Abstract: A temperature measurement device includes a first thermocouple mounted on a tubular body that is shielded from the effects of radiation by a radiation shield, and a second, unshielded thermocouple. A difference in the measured temperatures from the first and second thermocouples is compared with calculated temperatures using an iterative process to determine a corrected temperature of the gas stream that estimates and compensates for incident radiation.

Abstract: A tip assembly for an IR thermometer apparatus includes a heat sink having a heat sink cavity and a tip section and a fluid path and at least one hydraulic port. The tip assembly also includes an IR sensor mechanically seated in the tip section and thermally coupled to the heat sink. The tip assembly also includes an electrical connector configured to provide an electrical connection to the tip assembly. A fluid having a fluid temperature is introduced into the fluid path via the hydraulic port. The fluid causes the heat sink and the IR sensor to substantially reach one or more pre-determined temperatures by thermal conduction during calibration of the tip assembly. Another tip assembly having an internal heat source is described. Another tip assembly having an internal heat pump is described. A method to calibrate a tip assembly is also described.

Abstract: An assembly includes a thermocouple, a cold junction sensor, and a circuit. The thermocouple has a process end and a cold junction end. The cold junction end has first and second cold junction terminals. The cold junction sensor is supported near the cold junction end and configured to measure temperature at the cold junction end. The circuit is electrically connected to the cold junction sensor and to the first and second cold junction terminals. The circuit is configured to produce a thermocouple signal as a function of voltage across the first and second cold junction terminals and to produce a cold junction sensor signal as a function of temperature of the cold junction end as measured by the cold junction sensor. The circuit is further configured to calculate a correlation between the thermocouple signal and the cold junction sensor signal.

Abstract: Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.

Abstract: There is provided a differential scanning calorimeter for exactly measuring a calorie variation of the measured sample on the basis of the temperature difference between sample container and the reference container without the influence of the heat irregularity incoming from the surroundings and the noise components.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: Methods and systems for detecting faults in temperature sensors on engine systems provided with equipment for treatment of combustion products of an exhaust effluent stream during engine operation include determining sensor faults from differences in temperature between sensors present in such systems over time. Estimated exhaust gas temperatures may be compared against real time temperature measurements to arrive at a diagnostic residual value representing the difference between a modeled value and measured value, and deviation of the measured value from the modeled value is used to indicate a sensor fault.

Abstract: A testing device for testing thermal detectors includes a hollow sleeve, open on at least one end, configured to receive a thermal detector. The hollow sleeve can have a length greater than a diameter. A heater is positioned is in proximity to the hollow sleeve, and is configured to provide heat for testing the thermal detector. The heater can be a flexible foil heater. A power source is provided to supply power to the heater. A power control module can be provided for variably adjusting a set point temperature or a rate of temperature rise for the heater.

Abstract: In one aspect of the invention a drywell includes a heated receiver for receiving a temperature probe. The receiver has upper and lower ends and an inner shield positioned around the receiver to define a first air channel extending between the upper and lower ends. A flow plate is positioned above the upper end of the receiver and extends outwardly from the receiver. The flow plate defines a plate opening positioned over the receiver opening and has a lower surface sloping away from the receiver with distance above the receiver. A blower positioned below the lower end of the receiver induces air flow through the air channel. The lower surface of the flow plate directs the air flow away from the temperature probe.

Abstract: A sensor diagnostic method, such as to determine rationality of one of three temperature sensors used in an exhaust aftertreatment system, includes determining the temperature difference between the first and second sensor, determining the temperature difference between the second and third sensor, determining whether the temperature differences are within an acceptable threshold range and comparing the two temperature differences to determine which sensor is in error, if any.

Abstract: Until the accuracy in calculation of an estimated oil temperature value which is calculated by means of a heat dissipation amount map reaches a predetermined level, an ECU determines, when a transmission oil temperature well exceeds a predetermined temperature after the engine start, whether or not an oil temperature sensor fails. When it is determined that the oil temperature sensor is normal, the ECU uses the detected oil temperature value to learn about the heat dissipation map. When the accuracy in calculation of the estimated oil temperature value reaches the predetermined level through the learning about the heat dissipation amount map, the ECU determines whether or not the oil temperature sensor fails based on the divergence of the detected oil temperature value relative to the estimated oil temperature value.

Abstract: The invention relates to a method for detecting an abnormality of a temperature sensor. A plurality of temperature sensors are preliminarily grouped for each of predetermined attachment areas of a machine tool, and after a temperature of each part is measured in S1, the detected temperatures are classified in S2 for each of the grouped attachment areas, and then sorted in descending order in S3. Subsequently, a difference ?T between any closest two of the detected temperatures is obtained in S4, and then compared with a preset limit value ? in S5, when ?T exceeds the limit value ?, temperature sensors in a corresponding attachment area are determined abnormal in S6, and an alarm is displayed.

Abstract: A device temperature measurement circuit, an integrated circuit (IC) including a device temperature measurement circuit, a method of characterizing device temperature and a method of monitoring temperature. The circuit includes a constant current source and a clamping device. The clamping device selectively shunts current from the constant current source or allows the current to flow through a PN junction, which may be the body to source/drain junction of a field effect transistor (FET). Voltage measurements are taken directly from the PN junction. Junction temperature is determined from measured junction voltage.

Abstract: A control system is disclosed for determining an actual temperature of a light emitting diode. The control system uses conductor that supply power to the light emitting diode to supply a pulse to the light emitting diode. The pulse is determined along with a reaction caused by the pulse and the information gained is used in determination of the light emitting diode die temperature which can then be used in controlling current to the light emitting diode to control the temperature of the light emitting diode.

Abstract: A method for testing a measuring device is used to determine a permittivity of a frying fat which permittivity is inter alia dependent on the temperature, while taking into consideration the temperature. The method is characterized in that the permittivity is measured at least two different temperatures and the temperature dependence is determined and is used to make a statement on the ability to function of the measuring device.

Abstract: A method for monitoring the proper functioning of a temperature-dependent resistor, particularly a NTC resistor, for measuring the temperature of a medium heated by a heat source. Said medium is preferably the air flow in a clothes dryer for drying clothes. In order to increase the safety of a device, in particular a clothes dryer, where the temperature-dependent resistor is used in combination with a heat source, it is checked, once the heat source is switched on, whether the temperature measured by the resistor after a first predetermined period of time following the switching on of the heat source falls below a predetermined temperature threshold value. If this is the case, monitoring of a resistor-temperature curve characteristic of the temperature-dependent resistor is carried out.

Abstract: There are a number of sensors (2, 22) such as thermocouples which can provide a putative measurand signal which is within a predicted range for such signals whilst the sensor is incorrectly operating, such as as due to an open circuit. Techniques and processes are available to determine by interrogation sensor operational validity, but these can distort the measurand signal if correct. By time division multiplex techniques the present arrangement takes a putative measurand signal from a sensor (2, 22) in order that either within the same time division or more normally a separate time division, an interrogation of the sensor is performed in order to determine accuracy and therefore validity of the sensor 22.

Abstract: Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.

Abstract: An analog thermometer calibration apparatus may comprise a substantially flat piece of steel or other suitably rigid material having at least one hexagonal or appropriately non-circular shaped aperture or opening formed designed to be at least generally complimentary in size and shape to the calibration adjustment member or projection of an analog type thermometer such that the two may engage in a substantially complimentary manner that will permit rotation of the thermometer readout dial and to prevent the relative rotation of the base or lower portion of the analog thermometer connected to a temperature sensing stem probe during the rotation of the analog thermometer dial face during a calibration procedure. A round or other suitably shaped aperture opening may be included to accommodate support and passage of the temperature sensing probe of a more accurate digital type thermometer (or a recently calibrated thermometer of any type) in order to provide a calibration reference temperature reading.

Abstract: A method for calibrating a thermometer is provided. The method includes deriving values of at least two different reference calibration coefficients of a reference calibration equation. The reference calibration equation relates temperature of a reference temperature sensor to at least two different calibration coefficients and a measured characteristic of the reference temperature sensor. A primary temperature sensor of the thermometer is calibrated using the derived values of the at least two different reference calibration coefficients. In another method for calibrating a thermometer, value of at least one reference calibration coefficient is derived from a reference calibration equation. The reference calibration equation is a non-linear equation relating the temperature of the reference temperature sensor to the at least one calibration coefficient and a measured characteristic of the reference temperature sensor.

Abstract: A PWM signal generation circuit in an IPM includes an amplification circuit amplifying a voltage across terminals of a temperature sensor, a comparison circuit generating a PWM signal based on a triangular wave signal and an output signal of the amplification circuit, and a correction circuit setting an amplification ratio of the amplification circuit such that a pulse width of the PWM signal is set to a reference pulse width in an adjustment mode in which a switching element is caused to have a reference temperature. Consequently, characteristic variations in the temperature sensor, the amplification circuit, and the like can be corrected, and the temperature of the switching element can be detected with high accuracy.

Abstract: A system (100) for sensing a temperature of a light emitting diode (LED). The system may comprise an LED having a spectral output centered at a first wavelength, a first filter (104) that transitions from attenuation to transmission at about the first wavelength, and a second filter (106) that transitions from transmission to attenuation at about the first wavelength. The system may also comprise a first sensor (108) positioned to sense a first intensity of the LED through the first filter and a second sensor (110) positioned to sense a second intensity of the LED through the second filter. It will be appreciated that a single sensor may be substituted instead of the first and second sensors, provided that the single sensor is capable of selectively viewing the LED through the first and the second filters. The system may also comprise a computer (112) configured to derive a temperature of the LED considering the first intensity and the second intensity.

Abstract: A method for manufacturing a contact temperature sensor to be used at a temperature of use, including a) supplying a carbon fiber; b) heat treating of the fiber at a temperature higher than 800° C. and higher than the temperature of use; c) full layer depositing on the fiber, at a deposition temperature, an electrically insulating ceramic coating layer stable at the temperature of use, the ceramic material chosen among silica (SiO2), zirconia (ZrO2), and alumina (Al2O3); d) heat treating of the fiber, coated with the coating layer, at a temperature higher than the deposition temperature of the coating layer and higher than the temperature of use, or (c?) full layer depositing on the fiber a first coating layer of silicon carbide; d?) full layer depositing the first coating layer a second coating layer of boron nitride; e?) heat treating the fiber thereby obtained at a temperature above the deposition temperatures and the temperature of use of the sensor.

Abstract: A temperature varying low-temperature comparative calibration including a vacuum jacket, a comparative calibration block in the vacuum jacket which is formed of a material of a high heat conductivity and which is maintained at a fixed temperature by a refrigerator or a heater, a reference thermometer housing portion in the comparative calibration block in which a reference thermometer is mounted, and an insertion hole in the comparative calibration block through which a calibration target thermometer is inserted from outside the vacuum jacket via an introduction pipe. The introduction pipe is filled with heat exchange gas.

Abstract: A calibration apparatus for temperature probes comprising an elongate calibration chamber (1) with an opening (2) for receiving an insert (3) that has passages (4) for receiving temperature probes (6), and wherein the chamber (1) has several heat energy elements (9-11) that are controlled by temperature probes (12-14). In the insert as such one or more external probes (7) are provided, each of which has one or more temperature sensors to the effect that at least two sensors (19, 20 or 15, 17) are provided at respective dissimilar distances to an end of the insert (3). The latter sensors are connected to electronic regulation (20, 23) and measurement units (21, 24) for regulating the supply of power to the heat energy elements.

Abstract: In a hydrogen tank, discharge of a hydrogen gas may cause lowering of the temperature to a value at which it is assumed that disconnection has occurred in a thermistor. A temperature detection system for the hydrogen tank estimates the possibility that the temperature of the hydrogen tank is below this temperature value, according to the ambient temperature and the internal pressure. Only when there is no possibility that the temperature is below the value, disconnection is judged to have occurred.

Abstract: A technique for an infrared radiation thermometer used for thermography detects measurement abnormality of the infrared radiation thermometer and estimates the causes of the measurement abnormality such as contamination of an objective lens and a malfunction in a mechanism section of the infrared radiation thermometer.

Abstract: A conventional radiation thermometer encompasses an infrared radiation sensor and a heatable and/or coolable radiation incidence window. The method and radiation thermometer according to the invention use the established dependence of the sensor signal U of the infrared radiation sensor on the temperature Tw of the radiation incidence window W (or any other heatable or coolable optical element in the beam path) for verifying its proper functional operation. Applying the method according to the invention, the radiation incidence window (or perhaps another optical element in the beam path) is heated up or cooled by activating an associated electric heating or cooling device. The resulting change ?Uw in the sensor signal U is detected, preferably in continuous fashion, as a function of the window temperature Tw and analyzed or verified for any deviation from an acceptable value or permissible range.

Abstract: The present invention relates to a multi fixed-point cell for calibrating a thermometer and a thermometer calibration apparatus using the same, wherein measuring errors can be checked by using a property of constant temperature of a metal on the basis of a phase transition and wide range of temperature region can be measured by one time calibration, thereby capable of increasing efficiencies of time and cost which are taken for calibration. In a multi fixed-point cell for calibrating a thermometer according to the present invention, a thermometer inserting hole in which a thermometer is inserted is formed at one side and at least two reference material inserting holes in which reference materials having different phase transition temperatures are inserted respectively are formed on a same plane as that of the thermometer inserting hole so as to be spaced apart each other.

Abstract: To measure and regulate temperature, a temperature measuring resistor and a control element are accommodated in one layer as metallization on a substrate. The printed or otherwise manufactured conductors of the temperature measuring resistor and of the control element are arranged in close proximity to one another.

Abstract: A method for calibrating a digital temperature sensor circuit, the circuit comprising an analogue temperature sensing means, an internal reference voltage source and an analogue-to-digital converter (ADC). The ADC is arranged to receive respective signals from the analogue temperature sensing means and the reference voltage source and output a digital signal indicative of the ambient temperature. The method comprises the steps of determining the value of the internal reference voltage outputted by the reference voltage source, comparing it with the desired reference voltage value, and adjusting the reference voltage source in response to the result of the comparison step. Such an electrical voltage mode calibration can significantly reduce production costs, as it can be performed much faster than a traditional thermal calibration. The method can be applied to a sensor that produces a PTAT voltage that has to be compared to a temperature-independent bandgap reference voltage.

Abstract: The present invention relates to an optical fiber temperature sensor capable of reducing an error in a temperature measurement. The sensor comprises an optical fiber, an optical frequency difference adjusting section, a light source system, a spectrum measuring section, a temperature calculating section, and a correcting section. The light source system outputs, into different ends of the optical fiber, probe light and pumping light of which each center frequency is set corresponding to an instruction from the optical frequency difference indicating section respectively. The temperature calculating section calculates a temperature of an object based on BGS in a first domain measured by the spectrum measuring section. On the other hand, the correcting section outputs a correction instruction to the light source system so that BGS center frequency of a second domain may be in agreement with a reference value thereof.

Abstract: A temperature sensor disposed in an exhaust system of an engine is inspected. Determination is made that conditions for inspecting the temperature sensor are satisfied in the current engine load range. The time for the temperature in the exhaust system to reach a value appropriate for checking the temperature sensor is determined in accordance with engine water temperature. Output of the temperature sensor is checked to determine if the temperature sensor is normal at the determined time.

Abstract: A method for measuring temperature of a rotating body such as a steam turbine is provided. The method includes striking a light beam onto the rotating body onto the rotating body and measuring a reflectance of the light beam from the rotating body. The method further includes obtaining a temperature of the rotating body based upon the measured reflectance.

Abstract: A temperature calibration device uses Peltier cells for heating and cooling. The Peltier cells are connected to a relay that connects the cells to each other in one configuration for heating and a different configuration for cooling. The Peltier cells also receive supply voltages having different magnitudes and polarities for heating and cooling. By changing the manner in which the Peltier cells are connected to each other and using different supply voltages for heating and cooling, the cells are able to operate closer to their specified maximum temperature differential without sacrificing the useful life of the cells.

Abstract: The invention relates to an integrated temperature sensor (1) comprising: means (2000) for generating a pulse train (DATA_IN) at an oscillation frequency, means (3000) for counting the number of pulses during a fixed period of time independent of a temperature to be measured (T) and for generating a plurality of bits (b11, b10, . . . , b0) indicating the number of pulses in the pulse train (DATA_IN), and means (4000) for generating a serial digital signal (DATA_OUT) from said bits (b11, b10, . . . , b0), in which the means (2000) for generating a pulse train (DATA_IN) include a plurality of logic gates (2410, 2420, 2430, 2440, 2450) which can introduce a delay dependent on the temperature to be measured (T), said means (2000) generating a pulse train (DATA_IN) the oscillation frequency of which is dependent on said temperature to be measured (T). The invention also relates to a temperature measurement method and to a transponder for a wireless system.

Abstract: Infrared Ir Thermometer Calibration Systems and Methods are Disclosed in which the temperature of an IR thermometer calibration system is controlled such that radiation emitted by a target at a given input temperature is equal to the radiation emitted by a graybody heated to the input temperature and having an emissivity equal to an emissivity setting of an IR thermometer to be calibrated using the IR thermometer calibration system.

Abstract: A controller of a hob is connected to a temperature sensor of a radiation based heating element. In principle, two different groups of temperature sensors can be used, whose resistance values differ by approximately a factor of three. When the hob is first used, the resistance of the temperature sensor is measured at room temperature and is classified in one of the two groups of temperature sensors on the basis of a limit value between the two typical temperature profiles of the groups of temperature sensors. On the basis of this, calibration of the controller is carried out for the purpose of adjusting to the established group to which the temperature sensor belongs.

Abstract: A method for precision thermal measurement and control, especially for bioreactors, as well as the correction of temperature sensitive probes such as pH and dissolved oxygen. Typical control requirements are ±0.1° C. The thermal measurement circuit converts a sensor output to a high level voltage or current with great accuracy and provides noise immunity and sensor isolation. While digital outputs from sensor converters can have the greatest noise immunity, the noise associated with digital circuitry may contaminate low level sensor signals so in many cases an analog sensor converter is preferred because of low noise generation, especially if the converter is near the sensor. The circuit is low cost, reliable, generates minimal heat is immune to, and does not generate noise, and requires minimal calibration effort.

Abstract: A method and apparatus for measuring the temperature of a gas in a mass flow controller is described. One embodiment derives gas-temperature information from a mass flow sensor of the mass flow controller without relying on a separate temperature sensor. This embodiment supplies a substantially constant electrical current to a thermal mass flow sensor of the mass flow controller, the thermal mass flow sensor being designed to measure a mass flow rate of the gas; measures an input voltage of the thermal mass flow sensor to obtain a present input voltage, the input voltage varying with a temperature differential between a pair of sensing elements of the thermal mass flow sensor; calculates an adjusted input voltage by accounting for a component of the present input voltage that is dependent on the mass flow rate of the gas; and calculates the temperature of the gas based on the adjusted input voltage.

Abstract: Various systems and methods for temperature measurement are disclosed. For example, some embodiments of the present invention provide temperature measurement systems. Such temperature measurement systems include a variable current source and a diode connected transistor. The variable current source is capable of applying two or more distinct currents to the diode connected transistor. The currents result in a different base-emitter voltage on the diode connected transistor. The systems further include an n-factor coefficient register and an analog to digital converter. The analog to digital converter is operable to receive two of the base-emitter voltages created by applying the different currents, and to provide a digital output based at least in part on a value stored in the n-factor coefficient register and the two base-emitter voltages.

Abstract: In one embodiment, an integrated circuit (IC) is provided with a thermal diode and a constant current source. In this embodiment, the saturation current of the diode may be determined by means external to the IC. During normal operation of the IC, the constant current source drives a current to the diode, and the forward bias voltage of the diode is used as a temperature indicator. In another embodiment, an IC is provided with a pair of thermal diodes and a constant current source. During normal operation of the IC, each of the diodes receives a current of different magnitude from the constant current source, and a comparison of the diodes' forward bias voltages is used as a temperature indicator.

Abstract: The present invention relates to a method of measuring a temperature and/or temperature distribution at a resolution <1 &mgr; m in an object and to a device for performing such method, more particularly to a microscope for performing such method. The method comprises applying a molecular thermometer embedded in a matrix layer on an object, photoexciting the said molecular thermometer with a light source of said microscope and measuring emission of radiation from said molecular thermometer with two photodetectors of said microscope. A first intensity at a first wavelength is measured by said first detector, a second intensity at a second wavelength is measured by said second.detector, and a ratio of said intensities is calculated and used to determine a temperature with a calibrated curve. Said microscope is a confocal microscope or a stimulated emission depletion (STED) microscope.

Abstract: A temperature sensor includes a temperature sensing unit for producing a sensing level by sensing an internal temperature in a semiconductor memory device, a reference level generating unit for setting up a reference level by selecting one of a plurality of reference voltages, which are set up according to the internal temperature of the semiconductor memory device, in response to a test mode signal and a temperature detecting signal, wherein the reference level generating unit includes fuse, and a comparison unit for comparing the sensing level to the reference level and producing the temperature detecting signal.

Abstract: A method enables measurement of an inverter loss within a motor control circuit for an appliance. The method includes applying a constant DC current generated from a first AC supply voltage to a motor winding through an inverter at a first duty cycle, measuring a first voltage corresponding to the current through the motor at a motor current sense resistor, computing a first ratio of the first measured voltage at the motor current sense resistor to a first DC input voltage corresponding to the first AC supply voltage, identifying a second duty cycle from the first computed ratio, comparing the second duty cycle to the first duty cycle, and identifying a first inverter loss factor from the difference between the first duty cycle and the second duty cycle.

Abstract: A method for digitally controlling the resistive output of a temperature probe is disclosed. The system is comprised of a temperature sensor, a processor and a means under the control of the processor for modifying the resistive output such as a digital potentiometer. In one embodiment, the processor reads the temperature sensor and adjusts the potentiometer based on a correlative or predictive technique so as to provide a modified output that matches that of a standard resistive temperature probe and is compatible for display on a multi-parameter monitor.

Abstract: A fixing apparatus according to one aspect of the present invention includes a non-contact temperature detecting element 81 allocated in non-contact with a heat roller, the sensing element detecting a temperature of the heat roller. The non-contact temperature sensing section 81 includes a thermopile P which detects a target temperature Pt of a heat roller 2, a temperature element CPU 100 which estimates an ambient temperature at the periphery of the thermopile P and computes an estimated ambient temperature SQt, and a thermister Q which detects an ambient temperature Qt at the periphery of the thermopile and outputs the ambient temperature Qt at an output voltage of a predetermined rate with respect to a total output voltage value corresponding to the estimated ambient temperature SQt.

Abstract: A multiple sensor fiber optic sensing system. A method of sensing distributed temperature and at least another property in a well includes the steps of: interconnecting an optical switch to an optical fiber which extends along a wellbore in the well; operating the optical switch to optically connect the optical fiber to an interferometric measurement system; and operating the optical switch to optically connect the optical fiber to a distributed temperature measurement system. Another method includes the steps of: installing an optical fiber along a wellbore in the well, the optical fiber being a first distributed temperature sensor, the installing step including providing a substantial length of the optical fiber proximate a second sensor which senses the well property; and calibrating the second sensor using a temperature sensed by the first sensor in the substantial length of the optical fiber.

Abstract: A method for measuring the differential emissivity between two sites on the surface of a body and the temperature of the two sites. The method includes a plurality of measurements of the infrared radiation arising from each of the two sites under a number of different conditions. Some of the measurements include irradiation by external infrared radiation at a known wavelength and intensity. The infrared radiation arising from each of the sites may include emitted radiation, reflected ambient radiation, and reflected external radiation. Additionally, the temperature determined using the method described can be used to calibrate infrared imaging devices used to inspect the entire body.

Abstract: Systems and methods for calibrating a temperature sensing system are disclosed. In one respect, a dual light source configuration may be provided. A first light source may illuminate a sensing fiber and an anti-Stokes band may be detected. A second light source may illuminate a sensing fiber and a Stokes band may be detected, where the Stokes band is substantially similar to the anti-Stokes band of the first light source. A ratio between the anti-Stokes and Stokes band may be used to calibrate a temperature sensing system.