Abstract: An apparatus for use with automatic testing equipment for testing infrared sensors on integrated circuits is provided. The apparatus includes an infrared source, a heat mass, and an electronic frequency modulator. The infrared source is modulated according to a predetermined test frequency such that the infrared source emits an infrared test signal representative of a test temperature and corresponding to the temperature of the heat mass and the predetermined test frequency. A signal processor, electrically coupled to an integrated circuit having an infrared sensor, receives a sensed signal from the infrared sensor in response to the infrared test signal and uses the sensed signal according to the predetermined test frequency to determine a measured temperature.

Abstract: To improve the precision of temperature compensation in an infrared sensor and obtain a sharp image, a correction is applied to a variation in output voltage (referred to as “background infrared radiation absorption intensity distribution” below) due to intensity distribution of background infrared radiation, which is light other than the incident infrared radiation on the infrared sensor, and the temperature characteristic of each individual bolometer constituting the infrared sensor. That is, the temperature of the infrared sensor is measured as a first temperature, a correction value for the output voltage of each bolometer is found by referring to a table, which indicates the background infrared radiation absorption intensity distribution versus the temperature of the infrared sensor, as well as the first temperature, and the variation in output voltage is corrected.

Abstract: A test component coated with a coating system is provided. In at least one defined region of the test component, there is a delamination having defined properties deliberately introduced into the coating system. The test component may be employed in a method for testing a thermography apparatus that is designed for carrying out a thermography method, for its correct operation with a view to the detection of delaminations. In order to test the thermography apparatus, the at least one defined delamination of the coating system is detected on the test component by using the thermography method employed in the thermography apparatus.

Abstract: A user computer device is provided that comprises a temperature sensitive touchscreen having a temperature sensitive user interface comprising multiple thermal energy emitter/detector devices, such as thermocouples. The multiple thermal energy emitter/detector devices are capable both of detecting thermal energy and emitting thermal energy. The temperature sensitive user interface generates thermal patterns that may be transferred to other thermally sensitive electronic devices or that may be used to authenticate the user computer device. The user computer device also can detect and thermally communicate with a thermal energy docking station and, based on thermal recognition, activate applications displayed on the temperature sensitive touchscreen. Further, the user computer device can auto-bias a temperature of the temperature sensitive user interface in order to better assure proper operation of the temperature sensitive user interface in all operating conditions.

Abstract: A thermostat system is provided that comprises a base thermostat for providing basic thermostat control and a portable information display (PID) unit, or dockable display, that provides an improved user interface. The PID unit can be docked to the base thermostat by being releasably mounted on top of a front portion of the base thermostat. The base thermostat provides control of an environmental control system, allowing the regulation of the temperature in a building. The PID unit may be used when it is mounted to the base thermostat or un-mounted from the base thermostat. The PID unit provides an improved user interface and experience over the base thermostat.

Abstract: A method is present for monitoring a structure. A plurality of modes is identified for a first response for the structure at a first temperature. Each mode in the plurality of modes is adjusted from the first temperature to the second temperature to form a plurality of temperature adjusted modes. A temperature adjusted response is formed from the plurality of temperature adjusted modes in which the temperature adjusted response is adjusted to a second temperature from the first temperature. The temperature adjusted response is compared to a second response to evaluate the changes in the structure between the two sets of measurements.

Abstract: The invention relates to an apparatus for the calibration of a thermometer in situ, wherein the apparatus has a temperature sensor (S) for determining a temperature (T); wherein a reference element (K) is provided for calibrating the temperature sensor (S); wherein the reference element (K) at least partially comprises a ferroelectric material (D), which experiences a phase transformation at least one predetermined temperature (TPh) in a temperature range relevant for calibrating the temperature sensor (S).

Abstract: An outside air temperature (OAT) diagnostic system includes an ambient temperature monitoring module that receives (i) an OAT signal from an OAT sensor and (ii) an intake air temperature (IAT) signal from an IAT sensor of an engine. The ambient temperature monitoring module compares the OAT signal to an IAT signal and generates a first difference signal. A performance reporting module determines whether the OAT sensor is exhibiting a fault and generates an OAT performance signal based on the first difference signal.

Abstract: The present invention, in one aspect, provides a method for calibrating thermal control elements in situ using a single compound calibrator. In some embodiments, the present invention uses a compound calibrator to calibrate thermal control elements on a microfluidic device. In non-limiting embodiment, the compound calibrator can be a droplet, plug, slug, segment or continuous flow of any appropriate solution that, when heated, yields a thermal response profile with a plurality of features (e.g., maxima, minima, inflection points, linear regions, etc.).

Abstract: An assembly includes a thermocouple, a cold junction sensor, and a circuit. The thermocouple has a process end and a cold junction end. The cold junction end has first and second cold junction terminals. The cold junction sensor is supported near the cold junction end and configured to measure temperature at the cold junction end. The circuit is electrically connected to the cold junction sensor and to the first and second cold junction terminals. The circuit is configured to produce a thermocouple signal as a function of voltage across the first and second cold junction terminals and to produce a cold junction sensor signal as a function of temperature of the cold junction end as measured by the cold junction sensor. The circuit is further configured to calculate a correlation between the thermocouple signal and the cold junction sensor signal.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal sensor power savings using a toggle control. In some embodiments, an integrated circuit (e.g., a memory device) includes an on-die thermal sensor, a storage element (e.g., a register), and toggle logic. The toggle logic may transition the thermal sensor from a first power consumption level to a second power consumption level responsive, at least in part, to a toggle indication.

Abstract: In a method for diagnosing a faulty thermostat in a coolant circuit, in particular for an internal combustion engine, having a fan, the faulty thermostat is detected as a function of a measured temperature and a setpoint temperature, the fan being turned on at least temporarily during the diagnosis.

Abstract: Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.

Abstract: An optical measurement instrument includes one or more temperature sensors (122) arranged to measure sample well specific temperatures from sample wells (111-117) arranged to store samples (103-109) to be optically measured. A processing device (121) of the optical measurement instrument is arranged to correct, using a pre-determined mathematical rule, measurement results obtained by the optical measurements on the basis of the measured sample well specific temperatures. Hence, the adverse effect caused by temperature differences between different samples on the accuracy of the temperature correction of the measurement results is mitigated.

Abstract: In one example embodiment, a board for measuring device temperatures comprises a base and one or more fingers extending from the base. The base and the one or more fingers comprise a flexible material. One or more first temperature sensors are disposed on the one or more fingers. One or more second temperature sensors are disposed on the base. Each of the first and second temperature sensors comprises a partially thermally isolated temperature sensor.

Abstract: The present invention comprises a method for testing the accuracy and the reliability of a thermal unit of a thermal cycler or of an enclosure of a PCR thermal cycler thermally controlled by pulsed air, said thermal unit and enclosure thermally controlled by pulsed air comprising a plurality of locations for reaction mixture tubes, said method comprising the following steps: a) arranging a set of temperature-measuring sensors in locations for reaction mixture tubes selected in said thermal unit and enclosure thermally controlled by pulsed air, said temperature-measuring sensors comprising: (i) a reaction tube suited to the type of thermal unit tested, (ii) a selected volume of liquid at least partially filling said reaction tube, (iii) a thermal probe at least partially submerged in said liquid, and (iv) at least one means for linking said thermal probe to a means for receiving a signal generated by said thermal probe, ?said locations in which said temperature-measuring sensors are arranged being distri

Abstract: A temperature detector includes a plurality of comparators, an electronic component and a controller. Each of the comparators is responsible for detecting different temperature ranges. The electronic component has a temperature-dependent threshold voltage and an output connected to inputs of the plurality of comparators. The controller is configured to enable only one of the comparators at one time and to generate a value to the other inputs of the plurality of comparators.

Abstract: A system and method is presented for a multi-sensor component for an HVAC system. The multi-sensor component comprises a sensor assembly, having one or more detectors, comprising a plurality of temperature detectors operable to measure a temperature of an object or a medium, a presence detector operable to detect the presence of the object or medium, and a pressure detector operable to measure a pressure of the medium. The multi-sensor component also comprises a sensor monitor operably coupled to the detectors of the sensor assembly and configured to use a detection algorithm operable to detect one or more of the temperature, pressure and presence of the object or medium, the sensor monitor configured to verify a health of the one or more detectors of the sensor assembly, and also comprises a sensor housing or thermo-well or combination thereof having the sensor assembly and the sensor monitor affixed therein.

Abstract: Biochemical assay apparatus uses a container with a sleeve of electrically-conductive material (300) to heat it. The heating is done inside a chamber and a contactless heat sensor (110) such as a thermopile or a bolometer, also inside the chamber, is used to monitor the temperature of the electrically conductive material (300). There are many factors that distort the output of the heat sensor (110), particularly as the temperature rises and properties such as emissivity change, or as time goes by and tarnishing and dust affect the heat sensor output. Because the sleeve has low thermal mass and heat transfer only has to happen over short distances, it is relatively easy to calculate a change in actual temperature of the electrically conductive material (300) when subjected to a known pulse of drive current and this property can be used to calibrate the performance of the heat sensor (110) in situ in the chamber.

Abstract: A temperature sensor is provided. The temperature sensor includes: a temperature sensing unit for sensing a temperature and outputting a temperature sensing signal; an analog-to-digital converter (ADC), coupled to the temperature sensing unit, for converting the temperature sensing signal to a digital value, having an ADC output range; a calibration unit, coupled to the ADC, for correlating the ADC output range with at least one temperature range; a memory unit, coupled to the calibration unit, recording the ADC output range, and the at least one temperature range, and the correlation therebetween.

Abstract: Temperature-indicting system including a mechanical temperature-indicating system including a bourdon tube for directly driving an indicating pointer, and an electrical temperature-indicating system including an electronic sensor, a transmitter and one or more electrical switches. The transmitter is modular and easily replaceable. Output of the pointer and the transmitter is synchronized relative to accuracy so that comparison of switch points of the switches that correlate temperature determined by the mechanical system and temperature determined by the electronic system enables detection of a failure or inaccuracy in one or both systems.

Abstract: Circuitry is disclosed for the calibration of heating element and ambient temperature sensors, comprising: a) an amplifier having positive and negative inputs, and an output; b) one or more heating MOS transistors selectably coupled in parallel and having 1) a heating transistor drain coupled to the positive input of the amplifier; 2) a heating transistor source configured to receive a supply voltage; and 3) a heating transistor gate coupled to the amplifier output; c) one or more ambient MOS transistors selectably coupled in parallel and having 1) an ambient transistor drain, 2) an ambient transistor gate coupled to the amplifier output; and 3) an ambient transistor source configured to receive the supply voltage; d) a temperature difference resistance configured: 1) to be coupled at least partially between an ambient connection and the ambient transistor drain; and 2) to be coupled at least partially between the ambient connection and the negative input of the amplifier.

Abstract: An apparatus for measuring a characteristic and a chip temperature of an LED includes a thermal conductive component. An LED chip is disposed on the thermal conductive component. A temperature control unit is connected to the thermal conductive component for providing a temperature to the thermal conductive component, and therefore providing the temperature to the LED chip via the thermal conductive component. A power-source and voltage-meter unit provides a current to the LED chip, and measures a voltage value of the LED chip. Under a measurement mode, the current is featured with a current waveform having a high current level and a low current level which are alternatively changed, for applying to the LED chip. Measurements are conducted respectively corresponding to the high current level and the low current level, and a correlation curve between the voltage and the temperature can be obtained with the results of measurement.

Abstract: A procedure for a reasonability check of the signal of a temperature sensor that is arranged in a reducing tank, in particular a HWL-tank, is thereby characterized, in that the tank level is detected by a tank level sensor that is arranged almost at the same filling level position as the temperature sensor, in that the tank level sensor signal is compared to the temperature sensor signal and then, if default tank level sensor signals correlate within default limits with default temperature sensor signal values, a functioning temperature sensor and/or a functioning tank level sensor are indicated.

Abstract: A diverse and redundant resistance temperature detector (“D&R RTD”) is provided. The D&R RTD is utilized in obtaining temperature readings in environments, such as fluids and gasses, by measuring electrical characteristics of the D&R RTD that are influenced by the temperature. Furthermore, the D&R RTD's are arranged such that a plurality of measurements can be obtained, which provides sufficient diversity and redundancy of the measurements for enhanced diagnostics to be performed, such as optimization for fast dynamic response, calibration stability, in-situ response time testability, and in-situ calibration testability.

Abstract: A water heater is provided with monitor/diagnostic display apparatus that selectively provides a user with visual or other type of indicia of the recovery time for the water heater. The apparatus includes a monitoring unit that may be mounted on the water heater, and a display unit that may be mounted either on the water heater or remotely therefrom.

Abstract: This method for calibrating an electronic chip comprises: the placing of a calibration transducer of a chip to be calibrated in contact (144) with a first element and the measurement of a corresponding temperature variation ?Tc with this calibration transducer, the calibration thermal transducer having thermal characteristics different from those of the normal transducer so as to measure a temperature variation ?Tc that is different from a variation ?T1 measured by the normal transducer, and the calibration (154, 156) of the chip to be calibrated on the basis of the measured variations ?T1 and ?Tc.

Abstract: A sensor (10; 34) for measuring and/or detecting a fouling that forms on one surface of the sensor, includes the following: —a substrate (22) that is used for heat insulation, —at least one heating element (16; 36; 58; 78) arranged on one side on the substrate that is able to diffuse, on command, a homogenous, monitored heat flow from the side opposite the substrate, —a single temperature measuring element (18; 38; 56; 80) with dimensions that are smaller than those of the at least one heating element and positioned above and at the center of the latter, on the side opposite the substrate, in order to be in the most homogeneous part of the heat flow.

Abstract: Methods and systems for calibrating a temperature control system in a vapor deposition chamber. A temperature sensor senses temperature within a semiconductor processing chamber and generates an output signal. A temperature control system controls a chamber temperature by controlling a heating apparatus based on the output signal. A method includes instructing the control system to target a setpoint temperature, and depositing a layer of material onto a surface in the chamber by a vapor deposition process. A variation of a property of the layer is measured while depositing the layer, the property known to vary cyclically as a thickness of the layer increases. The measured property is allowed to vary cyclically for one or more cycles. If there is a difference between a time period of one or more of the cycles and an expected time period associated with the setpoint temperature, the temperature control system is adjusted based on the difference.

Abstract: The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.

Abstract: An electronic pacifier thermometer is provided. The electronic pacifier thermometer is composed of a pacifier device and a measurement device. The pacifier device has a built-in temperature sensing element (e.g., a temperature sensor) and a connector element. The measurement device contains a display, a circuit board mainly which is controlled by an integrated circuit, and a cable element. The circuit board contains an incomplete temperature measurement circuit that would be made complete through connection to the temperature sensing element. The temperature measurement circuit has a reference resistor (could also be installed inside the pacifier device) whose resistance difference is relative to the temperature sensing element in the pacifier device which is linearly corresponds to the temperature difference between the measured temperature and a pre-determined temperature value.

Abstract: A zero-heat-flux DTT measurement device is constituted of a flexible substrate supporting an electrical circuit including a heater trace defining a heater, thermal sensors, and a thermal sensor calibration circuit.

Abstract: A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range.

Abstract: An automatic auto-correcting method is presented to improve the accuracy of fiber optic distributed temperature measurements derived from Raman back scatterings utilizing two light sources with different wavelengths, by appropriate choice of the wavelengths of the two sources, the use of single pulse modulating circuit for the two light sources, and use of one of the light sources as a primary measurement system and the second light source as an occasional correcting source.

Abstract: A method for calibrating a superheat sensor (5) for a refrigeration system is provided. The method comprises the following steps. Increasing an amount of liquid refrigerant in the evaporator (1), e.g. by increasing an opening degree of the expansion valve (3). Monitoring one or more parameters, e.g. the temperature of refrigerant leaving the evaporator (1), said parameters reflecting a superheat value of the refrigerant. Allowing the value of each of the parameter(s) to decrease. When the value(s) of the monitored parameter(s) reaches a substantially constant level, defining the superheat value corresponding to the constant level to be SH=0. The superheat sensor (5) is then calibrated in accordance with the defined SH=0 level. When the parameter(s) reaches the substantially constant level it is an indication that liquid refrigerant is allowed to pass through the evaporator (1), and thereby that the superheat of the refrigerant leaving the evaporator (1) is zero.

Abstract: A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamber. A light detector then detects the amount of light that is being transmitted through the substrate. The amount of detected light energy is then used to calibrate a temperature measurement device that is used in the system.

Abstract: The publication discloses a method for determining a temperature of a substrate, comprising: providing a gas channel that is confined by at least one wall having a certain wall temperature; providing a substrate in said gas channel, proximate to the at least one wall, such that a gap exists between a surface of the substrate and the at least one wall; providing a gas flow with a certain mass flow rate through said gas channel, which gas flow extends at least partially through said gap; determining a pressure drop in the gas flow along the gas channel; and deriving from said pressure drop the temperature of said substrate using a pre-determined relation between the pressure drop along the gas channel, the wall temperature and the temperature of the substrate, at said mass flow rate. Also disclosed is a device for implementing the disclosed method.

Abstract: A system and method are disclosed for controlling a drywell including a receiver having upper and lower ends with the lower end being more insulated than the upper and having a temperature sensor in thermal contact therewith. Upper and lower heaters are in thermal contact with the upper and lower ends respectively. A controller includes an integrated circuit having a temperature sensor. A reading from the integrated circuit is used to control power to the upper heater and reduce a temperature gradient between the upper and lower ends of the receiver.

Abstract: A method and apparatus for estimating the temperature sensed upon contact with a surface. The method includes contactless heating of the surface, contactless measurement of a time change in temperature of the surface, and estimation of the temperature sensed upon contact with the surface on the basis of this time change in temperature.

Abstract: The present invention relates to a calibration circuit, computer program product, and method of calibrating a junction temperature measurement of a semiconductor element, wherein respective forward voltages at junctions of the semiconductor element and a reference temperature sensor are measured, and an absolute ambient temperature is determined by using the reference temperature sensor, and the junction temperature of the semiconductor element is predicted based on the absolute ambient temperature and the measured forward voltages.

Abstract: Some embodiments include apparatus and methods having a first switch, a second switch, and a circuit coupled to the first and second switches. The first switch may be configured to switch between an on-state and an off-state based on a value of a first current flowing through a number of resistors and a diode coupled in series with the resistors. The second switch may be configured to switch between the on-state and the off-state based on a value of a second current on a circuit path. The second current is a function of a voltage at a node between two of the resistors and a resistance of the circuit path. The circuit may be configured to provide a temperature reading based on the number of times the first switch or the second switch switches between the on-state and the off-state during a time interval.

Abstract: Temperature-indicting system including a mechanical temperature-indicating system including a bourdon tube for directly driving an indicating pointer, and an electrical temperature-indicating system including an electronic sensor, a transmitter and one or more electrical switches. The transmitter is modular and easily replaceable. Output of the pointer and the transmitter is synchronized relative to accuracy so that comparison of switch points of the switches that correlate temperature determined by the mechanical system and temperature determined by the electronic system enables detection of a failure or inaccuracy in one or both systems.

Abstract: A method and an apparatus for diagnosis of a flowmeter are disclosed. The method includes thermally coupling a first sensor unit of the flowmeter to a fluid and thermally coupling a second sensor unit of the flowmeter to the fluid. The method also includes actively heating or cooling the first sensor unit by applying power to the first sensor unit such that its temperature is different from the temperature of the fluid, and simultaneously actively heating or cooling the second sensor unit by applying power to the second sensor unit such that its temperature is different from the temperature of the fluid, and typically from the temperature of the first sensor.

Abstract: A self-calibrating, wide-range temperature sensor includes a current reference, impervious to process and voltage, with the current reference mirrored into two oppositely-sized bipolar transistors or diodes. Duplicate current sources are used with a ratio of geometries between them, such that the larger current biases the smaller bipolar transistor (less cross-sectional area) and the smaller current source biases the larger bipolar transistor (higher cross-sectional area). The current source in conjunction with the differential temperature sensing provides inherent calibration without drift while the differential sensing, from the ratio of geometries in the current paths also increases sensitivity.

Abstract: A method of calibrating a position sensor in an automotive transmission having a transmission housing having mounted therein a casing (10) for the position sensor which includes a pressure member (14) movably supported in the casing (10), and an electrical displacement sensor (38) actuated by the pressure member (14) for measuring the position of the pressure member (14) relative to the casing (10), such that, after the casing (10) of the position sensor has been mounted in the transmission housing, the displacement sensor (38) is used for performing at least one calibration measurement for at least one gear position, and, for each gear position to be detected, a tolerance range for the corresponding measurement value of the displacement sensor is defined on the basis of the result of the calibration measurement.

Abstract: A rationality diagnosis method and a rationality diagnosis apparatus for a sensor inside a tank are provided. The rationality diagnosis method and the rationality diagnosis apparatus can accurately and easily perform a diagnosis to determine whether rationality of all sensors is maintained. The rationality diagnosis method for the sensor inside the tank performs a rationality diagnosis of a concentration sensor, a liquid level sensor and a temperature sensor that are provided inside the tank that stores liquid. The rationality diagnosis method is characterized by diagnosing whether the rationality is lost in one of the concentration sensor, the liquid level sensor and the temperature sensor by determining whether there exists any contradiction between respective sensor values of the concentration sensor, the liquid level sensor and the temperature sensor.

Abstract: A method and apparatus for determining an operating voltage lower bound for preventing photovoltaic (PV) cell reverse breakdown during power conversion. The method comprises determining a PV cell operating temperature; computing, at a controller, an operating voltage corresponding to a maximum power point (MPP) based on the PV cell operating temperature; and determining, at the controller, an operating voltage lower bound based on the operating voltage.

Abstract: A device and method for investigating phase transformation properties and structural changes of materials. In one form, the device simulates actual thermal processing conditions, while the method can be used in both simulations as well as in actual processing conditions. An analysis using at least one of the device and method is referred to as a single sensor differential thermal analysis, as it compares the temperature recorded in a measured specimen against a reference thermal history without requiring the derivation of the reference thermal history from measured reference temperatures.

Abstract: A system and method are disclosed for controlling a drywell including a receiver having upper and lower ends with the lower end being more insulated than the upper and having a temperature sensor in thermal contact therewith. Upper and lower heaters are in thermal contact with the upper and lower ends respectively. A controller includes an integrated circuit having a temperature sensor. A reading from the integrated circuit is used to control power to the upper heater and reduce a temperature gradient between the upper and lower ends of the receiver.

Abstract: The presently described embodiments are directed to a calibration method and system for thin film thermistors that are locally heated with integrated thin film heaters. Initially, print head temperature is either measured or referenced. Then, transient thermistor resistances are measured and used to determine the thermistor resistance at a higher temperature. Notably, this calibration method is advantageously implemented as a step of an existing process without having to expose the print heads to operating temperatures. In some implementations of the presently described embodiments, trimming of the thermistors may be required once calibrated.