Abstract: Method of making an apparatus for inserting intraocular lenses (IOLs) into eyes include a hollow tube including a material and having a plasma exposed interior wall defining a hollow space through which an IOL is passed and an outlet through which the IOL is passed from the hollow space into an eye, and a lubricity enhancing component physically secured to said hollow tube and concentrated at or near the interior wall in an amount effective to facilitate the passage of the IOL through the hollow space.

Abstract: Supplying gases towards the web as it separates from the drum in a plasma-enhanced chemical vapor deposition system reduces the sticking of the web to the drum, and thus prevents power supply dropouts. The gas supplied can form into a plasma that helps dissipate the static charge which builds onto the web as it rolls off of the drum. By reducing the arcing and power supply dropouts, the quality of the deposited layer formed in a deposition zone can be improved.

Abstract: A plasma-polymerized anti-fogging film is formed by polymerization-depositing a high molecular polymerized DMDAS film on a substrate to provide the substrate surface with anti-fogging capability. The plasma polymerization deposition process is performed by using diacetoxy silane monomer that contains bi-carboxylate O.dbd.C--O-- functional group as the reactant monomer with an introduction of a suitable amount of oxygen to cause the polymerization reaction. The reactant monomer and the oxygen are introduced into a vacuum deposition apparatus and a high energy plasma is generated between electrodes of the vacuum deposition apparatus to cause the polymerization reaction on the substrate to form thereon the high molecular polymerized DMDAS anti-fogging film.

Abstract: The fuel hose of this invention is a fuel hose comprising a tubular fluororesin inner ply and, as laminated onto the peripheral surface thereof, a thermoplastic resin or rubber outer ply, the tubular fluororesin inner ply having been molded from a fluororesin with an F/C ratio, i.e. ratio of the number of fluorine atoms (F) to the number of carbon atoms (C), of not greater than 1.6 and the peripheral surface layer of the fluororesin inner ply having been modified into the following treated layer (A).(A) a layer with a distribution of oxygen atoms and having an F/C ratio, i.e. ratio of the number of fluorine atoms (F) to the number of carbon atoms (C), of not greater than 1.12 and an O/C ratio, i.e. ratio of the number of oxygen atoms (O) to the number of carbon atoms (C), of not less than 0.08.

Abstract: The present invention is a plastic container coated with a multi-layer barrier coating. The multi-layer barrier coating is useful for providing an effective barrier against gas permeability in containers and for extending shelf-life of containers, especially plastic evacuated blood collection devices.

Abstract: A method for identifying and protecting activated surface portions of a plastic substrate is provided. The method includes the steps of providing a plastic substrate having one or more activated surface portions and applying a solution containing a water-soluble, organic film-forming substance onto the substrate. The solution coats only the activated portions of the substrate surface. The method further includes the steps of drying the solution to form a temporary protective film on the activated portions of the surface, thereby rendering the activated portions less susceptible to abrasion or disruption during handling.

Abstract: A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.

Abstract: A plastic wrapping film is provided with one or more aluminum layers by vapor deposition and the or each layer is only partially oxidized in an oxidizing plasma so that the resulting barrier layer is distinguishable by slight reduction in transparency but excellent prevention of penetration by moisture and oxygen.

Abstract: A method of preparing particles of an exfoliated vermiculite for the manufacture of a finished product, such as a particle board, includes the steps of, if necessary, chemically modifying the vermiculite by impregnating the vermiculite with a suitable anhydride in a non-aqueous solvent; if necessary, applying to the particles of vermiculite an adhesion promoter to promote the adherence of a resin to the surfaces of the particles of vermiculite; and resinating the particles of vermiculite either with a thermoplastic resin which has been surface modified by irradiation or by fluorination, or by an isocyanate thermosetting resin, or by a dry powder novolac thermosetting resin; and if necessary removing any solvent present.

Abstract: A method of modifying at least part of the surface of a polymer or polymer matrix composite material including: (i) oxidising at least part of the surface of the polymer or polymer matrix material and (ii) subsequently treating the oxidised surface with an organofunctional coupling agent and/or chelating agent, simultaneously with a static and/or a high frequency alternating physical field.

Abstract: The invention provides a method of improving the electrical conductivity of a resin article and a method of coating the article, with high productivity and. without using an inorganic conductive substance-containing primer. The technology comprises coating the substrate with a coating composition essentially consisting of a film-forming component, a nitrogen-containing compound of general formula (1), and a solvent and subjecting the coated surface to corona discharge treatment. The resultant film with improved electrical conductivity is then electrostatically coated.R.sup.1 --Y (1)wherein R.sup.1 represents an alkyl or alkenyl group of 5-21 carbon atoms; Y represents ##STR1## R.sup.2 and R.sup.3 may be the same or different and each represents an alkyl group of 1-4 carbon atoms; m represents 2-3; R.sup.4 represents --H or --CH.sub.3 ; A represents ##STR2## where n represents 1-5.

Abstract: A method is disclosed for modifying a fluoropolymer including the following steps: providing a fluoropolymer surface, adding a solution including a a reactive species to the fluoropolymer surface, and exposing the reduced fluoropolymer surface to ultraviolet radiation in the presence of ozone or oxygen. The method reduces the discoloration of the fluoropolymer.

Abstract: Imaging elements, such as photographic, electrostatographic and thermal imaging elements, are comprised of a support, an image-forming layer and an electrically-conductive layer produced by coating a layer comprised of a metallo-organic compound and a film-forming binder and subjecting such layer to glow discharge treatment to render it electrically conductive. Use of a metallo-organic compound in combination with a glow discharge treatment provides a controlled degree of electrical conductivity and beneficial chemical, physical and optical properties which adapt the electrically-conductive layer for such purposes as providing protection against static or serving as an electrode which takes part in an image-forming process.

Abstract: Plasma assisted polymerization and deposition of a very thin inner surface coating in a plastic or metal container without an undesirable increase in container surface temperature is provided to change the surface properties of the internal plastic surface of a container by reaction of the surface with a reactive gas which has been energized to produce a plasma or the surface is activated by a plasma of reactive gas so that it becomes receptive to a further surface reaction.

Abstract: The methods of forming a chemically adsorbed film by contacting a substrate with a solution mixture containing an alkoxysilane surface active agent, a non-aqueous solvent and a silanol-condensing catalyst to form a film covalently bonded to the substrate via siloxane bonds. These methods do not generate hydrochloric acid gas in forming the films and allow practical reaction rates.

Abstract: A process for rendering the surfaces of polymeric plastic or rubber materials, which are intrinsically non-polar or only slightly polar, and hydrophobic, polar or more polar, and hydrophilic, so that amine-containing functional groups, and ultimately, a durable tenaciously adhering, slippery polyurethane or polyurethane-urea hydrogel coating may subsequently be applied to the polymer surface, is disclosed.

Abstract: A process for the production of a carrier for surface plasmon resonance analysis comprising:A) depositing a preparatory layer on a surface, said preparatory layer comprising a metal selected from the group consisting of: nickel, titanium and chromium, wherein said preparatory layer is substantially uniform and has a thickness of 20-40 Angstroms,B) depositing a silver layer on said preparatory layer wherein said silver layer is substantially uniform and has a thickness of 500-600 Angstroms, andC) said carrier is suitable for surface plasmon resonance analysis.

Abstract: A laminate using a polymeric molded article as a substrate and having a light transparency, gas barrier properties and an excellent alkali resistance. The laminate is obtainable by carrying out a surface treatment to deposit an oxide of at least one metal selected from the metal elements of groups 2, 8, 9, 10 and 11 of the periodic table, and then forming a gas barrier layer such as oxides of silicon, nitrides of silicon and carbides of silicon on the treated surface. The gas barrier layer is not peeled off from the polymeric molded article even after being immersed in an alkali solution of pH 12 or more. The amount of the metal on the treated surface is preferably in the range of 5.times.10.sup.14 atoms/cm.sup.2 to 3.times.10.sup.16 atoms/cm.sup.2 in terms of the metal atoms per unit area. The practical performance of the laminate is not deteriorated during the patterning, by alkali etching, of a transparent conductive layer formed on the laminate.

Abstract: A material consisting of a hydrophobic material having a metallic, ceramic or glass surface which has been modified by exposing the surface to a glow discharge plasma to activate the surface, followed by exposing the activated surface to one or more ethylenically unsaturated monomers and irradiating the surface with gamma or electron beam radiation to induce polymerization thereon of the monomer(s) so as to form a hydrophilic polymeric coating on the surface of an article.

Abstract: In a method for forming a film by thermal CVD, a fluorine-containing silicon oxide film is formed on a substrate by thermal reaction of a mixed gas while heating the substrate. The mixed gas includes an organic silane having a Si-F bond, an organic silane having no Si-F bond, and ozone.

Abstract: A method for fabricating an integrated circuit capacitor includes the steps of forming a first electrode on a microelectronic substrate, and plasma treating the first electrode with a with a plasma of a gas including nitrogen and oxygen. A dielectric film is formed on the plasma treated first electrode opposite the microelectronic substrate. A second electrode is formed on the dielectric film opposite the plasma treated first electrode.

Abstract: A transparency for ink jet printing is enhanced for use as an ink jet recording medium by increasing the hydrophilicity of the coating formed on a transparent substrate. In one embodiment, the coating is subjected to a corona plasma discharge exposure to create changes in oxygen functionality at the coating surface resulting in increases in surface hydrophilicity. In another embodiment, the surface is exposed with UV radiation and ozone exposure for controlled periods of time. In both cases, the surface hydrophilicity is increased by generating highly reactive free radical oxygen (O.sup.-) which results primarily in increases in the oxygen functional groups C.dbd.O and COO.sup.-.

Abstract: A process capable of forming an inorganic film which can be used at a relatively large thickness equivalent to, or greater than, the thickness of an organic SOG, without being subjected to oxidation by O.sub.2 plasma treatment used in a fabrication process of a semiconductor device. Polysilazane is first coated on a base, and the resulting polysilazane film is converted to a silicon dioxide film.

Abstract: The invention describes a process for producing extrusion-coated laminates, which comprises subjecting the surface of an extruded film to a corona discharge treatment while the film is in a partially molten state in order to improve the adhesion of the film to a substrate.

Abstract: Processes for patterning amorphous fluoropolymer Teflon.RTM.AF, passivating high temperature superconductor films, and improved electronic devices with amorphous fluoropolymer Teflon.RTM.AF films are disclosed.

Abstract: The present invention relates to a process for forming an electronic circuit, which comprises coating a polyorganosilane on at least one surface of a substrate for forming an electronic circuit, followed by drying to form a solid state polysilane thin film, masking a portion for forming a circuit of said thin film and oxidizing a remaining portion to form an insulating portion, and then doping an oxidizing substance to the portion subjected to masking to form a conductive portion, and in order to oxidize a partial portion of the thin film, said thin film is irradiated with UV light in the presence of oxygen, preferably, in the oxidizing step, by carrying out partial oxidation while controlling an oxidation degree, the remaining portion is converted into three or more kinds of portions having different volume resistivities.

Abstract: A method for performing plasma downstream processing by generating plasma of an oxygen-containing gas with a microwave in a space having a thickness of 1/10, or less, of a wavelength .lambda. of the microwave, deriving the generated plasma of the oxygen containing gas from such space through an opening formed around the central portion of such plasma generating space through a gap having a loop-shaped cross section in a plane parallel to the space and folded cross section in a plane including a central portion normal to such space; and irradiating the generated plasma of the oxygen containing gas derived from the plasma generating space to an object to be processed.

Abstract: A film is applied to a substrate in accordance with a predetermined pattern by applying a solution of a copolymer of fluoropolymers dissolved in a solvent onto the surface of the substrate; curing and annealing the solution to boil off the solvent and form a copolymer film on the substrate; depositing a thin metal film on the copolymer film; patterning the thin metal film by a photoresist etching process to expose the underlying copolymer film in accordance with the predetermined pattern; removing the exposed copolymer film so that the underlying substrate is exposed in accordance with the predetermined pattern; removing any remaining thin metal film; depositing the film to the remaining copolymer film and exposed substrate; then removing the remaining copolymer film and any film applied thereon by ultrasonic cleaning.

Abstract: A cathode structure is formed by a process in which a carbon-containing electron-emissive cathode is subjected to electronegative atoms that include oxygen and/or fluorine. The cathode is also subjected to atoms of electropositive metal, typically after being subjected to the atoms of oxygen and/or fluorine. The combination of the electropositive metal atoms and the electronegative atoms enhances the electron emissivity by reducing the work function.

Abstract: According to a semiconductor substrate treatment method, a surface or vicinity of a semiconductor substrate is deactivated by exposing the semiconductor substrate to a plasma atmosphere in which a gas containing at least hydrogen atoms is excited. A treatment is performed on the deactivated substrate surface. The treated substrate surface is activated by heating the semiconductor substrate.

Abstract: The fuel hose of this invention is a fuel hose comprising a tubular fluororesin inner ply and, as laminated onto the peripheral surface thereof, a thermoplastic resin or rubber outer ply, the tubular fluororesin inner ply having been molded from a fluororesin with an F/C ratio, i.e. ratio of the number of fluorine atoms (F) to the number of carbon atoms (C), of not greater than 1.6 and the peripheral surface layer of the fluororesin inner ply having been modified into the following treated layer (A).(A) a layer with a distribution of oxygen atoms and having an F/C ratio, i.e. ratio of the number of fluorine atoms (F) to the number of carbon atoms (C), of not greater than 1.12 and an O/C ratio, i.e. ratio of the number of oxygen atoms (O) to the number of carbon atoms (C), of not less than 0.08.

Abstract: Treatment in a plasma of a composite reinforcing agent improves the bonding of the agent to the cement portion of the composite. This method facilitates the use of inexpensive readily available light, high tensile strength fibers as reinforcing agents. The reinforcing agents are activated by providing on the surface thereof charged atoms compatible with the cementitious portion of a composite desired to be strengthened.

Abstract: This invention provides an improved process for surface modification of polymers, graphites and carbon-based composite materials, and improved surface-modified materials produced by the process. The preferred surface modification process of the present invention comprises the steps of: high dose single or multiple implantation of the substrate with energetic ions, including ions of at least one metal or semi-metal element able to form a stable, non-volatile oxide; and oxidative full or partial conversion of an upper portion of the implanted layer to a continuous, resistant oxide-enriched surface layer. The process may also comprise the additional implantation of a hardening non-metal element to participate in the formation of a glass-like surface layer or to form a carbonized, hardened sub-layer.

Abstract: A gas plasma treated porous medium and method of using such a medium to separate or remove materials such as components of biological fluids.

Abstract: In a method for producing corrosion and wear resistant coatings on iron material, in which subsurface areas are enriched with nitrogen, carbon, and oxygen, the iron material is nitrocarburized for forming a connective coating of carbonitride. The surface of the iron material is activated with a plasma-supported vacuum process. The ion material is subsequently oxidized to form a continuous oxide coating.

Abstract: A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

Abstract: A deposition rate of a dielectric material is varied with the electrical polarity of an underlying layer to obtain excellent deposition and planarization characteristics. A conductive layer and the underlying dielectric are surface-treated to have different electrical polarities so that the dielectric is formed by using the difference of deposition rates of the dielectric material between that on the conductive layer and that on the underlying dielectric. A CVD apparatus having a DC power source connected between a susceptor and a gas injection portion thereof is provided. The deposition and planarization can be performed at low temperatures and are simplified in process.

Abstract: The present invention may provide a method for manufacturing a magnetic recording medium with high reliability by rendering simply a surface of a magnetic recording medium rough. A recording film of a magnetic material is formed on a nonmagnetic substrate, then a multilayered or composite protection film including first and second materials is formed on the recording film, and then selectively etching one of said first and second materials to transform a surface of the recording film into a rough surface.

Abstract: A method is described for grading the electrical field at the surface of an electrode by depositing a semiconductive coating thereon. An electrode substrate is powered at a preselected temperature and power. A mixture of gases is then passed through an electrical discharge to ionize at least a portion thereof to form the semiconductive coating on the surface of the electrode. Also described is the plasma enhanced chemical vapor deposition of a diamondlike carbon (DLC) film onto a substrate. A substrate is maintained at a preselected DLC forming temperature and is negatively biased at a first preselected voltage. A first gaseous mixture of hydrocarbons and argon is then passed through an electrical discharge to at least partially ionize the hydrocarbons to form DLC film on the substrate. The substrate is then negatively biased at a second preselected voltage lower than the first preselected voltage.

Abstract: A method for forming a film by a plasma CVD process in which a high density plasma is generated in the presence of a magnetic field is described, characterized by that the electric power for generating the plasma has a pulsed waveform. The electric power typically is supplied by microwave, and the pulsed wave may be a complex wave having a two-step peak, or may be a complex wave obtained by complexing a pulsed wave with a stationary continuous wave of an electromagnetic wave having the same or different wavelength as that of the pulsed wave. The process enables deposition of a uniform film having an excellent adhesion to the substrate, at a reduced power consumption.

Abstract: A thin film coating system incorporates separate, separately-controlled deposition and reaction zones for depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. The associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by controlled coating thickness, including both constant and selectively varied thickness profiles.

Abstract: A method for sequentially depositing a silicon oxide based film as a barrier on a substrate. The film is useful for providing an effective barrier against gas permeability in containers and for extending shelf-life of containers, especially plastic evacuated blood collection devices.

Abstract: A silicon dioxide layer grown by liquid phase deposition is, subjected to an oxygen or hydrogen plasma treatment to enhance the physical and electrical properties thereof. The plasma treatment is carried out at a temperature of about 300.degree. C.

Abstract: The invention seeks to provide a substrate such as metal, ceramic, plastic, and glass material having a fluorine-based coating film having strong adhesion to a surface of the substrate. The substrate material comprises a monomolecular or polymer adsorption film formed on a base substrate surface and having siloxane bonds and a fluorine-based coating film provided on the adsorption film. The invention also seeks to provide a method of manufacturing a substrate material having a fluorine coating, which is simple and does not involve any electrolytic etching step. The method comprises a step of forming a monomolecular or polymer adsorbed film having --Si-- bonds from dehydrochlorination or dealchoholation the bonded on the substrate surface and causing a silane-based surface active material, capable of reaction with an active hydrogen, to be brought in contact with the substrate surface, and laminating a fluorine-based polymer bonded by a cross-linking reaction process on the adsorbed film.

Abstract: A protective layer or film is deposited onto a face surface of a plastic substrate, e.g., a PMMA shaped article, by (a) placing such plastic substrate on a weakly or unpolarized electrode comprising a plasma-generating circuit, (b) plasma-pretreating the plastic substrate in an oxygen plasma, under primary vacuum, by a pulse of electrical power density of such minimum magnitude as to oxygen-activate a face surface thereof, and (c) plasma-polymerizing at least one organosilicon monomer onto the face surface of said plastic substrate, also under vacuum and from an oxygen/organosilicon monomer plasma, whereby depositing a thin protective layer or film thereon.

Abstract: A method for reforming an insulating film such as a BSG film formed by a CVD technique. The method reduces the parasitic capacitance between conductor layers having an intervening film, especially a BSG film, and includes the steps of depositing a BSG film on a substrate from a gaseous source and exposing the BSG film to a reforming gas plasma.

Abstract: A gas discharge through nitrous oxide or nitrogen is used to remove polymeric deposits that form on the surface of a layer of a spin-on glass that was etched in an atmosphere of carbon-fluorine compounds. Removal of the polymeric deposit greatly improves adhesion to the spin-on glass layer of subsequently deposited layers. The removal is accomplished without increasing any tendency of the spin-on glass layer to absorb moisture.

Abstract: In a plasma-CVD method and apparatus, plasma is formed from a film material gas in a process chamber and, in the plasma, a film is deposited on a substrate disposed in the process chamber. Formation of the plasma from the material gas is performed by application of an rf-power prepared by effecting an amplitude modulation on a basic rf-power having a frequency in a range from 10 MHz to 200 MHz. A modulation frequency of the amplitude modulation is in a range from 1/1000 to 1/10 of the frequency of the basic rf-power. Alternatively, the rf-power is prepared by effecting on the basic rf-power a first amplitude modulation at a frequency in a range from 1/1000 to 1/10 of the frequency of the basic rf-power, and additionally effecting a second amplitude modulation on the modulated rf-power. A modulation frequency of the second amplitude modulation is in a range from 1/100 to 100 times the modulation frequency of the first amplitude modulation.

Abstract: A method of contacting a substrate having a surface containing hydroxyl groups with a non-aqueous solution containing a material having a chrolosilyl group; washing if desired; coating the substrate with a non-aqueous solvent containing a compound having a fluorocarbon group and a chlorosilane group or a solvent containing a compound containing a fluorocarbon group and an alkoxysilane; and baking the substrate if necessary in order to form a fluorocarbon-based polymer coating film chemically bonded to the substrate surface. The hydroxyl groups on the substrate surface and chlorosilyl groups are reacted to form a thin film having a large number of silanol groups (--SiOH) capable of connecting the polymer coating film to the substrate to form a heat-, weather-, and wear-resistant film on various surfaces.

Abstract: A process for producing a silicon oxide deposit at the surface of a metallic substrate comprising the following steps performed either concomitantly or successively: (1) treating the surface of the substrate with a corona discharge; and (2) exposing the surface to an atmosphere containing a silicon compound in the gaseous state. Both steps (1) and (2) are conducted at a pressure greater than 10,000 Pa. This process can be used to provide anti-corrosion treatment to a metallic substrate or to a metallized polymeric support.