Abstract: The present invention provides a polyester film which can be suitably used as an antireflective film, an optical film, etc., and comprises a coating layer capable of exhibiting excellent easy-bonding property and weather-resistant bonding property to various topcoat agents. The laminated polyester film of the present invention comprises a coating layer which is formed of a coating solution comprising (A) a compound having an isocyanate-based reactive group and a urethane bond, (B) a urethane resin and (C) at least one crosslinking agent.

Abstract: A superhydrophobic electromagnetic field shielding material includes a curable resin and a carbon material, the superhydrophobic electromagnetic field shielding material including at least two depression patterns on an exposed surface. The at least two depression patterns may include a first depression pattern including a plurality of grooves having a same shape and a second depression pattern including a plurality of grooves having a same shape. The carbon material may be about 3 wt % to about 20 wt % based on the total weight of the superhydrophobic electromagnetic field shielding material.

Abstract: Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.

Abstract: The present invention relates to cationically and radically curable coating compositions for coating a surface. The coating compositions consist essentially of a radically or cationically curable monomer, and a metal salt. The metal salt is chosen so that it is reduced at the surface to be coated, and where the standard reduction potential of the metal salt is greater than the standard reduction potential of the surface, and where when the composition is placed in contact with the surface, the metal salt of the composition is reduced at the surface, thereby initiating cure of the curable component in the compositions. Redox mediated cure of the coating compositions results in a coating or film on the surface. The invention also provides for functionalization of surfaces. Cross-linking of the coating occurs directly on the surface.

Abstract: A coating/sealant system that includes a coating and a sealant deposited over at least a portion of the coating, in which the coating includes a reaction product formed from reactants comprising a phosphated epoxy resin and a curing agent, and the sealant includes a sulfur-containing polymer.

Abstract: An epoxy glow coat and a method preparing an epoxy glow coat are disclosed. The epoxy glow coat comprises a mixture obtained by mixing predefined proportions of a clear epoxy and glow powder. The method comprises the steps of: mixing a predefined proportion of a clear epoxy and glow powder to obtain a viscous mixture; applying the viscous mixture on to a desired area; and curing the mixture.

Abstract: A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.

Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R-W-R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

Abstract: This disclosure relates to epoxides, polyepoxide compositions and epoxy resins whose degradation products exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed compositions and articles of manufacture comprising the disclosed compositions.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: An intermediate transfer media, such as a belt, that includes a first supporting substrate, such as a polyimide substrate layer, and a second layer of a silicone containing polyamideimide layer. Also, the intermediate transfer media can include a silicone containing polyamideimide single layer.

Abstract: An optical component for transmitting radiation includes a radiation protective layer, which includes at least one oxide material selected from germanium dioxide (GeO2), antimony pentoxide (Sb2O5), aluminum oxide (Al2O3), niobium(V) oxide (Nb2O5), tin oxide (SnO2), metal oxides of rare earths, in particular lanthanum oxide (La2O3) or cerium oxide (CeO2), yttrium oxide (Y2O3), yttrium aluminum oxides, zinc oxide (ZnO), indium oxide (In2O3), bismuth trioxide (Bi2O3), barium titanate (BaTiO3) and spinels, such as magnesium aluminate (MgAl2O4). The radiation protective layer can be varnish-like, and the oxide material can be contained in a binder of the varnish-like radiation protective layer.

Abstract: Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.

Abstract: A composition, including at least one curable structural adhesive, and at least one thermoplastic elastomer, wherein the thermoplastic elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: There is provided herein an epoxy laminate comprising (a) an epoxy resin composition further comprising (i) at least one curable epoxy resin, (ii) at least one curing agent, (iii) at least one curing catalyst; and, (iv) a flame retardant effective amount of at least one metal phosphonate represented by the general formula: where Me is a metal, n is equal to the valency of the metal which is in the range of from 1 to 4, R1 is a linear or branched alkyl of up to about 12 carbon atoms, R2 is a linear or branched alkyl of up to about 12 carbon atoms or a substituted aryl or unsubstituted aryl of general formula: where R3 hydrogen, or a branched or linear alkyl of up to about 4 carbon atoms, or NH2 or CN or NO2, (b) a reinforcing material; and, (c) a copper foil.

Abstract: The present invention relates to a polymer resin compound including a new polycyclic compound, and a photosensitive resin composition including the polymer resin compound as an effective binder matrix. In particular, the photosensitive resin composition according to the present invention uses a polymer resin compound, which includes a compound having double cyclic structure in one molecule as a monomer, as a binder matrix. Accordingly, the photosensitive resin composition has an excellent photosensitivity and an excellent developing property, and has a low distortion property during plastic processing. For this reason, the photosensitive resin composition has an advantage of curing various transparent photosensitive materials used to manufacture a color filter of a liquid crystal display, for example, a column spacer, an overcoat, a passivation material, and the like.

Abstract: Disclosed is a polyester film with a coating layer that has excellent appearance quality and antistatic properties. The coating layer is formed on the polyester film by applying a coating liquid to at least one surface of the polyester film and drying the coating liquid thereon. The coating liquid contains an electron conductive compound; at least one compound selected from the group consisting of a polyalkylene oxide, glycerol, a polyglycerol, and an alkylene oxide adduct of glycerol or polyglycerol, or at least one derivative thereof; and an epoxy crosslinking agent.

Abstract: Provided is an adhesive film for a semiconductor device that is capable of having the same physical properties as these at the time of manufacture even after it is stored for a long time. The adhesive film for a semiconductor device of the present invention contains a thermosetting resin, and in which the amount of reaction heat generated in a temperature range of ±80° C. of a reaction heat peak temperature measured by a differential scanning calorimeter after the adhesive film is stored at 25° C. for 4 weeks is 0.8 to 1 time the amount of reaction heat generated before storage.

Abstract: A laminated film includes a resin layer provided on at least one surface of a thermoplastic resin film substrate, wherein the resin layer comprises an acrylic-modified polyester whose acrylic resin component has a glass-transition temperature of not lower than 67° C. and a sugar alcohol and/or a sugar alcohol derivative; the mass ratio of the acrylic-modified polyester to the sugar alcohol and the sugar alcohol derivative (the mass of the acrylic-modified polyester/the total mass of the sugar alcohol and the sugar alcohol derivative) is from 75/25 to 97/3; the total content of the acrylic-modified polyester and the sugar alcohol and sugar alcohol derivative is 65% by mass or more based on the total resin layer; and the haze value of the laminated film is not more than 2.0%.

Abstract: A molded oxide product of the present invention contains an oxide region and an organic cross-linked region and has at least a surface layer formed of an inorganic glassy material. The molded oxide product can combine both organic and inorganic advantages such as good workability of organic materials and high weather resistance, heat resistance and hardness of inorganic materials. The molded oxide product can be produced through the following steps: step A for preparing a precursor R2-M-O-M? having a polymerizable functional group-containing organic group R2 and a M-O-M? bond; step B for applying an application liquid containing the precursor; step C for hardening the application liquid by photocuring and/or thermosetting; and step D for performing oxidation treatment on at least a surface layer of the hardened product in such a manner as to convert at least the surface layer of the hardened product to be of inorganic glassy material.

Abstract: A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.

Abstract: A barrier film including a first layer formed of a semicovalent inorganic material and a second layer formed of an ionic inorganic material is provided. Here, the first layer and the second layer are alternately disposed. The barrier film having an improved moisture barrier property compared to a gas-barrier plastic composite film of the prior art manufactured using only a metal oxide or nitride may be provided.

Abstract: The present disclosure provides a composite structure and associated method for preparing a composite substrate comprising an inorganic coating that is adhered to an organic-based substrate via an adhesion promoting agent comprising a molecule having a urea moiety at one end of the molecule and an alkoxysilane moiety at the other end of the molecule. The use of adhesion promoting agent having at least one of an amine or imine moiety and an alkoxysilane moiety promotes tight adhesion of the inorganic coating to the substrate. In one embodiment, the adhesion promoting agent may have the following structure as shown in formula (I) below: wherein X is an alkoxy group having from 1 to 3 carbon atoms; and n is a number from 1 to 5.

Abstract: A hard coat film includes a transparent plastic film substrate; and a hard coat layer, wherein the hard coat layer is formed of a composition for forming a hard coat layer, the composition containing the following component (A), component (B), and an organic solvent: Component (A): a polyrotaxane, Component (B): a monomer having two or more ethylenically unsaturated groups.

Abstract: A laminate article preferably including two or more layers adapted to be applied to a surface of a roadway that can function as a reflective marker, such as a lane marker or road feature marker. The article includes one or more reflective compounds, preferably particles, aggregates, or clusters that are partially embedded in an exposed outer surface layer of the article. In order to increase the durability of the material, protective media compounds are also present in the outer layer and extend outward therefrom with the protective material protruding a greater distance than the reflective compounds. The articles of the present invention are weather resistant, durable and resistant to damage by vehicles and snowplows.

Abstract: An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).

Abstract: Disclosed is a gas-barrier film laminate having at least two gas-barrier film layers laminated via an adhesive layer, wherein the gas-barrier film layer has a substrate film, and at least one constitutive unit layer comprising an anchor coat layer and an inorganic thin film layer formed on at least one surface of the substrate film in that order, and wherein the number of the bubbles having a diameter of at least 0.5 mm and the impurities having a diameter of at least 0.5 mm existing between the gas-barrier film layers is at most 3 in total per 100 cm2.

Abstract: A component of a wellbore tool comprises a plurality of compartments disposed over a body of the component and a coating disposed over at least a portion of a surface of the body. Each compartment comprises a healing agent formulated to form or catalyze the formation of a barrier upon release from the compartment. A matrix material separates the plurality of compartments. Methods of forming wellbore tools include forming a body, forming a plurality of capsules, and forming a coating comprising the capsules over the body. Methods of utilizing a wellbore tool in a subterranean borehole include contacting at least a portion of a body with a fluid comprising a healing agent formulated to a barrier. Coatings for wellbore tools include a fiber comprising a plurality of discrete cells and a matrix material contacting and at least partially surrounding the fiber. Each cell comprises a healing agent.

Abstract: The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.

Abstract: Disclosed herein is a refinish sheet produced by (1) coating one side of a temporary carrier sheet (A) with at least one aqueous coating material (B) comprising at least one free-radically crosslinkable binder (B1) having a glass transition temperature of ?70 to +50° C., an olefinically unsaturated double bond content of 2 to 10 eq/kg, and an acid group content of 0.05 to 15 eq/kg to produce at least one resultant layer (B); and (2) drying but not curing, or only part-curing, the at least one resultant layer (B) to produce at least one dried, uncured or part-cured layer (B). Also disclosed is a method of repairing a surface of a coated substrate using the refinish sheet.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: A coated article comprising a substrate having a plastic surface and adhered thereto an organometallic film in which the metal has f electron orbitals or is niobium is disclosed. Also disclosed are methods for applying organometallic films to substrates and the organometallic films themselves.

Abstract: A coating system for application to a substrate having a sol-gel film layer applied thereon includes a residual high acid value coating coat applied on top of the sol-gel film without an intervening adhesion layer. The residual high acid value coating composition may be a solvent borne composition that when cured, has a high level of residual free acid groups, equivalent to an acid number of greater than about 65 mgKOH/g. The residual high acid value coating may include a residual high acid value resin namely, a resin that cures having residual free acid groups, equivalent to an acid number of greater than about 65 mgKOH/g. The residual high acid value resin may be the reaction product of a polyol and a suitable crosslinker, such as a polyanhydride or polyisocyanate crosslinker or blend thereof. The residual high acid value coating composition may include opacifying pigments and condensation catalysts.

Abstract: Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B).

Abstract: A gas barrier film and method for manufacturing the abovementioned gas barrier film are disclosed in the present invention. The gas barrier film is applied in electronic product, food, medicine and other fields for protecting them from gas and water. The gas barrier film comprises a gas barrier layer and pluralities of cladding layers. The gas barrier layer is a liquid layer, and the cladding layers are disposed on the opposite surface of the gas barrier layer.

Abstract: A low temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having per molecule at least two epoxy groups and that is liquid at 25° C.; an aromatic amine based curing agent that contains an aromatic amine compound having per molecule at least two amino groups directly bonded to the aromatic ring and that is liquid at 25° C.; and Mg(II) acetylacetonate as a cure accelerator. The composition, which contains a novel cure accelerator using a metal complex, exhibits high stability at room temperature while lowering a cure temperature or shortening a cure time.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Abstract: An entry sheet comprising polymer material for drilling printed circuit boards is provided. The entry sheet is suitable for use with a broad range of diameters, including commonly available drill diameters. The entry sheet comprises an adhesive epoxy configured to, among others, resist drill deflection, resist mechanical damage, and reduce to dust such that the entry sheet may increase drilling accuracy, protect printed circuit board from damage, minimize entry burrs, and may addresses other issues such as fliers, bird nesting, and the like.

Abstract: Coating systems which provide corrosion resistance and, optionally, lubrication, for threaded connections are disclosed. The compositions comprise a first coating composition comprising polymer matrices of polyimides or epoxies which are modified with small amounts of a fluorine containing polymer. Also present in the coating compositions are corrosion inhibiting agents and inorganic particles having a mean diameter of between approximately 10 nm and 10 ?m. Solid lubricants, which may include at least one of PTFE, HDPE, Graphite, and MoS2, are optionally added to provide the first coating with a low coefficient of friction. The coating systems may further comprise a second coating composition, comprising a solid lubricant dispersed within an epoxy resin and a solvent. The first and second coating compositions are deposited on at least a portion of at least one of the pin and box members of the threaded connections.

Abstract: A coating system for application to a substrate having a sol-gel film layer applied thereon includes a decorative color coat applied directly on top of the sol-gel film without an intervening adhesion layer. The decorative color coat may be a solvent borne composition including a resin which is the reaction product of a crosslinked polyepoxy resin and a polyamine crosslinker, and one or more opacifying pigments. Decorative designs may be formed by selectively applying more than one layer of decorative color coats having different colors. A transparent clearcoat may be applied to the decorative film.

Abstract: Polyisocyanate coating compositions, the polyisocyanates of which include dimer structural units (patterns) and imino-trimer structural units (patterns), are converted, via cross-linking, into useful such coatings as paints or varnishes having enhanced shock-resistant properties, notably chip-resistant properties for vehicle body parts.

Abstract: The present invention provides epoxy curing agent compositions comprising benzylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: The invention relates to a sizing composition for a thermal and/or acoustic insulation product, based on mineral wool, comprising an epoxy resin of the glycidyl ether type, an amine hardener and an accelerator chosen from imidazoles, imidazolines and mixtures thereof. Application to the manufacture of thermal and/or acoustic insulation products having improved mechanical properties after aging, especially in a wet environment.

Abstract: Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: A. a first component which comprises: (i) a first amine functional adduct which comprises the reaction product of a stoichiometric excess of a diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group; B. a second component which comprises: (i) at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: Substrates, optionally coated with an undercoating, having grafted thereto one or more non-fouling materials are described herein. The non-fouling, polymeric material can be grafted to a variety of functionalized substrate materials, particularly polymeric substrates and/or polymeric undercoatings immobilized on a substrate. The compositions described herein are highly resistant protein absorption, particularly in complex media and retain a high degree of non-fouling activity over long periods of time. The compositions described herein may also demonstrate antimicrobial and/or anti-thrombogenic activity. The non-fouling material can be grafted to a functionalized substrate, or optionally from an undercoating on the substrate, preferably without significantly affecting the mechanical and/or physical properties of the substrate material.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract: The present invention relates to one-solution type thermosetting resin composition for a protective film of a color filter, and a color filter including the same. The one-solution type thermosetting resin composition includes a copolymer (A) including (meth)acrylate with an epoxy cyclic structure at the side chain, (meth)acrylate with a hydroxyl terminal, acid anhydride, and maleimide with a substituent; an epoxy resin (B); a base-generating agent (C); and an organic solvent (D). When a protective film of a color filter is prepared by using the one-solution type thermosetting resin composition according to the present invention, it has excellent storage stability as well as excellent flatness, close-contacting property, transmission properties, heat resistance, and chemical resistance.

Abstract: Fire-retardant polyamide cast items including an intumescent coating are described. The case items can have excellent fire-retardant properties and can include at least one fire-retardant system in the polyamide matrix. The items can also have an intumescent coating on at least one surface.