Abstract: An aqueous coating formulation which forms a thermal transfer layer of a thermal transfer ribbon. This formulation comprises an aqueous emulsion of a thermoplastic resin and/or wax coemulsified with an epoxy curing agent. This emulsion can be combined with an aqueous dispersion of an epoxy resin. These coating formulations provide thermal transfer layers with reactive components that increase in molecular weight when heated during transfer to provide images with high scratch and smear resistance without organic solvents. The reactive components are maintained in separate phases within the same thermal transfer layer or separate thermal transfer layers until exposed to a thermal print head.

Abstract: A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins; and/or hydroxy- or carboxyl-functional fluoropolymers, fluorochloropolymers or fluoroacrylic polymers blended with a at least one poly(phenylene ether) and at least one curing agent for the thermosetting resin.

Abstract: A laminated entry and exit material for drilling planar sheets such as printed circuit boards having a metal foil layer bonded to a fibrous core layer with an adhesive containing a particulate lubricant such as graphite or polyethylene glycol and cold or hot pressed. A second metal layer is preferably bonded to the fibrous core layer. The core of one embodiment of the exit material includes a particulate lubricant such as graphite or polyethylene glycol incorporated in the core at the time of manufacture of the core. The circuit board is placed between the entry and exit materials. Drill friction and heat are reduced by the lubricants and the heat sink provided by the foil thereby extending the service life of a drill.

Abstract: This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure: in which Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond, A is a hydrocarbyl group or an aromatic group, and L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond.

Abstract: There is disclosed N-substituted arylamino-phenol-formaldehyde condensates which are substantially free of water, contain not more than 2% by weight of a phenol and possess unobvious properties, e.g., which have the residues of an N-substituted arylamine and 1.5 to 3 moles of formaldehyde for each mole of the said arylamine, contain from about 35% to 63% by weight of phenol residue, contain at least 3.5% by weight of nitrogen, have a melt viscosity of less than 2,000 cps at 175° C., a hydroxyl equivalent of about 195 to 220, a Methanol Tolerance of at least 40%, high solubility in organic solvents commonly used in epoxy formulations, and are self-catalyzing curatives for epoxy resins.

Abstract: Novel adhesive compositions are described that include an epoxyamine and, preferably, a curing agent. The adhesive composition can be used in surgical settings such as implanting bioprostheses and/or in manufacturing of bioprostheses. Biocompatible substrates can be adhered together by an adhesive bond formed by curing of the epoxyamine adhesive composition.

Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.

Abstract: The invention is directed to a method for preparing a recoatable surface on a substrate. The substrate is coated with a base coat composition comprising a polyol acrylate monomer and an epoxy acrylate monomer which is subsequently cured with UV radiation. After curing, the base coat is imaged with a sublimation dye design, typically by contact with a transfer sheet. Advantageously, the imaged base coat can subsequently be coated with a top coat or stain to modify or enhance the properties or appearance of the design.

Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

Abstract: A cleaned, sterile ceramic, metallic or polymeric substrate surface is vapor-deposited under sterile conditions with silica, is wetted on top of this with a saline coupling agent under sterile conditions, and is provided on top of the latter with a preserving protective layer which is sterile and/or can be sterilized after polymerization and constitutes the activatable first component of a multi-component adhesive which at the time of use is formed by addition of at least one further adhesive component. A workpiece which has been partially or completely coated in this way can be connected with good adhesion to a polymer, even after several months of sterile storage and transportation, by means of the activation of the protective layer with a monomer.

Abstract: This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate, 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.

Abstract: Disclosed is an anticorrosion paint for preventing steel materials from corrosion by using polyaniline as an anticorrosion pigment. The anticorrosion paint has an excellent anticorrosion effect, long persistence of the anticorrosion effect, high durability and superior coating property controlling the anticorrosion effect, without using metal causing environmental pollution as an anticorrosion pigment. Especially, in the anticorrosion paint, the top coat paint for improving the protection of the primer coat paint and the anticorrosion effect. The top coat paint includes 40 to 89 wt % of matrix resin, 5 to 54 wt % of colored pigment, 1 to 50 wt % of dopants and 5 to 54 wt % of mixed solvents, and the primer coat paint includes 3 to 49 wt % of the polyaniline, 40 to 86 wt % of the matrix resin, 1 to 47 wt % of the dopants and 10 to 56 wt % of the mixed solvents. The anticorrosion paint plays a role in exerting persistently the excellent anticorrosion effect without causing environmental problem.

Abstract: Bodies made of expanded graphite are impregnated with low-viscosity, solvent-free, storage-stable, polymerizing resins from the group of isocyanates and their co-reactants and/or epoxy resins up to resin contents of 50% by weight. A primary product is made of expanded graphite with an open pore system, with a particularly preferred range of bulk densities of from 0.5 to 1.3 g/cm3 and with an ash value of not more than 4% by weight. Such bodies can also contain a proportion of additives. Sealing elements, components in fuel cells and heat-conducting elements are formed of the impregnated, shaped and rapidly curable graphite bodies. A process for producing such bodies is also provided.

Abstract: There is disclosed an oxygen-absorbing multi-layer film which comprises an outer layer comprising a thermoplastic resin; an adhesive layer comprising an epoxy resin; an oxygen-absorbing layer comprising a thermoplastic resin and an iron based oxygen-absorbing agent incorporated therein; and a heat sealing layer comprising an oxygen-permeable thermoplastic resin, wherein the adhesive layer comprises a gas barrier epoxy resin composition containing at least 30% by weight, preferably 40 to 90% by weight of a xylylenediamine unit (N—CH2—C6H4—CH2—N). The multi-layer film preferably having an overall thickness of at most 120 micron is excellent in oxygen-absorbing function, gas barrier properties, impact resistance, film rigidity and economical efficiency, and is well suited for use as packaging materials for food, pharmaceutical and the like.

Abstract: Transparent moldings comprising a polymeric base material and at least one coating formed thereon is disclosed. The coating includes a primer coat that containing an epoxy and/or acrylic resin is disposed on at least one surface of the base material, a heat-absorbing coating which contains a polythiophene compound and a scratch-resistant coating. In an additional embodiment of the invention, the coating contains no primer and the heat absorbing coating contains a polythiophene compound.

Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: The present invention provides a composite backing suitable for use in the manufacturing of carpeting, particularly tufted synthetic turf carpeting, or any other fabric product where dimensional stability in the presence of thermal or moisture gradients is desirable. The composite backing comprises reinforcement strands integrated into a woven backing fabric. The reinforcement strands may be laid in an open network structure needlepunched into a woven backing or may also be integrated into the woven backing by directly weaving the reinforcement strands into the woven backing as it is being fabricated. A synthetic turf product may be constructed by tufting the composite backing.

Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.

Abstract: Fuser members and processes are provided for crosslinked fluorocarbon elastomer surfaces containing a fluorocarbon elastomer and a non-amino crosslinker together with methods for providing a crosslinked fluorocarbon elastomer surface on a fuser member supporting substrate which include mixing together an acid acceptor, an emulsifier, water, and non-amino based crosslinker with a latex fluorocarbon elastomer.

Abstract: An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.

Abstract: The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R2 and R3 each represents a hydrogen atom and a methyl group; R4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.

Abstract: An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.

Abstract: An improved rotary blower (11) with an abradable coating (61) with a maximum hardness value of 2H on a pencil hardness scale. The coating material is a blend or mixture of preferably an epoxy-polymer resin matrix with a solid lubricant. The solid lubricant preferably is graphite. The improved abradable coating provides essentially zero clearance to increase the volumetric efficiency of a Roots type rotary blower.

Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

Abstract: The invention concerns a composite material in band or slab form made of two cover plates (1, 2), made of steel, which can be resistance welded together via electrically conductive bodies (4), and an intermediate layer (3) made of a filler material in which the bodies (4) are embedded, with the bodies (4), which are implemented as curved slugs, lying pressed flat between the cover plates (1, 2). This type of composite material is produced in that the filler material (3′) for the intermediate layer (3) is applied as a paste to a band (1′) serving as the first cover plate (1) as it passes by and the curved slugs (4′) are, after being laid on the filler material (3′), pressed into it at least until contact is made via a band (2′) supplied as the second cover plate (2) in a welding gap (8) formed by two roller electrodes (6,7) of a resistance welding device and the slugs are largely pressed flat with the bands (1′, 2′) during welding.

Abstract: Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used in admixture with acrylates and epoxy resin to form a polyamine-curable adhesive composition having excellent adhesive properties and chemical resistance.

Abstract: A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.

Abstract: A primer for flame sprayed polyolefin comprises an epoxy resin, preferably of low molecular weight and/or low viscosity; and an amine hardener, part of which becomes highly reactive on exposure to open flame, providing near instant cure of the composition under flame spray conditions. The invention is unique that it provides strong adhesion to steel, even where the surface preparation is less than ideal, as well as to concrete and other substrates. The primer eliminates the need to preheat the substrate. The primer has strong adhesion to the topcoat polyolefinic material, especially to a functionalized topcoat. The composition withstands open flame and does not char under polyolefin flame spray conditions, nor does it run or sag, and it is not prone to failure as it cools after the application of the polyolefin.

Abstract: A display device substrate which meets requirements for weight reduction, thickness reduction, high reliability, good heat resistance, and good impact resistance all at once. The display device substrate is composed of a pair of glass sheets facing each other and a layer of plastics material interposed between said paired glass sheets in such a way that said glass sheets have an internal compressive strain ascribed to the plastic sheet. Thus, the very thin glass sheets are hardly liable to breakage. This makes light weight and reduced thickness compatible with reliability.

Abstract: An adhesive/sealant which is curable by radiation exposure composition having at least one of adhesive and sealant properties and comprising a radiation polymerizable vinyl material, a polymerization initiator for radiation polymerization of the vinyl material, a thermosetting epoxy-containing material and a heat-activatable hardener for the epoxy-containing material.

Abstract: New photoresists are provided that are suitable for short wavelength imaging, including sub-300 nm and sub-200 nm such as 193 nm and 157 nm. Photoresists of the invention contain a resin with photoacid-labile groups, one or more photoacid generator compounds, and an adhesion-promoting additive compound. Photoresists of the invention can exhibit significant adhesion to SiON and other inorganic surface layers.

Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract: A method of treating a metal material to increase the metal's ability to adhere to other objects is provided. The metal material is prepared to receive a sol-gel solution coating. A sol-gel solution is prepared and the sol-gel solution is applied to the metal material. Subsequently, an epoxy-based adhesive coating is applied over the sol-gel solution, thereby creating an adhesive layer on the metal material.

Abstract: A film welding apparatus is provided for solvent welding a first film to a second film. The apparatus has a movable backing surface adapted to support the first film, a pressing roller adapted to press the second film against the first film, and a solvent dispenser adapted to dispense a solvent between the first and second films.

Abstract: Described are curable adhesives containing a polyacrylate component and an epoxy component, and that are preferably optically clear, as well as methods of using such adhesives and optical components and optical elements prepared from the adhesives.

Abstract: A separable layer of permanently thermoplastic bonding material made by extrusion lamination comprises a mixture of

Abstract: The present invention relates to a composite material, in particular for reflectors, having a metallic support (1) in strip form, an intermediate layer and having a multilayer optical system (3) which is applied to the intermediate layer (2). A non-metallic protective layer (4), which consists of a low-absorption material and has a thickness (D4) of from 5 to 20 nm, preferably from 5 to 10 nm, is applied to the multilayer optical system (3).

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: A nonbleeding bias charging member having an outer layer on a supporting substrate with fluorinated carbon and zinc oxide dispersed in the outer layer material, where bleeding of contaminants to imaging members is decreased or eliminated.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

Abstract: The subject matter of the invention is a base sheet for the preparation of a flexible printed circuit board which is a three-layered laminate consisting of (a) an electrically insulating film of a plastic resin such as a polyimide, (b) an epoxy resin-based adhesive layer and (c) a copper foil bonded to the film (a) with intervention of the adhesive layer (b). The base sheet can exhibit excellent performance in respect of peeling resistance, soldering heat resistance, dimensional stability and solvent resistance as well as workability into a printed circuit board only when each of the layers (a), (b) and (c) has a specified thickness in a narrow range of 10-30 &mgr;m, 5-15 &mgr;m and 5-15 &mgr;m, respectively.

Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.

Abstract: The invention relates to two-component preparations comprising components (I) and (II), wherein at least one component comprises epoxy compounds and the preparations cure by cationic polymerization, initiated by Lewis and/or Brönsted acids, after mixing of the two components, the preparations comprising the Lewis and/or Brönsted acids in the form of precursor compounds which are suitable for the formation of Lewis and/or Brönsted acids.

Abstract: An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a curing agent and (c) 1 to 100 parts by weight of a modified epoxy resin, is suitable as an underfill sealing agent, is capable of heat-curing in a short time with a good productivity, is capable of surely connecting a semiconductor device such as a CSP and a BGA on a wiring board without giving an adverse effect on each part disposed on the wiring board by heat-curing at a relatively low temperature, has excellent heat shock property (temperature cycling property) and impact resistance, is free from bleeding of contaminants from its cured product, and is capable of easily detaching the CSP or BGA from the wiring board in the case where a defect is found, making it possible to reuse a normal wiring board or semiconductor device.

Abstract: A metal surface treatment agent containing the following components (A) to (D), which securely adheres to a metal substrate such as aluminum, exhibits excellent corrosion preventive properties, even with a thin film thickness, and has excellent plasticity and adhesion to paints. (A) at least one organosilicon compound having three carbonyl groups and at least one alkoxysilyl group, the organosilicon compound being present in a weight ratio of 5 to 15, based on the total of the components (A) to (D) being 100; (B) at least one epoxy resin modified with an alkanolamine, the modified epoxy resin being present in a weight ratio of 10 to 30 relative to the above total; (C) at least one blocked polyisocyanate present in a weight ratio of 50 to 70 relative to the above total; and (D) at least one amino resin present in a weight ratio of ratio 5 to 15 relative to the above total.

Abstract: A polymer film capacitor is provided, utilizing a metallized film formed by a first vacuum-formed plasma treated surface, a vacuum-deposited, first radiation polymerized acrylate monomer film having first and second surfaces, the first surface being disposed on the first plasma-treated surface of the polymer substrate, and a metal layer disposed on the second surface of the first polymerized film. The metallized film is wound into a capacitor.

Abstract: A veneer-based product is made of a plurality of veneer layers, a resin binding the layers, and a filler having a high thermal conductivity.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.