Abstract: A system including an integrated circuit (IC) and a power supply regulator external to the IC. The IC operates in accordance with an active mode and a lower power mode, and is configured to retain a logical state during the low power mode. The power supply regulator is configured to i) supply a first voltage potential to a first pin of the IC during the active mode, and ii) disable the first voltage potential during the low power mode. The IC is configured to provide a first feedback signal from an internal supply of the IC to the power supply regulator via the first pin.

Abstract: The present invention relates to a memory circuit and a method of controlling data retention in the memory circuit, wherein a supply signal is selectively switched to a respective one of at least two virtual supply lines (24) each shared by a respective one of a plurality of groups (30-1 to 30-n) of memory cells (C0,0 to Cy,z). The selective switching is controlled based on a global activity control signal (A), used for setting the memory circuit either into a standby state or into an active state, and a local data retention indication signal (DR1 to DRn) allocated to a dedicated group of memory cells. Thereby, the data retention part of the memory circuit can be adapted to the application and its state, and standby mode leakaged power is only dissipated in those memory cells for which data retentions actually required.

Abstract: A method for operating a volatile memory supplied with a supply signal arranged either as a first supply signal of a first supply signal source or a second supply signal of a second supply signal source. If an available first supply signal is present it is used otherwise the second supply signal is used. The supply signal is supplied, based on a switch position of a switching element to the volatile memory. During a detected interrupted first supply signal, the switch position of the switching element is for a predetermined period of time such that the supply signal is supplied to the volatile memory. After expiry of the predetermined period of time, the switch position of the switching element is predetermined such that the volatile memory is decoupled electrically from the supply signal.

Abstract: An SRAM includes circuitry configured for the SRAM to operate at different operation modes using different voltage levels wherein the voltage level and thus the supply current leakage is regulated based on the operation mode. For example, the SRAM, in a normal operation mode, consumes power as other SRAMs. In a deep sleep mode the supply voltage (e.g., VDDI) for the bit cell in the SRAM macro is lowered by about 20-40% of the SRAM supply voltage (e.g., VDD), sufficient to retain the data in the bit cell. When access to the SRAM is not needed, the SRAM operates in the sleep mode, consuming little or no power.

Abstract: Data bits stored in memory cells are recognized by an ECC generator as data bit strings in a first direction and data bit strings in a second direction such that each data bit string in the first direction and each data bit string in the second direction share one data bit in common. The ECC controller identifies a data bit string in the first direction having more than one data bit in error based on a respective correction code in the first direction and identifies a data bit string in the second direction having more than one data bit in error based on a respective correction code in the second direction, and causes the data bit shared by the identified data bit string in the first direction and the identified data bit string in the second direction to be changed.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: A memory power supply circuit includes a memory module, a micro control unit (MCU), a phase switch circuit, and a multi-phase pulse-width modulation (PWM) controller. The MCU is operable to determine required current to be supplied to the memory module and output corresponding phase switch signals to the phase switch circuit. The PWM controller includes a number of phase pins connected to the phase switch circuit. The phase switch circuit controls enable states of the phase pins of the PWM controller.

Abstract: An apparatus, system, and method are disclosed for power loss management in a nonvolatile data storage device. A monitor module initiates a power loss mode in the nonvolatile data storage device in response to a primary power source failing to supply electric power above a predefined threshold to the nonvolatile data storage device. A secondary power source supplies electric power to the nonvolatile data storage device for at least a power hold-up time during the power loss mode. A power loss module adjusts execution of in-process operations on the nonvolatile data storage device during the power loss mode so that essential in-process operations execute within the power hold-up time.

Abstract: A nonvolatile semiconductor memory device has an internal step-down power generation circuit and a memory circuit. The internal step-down power generation circuit generates a first internal power supply voltage from an external power supply voltage in an active state, and generates a second internal power supply voltage different from the first internal power supply voltage from the external power supply voltage in a standby state. The memory circuit includes a cell array containing a nonvolatile memory cell and a sense amplifier detecting data read from the cell array. The sense amplifier is supplied with a voltage generated by the internal step-down power generation circuit as an internal power supply voltage.

Abstract: Embodiments of the invention relate to reducing energy consumption and optimizing workload and performance in multi-tier storage systems using extent-level dynamic tiering. An aspect of the invention includes a receiving data access information of a storage extent stored in a storage system and utilization information of storage devices in the storage system. The storage system includes a plurality of storage tiers and each of the plurality of storage tiers is made up of a plurality of storage devices. Storage resources required for each of the plurality of the storage tiers to satisfy the storage extent's performance and capacity requirements are estimated based on the data access information. One storage tier that would incur the lowest power consumption to the storage system for satisfying the storage extent's performance and capacity requirements is determined.

Abstract: A multi-port memory is operated according to a method. Data is written, in a first mode, to a storage node of a memory cell from a first port through a first conductance. The first mode is characterized by a power supply voltage being applied at a power node at a first level. Data is written, in a second mode, to the storage node of the memory cell simultaneously from the first port through the first conductance and a second port through a second conductance. The second mode is characterized by the power supply voltage being applied at the power node at a second level different from the first level.

Abstract: A system and method for implementing a low-power local-area wireless network for use with a mobile terminal satellite modem. This low-power local-area wireless network enables sensors on an asset to wirelessly transmit sensor data to a mobile terminal affixed on the asset. The mobile terminal reports the sensor data along with asset position information to a centralized facility via a communications satellite.

Abstract: A semiconductor memory device capable of reducing off-current in a standby mode is provided. The semiconductor memory device includes an enable signal generating unit configured to receive a plurality of address decoding signals and generate a first enable signal to select a first cell block and a second enable signal to select a second cell block, and an internal voltage generating unit for generating an internal voltage by controlling a supply of a first voltage in accordance with the first or second enable signals.

Abstract: When threshold voltages of constituent transistors are reduced in order to operate an SRAM circuit at a low voltage, there is a problem in that a leakage current of the transistors is increased and, as a result, electric power consumption when the SRAM circuit is not operated while storing data is increased. Therefore, there is provided a technique for reducing the leakage current of MOS transistors in SRAM memory cells MC by controlling a potential of a source line ssl of the driver MOS transistors in the memory cells.

Abstract: A device includes a backup power supply configured to provide power to an external system upon loss of primary system power. The backup power provided by at least one capacitor. While the capacitor is available as a backup power supply to the external system, a transient elevation of the capacitor's stored potential is created above an upper predetermined operating potential of the capacitor. Measurements of a capacitor's output voltage are obtained during the transient elevation of the capacitor's stored potential. A capacitance of the capacitor is determined from the measurements.

Abstract: “A circuit includes a series arrangement of capacitor stages, each stage including a single capacitor or a plurality of capacitors in parallel, the series arrangement configured such that each capacitor stage receives charge current via a common charging terminal. A controller is configured to separately measure a stored potential of each capacitor stage in the series arrangement. The circuit includes logic to selectively remove a controlled amount of charge from each capacitor stage individually (discharge logic), and logic to operate the discharge logic to maintain each capacitor stage in the series arrangement at a substantially equal stored potential (balancing logic).

Abstract: An integrated circuit (IC) including a controller integrally formed on a shared die with the IC and method of operating the same to compensate for process and environmental variations in the IC are provided. In one embodiment the IC is comprised of device and sub-circuits, and the method includes: receiving in the IC electrical power and information on at least one of one or more operational parameters of the IC; and adjusting one or more operating characteristics of at least one of the devices and sub-circuits in the IC based on the received information using a controller integrally formed on a shared die with the IC. Other embodiments are also disclosed.

Abstract: A system, method, and computer program product are provided for driving a memory circuit. In one embodiment, the memory circuit is driven utilizing a first resistance value in a first mode of operation. Further, in a second mode of operation, the memory circuit is driven utilizing a second resistance value. In another embodiment, a device is provided for driving a memory circuit without active termination utilizing a resistor.

Abstract: In a semiconductor device including a row-based control circuit applied with a current reduction circuit having a standby state and an active state, a refresh control circuit generates a refresh request signal every predetermined time interval on a self-refresh mode and time-sequentially generates an internal active signal at N times in connection with the refresh request signal once. The row-based control circuit time-sequentially refreshes information of memory cells on the based of the internal active signal at the N times. The refresh control circuit inactivates the row-based control circuit by making the current reduction circuit the standby state.

Abstract: A nonvolatile semiconductor memory includes a memory cell array, bit lines, a first voltage generator, and a second voltage generator. The memory cell array includes memory cells. The bit lines each of which is connected electrically to one end of the current path of the corresponding one of the memory cells. The first voltage generator which is capable of supplying via a first output terminal to the bit lines a first voltage externally supplied or a third voltage which is obtained by stepping down a second voltage supplied and higher than the first voltage and which is as high as the first voltage. The second voltage generator which is capable of supplying a fourth voltage obtained by stepping down the second voltage to the bit lines via a second output terminal when the first voltage generator steps down the second voltage to generate the third voltage.

Abstract: A flash storage device includes a power hold circuit including a double layer capacitor. A power source supplies power to the flash storage device and charges the double layer capacitor. The double layer capacitor supplies power for maintaining integrity of data during a data transfer occurring in the flash storage device when the power supplied by the power source is disrupted. Additionally, the flash storage device can inhibit subsequent data transfers until the power supplied by the power source is restored.

Abstract: The present invention provides a semiconductor memory circuit capable of reducing current consumption at non-operation in a system equipped with a plurality of chips that share the use of a power supply, address signals and a data bus. The semiconductor memory circuit has an internal circuit which is capable of selectively performing the supply and stop of an operating voltage via switch means and includes a memory array. An input circuit, which receives a predetermined control signal therein, controls the supply and stop of the operating voltage by the switch means to reduce a DC current and a leak current when no memory operation is done, whereby low power consumption can be realized.

Abstract: An image processing apparatus for eliminating the necessity of providing a first control board with a power supply unit beforehand for backing up data stored in an image memory, and reducing the cost of the apparatus as a whole. To accomplish this, in an image processing apparatus including a system control board configured to perform image processing, a memory backup function is enabled for an image memory storing data to be processed by the system control board, when a facsimile communication board is connected.

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: A power-up circuit comprises an external supply voltage potential detector, a first internal supply voltage potential detector, a second internal supply voltage potential detector, and a logic circuit. The external supply voltage potential detector is configured to detect a supply voltage that is external to the memory device and to generate a first detection signal indicating whether a voltage potential of the external supply voltage reaches a first predetermined value. The first internal supply voltage potential detector is configured to detect a first internal supply voltage that is internal to the memory device and to generate a second detection signal indicating whether a voltage potential of the first internal supply voltage reaches a second predetermined value.

Abstract: A semiconductor memory device and a method of generating an internal voltage in the semiconductor memory device are provided. The semiconductor memory device includes a controller configured to activate a sensing enable signal when an active command is applied from outside, inactivate the sensing enable signal when a precharge command is applied, and output the sensing enable signal, and an array internal voltage generator configured to output an active array power supply voltage as an array power supply voltage when the sensing enable signal is activated, output an external array power supply voltage and a standby array power supply voltage as the array power supply voltage when the sensing enable signal is inactivated, and output the standby array power supply voltage alone as the array power supply voltage when the sensing enable signal is inactivated for at least a specific period.

Abstract: The invention provides a method and system for time-based storage access, the method includes associating a plurality of storage volumes with specific periods of time during which they can be accessed, adjusting user fees based on access time periods of storage volumes, packing the plurality of storage volumes in available storage bins in the system based on periods of access for the plurality of storage volumes, wherein volumes with overlapping or similar periods of access are packed into a same storage bin if possible, and switching a storage bin to off or a reduced power state during periods when the storage volumes placed in the storage bin are not required, to reduce power consumption.

Abstract: An internal power supply control circuit of a semiconductor memory includes a periodic signal generating unit that generates a periodic signal to generate a permission signal to intermittently permit supply of power from an internal power supply circuit of the semiconductor memory to an internal circuit thereof with a predetermined period, when a mode changes from a normal operation mode where power is always supplied from the internal power supply circuit to the internal circuit to a standby mode where consumption power is further suppressed as compared with consumption power in the normal operation mode, and a permission signal output unit that outputs the permission signal synchronized with the periodic signal to the internal power supply circuit, when a mode signal indicating any mode of the normal operation mode and the standby mode and the periodic signal are input and the input mode signal indicates the standby mode.

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: A semiconductor storage device includes: a memory cell array that includes a plurality of memory cells having a cell transistor formed on a well subjected to application of a predetermined substrate potential; a memory cell array control circuit that switches the number of memory cells, for use in storage of data of 1 bit in a normal operation state, to m (m is a natural number) and switches the number of memory cells, for use in storage of data of 1 bit in a standby state, to n (n is a natural number larger than m); and a substrate potential control circuit that controls the substrate potential in the normal operation state to a first substrate potential and controls the substrate potential in the standby state to a second substrate potential (the second substrate potential>the first substrate potential).

Abstract: A memory device for use with a primary power source including: non-volatile memory; volatile memory; an interface for connecting to a backup power source; isolation logic for controlling access to the volatile memory by a host processor, said isolation logic having a first mode during which the isolation logic provides the host processor with access to the volatile memory for storing or reading data and a second mode during which the isolation logic isolates the volatile memory from access by the host processor; and a controller controlling the isolation logic, said controller programmed to place the isolation logic in the first mode when the volatile memory is being powered by the primary power source and, when power to the volatile memory from the primary power source is interrupted, to place the isolation logic in the second mode and transfer data from the volatile memory to the non-volatile memory.

Abstract: Methods and memory modules adapted for use in computer systems to generate different voltages for core supply (VDD) and input/output supply (VDDQ) inputs to memory components of the computer memory subsystem. The memory module includes a substrate with an edge connector, a memory component, and first and second voltage planes adapted to supply the core supply voltage and the input/output supply voltage to the memory component. The first voltage plane receives a system input voltage from the edge connector, and the second voltage plane is connected to the first voltage plane to receive a second voltage that is either higher or lower than the system input voltage. One of the first and second voltage planes is connected to the memory component to supply the core supply voltage thereto, and the other voltage plane supplies the input/output supply voltage to the memory component.

Abstract: The present invention provides a solution to avoid the robustness problems of sub-threshold circuits by switching small parts of circuits to nominal-voltage only when they are being used, and switching them back to sub-threshold levels when the operation finishes. Such “hybrid sub-threshold” approach is capable of supporting ultra-low power operation without the disadvantages of sub-threshold circuits. Hybrid power saving mode for logic circuits provide significant power saving and fast recovery time without performance degradation.

Abstract: An integrated circuit containing a nonvolatile memory circuit which contains memory segments and sense amplifier banks individually powered by a power decoder circuit. A method of accessing a portion of a powered-down memory.

Abstract: An active cycle control circuit for a semiconductor memory apparatus is configured to precharge a word line corresponding to a read cycle, and activate a word line corresponding to a refresh request signal in response to the refresh request signal generated during the read cycle.

Abstract: A semiconductor memory device includes a first power switch for interrupting supply of a first power voltage to a first node in a standby mode, and a second power switch connected between the first node and a second node applied with a second power voltage.

Abstract: An outputting transistor circuit of a push-pull structure has an outputting PMOS transistor and an outputting NMOS transistor connected in series between a first power supply and a grounded power supply. In a standby state, a voltage level of a gate terminal of the outputting PMOS transistor is set to a voltage level of a second power supply higher than a voltage level of the first power supply. In an active state, a voltage level of the gate terminal of the outputting PMOS transistor is changed to a voltage level of the first power supply in response to an active command or a read command, or in response to the state of a semiconductor memory device changing to the active state or a read state, and either the outputting PMOS transistor or the outputting NMOS transistor is turned ON in response to a data read signal from a memory cell.

Abstract: A word driver supplies a high level voltage to a word line when a memory cell is accessed and supplies low level voltage which is a negative voltage to the word line when the memory cell isn't accessed. A precharge circuit lowers a precharge voltage-supplying capacity to a bit line at least during a standby period when the memory cell is not accessed. A substrate voltage of an nMOS transistor with source or drain connected to the bit line is set to the low level voltage or lower of the word line. Therefore, when the word line and the bit line fails short and the voltage of the bit line changes to the low level voltage of the word line during the standby period, a substrate current can be prevented from flowing between the source of the nMOS transistor and a substrate or the drain and the substrate.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: An internal voltage generator when activated, generates an internal voltage to be supplied to an internal circuit. Operating the internal voltage generator consumes a predetermined amount of the power. In response to a control signal from the exterior, an entry circuit inactivates the internal voltage generator. When the internal voltage generator is inactivated, the internal voltage is not generated, thereby reducing the power consumption. By the control signal from the exterior, therefore, a chip can easily enter a low power consumption mode. The internal voltage generator is exemplified by a booster for generating the boost voltage of a word line connected with memory cells, a substrate voltage generator for generating a substrate voltage, or a precharging voltage generator for generating the precharging voltage of bit lines to be connected with the memory cells.

Abstract: A semiconductor memory device includes a memory cell array arranged in rows and columns, a row decoder and a control circuit. The row decoder drives word lines connected to the memory cell array by decoding a received row address and being synchronized with an internal clock signal. The control circuit receives a clock signal, a chip select signal and a mode signal, and generates the internal clock signal. The control circuit generates the internal clock signal so that the row decoder does not operate for a predetermined time in response to the chip select signal when the mode signal transitions from a power saving mode to a normal mode.

Abstract: An information processing device, including: a processing unit; a peripheral circuit module; and a boot address register, wherein the information processing device comprises a first operation mode and a second operation mode having an operating current which is lower than that of said first operation mode, wherein the boot address register holds an address of an instruction to be executed by said processing unit first when the boot address register returns from said second operation mode to said first operation mode, wherein the address is output from said boot address to the processing unit when said information processing device shifts from said second operation mode to said first operation mode.

Abstract: A communication device includes a voice data and RF integrated circuit (IC) that includes a memory module that stores a plurality of applications corresponding to a plurality of uses of the communication device. A processing module executes a selected one of the plurality of applications and selects one of a plurality of power modes based on a current one of the plurality of uses of the communication device corresponding to the selected one of the plurality of applications. The processing module generates a power mode signal based on the selected one of the plurality of power modes. An off-chip power management circuit receives the power mode signal and that generates a plurality of power supply signals to the voice data and RF IC based on the power mode signal.

Abstract: An error correction circuit coupled to a plurality of memory cells in a memory device includes an error correcting code (“ECC”) generator and an ECC controller. The ECC generator is coupled to the memory cells and recognizes data bits stored in the memory cells as a plurality of data bit strings in a first direction and as a plurality of data bit strings in a second direction such that each data bit string in the first direction and each data bit string in the second direction share one data bit in common. The ECC generator generates a respective correction code in the first direction for each data bit string in the first direction and also generates a respective correction code in the second direction for each data bit string in the second direction. The ECC controller is coupled to the memory cells and the ECC generator.

Abstract: There is provided a semiconductor device including: a temperature sensor detecting temperature; an inner circuit operating when supplied with a power supply voltage from a power supply line; a switch connected between the power supply line and the inner circuit; and a control circuit performing control in which, in a case where the temperature detected by the temperature sensor is higher than a threshold value, the switch is turned on when the inner circuit is in operation and the switch is turned off when the inner circuit is in non-operation, and in a case where the temperature detected by the temperature sensor is lower than the threshold value, the switch is turned on when the inner circuit is in operation and in non-operation.

Abstract: A bulk bias voltage generating device is configured to generate a first bulk bias voltage in a deep power down mode and a second bulk bias voltage in a normal mode. The first bulk bias voltage comprises an internal voltage level, and the second bulk bias voltage comprises an external voltage level.

Abstract: A computer power supply includes a standby voltage output terminal to output a standby voltage, a power connector connected to the standby voltage output terminal, and a standby voltage discharge circuit including a zener diode, first and second electrical switches. The standby voltage output terminal is connected to a cathode of the diode. An anode of the diode is connected to a first terminal of the first electrical switch. A second terminal of the first electrical switch is grounded. A third terminal of the first electrical switch is connected to a first terminal of the second electrical switch and the standby voltage output terminal via a first resistor. A second terminal of the second electrical switch is grounded. A third terminal of the second electrical switch is connected to the standby voltage output terminal via a second resistor. A capacitor is connected between the standby voltage output terminal and ground.

Abstract: A source control circuit comprises a control signal generating unit for generating a standby signal which is enabled in a standby condition, and a switching unit connected between a power line for supplying power to an internal circuit and an external power and controlling the supply of the external power in response to the standby signal.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.