Abstract: The present invention provides a copper alloy, that includes an Sn content of 3 wt % to less than 4 wt %; a Ni content of 0.5 wt % to less than or equal to 1.0 wt %; a Zn content of 0.05 wt % to less than or equal to 5.0 wt %; and Cu and unavoidable impurities combined as the balance; wherein a total content of insolubles is less than or equal to 0.02 wt %. The present invention also relates to a method for producing the above-described copper alloy, which includes holding a copper alloy at a temperature ranging from 550 to 700° C. for a time period ranging from 5 sec to less than or equal to 5 min in the course of cold working; subsequently heat treating the copper alloy to cool the copper alloy to room temperature at a cooling speed of 5° C./sec or higher; subsequently cold working the copper alloy to a target dimension; and stabilizing annealing the copper alloy at a temperature ranging from 325 to 450° C. and a time period ranging from 5 sec to less than or equal to 180 min.

Abstract: Copper-base alloys are provided that maintain high hot forgeability and cuttability and low-cost feature and which still are improved in resistance to dezincification. The alloys comprise 57-69% of Cu, 0.3-3% of Sn and 0.02-1.5% of Si, all percentages based on weight, with a Si/Sn value in the range of 0.051, and the balance being Zn and incidental impurities.

Abstract: A method for inhibiting metal dusting corrosion of surfaces exposed to supersaturated carbon environments comprising constructing said surfaces of, or coating said surfaces with a copper based alloy. The invention is also directed to a composition resistant to metal dusting.

Abstract: A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy phase and the soft copper alloy phase coexist in a mixture state. On the surface of the sliding material, the soft copper alloy phase comes to have a shape more concave than that of the hard copper alloy phase when receiving a load or when being in a sliding wear relation, in which concave portions is retained lubricant with the result that the anti-seizure property is enhanced. Further, since the soft phase and the hard phase are made of the same copper alloy, the wettability thereof becomes good, and Ni and etc. contained in the hard copper alloy phase are diffused into the soft copper alloy phase, so that the hardness of the boundary portion defined between the phases come to be gradually varied.

Abstract: A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 80 ksi, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal above 850° C. and subsequent cold rolling into sheet, strip or foil interspersed by bell annealing. As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section.

Abstract: A copper alloy contains from 4 to 20 wt. % tin and various other metals. The alloys can be used in the manufacture of structural parts which are joined together through the use of heat such as jewelry, clothing accessories and mechanically stressed structural parts in a general machine-building or automotive industry. Iron, titanium, zirconium, hafnium, manganese, zinc, phosphorus and lead can also be present in the alloy composition.

Abstract: Copper-base alloys are provided that maintain high hot forgeability and cuttability and low-cost feature and which still are improved in resistance to dezincification. The alloys comprise 57-69% of Cu, 0.3-3% of Sn and 0.02-1.5% of Si, all percentages based on weight, with a Si/Sn value in the range of 0.05-1, and the balance being Zn and incidental impurities.

Abstract: An unwrought continuous cast Cu—Ni—Sn spinodal alloy and a method for producing the same is disclosed. The Cu—Ni—Sn spinodal alloy is characterized by an absence of discontinuous &ggr;′ phase precipitate at the grain boundaries, ductile fracture behavior during tensile testing, high strength, excellent wear and corrosion resistance, superior bearing properties, and contains from about 8-16 wt. % nickel, from about 5-8 wt. % tin, and a remainder copper.

Abstract: A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 &mgr;m Ra and then fine finished by polishing to a roughness of at most 0.1 &mgr;Ra.

Abstract: A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from 50 at % to 70 at %. A physical vapor deposition target includes an alloy of copper and tin, with tin being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a conductive integrated circuit metal alloy interconnection includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. A conductive integrated circuit metal alloy interconnection includes an alloy of copper and silver, with the silver being present in the alloy at from 50 at % to 70 at %. A conductive integrated circuit metal alloy interconnection includes an alloy of copper and tin, with tin being present in the alloy at from less than 1.0 at % to 0.

Abstract: Disclosed is a copper alloy sliding material comprising 0.5 to 15 mass % Sn and 0.1 to 10 vol % of hard particles consisting of one or more selected from WC, W2C and Mo2C. The hard particles have preferably an average particle size of 0.1 to 10 &mgr;m, whereby they are dispersed in the copper alloy matrix so as to make the sliding-contact surface uneven, from which the hard particles protrude partially. The sliding material comprises an amount or a total amount of not more than 40 mass % of one or more selected from Ni, Ag, Fe, Al, Zn, Mn, Co, Si and P, an amount or a total amount of not more than 10 mass % of Bi and/or Pb, and/or an amount or a total amount of not more than 10 vol % of a solid lubricant comprising BN, graphite, MoS2 and/or WS2.

Abstract: Disclosed is a copper alloy sliding material having a metal structure wherein intermetallic compounds exist adjacently to Pb-phase islands and/or Bi-phase islands. Because intermetallic compounds exist between the matrix and the Pb phase and/or the Bi phase, the material can have improved anti-seizure property, since, under load or due to wear, the surface of the material has recessions at the soft Pb and/or Bi phase and the matrix with respect to the intermetallic compounds.

Abstract: A bond for a single layer metal bond abrasive tool can be easily chemically and electrochemically stripped from the metal core of a recovered used tool to facilitate reuse of the core. Relative to conventionally bonded tools, the speed of stripping the novel bond is quick, and the stripped core has a smooth, clean surface which needs only minimal mechanical repair prior to reuse. In one aspect, the novel bond is a quaternary bond composition consisting essentially of copper, tin, titanium and silver. The powder components can be used dry or mixed with a fugitive liquid binder as a paste. The novel bond can be brazed at lower temperature than copper/tin/titanium bonds prepared otherwise. The bond composition forms a good melt at braze temperature that flows smoothly, evenly over a tool preform and provides consistent quality bonding of abrasive from tool to tool.

Abstract: A copper-tin-titanium alloy which consists of 12 to 20% by weight tin, 0.002 to 1% by weight titanium, remainder copper and usual impurities. It is possible to add further elements. Semifinished products made from the copper alloy according to the invention are preferably produced by thin-strip casting or spray compacting. Due to a particularly advantageous combination of high mechanical strength properties with excellent ductility, combined with good resistance to corrosion, semifinished products made from the copper alloy according to the invention have numerous possible uses.

Abstract: A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.

Abstract: A high strength, highly electrically conductive copper-based alloy and method for producing the alloy are provided, with the alloy containing boron in the range of 0.0-2.9 at. %, magnesium in a range of about 2.8-7.6 at. %, tin in a range of about 2.1-4.3 at. %, and the balance copper and unavoidable impurities. The method for producing the high-strength, highly conductive alloy includes solution heat treating or annealing the material to dissolve the solute elements into a solid solution including the copper, rapidly quenching the material to freeze the solute elements in solid solution, and aging the material at a temperature in a range of about 400-475.degree. C. to precipitation harden the alloy material.

Abstract: The copper-based sliding material has improved seizure resistance, even if it is free of Pb, and enables thinning of the overlay. The copper alloy provided consists of from 0.1 to 2% of Ag, from 1 to 10% of Sn, and the balance consisting of Cu and unavoidable impurities and, further said Ag and Sn do not essentially form the secondary phases but are in complete or essentially solid-solution state in the Cu matrix.

Abstract: A wire for electric railways comprises a copper alloy which consists essentially, by weight percent, of 0.1 to 1.0% Cr, 0.01 to 0.3% Zr, 0.05 to 0.15% Sn, and 10 ppm or less O, and if required, further contains 0.01 to 0.1% Si, or 0.01 to 0.1% Si and 0.001 to 0.05% Mg, with the balance being Cu and inevitable impurities.

Abstract: This invention relates to a catalytic fuel composition capable of reducing pollutants in the combustion gasses generated upon combustion of the same. A catalytic material is combined with a liquid, petroleum-based fuel, mixed and solid particles are separated out to give the catalytic fuel product. The catalytic material predominantly comprises a plagioclase feldspar belonging mainly to the albite-anorthite series, and contains small amount of mica, kaolinite and serpentine, and optionally contains magnetite. An alloy material is also disclosed, comprising a mixture of the above-described catalytic material and a metal. The alloy material exhibits unique properties relative to the metal component alone, such as increased tensile strength, improved heat resistance, improved acid resistance, improved corrosion resistance, as well as exhibiting unusual conductive properties.

Abstract: Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders having about 90 parts copper, about 10 parts tin and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are disclosed. Lead-free metallurgy powder for use in manufacturing a shaped brass part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders about 70-90 parts copper, about 10-30 parts zinc and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped brass part up to about 5% weight are also disclosed.

Abstract: The invention concerns copper-based sintered components for use as contact components such as clutches and brakes and is intended to provide a sintered component comprising hard particles admixed with and finely and uniformly dispersed in a primary particle of a matrix to provide improved friction coefficient, and in which the dispersed hard particles are inhibited from coming off the Cu--Sn alloy matrix during contact movement so that the sintered component is possessed of good friction contact characteristics and improved mechanical properties under dry and wet conditions. The sintered contact component comprises a copper-based sintered alloy having a structure such that 15 to 25 wt % of a hard particulate material having a maximum particle diameter of not more than 15 .mu.m and a mean particle diameter of not more than 5 .mu.m is uniformly dispersed within copper particles in an alloy matrix.

Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.

Abstract: Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of about 90 parts copper, about 10 parts tin and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are disclosed. Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of about 70-90 parts copper, about 10-30 parts zinc and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are also disclosed.

Abstract: Lead-free copper-tin, low friction, castable bearing bronze alloy for industrial applications as bearing, bushing, and guide parts as well as threaded cast parts, with the following weight percentage range.Sn=3-9Bi=2.5-9P=0-0.3Zn=0-1Ni=0-2Pb=0-0.

Abstract: A suitable casting alloy for use in a fluid treatment device may be made as a copper-nickel-zinc-tin (CU--NI--ZN--SN) alloy without the addition of silver, silicon or magnesium, if certain identified trace metals are kept below certain levels. It appears that the previously identified additive metals, which are either expensive or dangerous, act to counteract the deleterious effects of these trace contaminants, and are not necessary of the contaminants are controlled. A method of forming the alloy prevents the explosive reactions encountered when melting together metals having significantly differing vaporization and melting temperatures.

Abstract: A slide bearing comprising a copper-nickel-tin alloy consisting essentially of______________________________________ 4-8% by wt nickel, 4-8% by wt tin, 0.005-1.0 by wt zinc, 0.005-0.5 by wt iron, 0.005-1.0 by wt lead, ______________________________________the remainder being copper and common impurities, the alloy having a multi-phase granular state with a preferred linear orientation and including:at least one of discontinuous gamma phase precipitations and continuous gamma phase precipitations, the precipitations being formed followed cold forming of the alloy by heat treatment at a temperature of 300.degree. to 450.degree. C. for 10 minutes to 50 hours so as to provide about 0.1 to about 30 volume % of the gamma phase in the alloy,up to 15 volume % of highly concentrated tin and nickel grain areas (GSnNi) characterized by the atomic formula Cu.sub.43 Ni.sub.17 Sn.sub.40,up to 15 volume % of highly concentrated tin and nickel grain areas (GSn) characterized by the atomic formula Cu.sub.80 Ni.sub.6 Sn.sub.

Abstract: A ternary brazing alloy for carbon or graphite consisting essentially of 0.5-10 wt % titanium, 10 to 50 wt % tin, balance copper.

Abstract: Metal filler compositions and methods of employing the same are disclosed, in which the compositions are copper base with the addition thereto of tin and silicon. For thermal spraying applications, aluminum is included in the formulation. By practice of the invention, substantial improvements in bond strength and quality of the surface finish are achieved.

Abstract: There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of______________________________________ 10-100 ppm In (indium), 10-1000 ppm Ag (silver), 10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), 10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), 3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), 3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), ______________________________________and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.

Abstract: A phosphorous copper based alloy having combined tin and antimony contents up to approximately six percent each for brazing filler metal joining copper and copper alloys producing strong clean joints at lower brazing temperatures. Silver added in amounts of 1-18% offers the ability to lower brazing temperatures further.

Abstract: A copper alloy for electronic instruments is disclosed which comprises 2.0 to 7.0 wt. % of Sn, 1.0 to 6.0 wt. % in total amount of at least one kind of Ni, Co and Cr, o.1 to 2.0 wt. % of Si, and the remainder of Cu and unavoidable impurities, thereby further the content of O.sub.2 in unavoidable impurities being not more than 50 ppm, the content of S being not more than 20 ppm, and the average particle diameter of precipitates being not larger than 10 .mu.m. As the uses of such copper alloys, lead material for semiconductor elements and connector, socket, spring and terminal for electronic and electric instruments are claimed.

Abstract: A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., the working direction and the direction perpendicular to it. A very thin-walled member can be produced from this spring material since its anisotropy in characteristics is small and will not increase even if the amount of working is increased.The copper base alloy of which this spring material is made consists essentially of 2.2-5% Ti, 0.1-0.8% Co, 0.02-0.5% Cr, 0-0.6% of Ni and/or Fe, 0-0.5% of at least one of Ca, Mg, Zn, Cd, Li, Zr, Si, Mn, Sn and Al, and the balance being Cu and incidental impurities.

Abstract: A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.

Abstract: A recording material made of an alloy capable of exhibiting different spectral reflectances at an equal temperature, depending on a heating-cooling cycle to which the alloy is subjected. The alloy can possess in solid state different crystal structures at a first temperature higher than the room temperature and at a second temperature lower than the first temperature but not lower than the room temperature. A part of the surface of the alloy exhibits, as a result of being quenched from the first temperature, a crystal structure which is different from the crystal structure at the second temperature, while the other part possesses the crystal structure at the second temperature, so that these two parts exhibit different spectral reflectances. Using this recording medium, it is possible to record, reproduce and erase information by means of, for example, laser beams.

Abstract: A filler metal for the welding of steel and iron, copper and copper alloys, with and without surface finishing, which shows a good wetting and also a good flow for surface-treated base metals, which does not form any scales and any visible crusting and does not build up too much, thus has an insignificant pore formation and a comparatively insignificant splatter formation, has the following composition in percentage by weight:0.01-2.5% Si,0.1-0.4% Sn,0.6-1.5% Mn,0.005-0.020% P and/or0.002-0.020% B,whereby P and B together are less than 0.020%, the remainder being copper, impurities Pb less than 0.02%, other impurities together less than 0.5%.

Abstract: Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controlled amounts of tin, palladium, indium and mixtures thereof.

Abstract: The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.

Abstract: The invention concerns a self-lubricating sintered bearing of antimony bronze, and method for its production, the bearing containing dispersed phases (3, 4, 5) which are harder than the matrix (11), of the following composition (% by weight):Sb 1.5 to 4%Sn 5 to 10% with Sn/Sb=1.3 to 3.5Cu+other elements and impurities: balance,and that its dispersed phases each consist of a diffusion halo (9, 10) in a condition of continuity with the matrix (11), said halo (9, 10) surrounding a microporosity (6, 7, 8) and being of a ternary intermetallic composition (Cu, Sn, Sb).The invention also concerns the process for the production of the self-lubricating sintered bronze bearings.

Abstract: A copper-tin alloy having improved wear performance and a process for forming the alloy is described herein. The alloy consists essentially of about 2% to about 11%, preferably about 3.5% to about 9% tin, about 0.03% to about 0.75%, preferably about 0.08% to about 0.5% phosphorous and the balance essentially copper. The processing for improving the wear performance includes a final heat treatment at a temperature in the range of about 400.degree. C. to about 650.degree. C., preferably about 500.degree. C. to about 600.degree. C. in an atmosphere having a dew point in the range of about -75.degree. C. to about +95.degree. C., preferably -57.degree. C. to +21.degree. C. and an oxygen level in the range of about 0.001 ppm to about 225 ppm.

Abstract: A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.

Abstract: A bearing material comprising copper and bismuth. Preferably there is from 12% to 18% by weight of bismuth and for some purposes there may be up to 35%. Depending upon special requirements, the bearing material may also have varying amounts of silver, antimony, zinc, phosphorous and nickel. Copper usually constitutes at least 50% by weight of the material.

Abstract: The disclosed electrode composition for a vacuum switch comprises copper, as a principal ingredient, a low melting point metal such as Bi, Pb, In, Li, Sn or any of their alloys, in a content not exceeding 20% by weight, a first additional metal such as Te, Sb, La, Mg or any of their alloys and a refractory metal such as Cr, Fe, Co, Ni, Ti, W or any of their alloys in a content less than 40% by weight.

Abstract: The present invention relates to novel tin bearing copper alloy compositions that possess a combination of high anneal resistance and high electrical cconductivity properties. These compositions contain about 0.025 to 0.15 weight percent free tin with a weight percent of combined tin that is 3.7 times the oxygen content. Selenium and/or tellurium additions of from 0.005 to 0.05 weight percent also contribute to or maintain the improved properties of the present invention.Other aspects of the invention relate to a process for preparing these anneal resistant, high electrical conductivity copper alloy compositions and an apparatus suitable for use as radiator fin, electrical connector, or commutator segment stock which is formed by such process.

Abstract: A copper based low melting point metal alloy composition consists essentially of about 2.5 to 11 atom percent tin and about 11 to 15 atom percent boron, the balance being essentially copper and incidental impurities. The composition is such that the total of copper and tin ranges from about 85 to 89 atom percent.

Abstract: Reactive metal-copper alloys containing specified amounts of a third metal selected from the group consisting of silicon, tin, germanium, manganese, nickel, cobalt and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and incidental impurities. The properties of the filler material can be improved further by addition of at least one element selected from the group consisting of Sn, In, Fe, Ni, Co, B and Li.

Abstract: An alloy containing Mn in an amount of from 5 to 30 weight percent, at least one member selected from the group consisting of Sn of an amount of not more than 5 weight percent, Al of an amount of not more than 8.5 weight percent, Zn of an amount of not more than 7 weight percent, Fe of an amount of not more than 2.5 weight percent, and Ni of an amount of not more than 2.5 weight percent, and the balance to make up 100 weight percent of Cu plus normally entrained impurities produces a metallic material proof against the attachment thereto of marine organisms when the alloy fulfils a requirement that it should possess an .alpha.(face-centered cubic lattice) single-phase structure.

Abstract: A silver-tin-copper-palladium alloy containing from 30 to 70% silver, 15 to 37% tin, at least 13% copper and from 0.05 to 0.95% palladium; and an amalgam thereof.

Abstract: Copper alloys are disclosed which contain nickel and tin and Fe, Zn, Mn, Zr, Nb, Cr, Al, or Mg in amounts within specified limits. When cold worked and aged according to a critical schedule these alloys develop a predominantly spinodal structure which renders them strong as well as ductile. The disclosed alloys are useful, for example, in the manufacture of components of electrical apparatus such as springs, connectors and relay elements.