Abstract: The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N?n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N?n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N?n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N?n is not less than 2.

Abstract: The invention relates to a gripper for handling frames (2) that are covered with a film (3) that is intended for the transport of wafers (6). The gripper comprises at least two flat fingers (10) that carry flattened finger tips (8). This construction allows to insert the gripper between two frames (2) that are mounted in a cassette (9) without complication. The fingers (10) support in subsections both the frame (2) and the film (3). The film is attached to the frame due to the suction effect exerted by vacuum openings (5) configured on the frame, thereby fixating the film on the gripper.

Abstract: A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process.

Abstract: A dummy substrate (17) differs from a substrate to be processed in having a first guide (G1) for assisting centering, however, it can be handled as a substitute of the substrate to be processed. In a process chamber (2), a second guide (G2) is arranged to assist the dummy substrate (17) to center. To detect a transfer shift of a transfer mechanism (TRM), at first, the dummy substrate (17) is centered to a placing table (14) on the placing table (14) or at an upper position thereof by engagement of the first and the second guides (G1, G2). The dummy substrate (17) centered in such a manner is received by the transfer mechanism (TRM) and transferred to a detector (11). Then, a detection value of a decentering quantity and that in a decentering direction of the dummy substrate (17) are obtained by the detector (11), and a transfer shift of the transfer mechanism (TRM) is obtained based on the detection values.

Abstract: A load lock for a lithographic apparatus is arranged to transfer an object, like a substrate, into and from the lithographic apparatus. The load lock outer wall defining at least part of a load lock volume accommodating a support unit for supporting the object when in the load lock. The load lock also has a temperature conditioned structure to control the temperature of the object to a desired temperature at least before the object is transferred from the load lock towards the lithographic projection apparatus.

Abstract: A robot assembly for transferring substrates includes a central tube assembly oriented along a central axis, perpendicular to a substrate transfer plane, and having an inner surface that forms part of a first enclosure at a first pressure, and an outer surface that forms part of a second enclosure at a second, different pressure. The robot assembly further includes a transfer robot which itself includes multiple rotor assemblies, each configured to rotate parallel to the substrate transfer plane. The various rotor assemblies are organized in pairs, each pair having one rotor fitted with a telescoping support arm/end effector arrangement to support substrates thereon, and the other rotor fitted with inner and outer actuator arms that cooperate to effect radial movement of the corresponding end effector of the paired rotor assembly. Each rotor is controlled to effect the transfer of substrates within a wafer processing system asynchronously and at differing heights.

Abstract: A system comprising a load port and a transfer module. In one embodiment, the load port includes a plate having a first opening and a second opening, a first workpiece access port, a second workpiece access port and at least one storage location. The storage location(s) may be located either beneath the second workpiece access port or above the first workpiece access port. The transfer mosule, which is located adjacent the load port, includes a load arm for moving the workpiece containers between the first workpiece access port, the second workpiece access port, any of the storage shelves and a material transport system.

Abstract: A cylinder which can precisely feed a piston rod 3 into three different positions. The cylinder includes a spring receiving member 14 which is placed coaxially with the piston rod in a piston room. Movement of the piston 4 is limited by one end of the piston room and a stopper 8 formed on the piston rod which prevents the piston from moving in the opposite direction. A first spring member 15 is disposed in the cylinder tube 2 to separate the spring receiving member from the piston. A hollow 9 is formed on the periphery of the piston rod at a further position from the piston than the stopper and a stop pin 11 in the cylinder tube 2 which is biased in the direction of the hollow by a second spring member 12 engages with the hollow. A load port utilizes the cylinder for a production system.

Abstract: According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract: Methods for correcting motion of a robot are provided in the present invention. In one embodiment, a method for correcting motion of a robot includes transferring a first substrate supported on a robot to a processing position using a robotic motion routine, depositing a material on the first substrate in the processing position, determining an offset between a center of the deposited material and a center of the first substrate, adjusting the robotic motion routine to compensate for the offset. In another embodiment, a processing chamber is provided configured to obtain samples from which motion of a robot operated therein may be corrected to improve substrate placement on a substrate support through analysis of material deposited on the substrate.

Abstract: In a resist-removing process system 1 for removing a resist film formed on a wafer W, the resist film is denatured so as to make the resist film soluble in water and, then, the resist film is removed from the wafer by applying a water-wash processing to the denatured resist film. A series of the denaturing processing and the water-wash processing are carried out such that the denaturing processing of the resist film, which requires a long processing time, is performed by alternately using batch type resist-denaturing process units 21a and 21b each permitting a plurality of wafers W to be processed simultaneously, and the water-wash processing requiring a processing time shorter than that of the denaturing processing of the resist film is carried out by simultaneously operating six water-wash process units 22a to 22f each applying a water-wash processing to the wafers W one by one.

Abstract: A pod cover removing-installing apparatus can open and close any covers for a variety of pods made by a various manufactures, can satisfy an allowable distortion error capable of being normally operated even if conditions such as temperature, humidity, and can remove and install the cover without causing it to collide with any one of the parts of the pods. The pod cover removing-installing apparatus to remove and install a cover for an opening of a pod, the inside of which is kept extremely clean, by causing the cover to engage a door for an opening of a high cleanliness room, while maintaining high cleanliness of the pod and the room by closely attaching the circumference of the two openings. The apparatus is provided with positioning pins for positioning the cover, a fine adjustment mechanism for fine adjustment of the positioning pins, and a holding mechanism for holding the position of the cover engaging the positioning pins.

Abstract: A vacuum processing apparatus comprising a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas; and a mass flow controller unit interposed between two processing chambers for supplying gas to the chambers.

Abstract: A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 ?m, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electrostatic carrier for the duration of and between at least two processing steps, during the manipulating steps and during any necessary intermediate storage.

Abstract: A vacuum processing method includes an atmospheric transfer step of transferring a wafer in atmospheric air to a vacuum transfer chamber using atmospheric transfer equipment disposed in atmospheric air, a vacuum transfer step of transferring the wafer received from the atmospheric transfer equipment to a position for a predetermined treatment within a vacuum processing chamber using vacuum transfer equipment disposed within the vacuum transfer chamber connecting the atmospheric transfer equipment and the vacuum processing chamber, a step of detecting the displacement of the wafer in a transverse direction with respect to a traveling direction near an ingress path of the wafer to the vacuum processing chamber by comparing a correct position of the wafer passing a line which is predetermined in advance with an actual position of said wafer being transferred by the vacuum transfer equipment, and a step of correcting the detected displacement of the wafer.

Abstract: It is an object of the present invention to provide a plate-shaped work piece transporting apparatus that has a fan, a dust-removal filter disposed above this fan, and a plate-shape porous member disposed above the dust-removal filter. By forming a chamber in which air can accumulate between the porous member and the dust-removal filter, it is possible to suppress air pulsations. Further, by providing support members on the porous member, the plate-shaped work piece can be supported and damage thereto can be avoided when the plate-shaped work piece, which is supported by air from the fan, drops to below a set height.

Abstract: When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that holds the first jig and is mounted on a heat treatment boat is adopted as a heat treatment boat of a vertical heat treatment furnace, the stress concentrated during the heat treatment on a particular portion of the semiconductor substrate can be reduced; in the case of a semiconductor substrate large in the tare stress and having an outer shape of 300 mm being heat treated, or even in the case of the heat treatment being carried out under very high temperature conditions, the slips can be suppressed from occurring. The present invention can be widely applied as a stable heat treatment method of semiconductor substrates.

Abstract: A bridge loadport is described comprising a tool interface, an advance plate assembly, a port plate, and a port door. The tool interface extends vertically and is configured to substantially cover one end of a process tool. The advance plate assembly is supported on the front side of the tool interface and is configured to support a front-opening unified pod (pod). The port plate extends vertically, covering an upper portion of the tool interface. An aperture having a size and shape that substantially matches a size and shape of a door of a pod is formed in the port plate. The port door has a port door actuator and a port door face attached to the port door actuator. In one embodiment, the port door face is movable with respect to the port door actuator along a ling perpendicular to the aperture.

Abstract: A substrate transfer controlling apparatus can easily maximize throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling apparatus includes an input device for inputting times required for actions of transfer devices and times required to process substrates in processing devices, and a schedule calculator for calculating execution times of actions of the transfer devices for allowing a time when a final one of the substrates to be processed is fully processed and returned from the substrate processing apparatus to be earliest, based on a predetermined conditional formula including, as parameters, the inputted times. The substrate transfer controlling apparatus further includes an action commander for instructing corresponding transfer devices to perform actions at calculated execution times of the actions of the transfer devices.

Abstract: An apparatus and method for visualization of process conditions in a process chamber or chambers, particularly during the fabrication of integrated circuits on substrates in the process chambers. The apparatus includes an inspection chamber which is installed adjacent to a process chamber. A camera provided in the inspection chamber is used to view the interior of the process chamber as the etching, chemical vapor deposition or other process is carried out in the process chamber. A video monitor is typically connected to the camera for viewing images from the camera. In the event that a defect-precipitating event occurs in the process chamber, such as a mechanical malfunction or accumulation of excessive levels of polymer deposition on the chamber walls, the event is displayed on the monitor in real-time.

Abstract: According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract: A variety of maintenance work is performed for each of operation units in a substrate processing apparatus. Doors are provided at given positions on sides of an apparatus space, each of which is provided with an interlock switch. An interlock release unit is provided near each of the doors for disabling the function by the interlock switch, and for placing a specific operation unit of the operation units in the apparatus space in an off state, while holding the other operation units in an on state. Re-operation instruction units are provided at given positions on the sides of the apparatus space for placing the specific operation unit in an on state that has been placed in an off state by the manipulation of the interlock release unit.

Abstract: A semiconductor manufacturing apparatus includes a transfer mechanism including a moving part for holding a substrate to be processed and moving along a longitudinal transferring passage and a plurality of processing units for performing respective processes on the substrate. The processing units are disposed along the transferring passage and the substrate is transferred between the processing units and the transfer mechanism. An exhaust chamber is provided under the processing units, the exhaust chamber having a gas exhaust opening at the side of the transferring passage, the exhaust chamber. Further, a suction exhaust line is connected to the exhaust chamber, and a guide member is provided inside the exhaust chamber or at a position facing the opening, wherein the guide member extends along the transferring passage.

Abstract: A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

Abstract: A door fixture to be fastened to a frame of an isolator includes a door and a double bayonet closure with two bayonet locks for reciprocally transferring the isolator from a first state, in which the door, which opens from inside the isolator, is open and detached from the isolator frame and a container flange surrounding a container is sealingly locked to the isolator frame, and a second state, in which the door is shut and sealingly locked to the isolator frame and the container flange is detached from the isolator frame, there being provided a first safety device, which allows the door to be opened only when a container flange of a container is sealingly locked to the isolator frame, and a second safety device, which allows for the removal of the container flange from the isolator frame only when the door is sealingly locked to the isolator frame.

Abstract: A bolt includes a main body and a spring pin. The main body includes a head and a shaft. The spring pin includes a base portion and an end portion. The shaft includes a portion of external thread and a hollow portion. The head includes a top surface and a hole opened in the top surface. The hole is connected to the hollow portion. The base portion is arranged in the hollow potion to move along an axis of the main body. The end portion is arranged in the hole to move along the axis. The spring pin is energized toward a side of the head such that the end portion protrudes beyond the top surface. The end portion is electrically connected to the portion of external thread.

Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

Abstract: In a port structure 16A in a semiconductor processing system 2, a door 20A is disposed in a port 12A defined by upright wall 52 and 54. A table 48 opposed to the port is disposed outside the system. Defined on the table is a mount region 76 for mounting an open type cassette 18A for a process subject substrate W. A hood 50 is disposed rotatable relative to the table. The hood defines in its closed position a closed space surrounding the mount region and port, the space having a size to receive the cassette. First ventholes 58 are formed in the upright walls and/or the door so as to introduce gas from within the system into the closed space in the hood. Second ventholes 72 are formed in the table so as to discharge the gas can be discharged out of the closed space.

Abstract: In a first aspect, a computer program product is provided. The computer program product includes a medium readable by a computer. The computer readable medium has computer program code adapted to (1) create a band map that indicates an expected status of one or more positions along a band of a continuously moving conveyor system, each position adapted to receive a carrier support adapted to transport at least one substrate carrier around an electronic device manufacturing facility; (2) monitor status of the one or more positions included in the continuously moving conveyor system; and (3) control operation of the continuously moving conveyor system based on the status of the one or more positions. Numerous other aspects are provided.

Abstract: An integrated lithographic fabrication cluster system, as presented herein, comprises an exposure apparatus to expose a pattern onto a substrate with an associated exposure controller to control the exposure apparatus and a track apparatus interconnecting a plurality of processing modules with an associated track controller to control the track apparatus. The cluster system also comprises a wafer handling apparatus coupled to the exposure apparatus and track apparatus that is configured to transfer substrates between the processing modules utilized by the exposure apparatus and track apparatus and a wafer handling controller to control the wafer handling apparatus. The cluster system further comprises a cluster controller that communicates control information to at least one of the exposure controller, the track controller, and the wafer handling controller to manage operations of the exposure apparatus, the track apparatus, and the wafer handling apparatus during the lithographic fabrication process.

Abstract: A downward mechanism for support pins is applicable to a reactor of removable type. Support pins are located on the base of the reactor, and each support pin has a base thereunder. The downward mechanism has an elevator mechanism and a board fixed thereto. The board has several holes for the pin and the base to pass respectively therethrough. Each hole elongates into a slit allowing each of the support pins, only, to pass respectively therethrough.

Abstract: A semiconductor wafer which is disk-shaped as a whole, and which has a substantially flat face, a back substantially flat in at least a main portion thereof and substantially parallel to the face, and a side surface. The side surface is convex as a whole in a longitudinal sectional view. A means to be detected, which is composed of a local flat surface, is disposed in the side surface.

Abstract: A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).

Abstract: The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.

Abstract: A load lock chamber provided between a port that accommodates an object to be processed and is maintained at an ambient pressure, and a process chamber that is maintained at a reduced pressure or vacuum environment and performs a predetermined process for the object, said load lock chamber replacing an atmosphere in said load lock chamber and delivering the object between the port and the process chamber includes a first load lock chamber that includes a first holder for holding the object received from the port, and a second load lock chamber that includes a second holder for holding the object received from the process chamber, wherein the first holder holds more objects than the second holder.

Abstract: The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.

Abstract: When the processing temperature in a heater should be changed between lots, for example, a foremost substrate in a subsequent lot is transported to a position close to the heater such as a substrate holding part, and is held in standby thereat until adjustment of a processing environment (namely, change of the processing temperature) is completed. The substrate held in standby is thereafter transported to the heater. As compared with the case in which substrates are placed in standby in an indexer, substrates can be fed faster to the heater after change of the processing temperature, thereby suppressing throughput reduction.

Abstract: A camera is fixed to a camera fixture extending forward and upward from a rear end of an arm mechanism. The camera picks up the direction of extension of the arm mechanism when the substrate is carried in and out. If a normal still image in a hot plate unit previously recorded and a still image picked up by the camera coincide with each other, a substrate transport robot TR carries in and out the substrate.

Abstract: A supply control apparatus is provided and includes a memory for storing lot control data for controlling a plurality of lots, reticule control data for controlling a plurality of masks, and inline photo device control data; an update section for updating the data; a control information generating section generating lot supply control information for controlling lot supply based on the lot control data and the reticule control data, as well as mask supply control information for controlling mask supply; and a communications section for transmitting the lot supply control information to a lot supply device that supplies lots to the photo device, transmitting the mask supply control information to a mask supply device that supplies masks to the photo device, while receiving notification information on the current position of a lot or a mask from the lot supply device, the mask supply device or the photo device.

Abstract: A working range setting method of a bonding device includes identifying a model of a first substrate, extracting a set value corresponding to a working range of working elements according to the identified model, and setting the working range of the corresponding working elements with the extracted set value.

Abstract: A dual chamber apparatus including a first chamber and a second chamber which is configured to be coupled to the first chamber at an interface. Each of the first chamber and the second chamber has a transfer opening located at the interface. An insulating plate is located on one of the first chamber and the second chamber at the interface and is configured to have a low thermal conductivity such that the first chamber and the second chamber can be independently controlled at different temperatures when the first chamber and the second chamber are coupled together. Additionally, the apparatus may include an alignment device and/or a fastening device for fastening the first chamber to the second chamber. In embodiments, the insulating plate may be constructed of Teflon. Further, the first chamber may be a chemical oxide removal treatment chamber and the second chamber may be a heat treatment chamber.

Abstract: A wafer flow recipe is prepared. Based on this wafer flow recipe, there are estimated and calculated respectively a PCD time from a time point at which a process for coating a resist liquid on a substrate by a coating unit has been terminated to a time point at which a first heating process is started at a first heating unit, a PAD time from a time point at which the first heating process has been terminated at the first heating unit to a time point at which an exposure process is started, and a PED time from a time point at which the exposure has been terminated to a time point at which a second heating process is started at a second heating unit. Then, these estimated times are displayed.

Abstract: There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.

Abstract: A planar motor is controlled by supplying a three-phase alternating current to a coil assembly. Each phase is supplied to one of three coils. The coils are positioned in a magnetic field generated by a magnet plate having alternating magnet poles at its surface for generating an alternating magnetic field. In operation, the phase of each current flowing through each coil determines the direction of a force generated due to the current in the magnetic field. For correct operation, the phase angle of each current is to be adapted to the local direction of the magnetic field by determining a commutation-offset angle. The commutation-offset angle is determined by generating a force in an unknown direction and varying the commutation-angle, and determining when the generated force is directed perpendicular to the magnet plate, while ensuring that the generated force does not exceed a horizontal friction force.

Abstract: A method of controlling a track apparatus in a lithocell apparatus arrangement, is presented herein. The lithocell includes a lithographic exposure apparatus configured to expose substrates and a track apparatus configured to prepare substrates before exposure and develop substrates after exposure. The method includes predicting times at which the lithographic exposure apparatus will be available to accept a prepared substrate for exposure from the track apparatus, and adjusting a rate at which the track apparatus prepares substrates so that a substrate is prepared in time for acceptance by the lithographic exposure apparatus.

Abstract: A semiconductor processing system utilizing transport speed monitoring of a wafer boat. The semiconductor processing comprises a process chamber, loading device, and transport speed monitoring device. The loading device transports a boat of wafers into and out of the process chamber where the wafers experience particular treatment. The transport speed monitoring device is responsible for detecting the movement of the wafer boat and asserting an abnormality signal when the transport speed of the wafer boat falls beyond a limit.

Abstract: A substrate processing apparatus having a recipe storage section, a transfer control section and a transfer schedule changing section which, when delivery of an n-th substrate from a transfer art to the previous module is delayed by “m” cycles, changes a transfer schedule so as to move each of n-th and subsequent substrates (including the n-th substrate) in the transfer schedule to a module to which an “m”-th substrate following the substrate has been allocated, and transferring the changed transfer schedule data to the transfer control section.

Abstract: A structure for racking substrates includes first to fourth main legs isolated from one another at intervals wider than widths of both long sides and both short sides of a substrate, first to fourth protrusions respectively protruded from the first to fourth main legs in a direction of the long sides or the short sides of the substrate, a first side support bar coupled to the first and second protrusions and supporting an edge of one long side or one short side of the substrate, a second side support bar coupled to the third and fourth protrusions and supporting an edge of the other long side or the other short side of the substrate, at least one auxiliary leg disposed between the first and second main legs, or the second and third main legs, or the third and fourth main legs, or the fourth and first main legs, and at least two central support bars coupled to the auxiliary leg, extended parallel to the long sides or the short sides of the substrate, and supporting a central portion of the substrate.

Abstract: A wafer carrying apparatus 20 for carrying intermediate products comprises: a conveyer 40 for carrying the intermediate products in the carrying direction; and a plurality of platforms 41 arranged in the conveyer 40 along the carrying direction of the intermediate products on the conveyer 40, each platform 41 being capable of mounting at least one intermediate product at a position in a direction crossing the carrying direction of the intermediate products on the conveyer 40.

Abstract: A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a test target film formed on a target substrate (W) by a semiconductor process. The information processing section (51) calculates a positional correction amount of the target substrate (W) necessary for improving planar uniformity of the characteristic, based on values of the characteristic measured by the measuring section (40) at a plurality of positions on the test target film. The control section (52) controls a drive section (30A, 32A) of a transfer device (30), based on the positional correction amount, when the transfer device (30) transfers a next target substrate (W) to the support member (17) to perform the semiconductor process.