Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

Abstract: Disclosed is a coating composition for a plastic label, which contains an oxetane compound, an epoxy compound, and a cyclic acetal and/or a poly(vinyl butyral). The coating composition excels in suitability for printing such as gravure printing or flexographic printing, cures rapidly to give excellent productivity, and after curing, gives a coating layer that excels in adhesion to a plastic base film and in toughness. A plastic label formed using the coating composition excels in surface scratch resistance and crumpling resistance, and therefore is particularly useful as a label for use in plastic containers, and metal containers such as bottle cans.

Abstract: A method for the formation of a paint film in which an aluminum or aluminum alloy part is subjected to an anodic oxidation treatment and an anodic oxide film is formed on the surface of the aluminum or aluminum alloy part, an anti-rust primer is coated on said anodic oxide film and an anti-rust primer paint film is formed and, as required, a top-coat paint is coated on said anti-rust primer paint film and a top-coat paint film is formed in which said anti-rust primer includes a base resin comprising hydroxyl group containing epoxy resin and a hardening agent, selected from among melamine resin and polyisocyanate, and barium sulfate, and the proportion of said barium sulfate included is a proportion within the range from 20 to 70 parts by mass per 100 parts by mass in total of the solid fractions of the base resin and the hardening agent.

Abstract: An adhesive composition or a coating composition of the present invention contains (a) 10 to 30% by mass of an epoxy resin; (b) 25 to 55% by mass of an oxetane compound; (c) 25 to 55% by mass of a vinyl ether compound; (d) 1 to 15% by mass of a modifier (wherein the total amount of the components (a) to (d) is 100% by mass); and (e) 3 to 15 parts by mass of a photocationic polymerization initiator with respect to 100 parts by mass of the total amount of the components (a) to (d).

Abstract: Marine coatings including cationic polymers hydrolyzable to nonfouling zwitterionic polymers, coated marine surfaces, and methods for making and using the marine coatings.

Abstract: A plastic composite comprises a first plastic substrate, an adhesive layer formed on the first plastic substrate, and a second plastic substrate formed on the adhesive layer. The first plastic substrate is made of thermoplastic resin material. The second plastic substrate is made of thermosetting resin material. The adhesive layer mainly comprises amino silane coupling agent. A method for manufacturing the plastic composites is also provided.

Abstract: A coating is a mixture of polybenzimidazole polymer and an epoxy. The coating may further include a primer underlying the coating. The coating may further include an adhesion promoter. A solution includes a polybenzimidazole polymer, an epoxy resin, an initiator, and a carrier solvent. The solution may further include a stabilizer and/or an adhesion promoter.

Abstract: A primer coating composition for a metal substrate is described. The primer has a suitable binder and is characterised in that there is at least one semiconductor photocatalyst dispersed throughout the primer coating composition. A process of coating a metal substrate is also described. The invention extends to the use of a semiconductor photocatalyst as a top-coat to primer adhesion promoter or as a primer to top-coat delamination inhibitor in a primer coating composition.

Abstract: Provided is a resin article produced by melt processing and having layers formed by a layer-separation. The resin article may include a first resin layer, a second resin layer formed on the first resin layer and an interface layer including a first resin and a second resin and formed between the first resin layer and the second resin layer. The resin article may have improved mechanical and surface characteristics. Further, since coating or plating is not required for manufacturing a resin article, a manufacturing time and/or cost can be reduced, and productivity can be increased.

Abstract: There is disclosed a composite comprising a first substrate comprising a formed resin body containing a silicone-modified resin, and a second substrate having a to-be-joined surface joined'to a to-be-joined surface of the first substrate, wherein the to-be-joined surface of the first substrate, or the to-be-joined surfaces of the first and second substrates has/have been subjected to application of one or more of an ultraviolet light irradiating treatment, a corona treatment, and a plasma treatment. As a result, there is provided a composite and an expedient production method of such a composite, which composite comprises a substrate comprising a formed resin body containing a silicone-modified resin, and another substrate joined to the firstly mentioned substrate in a strong manner with excellent durability therebetween.

Abstract: An epoxy resin composition for use in producing a prepreg for printed wiring boards excellent in appearance, flame retardancy, etc., which comprises an epoxy resin, a phenolic novolak, and a curing accelerator. It is characterized in that the epoxy resin comprises an epoxy (a) and an epoxy (b), wherein the epoxy (a) is a brominated epoxy resin which is obtained by reacting/mixing a bisphenol A epoxy resin with tetrabromobisphenol A and has an epoxy equivalent of 350 to 470 g/eq and an n=0 component content of 20 to 35% in terms of areal percentage in a GPC chart, and the epoxy (b) is at least one bifunctional epoxy resin which is obtained by reacting any one selected from the group consisting of bisphenol A, bisphenol F, and tetrabromobisphenol A with epichlorohydrin and has an n=0 component content as determined from a GPC chart of 60% or higher.

Abstract: An easy open end comprising a resin-coated metal plate obtained by coating a metal substrate with a polyester film via a primer, wherein the primer comprises an epoxy resin or a polyester resin and a resole-type phenol resin, and the resole-type phenol resin has 0.2 to 2.0 methylol groups per a benzene ring. The end can be lightly opened without causing defect at the time of opening the end by pushing in the end of a tab and cutting the score and, particularly, can be excellently opened at high temperatures without arousing the problem even in a state of being heated at high temperatures featuring excellent corrosion resistance, resistance against the content and retort resistance.

Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.

Abstract: Quaternary ammonium bicarbonates are suitable for use as latent catalysts in curable epoxy compositions. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Method for preparation and curing are also provided. Of particular utility are compositions comprising benzyltrimethyl ammonium bicarbonate. The curable epoxy composition is coated onto a substrate such as a film or sheet, to form a coated article. The cure of the epoxy can be advanced after coating.

Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Abstract: Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.

Abstract: The present disclosure provides a brush polymer, including: a linear polymer main chain; and brush structural side chains, including: a hydrophobic molecular branch, and a hydrophilic molecular branch and/or an anti-biofilm/or an anti-microbial molecular branch, wherein the linear polymer main chain is conjugated to the side chains by covalent bonds formed between a hydroxyl group and a reactive functional group, wherein the reactive functional group includes: isocyanate, carboxyl, or epoxy. The present disclosure also provides a medical application of the brush polymer.

Abstract: A housing includes a substrate, a wood-grain material layer, and a protective layer. The wood-grain material layer is formed on the substrate and includes a wood-grain surface. The protective layer is formed on the wood-grain surface. The protective layer is made of transparent resin.

Abstract: The present invention provides a laminated polyester film which can be suitably used in the applications requiring a good visibility and a good adhesion property to a hard coat layer, etc., for example, such as various kinds of optical films as members of liquid crystal displays as well as molding films. The laminated polyester film of the present invention comprises a polyester film and a coating layer formed on at least one surface of the polyester film which is produced by applying a coating solution comprising a metal oxide, an oxazoline compound and an epoxy compound thereonto, the coating layer having an absolute reflectance whose one minimum value is present in a wavelength range of 400 to 800 nm, and the absolute reflectance at the minimum value being not less than 4.0%.

Abstract: Provided is a high performance anti-spall laminate article comprising a bi-layer polymeric composite. The bi-layer composite includes a polymeric sheet and a poly(ethylene terephthalate) (PET) film laminated to each other. The PET film has a tensile modulus of about 600,000 psi or higher in both the machine direction (MD) and the transverse direction (TD), a shock brittleness index of about 55 Joules or higher in the machine direction and about 25 joules or higher in the transverse direction, and a percent elongation at break (EOB) of about 110-160 in the machine direction and about 60-110 in the transverse direction.

Abstract: The present invention includes compositions and methods of supplying a corrosion inhibitor including placing a corrosion inhibitor attached to a nanostructure carrier, placing the nanostructure carrier containing the corrosion inhibitor at a location and the nanostructure carrier is capable of releasing the corrosion inhibitor.

Abstract: A process for applying an overlayer to a cured thermoset molding composition is provided that includes exposing the cured thermoset molding composition to a plasma under conditions that modify the surface energy of a surface of the article without visually modifying the surface. The surface of the article is then overcoated with an overlayer having superior adhesion to a like article absent the intermediate plasma treatment. A component is also provided that is cured thermoset resin article having a shape and a surface. An overlayer is applied to the surface while the surface is still plasma activated. The overlayer is adhesion is unchanged by 4 weeks in a 100% humidity chamber at 30° C. over at least 95 area % of an interface between the overlayer and the surface.

Abstract: The present invention provides an under-fill material with which a semiconductor device having a high connection reliability can be provided while securing a usable material by reducing a difference in thermal-responsive behavior between a semiconductor element and an adherend, and a method for producing a semiconductor device using the under-fill material. In the under-fill material of the present invention, a storage elastic modulus E? [MPa] and a thermal expansion coefficient ? [ppm/K] after carrying out a heat-curing treatment at 175° C. for an hour satisfy the following formula (1) at 25° C.

Abstract: The multilayer film serves as a laminate. In some embodiments, the film is a multilayered structure that, in its base form, encompasses an intermediate layer with first and second outer layer affixed to opposing sides of the intermediate layer. In some embodiments, the first outer layer is a semi-crystalline fluoropolymer. In some embodiments, the intermediate layer includes a polyester and the second outer layer is an olefinic polymer.

Abstract: The invention relates to products and/or methods and/or systems of epoxy foils for the protection and/or sealing of material as wood, metal, steel, stone, concrete, glass etc. for houses, buildings, cars, ships, boats, bridges, roads, floors, ceilings, walls, textiles, paper, airplanes etc. The reactivity and/or the elasticity of epoxy foils are adjustable and are applicable directly or indirectly for the protection and/or sealing of all materials such as wood, concrete, glass, metal, plastic etc. The epoxy foils are universal in use, self fixing, self cleanable, highly durable, very economical, safer, and less harmful to the environment.

Abstract: A window panel for a display device including a plastic substrate, and a hard coating layer formed on at least one side of the plastic substrate and including at least two continuously deposited layers. Here, a display device includes the window panel.

Abstract: New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.

Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.

Abstract: The present invention provides a composite material comprising a glass cloth; and an organic-inorganic hybrid composition comprising diphenylsilanediol and alkoxy si lane, a composite film manufactured by using the same, and a method for manufacturing the composite film.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.

Abstract: A method for coating an uncoated or precoated metallic or plastics substrate by (a) applying an aqueous coating composition (W) whose constituents are free or substantially free from blocked isocyanate groups, which comprises an aqueous dispersion of an epoxide-amine adduct, and which comprises either no crosslinking agent or one or more nonblocked polyisocyanate crosslinking agents, to the substrate, (b) optionally applying one or more further coating compositions, and (c) curing the coating composition (W) and, where appropriate, the further coating composition(s) at temperatures of below 90° C.

Abstract: An organic/inorganic fouling resistant composite compound is disclosed, which includes a core of a polyhedron of polyhedral oligomeric silsesquioxane and at least one arm connected to a silicon atom of the polyhedral oligomeric silsesquioxane. The at least one arm includes a vinyl-based first structural unit including at least one ethylene oxide group at a side chain of the vinyl-based first structural unit and an oleophobic vinyl-based second structural unit including a silicon group at the side chain.

Abstract: A curable epoxy resin composition of an epoxy resin (a) and a combination (b) of an antioxidant (b1) and a UV absorber (b2). The UV absorber (b2) is a benzotriazole. The antioxidant (b1) is a compound of general formula I: wherein: R1=—H, —OH, —O—C1-18 alkyl, —C1-18 alkyl, —C5-12 cycloalkyl being unsubstituted or being substituted with C1-6 alkyl or C1-6 alkoxy, or —CH2—C5-12 cycloalkyl being unsubstituted or being substituted with C1-6 alkyl or C1-6 alkoxy; R2,3,4,5=independent from each other —C1-6 alkyl; and R6=a bivalent aliphatic, cycloaliphatic or aromatic residue. The weight ratio of (a) to (b) is from 90.0:10.0 to 98.5:1.5, with the proviso that the weight portion of (b1) is at least 0.5. The cured product has very good weather resistance after curing by polyaddition with a polycarboxylic acid anhydride or by homopolymerization. The cured product is suitable as an electrical insulation material.

Abstract: Disclosed are curable powder coating compositions that include a film-forming resin composition that includes (a) a first film-forming resin, (b) a second film-forming resin that is different from and incompatible with the first film-forming resin, and (c) a compatibilizing agent that includes a first portion that is compatible with the first film-forming resin and a second portion that is compatible with the second film-forming resin. The compatibilizing agent is present in such compositions in an amount sufficient to result in a coating composition that, when deposited onto at least a portion of a substrate and cured, produces a mid-gloss coating.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.

Abstract: A wafer processing laminate is provided comprising a support, a temporary adhesive layer on the support, and a wafer laid on the temporary adhesive layer. The temporary adhesive layer has a trilayer structure consisting of a first bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the circuit-forming front surface of the wafer, a second bond layer (B) of thermosetting modified siloxane polymer which is laid on the first bond layer, and a third bond layer (A?) of thermoplastic organosiloxane polymer which is laid on the second bond layer and releasably bonded to the support.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract: Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.

Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.

Abstract: The present invention is directed towards a paper-based composite packaging structure comprising a paper layer and a filler layer which may be laminated or otherwise adhered to the paper layer. In certain embodiments, the filler layer comprises a polymer or bio-based polymer. An optional barrier layer may be deposited on to one side of the paper layer or filler layer as desired to provide functional barrier characteristics. The composite paper-based film structure(s) may comprise additional layers such as one or more optional primer layers, adhesive layers, ink layers, and/or sealant layers that can be incorporated into the composite film structure as desired to enable the required functional characteristics of the composite film structure described herein. The paper-based composite packaging structure is substantially compostable and/or recyclable as both the paper and the bio-based polymer filler layers will break down under composting conditions and/or meet standardized recyclability requirements.

Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

Abstract: The present invention provides a polyester film which can be suitably used as an antireflective film, an optical film, etc., and comprises a coating layer capable of exhibiting excellent easy-bonding property and weather-resistant bonding property with respect to various topcoat agents to be applied thereonto. The laminated polyester film of the present invention comprises a coating layer which is formed of a coating solution comprising (A) an antistatic agent, (B) a compound having an isocyanate-based reactive group and a urethane bond, (C) a urethane resin having no isocyanate-based reactive group at a terminal end thereof, and (D) at least one crosslinking agent.

Abstract: A multilayer film suitable as a backing for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises at least 35% by weight, based on the overall layer moulding composition, of polyamide; b) a layer of a moulding composition which comprises at least 50% by weight, based on the overall layer moulding composition, of a polymer fraction consisting of: I) 30 to 95 parts by weight of polyamide and II) 5 to 70 parts by weight of polyolefin, where a sum of I) and II) in parts by weight is 100; and c) a layer of a moulding composition which comprises at least 35% by weight, based on the overall moulding composition, of polyamide; wherein at least one of layers a), b) and c) further comprises a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof.

Abstract: A coating composition for a solar cell backsheet of the present invention includes: (a) 10 to 40 mass % of vinyl ester resin or unsaturated polyester resin; (b) 30 to 60 mass % of vinyl monomer and/or (meth)acrylate monomer; (c) 5 to 40 mass % of denaturant (The components (a) to (c) are 100 mass % in total); (d) 0.

Abstract: The present invention provides an adsorptive member which is used in a heat exchanger such as an adsorptive heat pump or a humidity control apparatus such as a desiccant system and which is excellent in heat resistance and adhesion between adsorptive particles and a base material. The adsorptive member comprising a base material and an adsorptive material layer formed on the base material, wherein the adsorptive material layer comprises adsorptive particles and a binder as essential components, and the binder is an epoxy cured product comprising the following structural units (a) and (b): (a): a bisphenol type structural unit; and (b): a linear hydrocarbon structural unit having 4 or more carbon atoms, and/or a polyalkylene ether structural unit having 3 or more ether oxygen atoms.

Abstract: The present invention provides a cation-polymerizable resin composition comprising (A) a multi-branched polyether polyol obtained from a ring-opening reaction of (a1) a hydroxyalkyloxetane and (a2) an epoxy compound having one epoxy group, (B) an alicyclic epoxy compound having at least two alicyclic epoxy groups, and (C) an acid generator, which may be used in various uses including, for example, an adhesive agent or tackiness agent for optical elements, various kinds of coating agents and the like.

Abstract: A drilling entry board for a printed circuit board (PCB) includes a metal substrate and a lubricating copolymer. The lubricating copolymer is bonded on the metal substrate surface and comprises a water-soluble structure and a water insoluble structure.

Abstract: An exemplary embodiment discloses a shape memory polymer material (SMP) including a glue material chemically grafted onto a surface of the SMP material wherein the SMP material is capable of transforming between a permanent shape and a temporary shape.