Abstract: A method of calibrating an adjustable control device using a knob assembly with adjustable temperature scale. A knob and a bezel that bears the temperature scale are assembled and the temperature scale is calibrated without physically changing any internals within the adjustable control device. The knob and bezel are secured to the adjustable control device so that the knob and bezel assembly can transmit an input load from a user through to the adjustable control device and so that the bezel can be rotated relative to the knob which remains fixed to an input shaft of the control for calibration purposes.

Abstract: A method for testing a measuring device is used to determine a permittivity of a frying fat which permittivity is inter alia dependent on the temperature, while taking into consideration the temperature. The method is characterized in that the permittivity is measured at least two different temperatures and the temperature dependence is determined and is used to make a statement on the ability to function of the measuring device.

Abstract: A system and method is disclosed that reliably determines the transmissivity of a substrate. By determining the transmissivity of a calibration substrate, for instance, a temperature measuring device can be calibrated. The method and system are particularly well suited for use in thermal processing chambers that process semiconductor wafers used for forming integrated circuit chips.

Abstract: A system and method for providing greatly improved linear heat detection using fiber optic distributed temperature systems (DTS). The invention makes use of correction algorithms based on proportional-integral-derivative notions that anticipate exterior temperature increases based on the rate of measured temperature changes.

Abstract: A temperature measurement circuit includes a sensing unit and a temperature translation unit. The sensing unit is arranged for generating a positive temperature coefficient characteristic and a negative temperature coefficient characteristic according to a temperature. The temperature translation unit is coupled to the sensing unit, and is arranged for generating a measured temperature according to the positive temperature coefficient characteristic and the negative temperature coefficient characteristic.

Abstract: A temperature sensor, capable of operating in electromagnetic and/or electric environments such as electrical generators, motors and transformers and/or in environments where vibratory conditions are frequent or continuous, contains at least one light emitting optic fiber and one light receiving optic fiber and an electrically non-conductive dilatable object which variably occults the emitted light as the object's temperature varies. The light receiving optic fiber transmits light intensity and light intensity changes to an electronic device that may include a photometer and light-to-temperature computing equipment.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for the dynamic power control of a memory device thermal sensor. In some embodiments a memory device includes an on-die thermal sensor and enable logic to dynamically enable or disable the on-die thermal sensor. In some embodiments, the on-die thermal sensor senses thermal data responsive to a thermal data sense indication. The thermal data sense indication may be received subsequent to the expiration of a delay period.

Abstract: An infra-red imaging camera comprises focusing optics for gathering infra-red energy from an external scene, and an uncooled and unshielded detector arranged to detect infra red energy. Internal temperature sensing together with approximation of the temperature response of the camera provides a time varying calibration that allows the infra-red energy received at the detector to be used as a temperature measurement for objects in the camera's field of view.

Abstract: A method of forming a thermocouple (12), including: depositing a first material on a component (10) to form a first leg (14); depositing a second material through a mask (30) to form a pattern (50) on the component (10), the pattern (50) forming a plurality of discrete second leg junction ends (20) and a continuous patch (52) of the second material comprising indiscrete lead ends of the second legs (16), each second leg junction end (20) spanning from a respective junction (18) with the first leg (14) to the continuous patch (52); and laser-ablating the continuous patch (52) to form discrete lead ends (22) of the second legs (16), each lead end (22) electrically connected to a respective junction end (20), thereby forming discrete second legs (16).

Abstract: A temperature measuring device incorporates a fixed point cell to provide an integrated structure. The fixed point cell houses a pure substance within a substantially cylindrical graphite crucible. The pure substance is to be melted to give an absolute temperature. The crucible is enclosed within a sealed metal container. An annular metal tube surrounds the container and the inner wall of the tube is formed by the outer peripheral wall of the container. This provides excellent heat conduction from the interior of the tube to the interior of the crucible. The tube is arranged to define either a heat pipe or a thermal siphon and includes an appropriate vaporizable fluid.

Abstract: A method of calibrating a thermal sensor includes setting a wafer to a control temperature. The wafer includes the thermal sensor and other chip logic. The method also includes applying power exclusively to a thermal sensor circuit, calibrating the thermal sensor, and storing a calibration result. The method also includes retrieving the calibration result upon application of power to the other chip logic.

Abstract: A temperature detecting apparatus includes an integrated circuit that integrates an overheating detecting circuit, a breakage detecting circuit and a disabling circuit, and an element connection terminal connecting a temperature sensing element. The disabling circuit disables the breakage detecting circuit from detecting a breakage of wire when a voltage at the element connection exceeds a disabling threshold which is set higher than an overheating detection threshold and a breakage detection threshold. A predetermined voltage higher than the disabling threshold is applied to the element connection terminal when the temperature sensing element is not connected to the element connection terminal.

Abstract: An instrument for performing highly accurate PCR employing an assembly, a heated cover, and an internal computer, is provided. The assembly is made up of a sample block, a number of Peltier thermal electric devices, and a heat sink, clamped together. A control algorithm manipulates the current supplied to thermoelectric coolers such that the dynamic thermal performance of a block can be controlled so that pre-defined thermal profiles of sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block/heat sink assembly can be changed to another of the same or different design.

Abstract: Embodiments of the present invention generally relate to methods and apparatus for measuring, calibrating, and controlling substrate temperature during low temperature and high temperature processing.

Abstract: The specific heat of a working fluid flowing along a channel is measured without having to provide an explicit flow rate correction. A specific heat sensing probe is configured with a stagnation enclosure surrounding a thermal transfer sensor. The stagnation enclosure is designed to provide a stagnation chamber in throttled communication with an outside of the enclosure so that the working fluid can flow into and out of the stagnation chamber at a seepage rate substantially less than the fluid flow rate. The thermal transfer sensor is operable to exchange heat with adjacent fluid and to provide a signal representative of the quantity of heat exchanged.

Abstract: An apparatus for ascertaining and/or monitoring at least one temperature. The apparatus includes, according to a first variable, at least one temperature sensor, at least one reference temperature sensor and at least one heating/cooling unit, which is thermally coupled with the temperature sensor and with the reference temperature sensor. According to a second variant, the invention includes that at least one reference temperature sensor and the temperature sensor and the reference temperature sensor are embodied and placed in such a manner that they measure essentially the same temperature. At least one head transmitter is provided, which connects the temperature sensor and the reference temperature sensor with the head transmitter in such a manner that the head transmitter receives the data measured by the temperature sensor and the reference temperature sensor. At least one memory unit is provided, in which the measured data of the temperature sensor and the reference temperature sensor are storable.

Abstract: The present invention relates to the use of one or more amplicons as temperature calibrators. In some embodiments, the calibrators may be used to calibrate the temperature of a microfluidic channel in which amplification and/or melt analysis is performed. In some embodiments, the amplicons may be genomic, ultra conserved elements and/or synthetic. The amplicon(s) may have a known or expected melt temperature(s). The calibrators may be added to primers of study or may follow or lead the primers of study in the channel. The amplicon(s) may be amplified and melted, and the temperature(s) at which the amplicon(s) melted may be determined. The measured temperature(s) may be compared to the known temperature(s) at which the amplicon(s) was expected to melt. The difference(s) between the measured and expected temperatures may be used to calibrate/adjust one or more temperature control elements used to control and/or detect the temperature of the channel.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: When the driving wind and the cooling wind are generated, based on the phenomenon in which the temperature difference is generated between the front surface and the rear surface of the radiator (14), the temperature difference between the detection value of the rear temperature sensor (22) and the detection value of the front temperature sensor (21) is compared with the abnormality determination value so that it is determined whether the front temperature sensor (21) and the rear temperature sensor (22) are properly fixed on the radiator (14), whereby it is determined whether the abnormality (unauthorized alteration) exists. By setting the abnormality determination value according to the ambient temperature and the vehicle speed, corresponding to a variation in temperature difference between the front surface and the rear surface of the radiator (14), the abnormality determination value is varied to be set at a proper value.

Abstract: A method of calibrating a temperature sensor of a chemical microreactor envisages: determining an airflow along a path in such a way as to cause a thermal exchange between the airflow and a chemical microreactor, which is provided with an on-board temperature sensor and is set along the path; and detecting a temperature in the airflow downstream of the microreactor, in conditions of thermal equilibrium.

Abstract: A temperature sensor circuit includes a band-gap reference voltage circuit. The resistor and diode-connected bipolar transistor of the band-gap reference voltage circuit are separated into a transistor-resistor series circuit and a transistor-diode series circuit. The transistor-resistor series circuit is configured such that an emitter of the bipolar transistor Q21 is connected to a power supply voltage terminal VCC, a collector thereof is grounded via the resistor R2. The transistor-diode series circuit is configured such that an emitter of the bipolar transistor Q20 is connected to the power supply voltage terminal VCC, a collector thereof is connected to a collector of the diode-connected bipolar transistor Q19, and an emitter of the diode-connected bipolar transistor is grounded. A voltage divider circuit 5 having a plurality of output terminals is connected to the transistor-resistor series circuit and the transistor-diode series circuit via first and second buffer circuits 3 and 4, respectively.

Abstract: An apparatus for detecting a temperature using transistors includes a plurality of temperature detecting units that become selectively active according to predetermined temperature intervals; and a detection signal output unit that generates detection signals according to the signals transmitted by the plurality of temperature detecting units, and outputs the detection signals.

Abstract: A system and method for compensating for thermal drift. A temperature is measured in a meter as a temperature voltage. The temperature voltage is converted to a digital signal. The digital signal is processed to generate an offset voltage in response to the digital signal. The offset voltage is applied as an input to an amplifier. The amplifier receives as a second input a gauge voltage. An output is generated from the meter that corrects the gauge voltage using the offset voltage to compensate for thermal drift.

Abstract: Temperature detection circuitry is selectively coupled to a thermistor and one of two sources representing the impedance at respective ends of the expected range of temperature to which the thermistor is to be exposed. The offset of an amplifier and a scale factor to account for gain set of the amplifier are determined in an automatic calibration process while coupled to the source(s), and thereafter temperature readings are taken from the thermistor. During the calibration process, if the gain or scale factor are outside of expected ranges, a failure is determined and an alarm given and/or a heater is disabled.

Abstract: The present application is directed to a system for verifying calibration of a temperature sensor comprising an above-ambient temperature verifier and a below-ambient temperature verifier. The above-ambient temperature verifier includes a first housing containing an ohmic material. At least one pair of electrodes is provided to direct an applied current through the ohmic material to heat the material. A well is provided within the ohmic material for accepting a temperature sensor. A compression assembly cooperates with the ohmic material to create intimate contact with the temperature sensor. An above-ambient reference temperature monitor maintains a calibrated temperature within the ohmic material. The below-ambient temperature verifier includes a second housing and a below-ambient reference temperature monitor to maintain a calibrated temperature of a below-ambient temperature medium.

Abstract: A tip assembly for an IR thermometer apparatus includes a heat sink having a heat sink cavity and a tip section and a fluid path and at least one hydraulic port. The tip assembly also includes an IR sensor mechanically seated in the tip section and thermally coupled to the heat sink. The tip assembly also includes an electrical connector configured to provide an electrical connection to the tip assembly. A fluid having a fluid temperature is introduced into the fluid path via the hydraulic port. The fluid causes the heat sink and the IR sensor to substantially reach one or more pre-determined temperatures by thermal conduction during calibration of the tip assembly. Another tip assembly having an internal heat source is described. Another tip assembly having an internal heat pump is described. A method to calibrate a tip assembly is also described.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: A temperature measuring apparatus includes a light source, a first splitter, a second splitter, a reference beam reflector, an optical path length adjuster, a reference beam transmitting member, a first to an nth measuring beam transmitting member and a photodetector. The temperature measuring apparatus further includes an attenuator that attenuates the reference beam reflected from the reference beam reflector to thereby make an intensity thereof closer to an intensity of the measurement beam reflected from the temperature measurement object.

Abstract: The invention relates to a method for monitoring a sensor unit (20) that is arranged in the exhaust gas region of an internal combustion engine (10). According to the invention, a sensor temperature (31, 32) is directly or indirectly determined by the sensor unit (20), and is compared to an exhaust temperature (33) that is determined by a further sensor unit and/or to model variables and/or to defined threshold values, whereby a dismounting and/or an inappropriate mounting of the sensor unit is indicated.

Abstract: Some embodiments include apparatus and methods having a first switch, a second switch, and a circuit coupled to the first and second switches. The first switch may be configured to switch between an on-state and an off-state based on a value of a first current flowing through a number of resistors and a diode coupled in series with the resistors. The second switch may be configured to switch between the on-state and the off-state based on a value of a second current on a circuit path. The second current is a function of a voltage at a node between two of the resistors and a resistance of the circuit path. The circuit may be configured to provide a temperature reading based on the number of times the first switch or the second switch switches between the on-state and the off-state during a time interval.

Abstract: A thermostat diagnostic apparatus is provided with a cooling medium temperature sensor, an engine operating condition sensor and a malfunction diagnosing device. The malfunction diagnosing device is configured to diagnose a stuck-open malfunction of a thermostat provided in a coolant flow passage of an engine installed in a mobile body based on a comparison of a real cooling medium temperature detected by the cooling medium temperature sensor and an estimated cooling medium temperature estimated based on an engine operating condition of the engine detected by the engine operating condition sensor. The malfunction diagnosing device determines that the thermostat is stuck in an open state upon determining that either the estimated cooling medium temperature or the real cooling medium temperature exceeds a prescribed reference value during a period in which an increased heat exchange rate condition of a radiator is satisfied continuously.

Abstract: In a body temperature measuring system, power consumption of a data reading device is reduced. A clinical thermometer of this invention is a body temperature measuring system including a body temperature tag and a data reading device. A processing unit of the body temperature tag includes a power supply circuit, a semiconductor temperature sensor for detecting a band gap voltage, and a storage unit configured to store calibration data to calibrate the detected band gap voltage, and is configured to, upon activating the power supply circuit, send the detected band gap voltage via the antenna unit together with the calibration data. The data reading device includes an excitation unit, and a sensing unit configured to sense a change in a magnetic field generated by excitation. The power level of the excitation unit is changed upon sensing the change in the magnetic field.

Abstract: A method for providing control signals to a fan in a computer system is described. During the method, an electronic device receives temperature measurements and a fan-speed measurement performed in the computer system. Using a pattern-recognition model, the electronic device validates the measurements, and excludes any inaccurate measurements, such as those associated with drifting or failed sensors. Next, the electronic device determines control signals for a fan in the computer system using a model of coolant flow in the computer system and/or a slope of a phase-frequency curve of a cross power spectral density function corresponding to a pair of temperature profiles measured, as a function of time, by a pair of thermal sensors. Then, the determined control signals are provided to the fan.

Abstract: Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafer from below the surface upon which the incident light impinges. Calibration wafers and measurement systems may be arranged and configured so that light reflected at predetermined angles to the wafer surface is measured and other light is not. Measurements may also be based on evaluating the degree of contrast in an image of a pattern in or on the wafer. Other measurements may utilize a determination of an optical path length within the wafer alongside a temperature determination based on reflected or transmitted light.

Abstract: A temperature detection circuit includes a first voltage source circuit to generate a first voltage having a temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a second voltage source circuit to generate a reference voltage having no temperature dependence by utilizing a work function difference of gate electrodes of a plurality of field effect transistors, a correction circuit configured to correct the reference voltage and output a corrected voltage, and a subtraction amplifier configured to subtract the corrected voltage from the first voltage, amplify a resulting subtracted voltage, and output a resulting amplified voltage as a correction voltage signal to adjust a temperature coefficient of the correction voltage signal.

Abstract: Aspects describe creation of autonomous control for a composite curing process. Other aspects describe a controller and an apparatus for employing an autonomous control algorithm for a composite curing application. The algorithm can be based on thermocouple rules encapsulated within a thermocouple control wrapper. The thermocouple rules allow the thermocouple wrapper carry out diagnostic operations to determine the health of the associated thermocouple by communicating with neighboring thermocouples and validating temperature readings according to the thermocouple rules.

Abstract: An apparatus for use with automatic testing equipment for testing infrared sensors on integrated circuits is provided. The apparatus includes an infrared source, a heat mass, and an electronic frequency modulator. The infrared source is modulated according to a predetermined test frequency such that the infrared source emits an infrared test signal representative of a test temperature and corresponding to the temperature of the heat mass and the predetermined test frequency. A signal processor, electrically coupled to an integrated circuit having an infrared sensor, receives a sensed signal from the infrared sensor in response to the infrared test signal and uses the sensed signal according to the predetermined test frequency to determine a measured temperature.

Abstract: To improve the precision of temperature compensation in an infrared sensor and obtain a sharp image, a correction is applied to a variation in output voltage (referred to as “background infrared radiation absorption intensity distribution” below) due to intensity distribution of background infrared radiation, which is light other than the incident infrared radiation on the infrared sensor, and the temperature characteristic of each individual bolometer constituting the infrared sensor. That is, the temperature of the infrared sensor is measured as a first temperature, a correction value for the output voltage of each bolometer is found by referring to a table, which indicates the background infrared radiation absorption intensity distribution versus the temperature of the infrared sensor, as well as the first temperature, and the variation in output voltage is corrected.

Abstract: A user computer device is provided that comprises a temperature sensitive touchscreen having a temperature sensitive user interface comprising multiple thermal energy emitter/detector devices, such as thermocouples. The multiple thermal energy emitter/detector devices are capable both of detecting thermal energy and emitting thermal energy. The temperature sensitive user interface generates thermal patterns that may be transferred to other thermally sensitive electronic devices or that may be used to authenticate the user computer device. The user computer device also can detect and thermally communicate with a thermal energy docking station and, based on thermal recognition, activate applications displayed on the temperature sensitive touchscreen. Further, the user computer device can auto-bias a temperature of the temperature sensitive user interface in order to better assure proper operation of the temperature sensitive user interface in all operating conditions.

Abstract: A test component coated with a coating system is provided. In at least one defined region of the test component, there is a delamination having defined properties deliberately introduced into the coating system. The test component may be employed in a method for testing a thermography apparatus that is designed for carrying out a thermography method, for its correct operation with a view to the detection of delaminations. In order to test the thermography apparatus, the at least one defined delamination of the coating system is detected on the test component by using the thermography method employed in the thermography apparatus.

Abstract: A thermostat system is provided that comprises a base thermostat for providing basic thermostat control and a portable information display (PID) unit, or dockable display, that provides an improved user interface. The PID unit can be docked to the base thermostat by being releasably mounted on top of a front portion of the base thermostat. The base thermostat provides control of an environmental control system, allowing the regulation of the temperature in a building. The PID unit may be used when it is mounted to the base thermostat or un-mounted from the base thermostat. The PID unit provides an improved user interface and experience over the base thermostat.

Abstract: A method is present for monitoring a structure. A plurality of modes is identified for a first response for the structure at a first temperature. Each mode in the plurality of modes is adjusted from the first temperature to the second temperature to form a plurality of temperature adjusted modes. A temperature adjusted response is formed from the plurality of temperature adjusted modes in which the temperature adjusted response is adjusted to a second temperature from the first temperature. The temperature adjusted response is compared to a second response to evaluate the changes in the structure between the two sets of measurements.

Abstract: The invention relates to an apparatus for the calibration of a thermometer in situ, wherein the apparatus has a temperature sensor (S) for determining a temperature (T); wherein a reference element (K) is provided for calibrating the temperature sensor (S); wherein the reference element (K) at least partially comprises a ferroelectric material (D), which experiences a phase transformation at least one predetermined temperature (TPh) in a temperature range relevant for calibrating the temperature sensor (S).

Abstract: The present invention, in one aspect, provides a method for calibrating thermal control elements in situ using a single compound calibrator. In some embodiments, the present invention uses a compound calibrator to calibrate thermal control elements on a microfluidic device. In non-limiting embodiment, the compound calibrator can be a droplet, plug, slug, segment or continuous flow of any appropriate solution that, when heated, yields a thermal response profile with a plurality of features (e.g., maxima, minima, inflection points, linear regions, etc.).

Abstract: An outside air temperature (OAT) diagnostic system includes an ambient temperature monitoring module that receives (i) an OAT signal from an OAT sensor and (ii) an intake air temperature (IAT) signal from an IAT sensor of an engine. The ambient temperature monitoring module compares the OAT signal to an IAT signal and generates a first difference signal. A performance reporting module determines whether the OAT sensor is exhibiting a fault and generates an OAT performance signal based on the first difference signal.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal sensor power savings using a toggle control. In some embodiments, an integrated circuit (e.g., a memory device) includes an on-die thermal sensor, a storage element (e.g., a register), and toggle logic. The toggle logic may transition the thermal sensor from a first power consumption level to a second power consumption level responsive, at least in part, to a toggle indication.

Abstract: An assembly includes a thermocouple, a cold junction sensor, and a circuit. The thermocouple has a process end and a cold junction end. The cold junction end has first and second cold junction terminals. The cold junction sensor is supported near the cold junction end and configured to measure temperature at the cold junction end. The circuit is electrically connected to the cold junction sensor and to the first and second cold junction terminals. The circuit is configured to produce a thermocouple signal as a function of voltage across the first and second cold junction terminals and to produce a cold junction sensor signal as a function of temperature of the cold junction end as measured by the cold junction sensor. The circuit is further configured to calculate a correlation between the thermocouple signal and the cold junction sensor signal.

Abstract: In a method for diagnosing a faulty thermostat in a coolant circuit, in particular for an internal combustion engine, having a fan, the faulty thermostat is detected as a function of a measured temperature and a setpoint temperature, the fan being turned on at least temporarily during the diagnosis.

Abstract: Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.

Abstract: An optical measurement instrument includes one or more temperature sensors (122) arranged to measure sample well specific temperatures from sample wells (111-117) arranged to store samples (103-109) to be optically measured. A processing device (121) of the optical measurement instrument is arranged to correct, using a pre-determined mathematical rule, measurement results obtained by the optical measurements on the basis of the measured sample well specific temperatures. Hence, the adverse effect caused by temperature differences between different samples on the accuracy of the temperature correction of the measurement results is mitigated.