of the memory device and provide a temperature signal. The self-refresh module includes a temperature look-up table configured to receive the temperature signal and provide a third signal based on the temperature signal, and a temperature divider configured to provide a self-refresh pulse signal based on the second signal and the third signal.