Abstract: A circuit and method efficiently powers a static storage element during a low voltage mode of operation. The static storage element is powered at a first voltage level in an active mode of the static storage element. The static storage element is powered in a low power mode using alternating first and second phases. Powering the static storage element during the first phases in the low power mode includes powering the static storage element at or below a second voltage level, wherein powering the static storage element during the second phases in the low power mode includes powering the static storage element at a higher voltage level than the second voltage level. In another form two modes of low power operation are used where a first mode uses a less power efficient operation than the second mode, but both are more power efficient than a normal power mode.

Abstract: A method and apparatus implementing domino static random access memory (SRAM) leakage current reduction include a local evaluation circuit coupled to true and complement bit lines of a pair of local SRAM cell groups, receives precharge signals and provides an output connected to a global dot line. A sleep input is applied to SRAM sleep logic and a write driver including sleep control. Data true and data complement outputs of the write driver are forced to a respective selected level to discharge the bit lines and global dot lines when the sleep input transitions high. Discharging the bit lines and global dot lines is implemented through gating in the write driver without requiring any additional devices in the local evaluation circuit.

Abstract: The present disclosure includes various method, device, and system embodiments for multilevel driving of rowlines and/or wordlines. One such method embodiment includes supplying a first power voltage (V1) and a second power voltage (V2) that is greater than V1, to the driver circuit. The method includes supplying a first boost voltage (V3), V3 being greater than V2, and a reference voltage (Vref) that is less than V1, to the driver circuit. The method includes coupling a level shifter to the driver circuit, the level shifter including a number of input signals configured to control a drive output of the driver circuit in order to switch the drive output successively from a voltage at or below Vref to at least one of V1, V2, and Vref prior to switching the driving output to V3.

Abstract: Leakage current from a circuit for handling data is reduced using leakage control circuit operable in a leakage reduction mode. The data handling circuit comprises data handling logic operable to receive an input data value and to output and output data value. The data handling circuit also comprises a latch operable to latch the output data value in response to a clock signal having a clock period. Both the leakage control circuitry and the latch are controlled dependent upon the same clock signal and the leakage control circuitry is controlled such that it is in a leakage reduction mode for a time less than the clock period. This approach enables leakage reduction to be provided in circuits which are still operational and is particularly suited to data handling circuits that employ frequency scaling.

Abstract: Each memory cell has a pair of inverters whose inputs and outputs are connected to each other and holds complementary data respectively in storage nodes which are outputs of the inverters. In a write operation during which the complementary data are written to the storage nodes respectively, the power control circuit sets a power supply voltage of the inverter having the storage node to which low level is written lower than a power supply voltage of the inverter having the storage node to which high level is written. Since power supply capability to the inverter having the storage node to which the low level is written lowers, the voltage of the storage node easily changes to the low level. That is, a write margin of a memory cell can be improved.

Abstract: Provided is a high voltage generator for a flash memory device including a voltage pumping unit configured to generate a high voltage in response to a pumping clock signal, a transistor having a gate coupled to the high voltage and a source coupled to a program voltage, a voltage distributor coupled to the drain of the transistor, the voltage distributor configured to generate a distributor voltage, and a pumping clock controller configured to compare the distributor voltage to a reference voltage and to generate the pumping clock signal when the high voltage is less than a voltage substantially equal to the program voltage plus the threshold voltage of the transistor.

Abstract: The present invention relates to a memory circuit and a method of controlling data retention in the memory circuit, wherein a supply signal is selectively switched to a respective one of at least two virtual supply lines (24) each shared by a respective one of a plurality of groups (30-1 to 30-n) of memory cells (C0,0 to Cy,z). The selective switching is controlled based on a global activity control signal (A), used for setting the memory circuit either into a standby state or into an active state, and a local data retention indication signal (DR1 to DRn) allocated to a dedicated group of memory cells. Thereby, the data retention part of the memory circuit can be adapted to the application and its state, and standby mode leakaged power is only dissipated in those memory cells for which data retentions actually required.

Abstract: P-type multi gate field effect transistor access devices are adapted to be coupled to a memory cell to provide access to the memory cell. A method is described that uses a power switch to switch off address decoding circuitry allowing word lines to float toward a high supply voltage, turning off the p-type multi gate field effect transistor access devices.

Abstract: One embodiment of the present invention provides a system that facilitates changing a clock frequency in a memory system. During operation, the system receives a command to change the clock frequency to a new clock frequency. The system then iteratively changes the clock frequency to the new clock frequency. More specifically, the system starts an iteration by slewing the clock frequency toward the new clock frequency by an increment to reach an intermediate frequency without interfering with normal memory-system operation. Next, the system signals a memory controller to pause normal memory system operation by completing or cancelling all in-flight or outstanding memory system operations and not accepting additional memory operation requests.

Abstract: Integrated circuits are provided that have memory elements. The memory elements produce output signals. The integrated circuits may be programmable logic device integrated circuits containing programmable logic including transistors with gates. When loaded with configuration data, the memory elements produce output signals that are applied to the gates of the transistors in the programmable logic device to customize the programmable logic. To ensure that the transistors in the programmable logic are turned on properly, the memory elements are powered with an elevated power supply level during normal device operation. During data loading operations, the power supply level for the memory elements is reduced. Reducing the memory element power supply level during loading increases the write margin for the memory elements.

Abstract: There is provided a semiconductor device supplied with internal power generated by an internal power generation circuit to perform a stable operation and, also, suppress power consumption. A control circuit, a row/column decoder and a sense amplifier are driven by an internal buck voltage. On the other hand, a data path with high power consumption is driven by an external power supply voltage. A level conversion circuit receives an address signal or a command signal having a voltage level of the external power supply voltage, converts the voltage level to the internal buck voltage, and outputs a resultant signal to the control circuit. A level conversion circuit receives a control signal having a voltage level of the internal buck voltage from the control circuit, converts the voltage level to the external power supply voltage, and outputs a resultant signal to the data path.

Abstract: Circuitry gates the power supply to limit standby power in an integrated circuit. The IR drop through clamps may be compensated using a regulator feedback signal to improve the power performance and allow the power supply regulator to supply the best quality power signals possible.

Abstract: The present invention provides a semiconductor integrated circuit device which includes at least an SRAM memory cell array comprising a plurality of memory cells each constituted of a circuit including load MOS transistors, drive MOS transistors and transfer MOS transistors, a substrate bias generating circuit which is electrically connected to the load MOS transistors and supplies a substrate potential to the load MOS transistors during at least operation and standby, and a source bias generating circuit which is electrically connected to the drive MOS transistors and supplies a source potential to the drive MOS transistors at standby. It is possible to reduce a leak current in an SRAM memory cell during both operation and standby and reduce current consumption.

Abstract: A circuit includes a memory cell having a high voltage supply node and a low voltage supply node. Power multiplexing circuitry is provided to selectively apply one of a first set of voltages and a second set of voltages to the high and low voltage supply nodes of the cell in dependence upon a current operational mode of the cell. If the cell is in active read or write mode, then the multiplexing circuitry selectively applies the first set of voltages to the high and low voltage supply nodes. Conversely, if the cell is in standby no-read or no-write mode, then the multiplexing circuitry selectively applies the second set of voltages to the high and low voltage supply nodes. The second set of voltages are offset from the first set of voltages. More particularly, a low voltage in the second set of voltages is higher than a low voltage in the first set of voltages, and wherein a high voltage in the second set of voltages is less than a high voltage in the first set of voltages.

Abstract: Provided is a semiconductor memory device including an internal power supply with low current consumption, which includes: an active interval security block for generating active interval security signals with operation intervals by a row active signal and a column active signal; an active driving signal generating block for generating an active driving signal, responsive to the active interval security signals; a standby driving block for holding the level of an internal voltage; and an active driving block, which is additionally driven based on the active driving signal to hold the internal voltage.

Abstract: An internal voltage generator maintains stable level of an internal voltage without increasing physical area. The internal voltage generator includes an active level detector for detecting a level of an internal voltage by comparing the level of the internal voltage and a level of a reference voltage to thereby output a first active driving signal, a first active driver for providing the internal voltage in response to the first active driving signal, a driving time controller for generating a time driving signal activated for a predetermined time, an active driving controller for activating a second active driving signal while the time driving signal is activated and for outputting the first active driving signal as the second active driving signal while the time driving signal is inactivated, and a second active driver for providing the internal voltage in response to the second active driving signal.

Abstract: A wake-up circuit of a memory device employs a cascade chain structure in which bit lines are divided into a plurality of blocks, and if the bit lines of one of the blocks are determined to have undergone a wake-up operation based on a bit line voltage fed back in the block, the wake-up operation is performed on a subsequent block. Accordingly, a wake-up delay can be varied, and therefore peak currents can be controlled, thereby reducing overall system power noise.

Abstract: A synchronous DRAM is provided which includes arrangements for operations of power supply circuitry based upon whether the DRAM is in a power down mode or not. In one embodiment, a first power supply circuit and a second power supply circuit are provided which both receive externally supplied voltages and output internal supply voltages. The first power supply circuit is not in operation when a semiconductor device of the synchronous DRAM is in a power down mode. However, the second power supply circuit is continuously in operation during the power down mode. In another arrangement, the operation of a voltage limiter circuit is controlled based on whether or not the DRAM is in a power down mode.

Abstract: Methods and arrangements to configure power management systems for integrated circuits are provided herein. A group of IC components that are functionally distinct or have mutually exclusive and/or quasi-mutually exclusive, (ME/QME) operating patterns (i.e. alternate or partially overlapping duty cycles) can be powered with a single power cell. An integrated circuit design tool can identified components in an integrated circuit design that have the ME/QME operating patterns. These cells can be collocated in close proximity to each other and power management system components can be placed in this area such that a multiple signal processing cells can share a single power line and a single power cell. Such a configuration can greatly reduce the size of a power management system for an integrated circuit.

Abstract: A memory voltage generating circuit includes a first control module, a core circuit, and a second control module. The core circuit includes a regulation amplifier, a first MOSFET, a second MOSFET, and a switch. An output terminal and an inverting input terminal of the regulation amplifier are both connected to an output terminal of the core circuit. A non-inverting input terminal of the regulation amplifier is coupled to the second control module. The non-inverting input terminal of the regulation amplifier is also connected to a referenced voltage via one resistor and is grounded via another resistor. A source of the first MOSFET is coupled to the inverting input terminal of the regulation amplifier. A gate of the first MOSFET is connected to the output terminal of the regulation amplifier. Drains of the first MOSFET and the second MOSFET are coupled to an input voltage via the switch. A source of the second MOSFET is connected to another input voltage.

Abstract: The invention is directed to a system and method comprising a first semiconductor device and a second semiconductor device, wherein the first semiconductor device comprises a voltage supply means, characterized in that the voltage supply means of the first semiconductor device is connected to the second semiconductor device, so that the voltage supply means of the first semiconductor device can provide a supply voltage for the second semiconductor device.

Abstract: A semiconductor integrated circuit has a sense amplifier which senses and outputs data read out from memory cells connected to word lines and bit lines, and a read-out control circuit which has a standby state consuming minimum necessary power and a read state reading out the memory cells, and controls read-out of the memory cells, wherein the read-out control circuit includes, a bit line switching circuit which switches whether or not to transmit a potential on the bit line to an input terminal of the sense amplifier, and a first switching control circuit which controls the bit line switching circuit to prevent the potential on the bit line from being transmitted to the input terminal of the sense amplifier during a period of the standby state and a predetermined period after the standby state is released.

Abstract: Embodiments of the invention provide a standby leakage current reduction circuit and a semiconductor memory device comprising the standby leakage current reduction circuit. The invention provides a circuit adapted to reduce standby leakage current in a semiconductor memory device comprising memory cells. The circuit comprises a bias signal generator adapted to generate a bias signal, wherein a voltage level of the bias signal is set in accordance with a result of a standby leakage current test. The circuit further comprises a ground voltage controller adapted to receive the bias signal from the bias signal generator and to control a level of a voltage apparent on a virtual ground terminal in response to the bias signal while the semiconductor memory device is in a standby mode.

Abstract: Embodiments of the invention generally provide a method and wordline driver having a reduced leakage current. In one embodiment, a wordline is driven to a boosted high voltage with a driver transistor of the wordline driver if the wordline driver is in an operational mode and the wordline is driven to a downward-driven low voltage if the wordline driver is in a standby mode. The driver transistor is electrically isolated from the downward-driven low voltage of the wordline when the wordline driver is in the standby mode. A leakage current in the wordline driver is thereby reduced.

Abstract: A SRAM device includes at least one memory cell having a source line for receiving an internal supply power, and a voltage management circuit coupled to the source line for generating the internal supply power that varies in at least two different voltage levels, depending on various operation modes of the memory cell.

Abstract: A semiconductor integrated circuit in which a semiconductor chip 4 having a semiconductor memory and a mother chip 2 having logic circuit are mounted in a single package, wherein the leak current of the semiconductor chip 4 is reduced in standby state. A switch cell 20 that connects to the power pad 10 of the semiconductor chip 4 and that supplies power voltage from the exterior to the semiconductor chip 4 is provided to the mother chip 2. The switch cell 20 cuts off the connection between the power pad 10 of the semiconductor chip 4 and the power voltage line of the semiconductor memory of the mother chip 2 by using a control signal from a control circuit when the semiconductor memory is in standby mode. Leak current generated in the semiconductor memory can thereby be reduced.

Abstract: An internal voltage generator maintains stable level of an internal voltage without increasing physical area. The internal voltage generator includes an active level detector for detecting a level of an internal voltage by comparing the level of the internal voltage and a level of a reference voltage to thereby output a first active driving signal, a first active driver for providing the internal voltage in response to the first active driving signal, a driving time controller for generating a time driving signal activated for a predetermined time, an active driving controller for activating a second active driving signal while the time driving signal is activated and for outputting the first active driving signal as the second active driving signal while the time driving signal is inactivated, and a second active driver for providing the internal voltage in response to the second active driving signal.

Abstract: An apparatus is to reduce, during the standby time, the electric power caused by the leakage current flowing through a storage transistor in a 3-transistor dynamic cell. Source electrodes of storage transistors in a plurality of 3-transistor dynamic cells constituting a memory array are connected, and a switch is provided between the source electrode and a power supply terminal. The leakage current during the standby time is interrupted by bringing the switch into a conducting state during the active time, and by bringing the switch into a nonconducting state during the standby time.

Abstract: A method and apparatus of dynamically storing critical data of a gaming machine by allocating and deallocating memory space in a gaming machine is disclosed. One or more embodiments describe downloading or removing a new game to a gaming machine such that all existing critical data in NV-RAM memory is left intact. In one embodiment, the invention discloses a method and apparatus for dynamically allocating and deallocating memory space to accommodate either permanent or temporary storage in an NV-RAM. A method and apparatus is provided to monitor available memory space and dynamically resize the memory in NV-RAM. In one embodiment, a method is disclosed for performing an integrity check of the NV-RAM and determining whether a critical data error has occurred. In one or more embodiments, methods of compacting and shifting contents of an NV-RAM are described to consolidate available memory space or to prevent unauthorized access of NV-RAM memory.

Abstract: When it is detected that the voltage of a main power supply is reduced below a predetermined value during a normal operation, a power controller switches a power supply for a DRAM from the main power supply to a battery power supply and makes an instruction signal for instruction a self-refresh mode to a memory controller active. In response to this, the memory controller changes a clock enable signal for the DRAM to a low level to establish the self-refresh mode of the DRAM, and, after, the self-refresh mode of the DRAM is established, supplying of power to the memory controller is stopped. The clock enable signal for the DRAM is maintained to the low level by pull-down resistance even when the supplying of power to the memory controller is stopped from a condition that the signal is changed to the low level in the self-refresh mode, thereby maintaining the self-refresh mode of the DRAM.

Abstract: The object of the present invention is to provide a composite storage circuit capable of executing a writing operation and reading operation at high speed, and as the result of that, a semiconductor apparatus capable of realizing an instant-on function and an instant-off function is provided. The composite storage circuit is constituted of a volatile storage circuit and a non-volatile storage circuit connected in parallel, and the same information as storage information in the volatile storage circuit is stored in the non-volatile storage circuit. Moreover, as a power supply to the volatile storage circuit decreases, storage information in the volatile storage circuit is written in the non-volatile storage circuit. Further, after a power failure or a decreased power supply, storage information from the non-volatile storage circuit is returned to the volatile storage circuit upon restarting power feeding. Further, a semiconductor apparatus is constituted by having the composite storage circuit described above.

Abstract: A leakage current of the MOS transistor of a power control section at a standby time is drastically reduced and the reduction of the consumption power is achieved. A memory module is provided with power control sections. When either of the memory mats is not selected, the power control sections stop the power supply voltage to a non-selected memory mat, a word driver, an input-output circuit, a control circuit and an output circuit. At the standby time of the memory module, the power control section stops a power supply to power control sections, a control circuit, a predecoder circuit, and an input circuit. In this manner, the leakage current of the MOS transistor of the power control sections at the standby time can be drastically reduced.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, a source terminal which supplies a source potential to the memory cells, a first switching element which electrically connects the source terminal and a first power supply potential in an operation mode of the memory cells, and electrically disconnects the source terminal and the first power supply potential in a standby mode of the memory cells, a clamp MIS transistor which is series-connected between the source terminal and the first power supply potential, and clamps the source potential in the standby mode, a bias generation circuit which supplies a first bias potential to a gate terminal of the clamp MIS transistor, and a switching circuit which switches a potential of a back gate terminal of the clamp MIS transistor between a test mode and a non-test mode.

Abstract: After a refresh operation, a word control circuit holds the selection state of a word line selection signal line selected in each memory block corresponding to a refresh address. Further, in response to an access request, the word control circuit unselects only a word line selection signal line of a memory block selected by an external address corresponding to this access request. In each memory block, the word line selection signal line once selected is not unselected until the access request is received, so that the frequency of unselection and selection of the word line selection signal lines can be lowered. Consequently, a charge/discharge current of the word line selection signal lines can be reduced, which can reduce current consumption of a semiconductor memory.

Abstract: A voltage supply circuit for providing an internal supply voltage in an integrated circuit is provided. The voltage supply circuit comprises a supply source for setting the internal supply voltage on a supply voltage line and a control circuit which is connected to the supply source for switching on and off the supply source. The control circuit can itself be switched off and regularly switched on again, wherein the control circuit includes a control unit in order to switch the supply source on and off in such a way that the internal supply voltage on the supply voltage line differs essentially by no more than a limit value as a result of capacitive charge storage.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are provided. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A data storage circuit and a data preservation method for preserving data when a semiconductor device is in a sleep mode using a test scan chain are provided, where the data storage circuit includes a sleep mode control unit and a scan chain unit, the sleep mode control unit outputs a scan control signal and a scan clock signal in response to one of a test control signal and a sleep mode control signal received from the outside, stores an output data signal in a memory when the output data signal is received, and outputs a test pattern data signal as a scan data signal when the test pattern data signal is received, the scan chain unit outputs a normal data signal stored inside of the scan chain unit as the output data signal to the sleep mode control unit or receives and outputs the scan data signal to a combinational circuit unit in response to the scan control signal and the scan clock signal, and the data storage circuit and the data preservation method prevent a loss of data in a sleep mode of a semicondu

Abstract: A programmable logic device (PLD) such as a field programmable gate array (FPGA) has a power-down mode of operation that reduces power consumption during standby or idle periods for the PLD. In one embodiment of the invention, the PLD includes an internal power supply operable to provide power to PLD's programmable logic blocks. The internal power supply powers down the programmable logic blocks in response to the assertion of a power-down signal.

Abstract: A method and apparatus of dynamically storing critical data of a gaming machine by allocating and deallocating memory space in a gaming machine is disclosed. One or more embodiments describe downloading or removing a new game to a gaming machine such that all existing critical data in NV-RAM memory is left intact. In one embodiment, the invention discloses a method and apparatus for dynamically allocating and deallocating memory space to accommodate either permanent or temporary storage in an NV-RAM. A method and apparatus is provided to monitor available memory space and dynamically resize the memory in NV-RAM. In one embodiment, a method is disclosed for performing an integrity check of the NV-RAM and determining whether a critical data error has occurred. In one or more embodiments, methods of compacting and shifting contents of an NV-RAM are described to consolidate available memory space or to prevent unauthorized access of NV-RAM memory.

Abstract: A backup circuit that can be fabricated by the standard CMOS process and has a small circuit scale. The backup circuit (10) is disposed between a digital circuit (20) including a storage circuit and a power supply terminal (TIN, TGND) for supplying power to the digital circuit. MOS transistors (MOS1, MOS2) connected in series are disposed between the power supply terminal (TIN, TGND) and a backup capacitor (C1). The MOS transistors (MOS1, MOS2) serve as resistors when the power is normally supplied to the power supply terminal, and as diodes each operating with its backward direction defined as the direction from the digital circuit toward the power supply terminal when the power is cut off.

Abstract: A logic device operates with reduced leakage current. Controllability is achieved by using a reference voltage to control the amount of leakage reduction. A method of temperature dependent reference voltage generation is given which maintains virtual supply in acceptable range to provide sufficient noise margin in logic devices including memory cells.

Abstract: A power-gating system and method for integrated circuit devices wherein the minimization of “Standby” or “Sleep Mode” current is a design factor and wherein an output stage is coupled directly between a supply voltage level (VCC) and a reference voltage level (VSS). In a representative complementary metal oxide semiconductor (CMOS) implementation, the gate of the N-channel output transistor in the final inverter stage may be driven below VSS in Sleep Mode while, alternatively, the corresponding P-channel transistor can be driven above VCC. In Active Mode, the switching speed of the output stage is not impacted, and the preceding stage can be made smaller than that of the output stage.

Abstract: A system, method and apparatus for clock and power fault detection for a memory module is provided. In one embodiment, a system is provided. The system includes a voltage detection circuit and a clock detection circuit. The system further includes a controller coupled to the voltage detection circuit and the clock detection circuit. The system also includes a memory control state machine coupled to the controller. The system includes volatile memory coupled to the memory control state machine. The system further includes a battery and battery regulation circuitry coupled to the controller and the memory control state machine. The battery, battery regulation circuitry, volatile memory, memory control state machine, controller, clock detection circuit and voltage detection circuit are all collectively included in a unitary memory module.

Abstract: There is provided a bulk bias voltage VBB level detector in a semiconductor memory device capable of improving tWR fail generated at a low temperature by compensating a temperature variance. The VBB level detector includes A bulk bias voltage level detector in a semiconductor memory device, comprising: a voltage divider for generating detection voltage based on an inputted bulk voltage; and a CMOS circuit for generating a output signal having predetermined logic value determined by the detection voltage wherein the voltage divider includes a first transistor having a gate coupled to a ground voltage and a second transistor having a gate coupled to an internal power voltage and a bulk coupled to the inputted bulk voltage.

Abstract: A synchronous non-volatile memory device that includes a circuit for performing operations on the memory device, a circuit for receiving a request of operation and operative information required for performing the operation in temporal succession, an activation circuit for activating the circuit in response to the request of operation, a circuit for enabling the execution of the operation in response to the operative information, and a deactivation circuit for deactivating the operations performing circuit in response to the completion of the operation.

Abstract: A method and system for operating a DRAM device in either a high power, full density mode or a low power, half density mode. In the full density mode, each data bit is stored in a single memory cell, and, in the half density mode, each data bit is stored in two memory cells that are refreshed at the same time to permit a relatively slow refresh rate. When transitioning from the full density mode to the half density mode, data are copied from each row of memory cells storing data to an adjacent row of memory cells. The adjacent row of memory cells are made free to store data from an adjacent row by remapping the most significant bit of the row address to the least significant bit of the row address, and then remapping all of the remaining bits of the row address to the next highest order bit.

Abstract: A semiconductor memory device includes a memory cell array provided in a cell array area and including a plurality of memory cells, a source potential line which applies a source potential to the memory cells, a switching element group provided in the cell array area adjacent to the memory cell array, the switching element group electrically connecting the source potential line to a ground potential line, when the memory cells are in an operation mode, a first P-type MIS transistor connected between the source potential line and the ground potential line, and fixing the source potential when the memory cells are in the sleep mode, and a bias generation circuit provided in a peripheral circuit area, and supplying a first bias potential to the first MIS transistor, the first MIS transistor being provided in the peripheral circuit area.

Abstract: A semiconductor integrated circuit device and method for reducing gate induced leakage current associated with circuits of the semiconductor electrical device, such as a semiconductor integrated circuit memory device. During a standby mode, a voltage supplied to a plurality of circuits is reduced so as to reduce gate induced leakage (GIDL) current associated with said plurality of circuits. During time intervals while in the standby mode, the voltage supplied to a subset of said plurality of circuits is increased to a level necessary for a refresh function associated with said subset of said plurality of circuits and then it is reduced upon completion of said refresh function. In the example a semiconductor memory device, the circuits that are manipulated in this manner are wordline driver circuits.

Abstract: A programmable power-failure-detection circuit in an integrated circuit is provided that permits programmable selection of operating modes that either monitor a power supply of the integrated circuit or provide reduced power consumption from the power supply by disabling the monitoring of the power supply. The programmable power-failure-detection circuit includes at least one configurable memory cell, a monitor circuit, and a switch circuit disposed on the integrated circuit. The monitor circuit is adapted to monitor the power supply of the integrated circuit and generate a power failure signal in response to the power supply failing to comply with a prescribed operating specification. The switch circuit is coupled to the at least one configurable memory cell and the monitor circuit. The switch circuit is adapted to disable the monitor circuit in response to the at least one configurable memory cell.

Abstract: Embodiments of the invention provide techniques for reducing standby power consumption due to leakage currents in memory circuits. In some embodiments, systems are provided with one or more processors having) bit cells coupled to a word-line node and to a virtual ground node. The word-line node is to be at an active word-line voltage when the row is active and an inactive word-line voltage when the row is inactive. The virtual ground node is to be at an operational ground voltage when the memory array is enabled and at an elevated voltage when the memory array is in a standby mode. There is also a word-line driver circuit coupled to the bit cells through the word-line and virtual ground nodes. The current leakage in the bit cells and word-line driver circuit is reduced during the standby mode when the virtual ground node is at the elevated voltage.