Abstract: An input circuit for a semiconductor memory apparatus comprising a input unit configured to selectively latch a plurality of external signals and output the latched signal; and a control unit coupled to the input unit, the control unit configured to control the operations of the input unit according to an operation mode of the semiconductor memory apparatus is described herein.

Abstract: A memory is provided which can be operated at an active rate of power consumption in an active operational mode and at a predetermined reduced rate of power consumption in a standby operational mode. The memory includes a current generating circuit which is operable to supply a predetermined magnitude of current to a sample power supply input terminal of a sample memory cell representative of memory cells of the memory, the predetermined magnitude of current corresponding to the predetermined reduced rate of power consumption. A voltage follower circuit is operable to output a standby voltage level equal to a voltage level at the sample power supply input terminal when the predetermined magnitude of current is supplied thereto. A memory cell array of the memory is operable to store data. In the standby operational mode, a switching circuit is operable to supply power at the standby voltage level to a power supply input terminal of the memory cell array.

Abstract: When an operational mode is shifted to a standby mode, a first transistor is brought into a conduction state by a control signal, and a word line is thereby clamped to a ground voltage. Further, a second transistor is brought into a non-conduction state, and supply of an internal power supply voltage to a word line driver is shut off. Subsequently, the supply of the internal power supply voltage is halted for saving electrical power. When the operational mode returns to a normal mode, the supply of the internal power supply voltage is started, and subsequently, the first transistor is brought into the non-conduction state by the control signal, and the second transistor is thereby brought into the conduction state.

Abstract: A programmable logic integrated circuit device adapted to enter a low-power mode is described. The integrated circuit device includes a programmable logic block, a first low-power mode control circuit programmed into a portion of the programmable logic block, a second low-power mode control circuit, and a low-power enable input coupled to the first low-power mode control circuit and the second low-power mode control circuit. This arrangement allows the programmable logic integrated circuit device to transition into and out of low-power mode in response to a single signal from system control logic, so that the system control logic can be designed without detailed understanding of the inner workings of the programmable logic integrated circuit device or its programmed design.

Abstract: An internal voltage generator when activated, generates an internal voltage to be supplied to an internal circuit. Operating the internal voltage generator consumes a predetermined amount of the power. In response to a control signal from the exterior, an entry circuit inactivates the internal voltage generator. When the internal voltage generator is inactivated, the internal voltage is not generated, thereby reducing the power consumption. By the control signal from the exterior, therefore, a chip can easily enter a low power consumption mode. The internal voltage generator is exemplified by a booster for generating the boost voltage of a word line connected with memory cells, a substrate voltage generator for generating a substrate voltage, or a precharging voltage generator for generating the precharging voltage of bit lines to be connected with the memory cells.

Abstract: In memory circuitry, to ensure that a memory device, such as a DDR3 RDIMM, safely operates in self-refresh mode while the memory controller is powered down and off, the memory device's clock enable (CKE) input is connected to both (i) the CKE signal applied by the memory controller and (ii) a termination voltage provided by the power module. To power down the memory controller, the memory controller drives the CKE signal low, then the power module drives the termination voltage low, then the power module powers down the memory controller. To resume normal operations, the power module powers up the memory controller, then the memory controller drives the CKE signal low, then the power module powers up the termination voltage. By holding the termination voltage low, the memory circuitry ensures that the memory device stays in self-refresh mode while the memory device is powered down and off.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are included. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A semiconductor memory device and a method of generating an internal voltage in the semiconductor memory device are provided. The semiconductor memory device includes a controller configured to activate a sensing enable signal when an active command is applied from outside, inactivate the sensing enable signal when a precharge command is applied, and output the sensing enable signal, and an array internal voltage generator configured to output an active array power supply voltage as an array power supply voltage when the sensing enable signal is activated, output an external array power supply voltage and a standby array power supply voltage as the array power supply voltage when the sensing enable signal is inactivated, and output the standby array power supply voltage alone as the array power supply voltage when the sensing enable signal is inactivated for at least a specific period.

Abstract: A configurable power controller and method for controlling power of a macro circuit block, such as a memory circuit, in multiple power modes is described to help minimize power consumption of the macro circuit block when the application environment for the macro circuit block is in a lower power mode than during its normal power mode.

Abstract: Power-backup capabilities are provided by implementing a variety of different methods, systems and devices. According to one such implementation, a data storage device stores data in response to data accesses under the control of a memory control circuit. A solid-state memory circuit and a volatile caching memory circuit provide the memory control circuit with access to a set of common data. A power-reservoir circuit includes two or more capacitor cells that respectively hold charge to provide operating power to the data storage device to permit transfer of the data from the volatile memory circuit to the solid-state memory circuit in the event of a power loss. A detection circuit is connected to a center tap between the capacitor cells and uses the tap to detect characteristics of the cells relative to one another, and to provide an output that can be used to characterize the cells' electrical characteristics relative to one another.

Abstract: Power-backup capabilities are provided by implementing a variety of different methods, systems and devices. According to one such implementation, an energy storage circuit is powered using a variable voltage controlled to limit the current draw from a power supply, to charge the energy storage circuit for providing backup power to a solid state drive (SSD) type of data storage arrangement. Certain applications involve controlling the power draw from the power supply, in response to feedback and/or power drawn from other circuits, as may be applicable to an initial startup of the energy storage circuit and/or the initial startup of a larger system in which the energy storage circuit is employed.

Abstract: Power-backup capabilities are provided by implementing a variety of different methods, systems and devices. According to one such implementation, a memory device stores data in response to data accesses under the control of a memory control circuit. A solid-state memory circuit and a volatile caching memory circuit provide the memory control circuit with access to a set of common data. A circuit carries primary operating power to the memory device. A backup power circuit has a power module having and securing a power-reservoir circuit. A capacitor holds a charge to provide operating power to the memory circuits to permit transfer of the data from the volatile memory circuit to the solid-state memory circuit. A notification circuit provides an external user indication of the power-reservoir circuit integrity. A circuit-based structure secures the power-reservoir circuit for operation as part of the memory device and facilitates replacement of the power-reservoir circuit.

Abstract: Disclosed are a phase change memory device in which an active time is reduced and a method of discharging a bitline in the phase change memory device. In the phase change memory device having the reduced active time and the method of discharging the bitline in the phase change memory device, the bitline is either always discharged when the phase change memory device is in standby, is discharged after the active operation of the phase change memory device, or is discharged prior to and after the active operation of the phase change memory device.

Abstract: An integrated circuit, including: (i) a power gated circuit which power supply is shut down during a low-power period; (ii) a retention circuit, coupled to the power gated circuit during at least a portion of a non-low-power period, the retention circuit is adapted to store, during the low-power period, state information reflecting a state of the power gated circuit before the low-power period started; (iii) a first portion of the power grid, coupled to the retention circuit and to a first end of a power supply switch, adapted to provide to the retention circuit a supply voltage during the low-power period and during a non-low-power period; wherein the power supply switch is open during the low-power period and is closed during the non-low-power period; and (iv) a second portion of the power grid, coupled to a second end of the power supply switch and to the power gated circuit; adapted to supply a gated supply voltage to the power gated circuit during the non-low-power period.

Abstract: A semiconductor memory device includes a cell core storing data, a plurality of peripheral circuit components, collectively driving data to/from the cell core and providing a default state at an output signal state during an initialization process upon power-up, and an initialization circuit detecting a standby mode of operation for the semiconductor memory device, and upon detecting the standby mode controlling operation of the plurality of peripheral circuit components to provide the default state as the signal state during standby mode.

Abstract: Methods and arrangements to configure power management systems for integrated circuits are provided herein. A group of IC components that are functionally distinct or have mutually exclusive and/or quasi-mutually exclusive, (ME/QME) operating patterns (i.e. alternate or partially overlapping duty cycles) can be powered with a single power cell. An integrated circuit design tool can identified components in an integrated circuit design that have the ME/QME operating patterns. These cells can be collocated in close proximity to each other and power management system components can be placed in this area such that a multiple signal processing cells can share a single power line and a single power cell. Such a configuration can greatly reduce the size of a power management system for an integrated circuit.

Abstract: A method for operating a volatile memory supplied with a supply signal arranged either as a first supply signal of a first supply signal source or a second supply signal of a second supply signal source. If an available first supply signal is present it is used otherwise the second supply signal is used. The supply signal is supplied, based on a switch position of a switching element to the volatile memory. During a detected interrupted first supply signal, the switch position of the switching element is for a predetermined period of time such that the supply signal is supplied to the volatile memory. After expiry of the predetermined period of time, the switch position of the switching element is predetermined such that the volatile memory is decoupled electrically from the supply signal.

Abstract: In an SRAM according to the present invention, an internal power supply voltage for a memory cell is applied to a back gate of each of P-channel MOS transistors included in an equalizer, a write driver, and a column select gate. Therefore, even if an internal power supply voltage for a peripheral circuit is shut off to reduce current consumption during standby, a threshold voltage of each of the P-channel MOS transistors is maintained at a high level, and hence a leakage current is small.

Abstract: The present invention provides a semiconductor memory circuit capable of reducing current consumption at non-operation in a system equipped with a plurality of chips that share the use of a power supply, address signals and a data bus. The semiconductor memory circuit has an internal circuit which is capable of selectively performing the supply and stop of an operating voltage via switch means and includes a memory array. An input circuit, which receives a predetermined control signal therein, controls the supply and stop of the operating voltage by the switch means to reduce a DC current and a leak current when no memory operation is done, whereby low power consumption can be realized.

Abstract: When threshold voltages of constituent transistors are reduced in order to operate an SRAM circuit at a low voltage, there is a problem in that a leakage current of the transistors is increased and, as a result, electric power consumption when the SRAM circuit is not operated while storing data is increased. Therefore, there is provided a technique for reducing the leakage current of MOS transistors in SRAM memory cells MC by controlling a potential of a source line ssl of the driver MOS transistors in the memory cells.

Abstract: A protection circuit, applied to a flash memory including a power supply pin, includes a capacitor and a switch. A power supply provides a reference voltage. The capacitor is electrically connected to the power supply pin and a ground point. The switch is electrically connected between the power supply pin and the power supply. When the reference voltage is higher than a threshold voltage, the switch is turned on, such that the reference voltage is inputted into the power pin via the switch. When the reference voltage is lower than the threshold voltage, the switch is turned off.

Abstract: A semiconductor memory device having a memory cell including a flip-flop; and a memory cell power supply circuit for supplying a low voltage cell power supply voltage to the memory cell. The memory cell power supply circuit supplies a cell power supply voltage in a first period and a different cell power supply voltage in a second period, a predetermined first power supply voltage in case where the cell power supply voltage in supplied in a data read cycle and in a case where data is not written to a memory cell to which the cell power supply voltage is supplied in a write cycle, and a second power supply voltage higher than the first power supply voltage in a case where data is written to a memory cell to which the cell power supply voltage is supplied in a write cycle.

Abstract: Sequential circuitry comprising a data input, a data output, a clock signal input and a clamp signal input is disclosed. The sequential circuitry is arranged to clock a data signal received at said data input into said sequential circuitry in response to a clock signal received at said clock signal input, and to output a data signal from said sequential circuitry at said data output in response to said clock signal. The sequential circuitry is responsive to a predetermined value at said clamp signal input to switch to a low power mode and to set said data output to a forced value, while retaining said sequential state within said circuitry, said forced value being selected to reduce leakage power from combinatorial circuitry arranged to receive said output data signal.

Abstract: A structure and method to reduce leakage of a Static Random Access Memory (SRAM) array, wherein the array is subdivided into a set of sub-arrays, whose supply voltages can be controlled independently using a single voltage regulation circuit dedicated to the entire SRAM array. A switch fabric enables independent switching of individual sub-arrays between a virtual ground level and a system ground level based on whether the sub-array is operating in power saving mode or a high performance mode to reduce leakage current when a sub-array is configured in a power saving mode.

Abstract: An apparatus and method for controlling standby mode in an electronic device. In standby mode, power and clock signals are reduced or stopped to conserve power. The apparatus includes an initiator module coupled to a power and clock control module (PCCM). When the initiator module meets conditions for standby mode, the initiator module sends a standby signal to the PCCM and does not interact with other initiator, target, or interconnect modules. When the PCCM communicates a wait signal, the initiator module enters standby mode. When the initiator module detects a wakeup event, the standby signal is deactivated. In this state, the initiator module may process information but may not interact with other modules. When the PCCM deactivates the wait signal and returns power and clock signal to steady state levels, initiator module may resume normal operation.

Abstract: Embodiments of the invention supply power to DRAM or other memory devices with a multi-phase voltage regulator. A power controller coupled to the multi-phase voltage regulator causes one or more phases of the multi-phase voltage regulator to be activated or deactivated (shed) according to predetermined criteria. Embodiments of the invention thus improve power management by providing one or more reduced power states for the memory devices. Other embodiments are described.

Abstract: The present invention relates to a memory circuit and a method of controlling data retention in the memory circuit, wherein a supply signal is selectively switched to a respective one of at least two virtual supply lines (24) each shared by a respective one of a plurality of groups (30-1 to 30-n) of memory cells (C0,0 to Cy,z). The selective switching is controlled based on a global activity control signal (A), used for setting the memory circuit either into a standby state or into an active state, and a local data retention indication signal (DR1 to DRn) allocated to a dedicated group of memory cells. Thereby, the data retention part of the memory circuit can be adapted to the application and its state, and standby mode leakaged power is only dissipated in those memory cells for which data retentions actually required.

Abstract: A method includes providing power to on-die combinatorial circuitry of an integrated circuit (IC) from an external power supply regulator during an active mode of the IC. A state of the on-die combinatorial circuitry of the IC is moved into on-die storage of the IC. Power to the on-die combinational circuitry is disabled during a low power mode of the IC by disrupting power supplied from the external power supply regulator to the IC. A power feedback signal from an internal portion of the IC is provided to the external power supply regulator.

Abstract: An integrated circuit includes at least one memory array for storing data. A first switch is coupled with the memory array. A first power line is coupled with the first switch. The first power line is operable to supply a first power voltage. A second switch is coupled with the memory array. A second power line is coupled with the second switch. The second power line is operable to supply a second power voltage for retaining the data during a retention mode. A third power line is coupled with the memory array. The third power line is capable of providing a third power voltage.

Abstract: In one embodiment, a hybrid storage device including a persistent memory, a volatile memory, a processor, a memory loader module that enables the processor to load a first set of information from the persistent memory device to the volatile memory device, to organize the first set of information according to a predetermined format, and a storage drive interface controller that enables the processor to receive information access requests from a host computer, to provide a second set of information from the volatile memory device to the host computer, and to provide a metadata descriptive of the first set of information to the host computer is disclosed. A host computer is enabled to access the first set of information using metadata provided by the storage drive interface controller without having the first set of information in a local memory of the host computer.

Abstract: A system, method and apparatus for clock and power fault detection for a memory module is provided. In one embodiment, a system is provided. The system includes a voltage detection circuit and a clock detection circuit. The system further includes a controller coupled to the voltage detection circuit and the clock detection circuit. The system also includes a memory control state machine coupled to the controller. The system includes volatile memory coupled to the memory control state machine. The system further includes a battery and battery regulation circuitry coupled to the controller and the memory control state machine. The battery, battery regulation circuitry, volatile memory, memory control state machine, controller, clock detection circuit and voltage detection circuit are all collectively included in a unitary memory module.

Abstract: A method of operating a semiconductor memory device may include initializing a first internal circuit in response to a first initialization signal based on an internal power voltage. The first initialization signal may be generated if the semiconductor memory device performs a power-up operation. The semiconductor memory device may enter a deep-power-down (DPD) mode without generating the first initialization signal. The first initialization signal may be generated if the semiconductor memory device exits the DPD mode.

Abstract: Embodiments provide methods, apparatuses and systems including a plurality of memory cells configured to store bit values while being powered at a power-saving voltage lower than a normal-operation voltage during operation of a host apparatus, and power circuitry coupled to the plurality of memory cells. The power circuitry is configured to selectively power a first subset of the plurality of memory cells at the normal-operation voltage during operation of the host apparatus while concurrently powering a second subset of the plurality of memory cells at the power-saving voltage. The first and second subsets being different subsets of the memory cells.

Abstract: A power failure protection circuit (10) for a non-volatile semiconductor storage device includes at least an energy storage unit (C1) that serves as a backup power supply for providing backup electrical energy when a power failure occurs. During normal operation of the device, a main control unit (12) is responsible for controlling an external power input to charge the energy storage unit, for dynamically detecting the status of the energy storage unit and for using information about the status to ensure sufficient backup electrical energy for the energy storage unit. During an abnormal operation of the power supply, the main control unit (12) is responsible for discharging the energy storage unit.

Abstract: A memory module comprises a plurality of main memories; a buffer RAM configured to temporarily store data being provided to or read from the main memories and to perform a buffer function between an external device and the main memories; and a NAND flash memory configured to store data of the buffer RAM during an interruption of power being supplied to the buffer RAM.

Abstract: A power gating circuit of a memory device includes a power gating unit and a control unit. The power gating unit includes first, second, and third power gating transistors connected in parallel between a power supply voltage and an internal power supply voltage bus of the memory device. The three power gating transistors are sequentially turned ON. The second and third power gating transistors turn ON sequentially in response to the increasing voltage level of the bus. The timing points when the second and third power gating transistors are sequentially turned ON is based upon detecting the gradually increasing the voltage level of the internal power supply voltage. The size of the first power gating transistor may be smaller than the size of the second power gating transistor, and the size of the second power gating transistor may be smaller than the size of the third power gating transistor.

Abstract: The present invention provides a solution to avoid the robustness problems of sub-threshold circuits by switching small parts of circuits to nominal-voltage only when they are being used, and switching them back to sub-threshold levels when the operation finishes. Such “hybrid sub-threshold” approach is capable of supporting ultra-low power operation without the disadvantages of sub-threshold circuits.

Abstract: A method and apparatus is provided to enhance the power-up sequence for integrated circuits (ICs) that contain memory cells having single-ended data inputs with no local reset function. During a power-up sequence, the logic levels that are applied to the data, address, and power inputs of the memory cell are restricted to particular magnitudes by a power-on reset (POR) state machine. First, the data input of the memory cell is held to a logic low value while an address signal of the memory cell is allowed to be asserted to a logic high value in conjunction with activating a power supply that provides operational power to the IC. Next, the address input to the memory cell ramps up to full logic high value, while the regulated power supply to the memory cell array is held low. The regulated power supply then ramps up to an operational level to bias the memory cell into a known logic state.

Abstract: A system, method and apparatus for clock and power fault detection for a memory module is provided. In one embodiment, a system is provided. The system includes a voltage detection circuit and a clock detection circuit. The system further includes a controller coupled to the voltage detection circuit and the clock detection circuit. The system also includes a memory control state machine coupled to the controller. The system includes volatile memory coupled to the memory control state machine. The system further includes a battery and battery regulation circuitry coupled to the controller and the memory control state machine. The battery, battery regulation circuitry, volatile memory, memory control state machine, controller, clock detection circuit and voltage detection circuit are all collectively included in a unitary memory module.

Abstract: A memory device for use with a primary power source includes: volatile memory including a plurality of memory portions each of which has a normal operating state and a low-power state; an interface for connecting to a backup power source arranged to temporarily power the volatile memory upon a loss of power from the primary power source; a non-volatile memory; and a controller in communication with the volatile memory and the non-volatile memory programmed to detect a loss of power of the primary power source and in response to move data from the volatile memory to the non-volatile memory at least one memory portion at a time, and while moving data from the volatile memory to the non-volatile memory place the memory portions from which data is being moved into a normal operating state and the memory portions from which data is not being moved into a low-power state.

Abstract: A device includes: non-volatile memory; a controller in communication with the non-volatile memory, wherein the controller is programmed to move data from a volatile memory to the non-volatile memory upon a loss of power of a primary power source of the volatile memory; and a backup power supply providing temporary power to the controller and the volatile memory upon the loss of power of the primary power source, including: a capacitor bank with an output terminal; a connection to a voltage source that charges the capacitor bank to a normal operating voltage; and a state-of-health monitor that is programmed to generate a failure signal based on a voltage at the output terminal of the capacitor bank.

Abstract: A first signal input circuit outputs a first control signal in response to self-refresh and active signals. A second signal input circuit outputs a second control signal in response to the self-refresh and active signals. The power supply circuit applies a first supply voltage to an output terminal in response to the first control signal. An elevated voltage generator generates a elevated voltage by pumping a second supply voltage, and applies the elevated voltage to the output terminal, in response to the first and second control signals.

Abstract: A semiconductor memory device is capable of maintaining a predetermined back-bias voltage level regardless of operation modes of the semiconductor memory device, by generating a back-bias voltage with driving force changed according to the operation modes. The semiconductor memory device includes an active pumping control signal generating unit for generating an active pumping control signal in response to a plurality of active signals, a voltage detecting unit for detecting a voltage level of a back-bias voltage terminal to output a detection signal, an oscillator for generating an oscillation signal oscillating at a predetermined frequency in response to the detection signal, and a charge pumping unit for performing a charge pumping operation in response to the oscillation signal by controlling a force of driving the back-bias voltage terminal in response to the active pumping control signal.

Abstract: An integrated device comprising a storage location, wherein data stored in the storage location is repeatedly refreshed with a first predetermined refresh rate during a first period of time. The first period of time provides a first predetermined duration. After the end of the first period of time, the data is repeatedly refreshed with a second predetermined refresh rate.

Abstract: A first precharge circuit couples a bit line pair to a precharge voltage line in a standby period, and separates at least an access side of the bit line pair from the precharge voltage line in accordance with operation start of a word line driving circuit. A sense amplifier amplifies a voltage difference of a node pair after the operation start of the word line driving circuit. A switch circuit is provided between the bit line pair and the node pair. The switch circuit has coupled the access side of the bit line pair to an access side of the node pair at an instant of the operation start of the word line driving circuit, and has separated a non-access side of the bit line pair from a non-access side of the node pair at an instant of operation start of the sense amplifier.

Abstract: A static random access memory comprising a column driver, a row driver, a cell, and a control unit is disclosed. The column driver selects a first word line or a second word line. The row provides data to a first bit line and a second bit line. The data of the first bit line is opposite to that of the second bit line. The control unit controls the voltage of the cell. In normal mode, the voltage of the cell is equal to a second voltage. In stand-by mode, the voltage of the cell exceeds the second voltage.

Abstract: Disclosed herein are memory devices comprising a plurality of memory cells to which a standby voltage is to be supplied during standby mode to avoid loss of data, and methods of operating said memory devices, the methods comprising: (a) determining an actual value of a bit integrity parameter of the memory cells; (b) comparing said actual value with a predetermined minimal value of the bit integrity parameter which takes into account possible variations in cell properties as a result of process variations; and (c) adjusting the standby voltage towards a more optimal value based on the result of the comparison in such a way that said bit integrity parameter determined for said more optimal value of the standby voltage approaches the predetermined minimal value. The circuitry for measuring the bit integrity parameter preferably comprises a plurality of replica test cells which are added to the memory matrix.

Abstract: Techniques for reducing gate induced drain leakage (GIDL) in memory devices utilizing negative wordline architectures. More specifically, a method and apparatus are provided to determine whether any of the word lines in a section of a memory array are active. If any one of the plurality of word lines is active, each of the inactive word lines in the section are coupled to a negative voltage level. If none of the plurality of word lines is active, each of the plurality of word lines is coupled to ground to reduce GIDL.

Abstract: A semiconductor memory device includes a first refresh cycle changing circuit that changes a refresh cycle according to an auto-refresh mode, without giving influence to a refresh cycle according to a self-refresh mode, and a second refresh cycle changing circuit that changes a refresh cycle according to the self-refresh mode, without giving influence to a refresh cycle according to the auto-refresh mode. In this way, according to the present invention, the refresh cycle according to the auto-refresh mode and the refresh cycle according to the self-refresh mode can be controlled independently. Therefore, refresh operation considering the characteristic of each mode can be executed.

Abstract: A method for operating an SRAM cell comprises, during a read operation, forward biasing an N-well of a first and second pull-up transistor, and forward biasing a P-well of a first and second pull-down transistor and a first and second access transistor. The method further comprises, during a write operation, zero or reverse biasing an N-well of a first and second pull-up transistor, and forward biasing a P-well of a first and second pull-down transistor and a first and second access transistor. The method further comprises, during an idle state, zero biasing an N-well of a first and second pull-up transistor and zero biasing a P-well of a first and second pull-down transistor and a first and second access transistor. In addition, one or more rows or columns of memory cells may receive a bias voltage.