Abstract: Disposable, pre-sterilized, and pre-calibrated, pre-validated conductivity sensors are provided. These sensors are designed to store sensor-specific information, such as calibration and production information, in a non-volatile memory chip on the sensor on in a barcode printed on the sensor. The sensors are calibrated using 0.100 molar potassium chloride (KCl) solutions at 25 degrees Celsius. These sensors may be utilize with in-line systems, closed fluid circuits, bioprocessing systems, or systems which require an aseptic environment while avoiding or reducing cleaning procedures and quality assurance variances.

Abstract: A monitoring circuit for an integrated circuit comprises a non-temperature-inverted circuit and a temperature-inverted circuit. Operating parameters of the two circuits are measured, representing the propagation speed of signals in the respective circuits. In response to a change in temperature, the non-temperature-inverted circuit slows down and the temperature-inverted circuit speeds up. In contrast, in response to a change in operating voltage both circuits either speed up or slow down. This divergence in response to temperature and similar response to voltage enables the monitoring circuit to distinguish between changes in operating voltage and changes in operating temperature.

Abstract: An automatic and continuous method is presented to improve the accuracy of fiber optic distributed temperature measurements derived from Raman back scatterings utilizing two light sources with different wavelengths, by choosing the wavelengths of the two sources so the primary source's return anti-Stokes component overlaps with the incident wavelength of the secondary light source thereby canceling out the non-identical attenuations generated by the wavelength differences between Stokes and anti-Stokes bands.

Abstract: This document provides methods and materials for calibrating a caloric assay. For example, caloric calibration devices and methods for using caloric calibration devices to calibrate a caloric test are provided.

Abstract: A method for calibrating a transmitter with measurement circuitry electrically connected to first and second input terminals includes connecting a primary temperature sensor to the first input terminal and connecting a calibrated reference device to the second input terminal. The measurement circuitry is calibrated with respect to the first input terminal according to signals received from the second input terminal while measuring temperature according to signals received from the first input terminal.

Abstract: A thermocouple welding test apparatus for testing whether a thermocouple is normally welded includes a first comparison circuit, a second comparison circuit, a switch circuit and an indication circuit. The first comparison circuit receives a first DC voltage from the thermocouple, and compares the first DC voltage with a first reference voltage to output a first control signal. The second comparison circuit receives a second DC voltage from the thermocouple, and compares the second DC voltage with a second reference voltage to output a second control signal. The switch circuit receives the first control signal and the second control signal, and outputs an indication signal accordingly. The indication circuit receives the indication signal, and indicates whether the thermocouple is normally welded accordingly.

Abstract: A method of estimating the output light flux of a light emitting diode, comprises applying a drive current waveform to the LED over a period of time comprising a testing period. The forward voltage across the LED is monitored during the testing period, and the output light flux is estimated as a function of changes in the forward voltage.

Abstract: The present invention relates to methods and systems that result in high quality, reproducible, thermal melt analysis on a microfluidic platform. The present invention relates to methods and systems using thermal systems including heat spreading devices, including interconnection methods and materials developed to connect heat spreaders to microfluidic devices. The present invention also relates to methods and systems for controlling, measuring, and calibrating the thermal systems of the present invention.

Abstract: A system and method are disclosed for controlling a drywell including a receiver having upper and lower ends with the lower end being more insulated than the upper end having a temperature sensor in thermal contact therewith. Upper and lower heating elements are in thermal contact with the upper and lower ends, respectively. A controller includes an integrated circuit having a temperature sensor. A reading from the integrated circuit is used to control power to the upper heating element and reduce a temperature gradient between the upper and lower ends of the receiver.

Abstract: A testing device for testing thermal detectors includes a hollow sleeve, open on at least one end, configured to receive a thermal detector. The hollow sleeve can have a length greater than a diameter. A heater is positioned is in proximity to the hollow sleeve, and is configured to provide heat for testing the thermal detector. The heater can be a flexible foil heater. A power source is provided to supply power to the heater. A power control module can be provided for variably adjusting a set point temperature or a rate of temperature rise for the heater.

Abstract: A method for calibrating a temperature sensor comprises: receiving first and second reference voltages from respective first and second tap points within a string of sequentially connected resistive devices of the temperature sensor. Each resistive device has a resistance that varies as a function of temperature. The receiving is performed at two or more known temperatures. A respective code is output corresponding to each respective one of the two or more known temperatures, based on the first and second reference voltages. At least one of the tap points is adjusted, based on the two or more known temperatures and the respective output codes.

Abstract: Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.

Abstract: Some embodiments provide a system that tests a computing system. During operation, the system monitors a temperature of a component in the computing system while running a series of calibrated workloads on the component. Next, the system analyzes a fluctuation of the temperature resulting from the calibrated workloads to determine a thermal performance of the component. The system then uses the determined thermal performance to improve the reliability of the computing system.

Abstract: Aspects of the disclosure relate to computing technologies. In particular, aspects of the disclosure relate to mobile computing device technologies, such as systems, methods, apparatuses, and computer-readable media for improving calibration data by increasing the diversity of orientations used for generating the calibration data. In one embodiment, the computing device receives a plurality of calibration measurements associated with one or more sensors of a device, determines a degree to which the plurality of calibration measurements were captured at different orientations of the device, and determines, based on the degree, whether to update one or more calibration parameters.

Abstract: A method of measuring conditions of an ultrasonic instrument includes providing an ultrasonic instrument that includes an end effector and a waveguide operably coupled to a generator and the end effector. The method involves generating one or more pulses with the generator, transmitting the one or more pulses to one or both of the waveguide and the end effector, generating one or more waves that scatter in an interferential pattern in response to the transmission of the one or more pulses, registering a signal indicative of the interferential pattern, generating an actual interferential pattern based upon the signal, and identifying one or more conditions of the end effector based upon the actual interferential pattern.

Abstract: The present invention relates to a method of measuring a temperature and/or temperature distribution at a resolution <1 &mgr; m in an object and to a device for performing such method, more particularly to a microscope for performing such method. The method comprises applying a molecular thermometer embedded in a matrix layer on an object, photoexciting the said molecular thermometer with a light source of said microscope and measuring emission of radiation from said molecular thermometer with two photodetectors of said microscope. A first intensity at a first wavelength is measured by said first detector, a second intensity at a second wavelength is measured by said second.detector, and a ratio of said intensities is calculated and used to determine a temperature with a calibrated curve. Said microscope is a confocal microscope or a stimulated emission depletion (STED) microscope.

Abstract: A calibrated airflow sensor and monitoring method are provided. The monitoring method which includes: providing an airflow sensor positioned within an electronic system to be at least partially air-cooled, the airflow sensor including at least one temperature sensor and a heater associated with one temperature sensor of the at least one temperature sensor; calibrating, with the airflow sensor positioned within the electronic system, a duty cycle for use in powering the heater associated with the one temperature sensor; and providing a controller configured to use the calibrated duty cycle in powering the heater of the temperature sensor during airflow monitoring of the electronic system, and to obtain a hot temperature (Thot) reading from the one temperature sensor having the associated heater, and to determine, based at least in part on the hot temperature (Thot) reading, whether to issue an airflow warning.

Abstract: The invention relates to systems and methods for calibrating and using resistance temperature detectors. In one embodiment, the system includes a calibration circuit comprising a resistance temperature detector in a bridge circuit with at least one potentiometer, and a programmable gain amplifier coupled to the bridge circuit. Embodiments of the invention further comprise methods for calibrating the bridge circuit and the programmable gain amplifier for use with the resistance temperature detector and methods for determining the self heating voltage of the bridge circuit.

Abstract: A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.

Abstract: A method of calibrating a reversible-binding sensor for detecting an analyte includes: (i) varying the temperature of a first calibration solution from a first temperature (T1) to a second temperature (T2) while the first calibration solution is in contact with a sensing region of the sensor; (ii) determining the sensor output for the first calibration solution as a function of temperature; (iii) varying the temperature of a second calibration solution from a third temperature (T3) to a fourth temperature (T4) while the second calibration solution is in contact with the sensing region, the second calibration solution having a concentration of analyte which is different from that of the first calibration solution; (iv) determining the sensor output for the second calibration solution as a function of temperature; and (v) using the determined sensor output from steps (ii) and (iv) to calibrate the sensor.

Abstract: In a process temperature transmitter, a method for providing a process temperature output is described. The method includes providing a measurement current through a circuit including a reference resistor and a resistance temperature device (RTD). A first voltage across the reference resistor is measured while the measurement current flows through it. A first voltage across the RTD is also measured while the measurement current flows through it. A first resistance of the RTD is calculated based on the measured voltage across the reference resistor and the measured first voltage. A first process temperature output is provided based on the first resistance of the RTD. A second voltage is subsequently measured across the RTD while a measurement current flows through it. A second voltage across the reference resistor is then estimated based on the measured second voltage across the RTD and the measured first voltage across the reference resistor.

Abstract: A processing apparatus includes a carrier receiving region configured to receive a sample carrier with at least one channel that carries at least one sample. The apparatus further includes a thermal control device configured to thermal cycle the sample carrier when the sample carrier is installed in the carrier receiving region, thereby thermal cycling the sample carried therein. The apparatus further includes a thermal control system configured to control the temperature control device based on a predetermined set of target sample temperatures and a temperature map, which maps the predetermined set of target sample temperatures to a set of temperatures of the temperature control device. The set of temperatures of the temperature control device is different from the predetermined set of target sample temperatures, and the set of temperatures of the temperature control device thermal cycle the sample carrier with the temperatures of the predetermined set of target sample temperatures.

Abstract: A method and apparatus for temperature sensor calibration is disclosed. In one embodiment, an integrated circuit (IC) is tested at a first known temperature corresponding to a first temperature threshold. During the test, a first temperature reading is obtained from a temperature sensor. A first offset is calculated by determining the difference between the first known temperature and the first temperature reading. The first offset is recorded in a storage unit for later use during operation of the IC. During operation, the first offset may be added to temperature readings obtained from a temperature sensing unit to produce an adjusted temperature value. The adjusted temperature value may be compared to one or more temperature thresholds. Based on the comparisons, a power management unit may perform power control actions.

Abstract: An improved calibration machine for calibrating a thermal trip apparatus of a circuit interrupter employs a tool having an elongated shank and a pair of engagement elements. The engagement elements are engageable with a support that carried a bimetal element. The engagement elements can deform the support in opposite directions to either increase or decrease the thermal trip setting of the thermal trip apparatus. If the support is over-deformed in one direction, it can be deformed in an opposite direction to enable a circuit interrupter whose thermal trip apparatus has been deformed beyond a desired target thermal calibration setting to be deformed in an opposite direction to reach the desired target thermal calibration setting.

Abstract: A method to estimate ambient air temperature in the vicinity of a vehicle equipped with an internal combustion engine equipped with at least an ignition and an electronic control unit (ECU) with memory.

Abstract: An accurate, cost-efficient temperature sensor may be integrated into an integrated circuit (IC) using common materials as the IC's interconnect metallization. The temperature sensor may include an impedance element having a length of metal made of the interconnect metal, a current source connected between a first set of contacts at opposite ends of the impedance element, and an analog-to-digital converter connected between a second set of contacts at opposite ends of the impedance element. The temperature sensor may exploits the proportional relationship between the metal's resistance and temperature to measure ambient temperature. Alternatively, such a temperature sensor may be used on disposable chemical sensors where the impedance element is made of a common metal as conductors that connect a sensor reactant to sensor contacts. In either case, because the impedance element is formed of a common metal as other interconnect, it is expected to incur low manufacturing costs.

Abstract: A system and method are disclosed for controlling a drywell including a receiver having upper and lower ends with the lower end being more insulated than the upper and having a temperature sensor in thermal contact therewith. Upper and lower heaters are in thermal contact with the upper and lower ends respectively. A controller includes an integrated circuit having a temperature sensor. A reading from the integrated circuit is used to control power to the upper heater and reduce a temperature gradient between the upper and lower ends of the receiver.

Abstract: According to one embodiment, a thermocouple abnormality detection system including: a plurality of thermocouples each including a plurality of thermocouple wires housed in a sheath; a transmission signal conversion unit configured to convert a thermo-electromotive force generated by each of the plurality of the thermocouple wires to a transmission signal and to output the transmission signal; a transmission unit configured to transmit the transmission signal outputted from the transmission signal conversion unit; and an abnormality detection circuit configured to detect an abnormality of each of the plurality of the thermocouples by comparing, with each other, the transmission signals obtained from the plurality of thermocouple wires provided in each of the thermocouples.

Abstract: A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamber. A light detector then detects the amount of light that is being transmitted through the substrate. The amount of detected light energy is then used to calibrate a temperature measurement device that is used in the system.

Abstract: A temperature sensor is disclosed as having a resistance thermocouple, accommodated in a sensor housing, for detecting a process temperature. The thermocouple can be connected via a multipole electric line to an electronic temperature transmitter for measured-value conditioning, the resistance thermocouple being equipped for in-situ calibration with a Johnson noise thermometer for determination of a reference temperature.

Abstract: A surrogate temperature sensor (52) for a convection cooled radiant heater system is described. The surrogate temperature sensor has an internal controllable heater (62) and a sensing device such as a thermocouple (64). The surrogate temperature sensor is paired with a furnace/dryer radiant heat source (38). The surrogate's internal heater provides sufficient power to heat the surrogate to the same temperature as the radiant heater. At least one surrogate temperature sensor (52) is positioned to be exposed to the cooling media in a manner similar to the radiant heat source. The surrogate sensor reports its temperature which is indicative of the radiant heater temperature to the cooling controller. The controller responds to this signal and adjusts cooling to maintain the radiant heater at its desired temperature.

Abstract: The present invention relates to a calibration circuit, computer program product, and method of calibrating a junction temperature measurement of a semiconductor element, wherein respective forward voltages at junctions of the semiconductor element and a reference temperature sensor are measured, and an absolute ambient temperature is determined by using the reference temperature sensor, and the junction temperature of the semiconductor element is predicted based on the absolute ambient temperature and the measured forward voltages.

Abstract: A procedure for checking the functionality of an electric heating device (10) with at least one PTC-element (13, 14) is suggested. The electric heating device (10) is operated at a battery voltage. When controlling the heating device (10) it is impinged with a current and at least one measuring value is detected, which represents the current that flows through the heating device. The measuring value for the current is compared to at least one reference value with a default tolerance width while considering the battery voltage. In the case of a measuring value that deviates from the reference value an error can be assumed.

Abstract: A DTS system resistant to hydrogen induced attenuation losses during the service life of an installation at both low and high temperatures using matched multi-wavelength DTS automatic calibration technology in combination with designed hydrogen tolerant Pure Silica Core (PSC) optical fibers.

Abstract: A zero-heat-flux DTT measurement device is constituted of a flexible substrate supporting an electrical circuit including a heater trace defining a heater, thermal sensors, and a thermal sensor calibration circuit.

Abstract: The invention relates to a temperature calibrating system (1) comprising a thermo siphon, a heat pipe or an equivalent (2) connected between a cooling unit (4) and a temperature calibration unit (3), where the system (1) further comprises an external chamber (8) connected to the heat pipe/thermo siphon or equivalent (2) for controlling the thermal conductivity between the two units and where the temperature of the external chamber (8) is held at a certain temperature, for example ambient temperature or a temperature controlled by external means. The external chamber (8) can be connected to the heat pipe/thermo siphon (2) via a conduit (9) which connection point is placed above liquid level at a evaporating end of the heat pipe/thermo siphon (2) and in that the external chamber (8) is arranged below the connection between the conduit (9) and the heat pipe/thermo siphon (2).

Abstract: A method is disclosed for operating a sensor arrangement having at least one measuring sensor and at least one reference sensor for recording the same physical variable, and having an analysis unit electrically connected thereto, with a characteristic of the sensor arrangement being recorded in an initialization phase from measured values of the at least one measuring sensor and of the at least one reference sensor, and an alarm being given during continuous operation if the deviation from the characteristic lies outside a tolerance band. It is proposed to suspend the alarm dynamically so long as the changes in the measured value in the variation over time of the at least one measuring sensor or in the variation over time of the at least one reference sensor differ by more than a definable limit within a definable time interval.

Abstract: The invention relates to systems and methods for calibrating and using resistance temperature detectors. In one embodiment, the system includes a calibration circuit comprising a resistance temperature detector in a bridge circuit with at least one potentiometer, and a programmable gain amplifier coupled to the bridge circuit. Embodiments of the invention further comprise methods for calibrating the bridge circuit and the programmable gain amplifier for use with the resistance temperature detector and methods for determining the self heating voltage of the bridge circuit.

Abstract: A heat conduction-type sensor corrects (calibrate) effects of a temperature of a measurement target fluid and a type of the fluid on a measurement value in measurement of a flow velocity, a mass flow, or an atmospheric pressure. Also provided is a thermal flow sensor and a thermal barometric sensor with this correcting function, high sensitivity, simple configuration, and low cost. At least two thin films that are thermally separated from a substrate through the same cavity are provided, one thin film comprises a heater and a temperature sensor, and the other thin film comprises at least one temperature sensor, the temperature sensors being thin-film thermocouples. The thin film is arranged in proximity so that it is heated only through the measurement target fluid by heating of the heater. A calibration circuit calculates and compares quantities concerning heat transfer coefficients of a standard fluid and the unknown measurement target fluid.

Abstract: In one embodiment, a system includes a first cold noise source, a first radiometer receiver, and a first detector. The first cold noise source generates a first thermal radiation signal having a first carrier frequency band. The first thermal radiation signal carries a first information signal. The first cold noise source also transmits the first thermal radiation signal through a first antenna. The first radiometer receiver receives the first thermal radiation signal through a second antenna, and the first detector extracts the first information signal from the first thermal radiation signal.

Abstract: An imaging thermographic measuring system to measure the thermal output (Qout) at a target object, such as a building wall, building facade, or the like, comprising a measuring station provided for the arrangement distant from the object with an electric imaging device to record a thermographic thermal image, with a temperature distribution to be allocated thereto, and with a temperature sensor distant from the object to measure a temperature (Tref) distant from the object; at least one thermal transition sensor provided to be arrange close to the object, a transmission arrangement to transmit values between at least one thermal transition sensor and the measuring station, with the thermal transition sensor being embodied to predetermine the test values to determine a thermal transition coefficient (h).

Abstract: Methods and systems for compensating temperature measurements by a temperature gauge comprising a first temperature sensor and a second reference temperature sensor, having different thermal properties, located in the same temperature environment to be measured. The methods and systems compensate for errors in the measured temperatures due to variations in the reference sensor caused by temperature effects.

Abstract: A system includes a first module, a second module, and a third module. The first module determines a first temperature and a first power dissipation value of a thermistor based on a resistance of a first resistor connected in series with the thermistor. The second module, after disconnecting the first resistor and connecting a second resistor in series with the thermistor, determines a second temperature and a second power dissipation value of the thermistor based on a resistance of the second resistor. The third module determines a thermal dissipation factor based on the first and second temperatures and the first and second power dissipation values, and corrects temperature sensed by the thermistor based on the thermal dissipation factor.

Abstract: A method for manufacturing a contact temperature sensor to be used at a temperature of use, including a) supplying a carbon fiber; b) heat treating of the fiber at a temperature higher than 800° C. and higher than the temperature of use; c) full layer depositing on the fiber, at a deposition temperature, an electrically insulating ceramic coating layer stable at the temperature of use, the ceramic material chosen among silica (SiO2), zirconia (ZrO2), and alumina (Al2O3); d) heat treating of the fiber, coated with the coating layer, at a temperature higher than the deposition temperature of the coating layer and higher than the temperature of use, or (c?) full layer depositing on the fiber a first coating layer of silicon carbide; d?) full layer depositing the first coating layer a second coating layer of boron nitride; e?) heat treating the fiber thereby obtained at a temperature above the deposition temperatures and the temperature of use of the sensor.

Abstract: In a hydrogen tank, discharge of a hydrogen gas may cause lowering of the temperature to a value at which it is assumed that disconnection has occurred in a thermistor. A temperature detection system for the hydrogen tank estimates the possibility that the temperature of the hydrogen tank is below this temperature value, according to the ambient temperature and the internal pressure. Only when there is no possibility that the temperature is below the value, disconnection is judged to have occurred.

Abstract: A temperature sensor plausibility diagnosis unit performs plausibility diagnosis of a temperature sensor disposed inside a storage tank in an exhaust purification apparatus of an internal combustion engine that delivers an additive inside the storage tank to an exhaust pipe upstream of a reduction catalyst and selectively reduces and purifies NOx in the exhaust. The temperature sensor plausibility diagnosis unit includes an additive heat capacity calculating portion that calculates the heat capacity of the additive, a heat quantity variation calculating portion that calculates an increase or decrease in the quantity of heat that the additive receives, and a plausibility diagnosing portion that determines the plausibility of the temperature sensor by comparing an estimated temperature course of the additive estimated from the heat capacity of the additive and the increase or decrease in the quantity of heat with a sensor temperature course of the additive detected by the temperature sensor.

Abstract: A temperature measuring device which measures a temperature of a heat treatment mechanism in a heat treatment apparatus which heat-treats a substrate with a predetermined temperature using the heat treatment mechanism, includes: a substrate and a Wheatstone bridge circuit which is disposed on the substrate and includes a plurality of temperature-measuring resistors whose resistance is varied depending on a change in temperature.

Abstract: Disclosed is a cargo deck for a cargo hold of an aircraft, comprising at least one temperature measuring device for non-contacting measurement of the temperature of a container, a pallet or a similar unit load device (ULD).

Abstract: The invention pertains to flexible devices used for zero-heat-flux, deep tissue temperature measurement, especially to disposable temperature measurement devices. Such a device is constituted of a flexible substrate. An electrical circuit is disposed on a side of the substrate. The electrical circuit includes first and second thermal sensors disposed, respectively, on first and second substrate layers. A heater trace is disposed on the first substrate layer with the first thermal sensor. The first and second substrate layers are separated by a flexible layer of insulation disposed between the first and second substrate layers. The heater trace defines a heater with a central portion that operates with a first power density and a peripheral portion around the central portion that operates with a second power density greater than the first power density.

Abstract: A zero-heat-flux DTT measurement device is constituted of a flexible substrate supporting an electrical circuit including a heater trace defining a heater, thermal sensors, and a thermal sensor calibration circuit.