Abstract: An apparatus and method for positioning packaged semiconductor devices having different rectangular shapes and sizes. A positioning apparatus includes an adjustable alignment guide releasably coupled to a base. The adjustable alignment guide may be positioned along a first axis to partially define a recess into which the packaged semiconductor devices are placed during positioning. The positioning apparatus may also include additional adjustable alignment guides that may be positioned along the first or a second axis to further define the recess into which the packaged semiconductor device is to placed during positioning. The adjustable alignment guides may have alignment surfaces against which the integrated circuit rests when placed into the recess that is partially defined by the alignment surfaces.

Abstract: A rotation device includes: an endless guide; and a plurality of moving sections that move while being guided by the guide, wherein an interval between the moving sections can be changed.

Abstract: A conveying apparatus is provided with a control device for performing infinite rotation control of rotation of a strut or wrist shaft of a robot conveying an article and a drive shaft of a conveyor. The control device comprises a rotary shaft (6) rotationally driven, a drive (7) for rotating the rotary shaft, an encoder for detecting a rotation of the rotary shaft, a servo control device (22) for controlling the drive (7) based on a program command, a main control device (10) for controlling rotation, and an infinite rotation control device (12) for controlling infinite rotation. The program command is prepared and position control is carried out based on a reference encoder value. In the case of issuance of a command from a command circuit, by adding or subtracting an encoder value equivalent to a position-moving amount, the reference encoder value is changed and stored.

Abstract: Apparatus for manipulating wafers comprising a fixture including seats each for receiving and supporting a wafer in a seated condition and an element mounted for reciprocal movement in opposition to the fixture between a retracted condition and an extended condition into an opening of the fixture for engaging a wafer held by the fixture in the seated condition.

Abstract: A motor has its rotating shaft fixed by a fixing member so as to be inclined at an angle of &thgr; to the horizontal direction. A supporting member is attached to the rotating shaft of the motor. A plurality of accommodating units are distributed at equal spacing along the circumference, centered on the rotating shaft of the motor, of the supporting member. A pair of peripheral surface members in each of the accommodating units is attached to the fixing member so as to be capable of freely opening and closing by a supporting shaft, and has an approximately square columnar shape in its closed state. An opening at one end of the pair of peripheral surface members having the approximately square columnar shape is opened, and a bottom surface member is arranged on an opening at the other end thereof. Each of the accommodating units is attached to the supporting member such that the supporting shaft is inclined at an angle of &agr; to the rotating shaft of the motor.

Abstract: A wafer handling system and a method of retrofitting the system to an existing wafer handling apparatus are provided that make possible a method of handling wafers by contacting only a narrow area of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion that renders the wafer unusable in that area. The system provides a chuck on a wafer transfer arm that holds a wafer by gravity on a segmented, upwardly facing annular surface. A compatible annular surface is provided on an aligning station chuck so that wafers can be transferred by contact only with the exclusion area of the wafer surface. A load arm has two similarly compatible chucks further provided with pneumatically actuated grippers to allow the wafer to be loaded into a vertical processing apparatus.

Abstract: A robot wherein the condition for a work and a sequence of movements to be performed may be set in connection with positions. In addition to setting a position at which a work is performed, the robot sets the conditions for performance of a work at a set position and of a sequence of movements between set positions. The set conditions may be memorized in connection with the set positions so as to be performed as are read out.

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Abstract: A method for moving a substrate to a predetermined location with a specified orientation with a robotic manipulator, the robotic manipulator having a plurality of joint actuators and an end-effector for holding the substrate, wherein the end-effector is independently rotatable with respect to the remaining robotic manipulator. The method can select a reference point on the end-effector for determining a position of the end-effector, wherein the reference point is offset from a wrist of the robotic manipulator, determining a motion path for movement of the end-effector of robotic arm toward predetermined location with specified orientation, and generating motion profiles for translational and rotational components of movement of the end-effector of robotic manipulator along the motion path.

Abstract: An assembly for orienting and fixturing an array of contact lenses in a lens-fixturing tray to enable automated picking of the lenses includes an array of tubes to which a first support tray having an array of lens receptacles each having a respective contact lens therein is removably mounted. A lens-fixturing tray having an array of lens receptacles is removably mounted to the other end of the tubes and the assembly is rotated and submerged in a fluid bath whereby the lenses release from the first support tray and float downwardly through a respective tube coming to rest in a centered, concave side-up position in a respective receptacle of the lens-fixturing tray.

Abstract: The invention relates to a method and device for making a series of cuts at different angles in one or more panels using a panel sawing machine. The method comprises the steps of: placing a stack of panels on a worktable; turning the stack a first time in a first direction of rotation; making a first series of cuts in the stack; turning the stack a second time in a direction opposite to the first direction of rotation and in such a way as to move the stack closer to the cutting line; and making a second series of cuts in the stack. The device comprises: a worktable having a cutting line for a panel sawing machine; a pickup element that moves along a first guide perpendicular to the cutting line; and a pusher element that moves along a second guide parallel to the cutting line.

Abstract: An apparatus for thermally processing a wafer at an elevated temperature, in which a processing position is bounded at least on one side by a housing part which, in use, is at an elevated temperature, the apparatus being provided with measuring means for determining the position of a wafer in the processing position before and/or during processing, the measuring means being provided with at least one signal processor and at least one signal conductor, the or each signal processor being located at a distance from the processing position in an area of lower temperature, the signal conductor extending through the housing part being at an elevated temperature and extending from a measuring point in or near the processing position to the signal processor for transmitting to the signal processor contactlessly obtained measuring signals, the at least one signal conductor, at least the part extending through the housing part being at an elevated temperature, being heat resistant.

Abstract: An apparatus and method for removing an unvulcanized tire tread from a storage device (14) includes the step of inverting the tread (12) and transporting it to a roller conveyor in a single step. The tread (12) is picked up by a vacuum bar (80) fitted with a series of suction cups (76). Individual suction cups (76) can be selectively supplied with vacuum depending on the length of the tread (12). After the suction cups (76) have engaged the tread, the tread is raised from the storage device (14), inverted through 180 degrees, and then set onto a special slotted roller conveyor (130). The slotted roller conveyor (130) has a center slot (142) to receive the vacuum bar (80) as it passes therethrough. Side slots (144,146) in the conveyor receive arms (90,92) attached to the vacuum bar (80).

Abstract: A method for holding and orienting a wafer having an alignment feature, the method includes gripping a wafer with an end effector attached to an end of a robot arm, the end effector including a gripping mechanism which includes a first contacting member, a second contacting member, and a drive element, and wherein gripping includes increasing and decreasing the space between the first and second contacting members, the method also including rotating the wafer about an axis that is perpendicular to the plane of the wafer and sensing the alignment feature on the wafer as the gripping mechanism rotates the wafer.

Abstract: An apparatus for holding and orienting a wafer includes a movable robot arm, and an end effector attached to an end of the robot arm, the end effector including a gripping mechanism which during operation holds and rotates the wafer about an axis that is perpendicular to the plane of the wafer, wherein the gripping mechanism comprises a first contacting member, and a second contacting member, and a drive member arranged to grip opposing edges of the wafer, and wherein the drive member comprises a first pair of rollers.

Abstract: Apparatus for repositioning eggs from a generally vertical position to a generally horizontal position such that injection/removal of material into/from the side of the egg can occur. Each apparatus may include a cradle, an alignment member, and an orientation member. The cradle has an inclined, arcuate surface with an upper portion, a lower portion, and opposite side portions. The alignment member is operably positioned adjacent the cradle and is configured to engage an egg positioned on the arcuate surface lower portion in an inclined orientation and to releasably secure the egg in a predetermined alignment relative to the cradle. The orientation member is operably positioned relative to the cradle, and is configured to urge an egg positioned on the lower portion in an inclined orientation to a generally vertical orientation after injection/removal of material into/from the egg has occurred.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract: A wafer holder has a set of minimum contact wafer support members predefining support member contacting portions on a planar wafer surface of a wafer. The wafer chuck has a wafer support region for contacting the planar wafer surface. The wafer support region of the chuck includes recesses configured at predefined positions corresponding to support member contacting portions of the lower wafer surface. The wafer handling system further includes a wafer transport device including a rotational position adjusting device for adjusting the rotational position of a wafer that is transported between the wafer holder and the wafer chuck. Thereby, elevations on the lower wafer surface, like scratches or deposited material which are produced by the contact between the support members and the wafer, are encapsulated by the recesses of the wafer chuck. A method for moving a wafer between a wafer holder and a wafer chuck is also provided.

Abstract: An apparatus and method for removing an unvulcanized tire tread from a storage device (14) includes the step of inverting the tread (12) and transporting it to a roller conveyor in a single step. The tread (12) is picked up by a vacuum bar (80) fitted with a series of suction cups (76). Individual suction cups (76) can be selectively supplied with vacuum depending on the length of the tread (12). After the suction cups (76) have engaged the tread, the tread is raised from the storage device (14), inverted through 180 degrees, and then set onto a special slotted roller conveyor (130). The slotted roller conveyor (130) has a center slot (142) to receive the vacuum bar (80) as it passes therethrough. Side slots (144,146) in the conveyor receive arms (90,92) attached to the vacuum bar (80).

Abstract: There is provided an aligner apparatus and method which can align a semiconductor substrate without contaminating a rear surface. The aligner apparatus for arbitrarily aligning the circular semiconductor substrate having a notch or “orifla” at an edge portion includes at least three spindle units rotatably axially supported by a plate, holding units for holding the semiconductor substrate, attached to respective tip ends of the spindle units, a rotation mechanism for rotating the spindle units, and a sensor for detecting the notch or “orifla”. An edge portion of the semiconductor substrate is brought into contact with the respective holding units, so that the semiconductor substrate is held. When the spindle units rotate, the semiconductor substrate held by the holding units rotates around its axial line.

Abstract: The present invention is an alignment apparatus which obtains an amount of correction for centering a semiconductor wafer from four points of a wafer edge detected by noncontact proprioceptors in a wafer delivery position P1 where the semiconductor wafer is passed to a wafer carrying unit from a wafer carrying robot and centers the semiconductor wafer.

Abstract: Improved variable-pitch pick and place devices may include one or more improvements such as a mechanical linkage such as pantograph linkage, the linkage itself linked to a plurality of device-gripping mechanisms arranged in a row so as to keep uniform, though variable, spacing between the device-gripping mechanisms, with the number of such mechanisms being increased relative to the number of parts in the linkage for reduced tolerance stack-up and improved positioning accuracy. The horizontal position of the linkage may be fixed at a position not at an end thereof, and desirably within the middle third or at the middle thereof. The linkage may be controlled at three points. These points may include a vertically flexible but horizontally fixed link to a supporting structure at the middle of the pantograph, a link at one end of the pantograph to one side of an endless loop of timing belt, and a link at the other end of the pantograph to the other side of the endless loop of timing belt.

Abstract: An apparatus includes coupling and supporting devices for floating and positioning a fixture to dock with another fixture. A coupling device is mounted on the fixture and coupled to an immediate plate using ball bearings to provide movements in X-Y directions as well as angular movements. The supporting device comprises a ball joint mounted between the immediate plate and a supporting plate to allow the fixture to be tilted. Sliding rods and a hinge are mounted on the supporting plate so that the fixture can be flipped over 180 degrees. Springs can be used instead of a ball joint. Sliding tracks and plates can also be used to provide movements in the X-Y directions. Guide devices each having a male guide member with a cone shaped head and a matched female guide member with a cone shaped void are used to guide the fixtures into positions for docking.

Abstract: Apparatuses and methods for use in adjusting a substrate centering system to center a substrate on a rotatable chuck in a semiconductor processing machine, the chuck including at least one reference point. One apparatus comprises a plate configured to be placed on the chuck and at least one centering mark formed on the plate, wherein the at least one centering mark is configured so that it may be compared to the at least one reference point on the chuck to determine if the plate is centered. The plate often is at least partially transparent so that its position relative to the at least one reference point on the chuck may be seen.

Abstract: A self-teaching robot arm positioning method that compensates for support structure component alignment offset entails the use of a component emulating fixture preferably having mounting features that are matable to support structure mounting elements. Robot arm mechanism motor angular position data measured relative to component emulating fixture features are substituted into stored mathematical expressions representing robot arm vector motion to provide robot arm position output information. This information indicates whether the actual relative alignment between the robot arm mechanism and a semiconductor wafer carrier is offset from a nominal relative alignment. The robot arm mechanism position output information can be used to effect either manual or automatic correction of an offset from the nominal relative alignment.

Abstract: A pinion support is disclosed for use with a motor set on a gear box casing and an output drive pinion having an axial recess at the outer end of the pinion. The pinion support includes a housing which is rigidly secured against movement to the gear box casing and includes a portion which overlies the outer end of the pinion. A pin is rigidly secured to the portion of the housing and this pin extends coaxially into the axial recess at the outer end of the pinion. A bearing assembly is operatively positioned between an outer surface of the pin and an inner surface of the pinion recess. The pinion support is particularly well suited for use in an automotive framing system.

Abstract: Specimen edge-gripping prealigners (8, 80) grasp a wafer (10) by at least three edge-gripping capstans (12) that are equally spaced around a periphery (13) of the wafer. Each edge-gripping capstan is coupled by a continuous synchronous belt (14) to a drive hub (15, 84) that is rotated by a drive motor (18, 88). The belts are tensioned by idler pulleys (22, 92) that are rotated by a motive force (25, 96, 102). The edge-gripping capstans and the drive drums are mounted to hinged bearing housings (28, 112) that are spring biased to urge the capstans away from the drive hub. Deactivating the motive force rotates the idler plates into a belt tensioning position that draws the capstans inward to grip the periphery of the wafer. Once gripped, rotation of the drive hub is coupled through the tensioned belts to the capstans. Driving all the capstans provides positive grasping and rotation of the wafer without surface contact with the wafer and thereby reduces wafer damage and particle contamination.

Abstract: A crane gear for the transport of web rolls with a winding core, provided with a passage hole, exhibits a support frame, which is attached to a cable and which is provided with receiving units. The support frame comprises an upper yoke carrier with legs, which point in the downward direction and whose ends are provided with hooks and from which a support rod, which is slid through the passage hole, can be suspended.

Abstract: A workpiece changing system capable of automatically changing a heavy workpiece using a robot. A jig for attaching a workpiece thereto is mounted on a jig mounting device. The jig mounting device comprises a jig mounting unit having a rotary member and a swing member. The rotary member rotates the jig and the workpiece on the jig and hold them at a desired rotary position. The tilting member swings around an axis to tilt the jig and the workpiece on the jig and hold them at a desired tilting position. As the jig and the workpiece on the jig can take a suitable orientation or posture for being handled by the handling robot, the handling robot can hold a heavy workpiece without exerting excessive load on the robot wrist.

Abstract: An ergonomic loading assembly for an I/O port onto which a bare cassette may be easily loaded and unloaded. The loading assembly further provides isolation between the operator and the I/O port after loading of a cassette to minimize safety risks and to minimize the amount of particulates and contaminants around the workpieces while on the port. In a preferred embodiment, the loading assembly includes a cover assembly having a stationary cover section around the port plate, and two pivoting cover sections which open and close like jaws to allow a cassette to positioned within the cover assembly when opened and which enclose the cassette within the cover assembly when closed. The loading assembly further includes a pivoting deck onto which the cassette is loaded when the pivoting cover sections are open. The deck receives the cassette with the workpieces oriented at or near vertical.

Abstract: A semiconductor fabricating apparatus having a vertical reaction furnace, a boat for holding plural wafers in a multi-layered fashion and being loaded into the vertical reaction furnace, a storage disposed at a location corresponding to the boat for storing at least one of the wafer cassettes, a wafer transfer device for transferring the wafer between the storage and the boat, a cassette transfer unit for transferring the wafer cassettes between the apparatus and outside thereof, a cassette transfer device for effecting the transfer of the wafer cassettes between the cassette transfer unit and the storage, and a plurality of cassette shelves disposed within a range allowing transfer of the wafer cassettes from the cassette transfer device for receiving the wafer cassettes in upwardly-oriented positions.

Abstract: This invention related to a substrate transfer apparatus having an arm holder moving into and out of a cassette while a substrate is mounted thereon, a forward and backward driving mechanism for moving the arm holder forward and backward, and a contact support member for supporting the substrate in contact with a lower surface peripheral portion of the substrate placed on the arm holder, said contact support member comprising a first defining portion for defining a front end of the substrate placed on the arm holder, and a second defining portion facing the first defining portion, for defining a rear end of the substrate placed on the arm holder.

Abstract: A wafer orienting apparatus for aligning a plurality of semiconductor wafers each of which has a v-notch formed on its outer periphery. The apparatus includes a cassette process carrier for supporting the plurality of wafers in parallel wafer supporting slots and wafer supporting means engaging the periphery of each wafer in an individual slot with the central axis of all wafers in coaxial alignment A supporting platform is placed over the cassette for supporting the wafers in an inverted position in which the wafers are substantially vertical and biased by their own weight against a multiplicity of orienting mechanisms. The orienting mechanisms are arranged to correspond to each wafer position within the cassette. The plurality of orienting mechanisms are integrated with the supporting platform so that all wafers within the cassette can be aligned during this aligning process.

Abstract: An assembly for turning bundles includes a planar surface that receives bundles from an upstream station. A sensor detects movement of the bundle toward the surface and initiates a timing sequence. The sequence includes slowing the bundle over the surface so that it does not contact the stop at high speed. The stop is then retracted after the bundle movement is terminated and a portion of the surface is lifted and rotated through approximately ninety degress to re-orient the bundle. After the bundle is lowered to the planar surface, it is then advanced by a drive assembly from the surface toward a downstream station.

Abstract: A wafer orienting apparatus for aligning a plurality of semiconductor wafers each of which bas a v-notch formed on its outer periphery. The apparatus includes a cassette process carrier for supporting the plurality of wafers in parallel wafer supporting slots and wafer support means engaging the periphery of each wafer in an individual slot with the central axis of all wafers in coaxial alignment. A supporting platform is placed over the cassette for supporting the wafers in an inverted position in which the wafers are substantially vertical and biased by their own weight against a multiplicity of orienting mechanisms. The orienting mechanisms are arranged to correspond to each wafer position within the cassette. The plurality of orienting mechanisms are intergrated with the supporting platform so that all wafers within the cassette can be aligned during this aligning process.

Abstract: A fin alternating and delivering apparatus is provided for orientating and delivering fins emanating from a fin mill to a fin trayer for assembly into a heat exchanger. The fin alternating and delivering apparatus includes an entrance chute for receiving fins emanating from the fin mill in a horizontal position. The fin alternating and delivering apparatus also includes a sensor disposed adjacent the entrance chute to sense the fins entering the entrance chute. The fin alternating and delivering apparatus includes an air jet operatively connected to the sensor for delivering a blast of air to the fins upon sensing the fins entering the entrance chute to reorientate the fins from the horizontal position to a vertical position. The fin alternating and delivering apparatus further includes a discharge chute disposed adjacent the entrance chute for guiding the fins from the entrance chute to the fin trayer in the vertical position.

Abstract: An apparatus for positioning a case to be loaded with an optical disk, includes a pair of slide plates slidable in opposite, horizontal directions for moving a pair of positioning members (5A, 5B) rotatably connected to the ends of the slide plates. The positioning members are moved between a withdrawn rest position in which toe faces (6a) of the positioning members (5A, 5B) do not contact the case, and a locating position wherein the toe faces contact an outer circumference of a ridge of the case to precisely locate the case. The positioning members (5A, 5B) are driven between the withdrawn position and the locating position by a cam drive including a cam and a cam follower cooperating with each positioning member. The cam follower moves along the inclined surface of the cam provided at the case locating station.

Abstract: A wafer chuck for positioning and releasably holding a wafer includes a support platform having an upper surface for positioning and supporting the wafer. Wafer banking pins are affixed to the support platform for positioning the wafer. A lift device acting on the wafer when it rests on the support platform to move the wafer relative to the support platform in a slanted direction away from the support platform and wafer banking pins. The lift device has a plurality of wafer lifting fingers that cooperatively extend in a biased and substantially vertical direction are disposed in a pattern to be supportive of the wafer. Each of the wafer lifting fingers has an end portion that is movable relative to the support platform between a first position at which it is retracted from the upper surface of the support platform and a second position at which it protrudes from the upper surface of the support platform so as to engage the wafer to lift it relative to the support platform.

Abstract: Apparatus for detection of an edge of a generally disk-shaped workpiece, such as a semiconductor wafer, includes a light source positioned to direct a light beam at the surface of the workpiece near the edge thereof such that a first part of the light beam passes the workpiece and a second part of the light beam is intercepted by the workpiece. An angle between the light beam and a normal to the surface is equal to or greater than a critical angle that produces total internal reflection of the light beam in the workpiece. The apparatus further includes a mechanism for rotating the workpiece and a light sensor positioned to sense the first part of the light beam and to generate an edge signal that represents the edge of the workpiece as the workpiece is rotated. The apparatus may be used for sensing orientation and location of semiconductor wafers of different materials, including those which are transparent to the light beam.

Abstract: A unitary prealigner and four link robot arm includes an upper arm, a middle arm, a forearm, and a hand that is equipped with vacuum pressure outlets to securely hold a specimen. The robot arm is carried atop a tube that is controllably positionable along a Z-axis direction. The prealigner is attached to the tube by a movable carriage that is elevatable relative to the robot arm. The prealigner further includes a rotatable chuck having a vacuum pressure outlet for securely holding a specimen in place within an edge detector assembly that senses a peripheral edge of the specimen. The prealigner may be elevated to receive a specimen from the robot arm or it may be lowered to allow clearance for the robot arm to rotate. In operation, the robot arm retrieves a specimen and places it on the prealigner, which performs an edge scanning operation to determine the effective center and specific orientation of the specimen.

Abstract: The present invention is a wafer handling robot which does not require a second mechanism for performing the task of pre-alignment. The robot uses the moving elements of the wafer handling robot which perform the wafer handling tasks to perform the tasks of centering and notch or flat finding of a wafer.

Abstract: A passive mechanism for centering a wafer on a chuck and with respect to a backside exclusion gas ring includes a plurality of wheels that are rotatably mounted in a circular pattern at the top surface of a chuck. The axis of rotation of each wheel is parallel to the top surface of the chuck and perpendicular to a radius extending outward from the centerpoint of the chuck surface. When a wafer is placed on the chuck, its edge contacts the wheels and, by its own weight, the wafer moves toward the center of the chuck, thereby centering itself. The wafer either slides on the wheels or, if the frictional force between the wafer and one or more of the wheels is great enough, the wafer causes the wheel to turn. The wheels may be mounted on the chuck, a carrier ring or a wafer transfer arm for moving wafers between processing stations. In one embodiment the alignment wheels are mounted on a carrier ring, and a second alignment mechanism aligns the carrier ring to the chuck.

Abstract: An apparatus for centering and gripping semiconductor wafers. A solenoid is used to actuate two or three curved contacts. Power to the solenoid, and position information from the solenoid is transmitted along a pair of wires. To center the wafer, the solenoid is actuated and the contacts move radially towards the center of the wafer. The contacts grip the edge of the wafer and a pulse-width-modulation signal is used to determine solenoid position as a function of back electromotive force value or waveform. During handling, the contacts hold the wafer such that the wafer does not move relative to the apparatus.

Abstract: A rotator for holding and rotating a steel shipping container includes a n frame and a cradle frame attached to the main frame to allow relative rotation between the main frame and the cradle frame under the power of a hydraulic jack or the like. The container is secured to the cradle frame while the cradle frame is horizontal, and compressed air is supplied to the jack to tilt the cradle frame and the container for refurbishing. Pins are provided to hold the cradle frame in both the horizontal position and the tilted position.

Abstract: The invention, in its various embodiments is a method and apparatus for uniformly orienting shafts which contain an operational feature on one end and which are blunt on the other end. In one aspect of the present invention, a machine feeds the shafts onto a surface containing one or more slots, where the slots are shaped to completely receive a shaft only when the shaft is in a preferred orientation. Shafts which are in the preferred orientation are oriented 180.degree. differently from shafts which are not in the preferred orientation. Shafts which are not in the preferred orientation will be dislodged from the slots and sent down a first exit chute. Shafts which are in the preferred orientation are sent down a second exit chute. The method comprises dispensing the shafts into slots on a surface where the slots are shaped to completely receive a shaft only when the shaft is in a preferred orientation, and selectively removing shafts which are not in the preferred orientation from the slots.

Abstract: A method and apparatus for orienting a disk to precisely align a fiducial mark on the disk relative to an external reference point while gripping the disk only along its circumferential edge.

Abstract: A wafer position error detection and correction system determines the presence of a wafer on a wafer transport robot blade. The system also determines a wafer position error by monitoring the position of the wafer with respect to the blade with one sensor which is located proximate to each entrance of a process chamber. When a wafer position error is detected, the system determines the extent of the misalignment and corrects such misalignment if correctable by the wafer transport robot or alerts an operator for operator intervention. The system incorporates a transparent cover on the surface of the wafer handling chamber and four optical detection sensors disposed on the surface of the transparent cover, in which each sensor is placed proximate to the entrance of the process chamber. In addition, an I/O sensor is placed adjacent the I/O slit valve to detect and correct wafer position errors.

Abstract: An improved panel positioning device which can be easily and accurately regulated by linearly regulating a heightwise displacement of the panel. A panel is mounted to an upper portion of a holder, and the holder is pivotally mounted to a holder support plate, a first regulating plate provided with first and second side plates on both sides is located below the holder support plate. First through fifth regulating knobs regulates a pivot angle, a lengthwise position, a widthwise position, a pivot angle about a lengthwise axis, and a heightwise position of the holder respectively. A third regulating plate for regulating the heightwise position of the holder is mounted to a side frame so as to be lengthwisely moved and is engaged with the fifth regulating knob at one side thereof.

Abstract: A rotating and translating support assembly for receiving a front-opening pod according to applicable SEMI standards, and thereafter rotating the pod to a desired orientation. In this way, a number of pods may be received at interface ports of a minienvironment, and each of the pods and ports may be angled toward and aligned with a single, 2-arm pick and place robot. In a preferred embodiment of the present invention, the rotating and translating support assembly comprises a plate rotationally and translationally mounted on a shelf extending from the minienvironment adjacent to a front-opening interface port. In one embodiment, the support plate may be mounted on a shaft attached to a rotating assembly, such as for example a worm and drive gear. The rotating assembly may in turn be mounted on a translating assembly, such as for example a carriage riding on a lead screw.