Abstract: The invention relates to a temperature calibrating system (1) comprising a thermo siphon, a heat pipe or an equivalent (2) connected between a cooling unit (4) and a temperature calibration unit (3), where the system (1) further comprises an external chamber (8) connected to the heat pipe/thermo siphon or equivalent (2) for controlling the thermal conductivity between the two units and where the temperature of the external chamber (8) is held at a certain temperature, for example ambient temperature or a temperature controlled by external means. The external chamber (8) can be connected to the heat pipe/thermo siphon (2) via a conduit (9) which connection point is placed above liquid level at a evaporating end of the heat pipe/thermo siphon (2) and in that the external chamber (8) is arranged below the connection between the conduit (9) and the heat pipe/thermo siphon (2).

Abstract: The invention relates to systems and methods for calibrating and using resistance temperature detectors. In one embodiment, the system includes a calibration circuit comprising a resistance temperature detector in a bridge circuit with at least one potentiometer, and a programmable gain amplifier coupled to the bridge circuit. Embodiments of the invention further comprise methods for calibrating the bridge circuit and the programmable gain amplifier for use with the resistance temperature detector and methods for determining the self heating voltage of the bridge circuit.

Abstract: A heat conduction-type sensor corrects (calibrate) effects of a temperature of a measurement target fluid and a type of the fluid on a measurement value in measurement of a flow velocity, a mass flow, or an atmospheric pressure. Also provided is a thermal flow sensor and a thermal barometric sensor with this correcting function, high sensitivity, simple configuration, and low cost. At least two thin films that are thermally separated from a substrate through the same cavity are provided, one thin film comprises a heater and a temperature sensor, and the other thin film comprises at least one temperature sensor, the temperature sensors being thin-film thermocouples. The thin film is arranged in proximity so that it is heated only through the measurement target fluid by heating of the heater. A calibration circuit calculates and compares quantities concerning heat transfer coefficients of a standard fluid and the unknown measurement target fluid.

Abstract: In one embodiment, a system includes a first cold noise source, a first radiometer receiver, and a first detector. The first cold noise source generates a first thermal radiation signal having a first carrier frequency band. The first thermal radiation signal carries a first information signal. The first cold noise source also transmits the first thermal radiation signal through a first antenna. The first radiometer receiver receives the first thermal radiation signal through a second antenna, and the first detector extracts the first information signal from the first thermal radiation signal.

Abstract: An imaging thermographic measuring system to measure the thermal output (Qout) at a target object, such as a building wall, building facade, or the like, comprising a measuring station provided for the arrangement distant from the object with an electric imaging device to record a thermographic thermal image, with a temperature distribution to be allocated thereto, and with a temperature sensor distant from the object to measure a temperature (Tref) distant from the object; at least one thermal transition sensor provided to be arrange close to the object, a transmission arrangement to transmit values between at least one thermal transition sensor and the measuring station, with the thermal transition sensor being embodied to predetermine the test values to determine a thermal transition coefficient (h).

Abstract: Methods and systems for compensating temperature measurements by a temperature gauge comprising a first temperature sensor and a second reference temperature sensor, having different thermal properties, located in the same temperature environment to be measured. The methods and systems compensate for errors in the measured temperatures due to variations in the reference sensor caused by temperature effects.

Abstract: A method for manufacturing a contact temperature sensor to be used at a temperature of use, including a) supplying a carbon fiber; b) heat treating of the fiber at a temperature higher than 800° C. and higher than the temperature of use; c) full layer depositing on the fiber, at a deposition temperature, an electrically insulating ceramic coating layer stable at the temperature of use, the ceramic material chosen among silica (SiO2), zirconia (ZrO2), and alumina (Al2O3); d) heat treating of the fiber, coated with the coating layer, at a temperature higher than the deposition temperature of the coating layer and higher than the temperature of use, or (c?) full layer depositing on the fiber a first coating layer of silicon carbide; d?) full layer depositing the first coating layer a second coating layer of boron nitride; e?) heat treating the fiber thereby obtained at a temperature above the deposition temperatures and the temperature of use of the sensor.

Abstract: A system includes a first module, a second module, and a third module. The first module determines a first temperature and a first power dissipation value of a thermistor based on a resistance of a first resistor connected in series with the thermistor. The second module, after disconnecting the first resistor and connecting a second resistor in series with the thermistor, determines a second temperature and a second power dissipation value of the thermistor based on a resistance of the second resistor. The third module determines a thermal dissipation factor based on the first and second temperatures and the first and second power dissipation values, and corrects temperature sensed by the thermistor based on the thermal dissipation factor.

Abstract: In a hydrogen tank, discharge of a hydrogen gas may cause lowering of the temperature to a value at which it is assumed that disconnection has occurred in a thermistor. A temperature detection system for the hydrogen tank estimates the possibility that the temperature of the hydrogen tank is below this temperature value, according to the ambient temperature and the internal pressure. Only when there is no possibility that the temperature is below the value, disconnection is judged to have occurred.

Abstract: A temperature sensor plausibility diagnosis unit performs plausibility diagnosis of a temperature sensor disposed inside a storage tank in an exhaust purification apparatus of an internal combustion engine that delivers an additive inside the storage tank to an exhaust pipe upstream of a reduction catalyst and selectively reduces and purifies NOx in the exhaust. The temperature sensor plausibility diagnosis unit includes an additive heat capacity calculating portion that calculates the heat capacity of the additive, a heat quantity variation calculating portion that calculates an increase or decrease in the quantity of heat that the additive receives, and a plausibility diagnosing portion that determines the plausibility of the temperature sensor by comparing an estimated temperature course of the additive estimated from the heat capacity of the additive and the increase or decrease in the quantity of heat with a sensor temperature course of the additive detected by the temperature sensor.

Abstract: Disclosed is a cargo deck for a cargo hold of an aircraft, comprising at least one temperature measuring device for non-contacting measurement of the temperature of a container, a pallet or a similar unit load device (ULD).

Abstract: A temperature measuring device which measures a temperature of a heat treatment mechanism in a heat treatment apparatus which heat-treats a substrate with a predetermined temperature using the heat treatment mechanism, includes: a substrate and a Wheatstone bridge circuit which is disposed on the substrate and includes a plurality of temperature-measuring resistors whose resistance is varied depending on a change in temperature.

Abstract: The invention pertains to flexible devices used for zero-heat-flux, deep tissue temperature measurement, especially to disposable temperature measurement devices. Such a device is constituted of a flexible substrate. An electrical circuit is disposed on a side of the substrate. The electrical circuit includes first and second thermal sensors disposed, respectively, on first and second substrate layers. A heater trace is disposed on the first substrate layer with the first thermal sensor. The first and second substrate layers are separated by a flexible layer of insulation disposed between the first and second substrate layers. The heater trace defines a heater with a central portion that operates with a first power density and a peripheral portion around the central portion that operates with a second power density greater than the first power density.

Abstract: A method of calibrating an adjustable control device using a knob assembly with adjustable temperature scale. A knob and a bezel that bears the temperature scale are assembled and the temperature scale is calibrated without physically changing any internals within the adjustable control device. The knob and bezel are secured to the adjustable control device so that the knob and bezel assembly can transmit an input load from a user through to the adjustable control device and so that the bezel can be rotated relative to the knob which remains fixed to an input shaft of the control for calibration purposes.

Abstract: A zero-heat-flux DTT measurement device is constituted of a flexible substrate supporting an electrical circuit including a heater trace defining a heater, thermal sensors, and a thermal sensor calibration circuit.

Abstract: A method for testing a measuring device is used to determine a permittivity of a frying fat which permittivity is inter alia dependent on the temperature, while taking into consideration the temperature. The method is characterized in that the permittivity is measured at least two different temperatures and the temperature dependence is determined and is used to make a statement on the ability to function of the measuring device.

Abstract: A system and method is disclosed that reliably determines the transmissivity of a substrate. By determining the transmissivity of a calibration substrate, for instance, a temperature measuring device can be calibrated. The method and system are particularly well suited for use in thermal processing chambers that process semiconductor wafers used for forming integrated circuit chips.

Abstract: A temperature measurement circuit includes a sensing unit and a temperature translation unit. The sensing unit is arranged for generating a positive temperature coefficient characteristic and a negative temperature coefficient characteristic according to a temperature. The temperature translation unit is coupled to the sensing unit, and is arranged for generating a measured temperature according to the positive temperature coefficient characteristic and the negative temperature coefficient characteristic.

Abstract: A system and method for providing greatly improved linear heat detection using fiber optic distributed temperature systems (DTS). The invention makes use of correction algorithms based on proportional-integral-derivative notions that anticipate exterior temperature increases based on the rate of measured temperature changes.

Abstract: A temperature sensor, capable of operating in electromagnetic and/or electric environments such as electrical generators, motors and transformers and/or in environments where vibratory conditions are frequent or continuous, contains at least one light emitting optic fiber and one light receiving optic fiber and an electrically non-conductive dilatable object which variably occults the emitted light as the object's temperature varies. The light receiving optic fiber transmits light intensity and light intensity changes to an electronic device that may include a photometer and light-to-temperature computing equipment.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for the dynamic power control of a memory device thermal sensor. In some embodiments a memory device includes an on-die thermal sensor and enable logic to dynamically enable or disable the on-die thermal sensor. In some embodiments, the on-die thermal sensor senses thermal data responsive to a thermal data sense indication. The thermal data sense indication may be received subsequent to the expiration of a delay period.

Abstract: An infra-red imaging camera comprises focusing optics for gathering infra-red energy from an external scene, and an uncooled and unshielded detector arranged to detect infra red energy. Internal temperature sensing together with approximation of the temperature response of the camera provides a time varying calibration that allows the infra-red energy received at the detector to be used as a temperature measurement for objects in the camera's field of view.

Abstract: A method of forming a thermocouple (12), including: depositing a first material on a component (10) to form a first leg (14); depositing a second material through a mask (30) to form a pattern (50) on the component (10), the pattern (50) forming a plurality of discrete second leg junction ends (20) and a continuous patch (52) of the second material comprising indiscrete lead ends of the second legs (16), each second leg junction end (20) spanning from a respective junction (18) with the first leg (14) to the continuous patch (52); and laser-ablating the continuous patch (52) to form discrete lead ends (22) of the second legs (16), each lead end (22) electrically connected to a respective junction end (20), thereby forming discrete second legs (16).

Abstract: A temperature measuring device incorporates a fixed point cell to provide an integrated structure. The fixed point cell houses a pure substance within a substantially cylindrical graphite crucible. The pure substance is to be melted to give an absolute temperature. The crucible is enclosed within a sealed metal container. An annular metal tube surrounds the container and the inner wall of the tube is formed by the outer peripheral wall of the container. This provides excellent heat conduction from the interior of the tube to the interior of the crucible. The tube is arranged to define either a heat pipe or a thermal siphon and includes an appropriate vaporizable fluid.

Abstract: A method of calibrating a thermal sensor includes setting a wafer to a control temperature. The wafer includes the thermal sensor and other chip logic. The method also includes applying power exclusively to a thermal sensor circuit, calibrating the thermal sensor, and storing a calibration result. The method also includes retrieving the calibration result upon application of power to the other chip logic.

Abstract: A temperature detecting apparatus includes an integrated circuit that integrates an overheating detecting circuit, a breakage detecting circuit and a disabling circuit, and an element connection terminal connecting a temperature sensing element. The disabling circuit disables the breakage detecting circuit from detecting a breakage of wire when a voltage at the element connection exceeds a disabling threshold which is set higher than an overheating detection threshold and a breakage detection threshold. A predetermined voltage higher than the disabling threshold is applied to the element connection terminal when the temperature sensing element is not connected to the element connection terminal.

Abstract: An instrument for performing highly accurate PCR employing an assembly, a heated cover, and an internal computer, is provided. The assembly is made up of a sample block, a number of Peltier thermal electric devices, and a heat sink, clamped together. A control algorithm manipulates the current supplied to thermoelectric coolers such that the dynamic thermal performance of a block can be controlled so that pre-defined thermal profiles of sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block/heat sink assembly can be changed to another of the same or different design.

Abstract: Embodiments of the present invention generally relate to methods and apparatus for measuring, calibrating, and controlling substrate temperature during low temperature and high temperature processing.

Abstract: The specific heat of a working fluid flowing along a channel is measured without having to provide an explicit flow rate correction. A specific heat sensing probe is configured with a stagnation enclosure surrounding a thermal transfer sensor. The stagnation enclosure is designed to provide a stagnation chamber in throttled communication with an outside of the enclosure so that the working fluid can flow into and out of the stagnation chamber at a seepage rate substantially less than the fluid flow rate. The thermal transfer sensor is operable to exchange heat with adjacent fluid and to provide a signal representative of the quantity of heat exchanged.

Abstract: An apparatus for ascertaining and/or monitoring at least one temperature. The apparatus includes, according to a first variable, at least one temperature sensor, at least one reference temperature sensor and at least one heating/cooling unit, which is thermally coupled with the temperature sensor and with the reference temperature sensor. According to a second variant, the invention includes that at least one reference temperature sensor and the temperature sensor and the reference temperature sensor are embodied and placed in such a manner that they measure essentially the same temperature. At least one head transmitter is provided, which connects the temperature sensor and the reference temperature sensor with the head transmitter in such a manner that the head transmitter receives the data measured by the temperature sensor and the reference temperature sensor. At least one memory unit is provided, in which the measured data of the temperature sensor and the reference temperature sensor are storable.

Abstract: The present invention relates to the use of one or more amplicons as temperature calibrators. In some embodiments, the calibrators may be used to calibrate the temperature of a microfluidic channel in which amplification and/or melt analysis is performed. In some embodiments, the amplicons may be genomic, ultra conserved elements and/or synthetic. The amplicon(s) may have a known or expected melt temperature(s). The calibrators may be added to primers of study or may follow or lead the primers of study in the channel. The amplicon(s) may be amplified and melted, and the temperature(s) at which the amplicon(s) melted may be determined. The measured temperature(s) may be compared to the known temperature(s) at which the amplicon(s) was expected to melt. The difference(s) between the measured and expected temperatures may be used to calibrate/adjust one or more temperature control elements used to control and/or detect the temperature of the channel.

Abstract: When the driving wind and the cooling wind are generated, based on the phenomenon in which the temperature difference is generated between the front surface and the rear surface of the radiator (14), the temperature difference between the detection value of the rear temperature sensor (22) and the detection value of the front temperature sensor (21) is compared with the abnormality determination value so that it is determined whether the front temperature sensor (21) and the rear temperature sensor (22) are properly fixed on the radiator (14), whereby it is determined whether the abnormality (unauthorized alteration) exists. By setting the abnormality determination value according to the ambient temperature and the vehicle speed, corresponding to a variation in temperature difference between the front surface and the rear surface of the radiator (14), the abnormality determination value is varied to be set at a proper value.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: A method of calibrating a temperature sensor of a chemical microreactor envisages: determining an airflow along a path in such a way as to cause a thermal exchange between the airflow and a chemical microreactor, which is provided with an on-board temperature sensor and is set along the path; and detecting a temperature in the airflow downstream of the microreactor, in conditions of thermal equilibrium.

Abstract: A temperature sensor circuit includes a band-gap reference voltage circuit. The resistor and diode-connected bipolar transistor of the band-gap reference voltage circuit are separated into a transistor-resistor series circuit and a transistor-diode series circuit. The transistor-resistor series circuit is configured such that an emitter of the bipolar transistor Q21 is connected to a power supply voltage terminal VCC, a collector thereof is grounded via the resistor R2. The transistor-diode series circuit is configured such that an emitter of the bipolar transistor Q20 is connected to the power supply voltage terminal VCC, a collector thereof is connected to a collector of the diode-connected bipolar transistor Q19, and an emitter of the diode-connected bipolar transistor is grounded. A voltage divider circuit 5 having a plurality of output terminals is connected to the transistor-resistor series circuit and the transistor-diode series circuit via first and second buffer circuits 3 and 4, respectively.

Abstract: An apparatus for detecting a temperature using transistors includes a plurality of temperature detecting units that become selectively active according to predetermined temperature intervals; and a detection signal output unit that generates detection signals according to the signals transmitted by the plurality of temperature detecting units, and outputs the detection signals.

Abstract: A system and method for compensating for thermal drift. A temperature is measured in a meter as a temperature voltage. The temperature voltage is converted to a digital signal. The digital signal is processed to generate an offset voltage in response to the digital signal. The offset voltage is applied as an input to an amplifier. The amplifier receives as a second input a gauge voltage. An output is generated from the meter that corrects the gauge voltage using the offset voltage to compensate for thermal drift.

Abstract: Temperature detection circuitry is selectively coupled to a thermistor and one of two sources representing the impedance at respective ends of the expected range of temperature to which the thermistor is to be exposed. The offset of an amplifier and a scale factor to account for gain set of the amplifier are determined in an automatic calibration process while coupled to the source(s), and thereafter temperature readings are taken from the thermistor. During the calibration process, if the gain or scale factor are outside of expected ranges, a failure is determined and an alarm given and/or a heater is disabled.

Abstract: The present application is directed to a system for verifying calibration of a temperature sensor comprising an above-ambient temperature verifier and a below-ambient temperature verifier. The above-ambient temperature verifier includes a first housing containing an ohmic material. At least one pair of electrodes is provided to direct an applied current through the ohmic material to heat the material. A well is provided within the ohmic material for accepting a temperature sensor. A compression assembly cooperates with the ohmic material to create intimate contact with the temperature sensor. An above-ambient reference temperature monitor maintains a calibrated temperature within the ohmic material. The below-ambient temperature verifier includes a second housing and a below-ambient reference temperature monitor to maintain a calibrated temperature of a below-ambient temperature medium.

Abstract: A tip assembly for an IR thermometer apparatus includes a heat sink having a heat sink cavity and a tip section and a fluid path and at least one hydraulic port. The tip assembly also includes an IR sensor mechanically seated in the tip section and thermally coupled to the heat sink. The tip assembly also includes an electrical connector configured to provide an electrical connection to the tip assembly. A fluid having a fluid temperature is introduced into the fluid path via the hydraulic port. The fluid causes the heat sink and the IR sensor to substantially reach one or more pre-determined temperatures by thermal conduction during calibration of the tip assembly. Another tip assembly having an internal heat source is described. Another tip assembly having an internal heat pump is described. A method to calibrate a tip assembly is also described.

Abstract: A temperature measuring apparatus includes a light source, a first splitter, a second splitter, a reference beam reflector, an optical path length adjuster, a reference beam transmitting member, a first to an nth measuring beam transmitting member and a photodetector. The temperature measuring apparatus further includes an attenuator that attenuates the reference beam reflected from the reference beam reflector to thereby make an intensity thereof closer to an intensity of the measurement beam reflected from the temperature measurement object.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: The invention relates to a method for monitoring a sensor unit (20) that is arranged in the exhaust gas region of an internal combustion engine (10). According to the invention, a sensor temperature (31, 32) is directly or indirectly determined by the sensor unit (20), and is compared to an exhaust temperature (33) that is determined by a further sensor unit and/or to model variables and/or to defined threshold values, whereby a dismounting and/or an inappropriate mounting of the sensor unit is indicated.

Abstract: Some embodiments include apparatus and methods having a first switch, a second switch, and a circuit coupled to the first and second switches. The first switch may be configured to switch between an on-state and an off-state based on a value of a first current flowing through a number of resistors and a diode coupled in series with the resistors. The second switch may be configured to switch between the on-state and the off-state based on a value of a second current on a circuit path. The second current is a function of a voltage at a node between two of the resistors and a resistance of the circuit path. The circuit may be configured to provide a temperature reading based on the number of times the first switch or the second switch switches between the on-state and the off-state during a time interval.

Abstract: A thermostat diagnostic apparatus is provided with a cooling medium temperature sensor, an engine operating condition sensor and a malfunction diagnosing device. The malfunction diagnosing device is configured to diagnose a stuck-open malfunction of a thermostat provided in a coolant flow passage of an engine installed in a mobile body based on a comparison of a real cooling medium temperature detected by the cooling medium temperature sensor and an estimated cooling medium temperature estimated based on an engine operating condition of the engine detected by the engine operating condition sensor. The malfunction diagnosing device determines that the thermostat is stuck in an open state upon determining that either the estimated cooling medium temperature or the real cooling medium temperature exceeds a prescribed reference value during a period in which an increased heat exchange rate condition of a radiator is satisfied continuously.

Abstract: In a body temperature measuring system, power consumption of a data reading device is reduced. A clinical thermometer of this invention is a body temperature measuring system including a body temperature tag and a data reading device. A processing unit of the body temperature tag includes a power supply circuit, a semiconductor temperature sensor for detecting a band gap voltage, and a storage unit configured to store calibration data to calibrate the detected band gap voltage, and is configured to, upon activating the power supply circuit, send the detected band gap voltage via the antenna unit together with the calibration data. The data reading device includes an excitation unit, and a sensing unit configured to sense a change in a magnetic field generated by excitation. The power level of the excitation unit is changed upon sensing the change in the magnetic field.

Abstract: A method for providing control signals to a fan in a computer system is described. During the method, an electronic device receives temperature measurements and a fan-speed measurement performed in the computer system. Using a pattern-recognition model, the electronic device validates the measurements, and excludes any inaccurate measurements, such as those associated with drifting or failed sensors. Next, the electronic device determines control signals for a fan in the computer system using a model of coolant flow in the computer system and/or a slope of a phase-frequency curve of a cross power spectral density function corresponding to a pair of temperature profiles measured, as a function of time, by a pair of thermal sensors. Then, the determined control signals are provided to the fan.

Abstract: Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafer from below the surface upon which the incident light impinges. Calibration wafers and measurement systems may be arranged and configured so that light reflected at predetermined angles to the wafer surface is measured and other light is not. Measurements may also be based on evaluating the degree of contrast in an image of a pattern in or on the wafer. Other measurements may utilize a determination of an optical path length within the wafer alongside a temperature determination based on reflected or transmitted light.

Abstract: A temperature detection circuit includes a first voltage source circuit to generate a first voltage having a temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a second voltage source circuit to generate a reference voltage having no temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a correction circuit configured to correct the reference voltage and output a corrected voltage, and a subtraction amplifier configured to subtract the corrected voltage from the first voltage, amplify a resulting subtracted voltage, and output a resulting amplified voltage as a correction voltage signal to adjust a temperature coefficient of the correction voltage signal.

Abstract: Aspects describe creation of autonomous control for a composite curing process. Other aspects describe a controller and an apparatus for employing an autonomous control algorithm for a composite curing application. The algorithm can be based on thermocouple rules encapsulated within a thermocouple control wrapper. The thermocouple rules allow the thermocouple wrapper carry out diagnostic operations to determine the health of the associated thermocouple by communicating with neighboring thermocouples and validating temperature readings according to the thermocouple rules.