Abstract: An article comprises a substrate wherein at least a portion of its surface is provided with a thermosettable adhesive composition prepared from a polyepoxide resin, a curing agent and a plurality of microspheres. The cured composition forms a semi-structural bond with said substrate which is inseparable at the use temperature and is cleanly removable from said substrate when heated to a temperature of greater than the use temperature.

Abstract: The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and/or tetrafunctional epoxy resins and/or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

Abstract: In an insulating film having improved adhesive strength and a multilayer printed circuit board having the same, the insulating film made of an epoxy resin, a rubber and a filler, for use in an insulating layer of a multilayer printed circuit board, is composed of a first coating layer and a second coating layer. The first coating layer has a greater amount of rubber and filler and a smaller amount of epoxy resin than the second coating layer.

Abstract: A corrosion and ultraviolet ray resistant composite coated article (46) for use in or to contain electrical equipment is made by first cleaning an uncoated article (10) at a cleaning station (14), and then successively passing the cleaned article through wash workstation (16) phosphate bond coating workstation (18), wash workstation (22), non-chrome sealant coating workstation (24), drying workstation (26), heating workstation (30), epoxy resin coating workstation (32), and exterior painting workstation (40) by any type of transport system (12, 36), where the epoxy coated article can be passed again through previous workstations (14, 16, 18, 22, 24, 26, 30, 34) before final painting at workstation (40).

Abstract: Disclosed are a curable polyphenylene ether (PPE) resin composition comprising (a) a PPE resin and (b) a of a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton (DSBS compound), or a mixture of the DSBS compound and a ring-opening polymerization re-action product thereof; a cured PPE resin composition obtainable by curing the curable PPE resin composition; and a laminate structure obtained by using the curable or cured PPE resin composition. The curable PPE resin composition exhibits, after cured, excellent chemical resistance, moisture resistance, dielectric characteristics, heat resistance, flame retardancy and dimensional stability, so that it can be used as a dielectric, insulating or heat resistant material in the electrical, electronic, space and aircraft industries.

Abstract: The invention is directed to gassing stabilized aqueous coating compositions comprising A) a metallic pigment and at least one reaction product of: (a) 5 to 95 weight percent of a at least one phosphonic acid derivative selected form compound I and II wherein R1 is H or O═P(OH)2; R2 and R3 are independently H, OH or an aliphatic, cycloaliphatic and aromatic substituent having 1 to 25 carbon atoms and optionally up to 10 heteroatoms of at least one of oxygen and phosphorus; and R′ is an aliphatic, cycloaliphatic and aromatic substituent having 1 to 25 carbon atoms and optionally up to 10 heteroatoms of at least one of oxygen and phosphorus; (b) 5 to 95 weight percent of a at least one compound having at least two epoxy groups and a number average molecular weight Mn of 300 to 5000 g/mol; and (c) 0 to 90 weight percent of a compound having one epoxy-functional group, wherein the proportions by weight of components (a), (b) and (c) total 100 weight percent.

Abstract: Provided is a liquid crystal sealant composition in which an aqueous solution obtained by admixing the epoxy resin composition with purified water has an ionic conductivity of 1 mS/m or less; the B stage-reduced product has a viscosity of 50 to 10000 Pa·s at 80 to 100° C.; the cured matter of the above composition has a linear expansion coefficient of 10×10−5 mm/mm/° C. or less and a glass transition temperature Tg of 100° C. or higher; and the above cured matter has a moisture permeability of 200 g/m2·24 hours or less at 80° C. and which can meet a liquid crystal display element (cell) produced by a single layer press hot bonding system and exhibits high adhesion reliability and makes it possible to produce a homogeneous liquid crystal display element having a high quality.

Abstract: The instant invention is a bio-supportive medium comprising a degradable material, at least one nutritional source, and at least one bio-limiting agent dispersed in the biodegradable material. The nutritional source is present in the degradable material or an additive to the degradable material. The components of the bio-supportive medium are provided in quantities, such that the bio-supportive medium is capable of supporting formation of a biomass having a specific consortium of organisms, substantially at equilibrium within its environment or host habitat. While maintaining the biomass, the bio-limiting agent also provides the bio-supportive medium to limit the amount and type of species present in the biomass. The instant invention provides a unique bio-mimicking and environmentally-friendly way to control fouling of materials exposed to marine and aquatic environments.

Abstract: In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the group including curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof.

Abstract: A method of forming a film laminate uses an adhesive containing at least three components A, B and C. The method includes providing a radiation curable adhesive that contains a) a compound bearing at least one epoxy group, b) a compound with at least three OH groups and a molecular weight below 400 and c) a photoinitiator which initiates a polymerization of components a) and b) after exposure to light with a wavelength of 100 to 600 nm.

Abstract: The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Abstract: The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

Abstract: A process for producing mica-containing insulating tape for windings of rotating high voltage electrical machinery which after winding under a vacuum and pressure can be impregnated with a solvent-free synthetic resin and then cured under the action of heat, a fiber-containing mica film which in addition to fine mica also has organic and/or inorganic fibers being sprinkled with an epoxy resin mixture in the form of a powder enamel and the side of the fiber-containing mica film which has been sprinkled with the powder enamel being cemented under pressure and at an elevated temperature to a carrier material.

Abstract: A thermosetting resin composition comprising: a polycarbodiimide obtained from organic polyisocyanates containing at least one kind of aromatic polyisocyanate, an epoxy resin, a curing agent for epoxy resin, and a rubber component, wherein the proportions of the individual components are 100 parts by weight of the polycarbodiimide, 30 to 150 parts by weight of the epoxy resin, 1.0 equivalent or less, relative to the epoxy resin, of the curing agent for epoxy resin, and 0.1 to 20 parts by weight of the rubber component which is, in a semi-cured state (a B-stage), free from resin cracking or powder detaching when bent and therefore easy to handle and, after curing, has good electrical properties and heat resistance.

Abstract: An energy absorbing structural laminate comprising: (a) a first layer of composite material comprising x1 plies; wherein at least 0.5x1 plies contain fibers arranged in a shape of a continuous curve; wherein said continuous curve is the same or different in different plies; (b) a second layer of composite material comprising x2 plies; wherein at least 0.5x2 plies contain fibers arranged in a shape of a continuous curve; wherein said continuous curve is the same or different in different plies; and (c) a viscoelastic layer disposed between the first and second layers such that shear strains are substantially distributed throughout the viscoelastic layer when a load is applied to the structural laminate.

Abstract: Adhesive composition for the cementing of a surface layer of a floor covering with a carrier layer of a floor covering includes, a crosslinking adhesive and an antimony- and halogen-free flameproofing agent. The adhesive composition and floor covering are particularly suited for aviation. The fraction of the flameproofing agent may be at least 5% by weight of the adhesive composition. The flameproofing agent may contain ammonium polyphosphate. The adhesive composition makes possible, in a simple and low-cost manner, a cementing of the surface layer with the carrier layer, wherein the requirement of its being highly flame-resistant is accounted for. Moreover, when using the adhesive composition in accordance with the invention, values with regard to combustion gas density and the release of toxic agents clearly fall below acceptable limits governing aviation in cases of fire so that the floor covering is completely suitable for aviation.

Abstract: A composite containing an ABS component is disclosed.

Abstract: A method is provided for adhering a polyurethane-based sealant or adhesive to a substrate. The method comprises: i) applying an aqueous primer solution onto a substrate, the primer solution comprising water, an aminotitanate compound, and preferably an epoxysilane compound having at least one epoxy group and at least two alkoxy groups; ii) applying a polyurethane adhesive or sealant to the primer-treated substrate; and iii) forming a reaction product of the primer and the polyurethane. Also provided are a substrate having a layer of a polyurethane adhesive or sealant, and a stabilized aqueous primer solution containing an epoxysilane compound and an aminotitanate compound.

Abstract: A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and sufficient particulate thermoplastic polymeric material to at least partially regionally plasticize the cured epoxy resin wherein up to all of the particulate thermoplastic polymeric material may be provided by the walls of the microcapsules. A method of curing the adhesive by heating the composition is also provided. A joint made by adhering members together with the adhesive composition and a method of making the joint are also provided.

Abstract: The present invention provides a cationic coating composition capable of forming a coating film which is excellent in a corrosion resistance and an adhesive property and an electrodepositably coating property toward a rust preventive steel plate (zinc-plated steel plate). The cationic coating composition described above comprises as a vehicle component, a polyol-modified, amino group-containing epoxy resin prepared by reacting an epoxy resin (A) having an epoxy equivalent of 180 to 2500 with a polyol compound (B) obtained by adding caprolactone to a compound having plural active hydrogen groups and an amino group-containing compound (C).

Abstract: Disclosed are an insulating film having improved adhesive strength and a multilayer printed circuit board having the same. The insulating film made of an epoxy resin, a rubber and a filler, for use in an insulating layer of a multilayer printed circuit board, is composed of a desmear-treated first coating layer and a non-desmear treated second coating layer. As such, the first coating layer has more rubber and filler amounts and less epoxy resin amount than does the second coating layer. The insulating film is advantageous in light of high roughness thereon by the desmear treatment, and an improvement of adhesive strength between an insulating layer and a plating layer formed on the insulating layer, upon preparation of the multilayer printed circuit board.

Abstract: An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.

Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

Abstract: A multi-layered protective finish for use on hardwood surfaces includes ceramic additives in selected layers. The finish is comprised of multiple sealant layers (preferably epoxy) and top coat layers (preferably polyurethane), some of which contain ceramic components, namely, aluminum oxide and zirconium oxide. The multi-layered, ceramic-based finish exhibits enhanced abrasion and stain resistance. The required concentrations of zirconium oxide provide enhanced hardness without sufficiently compromising flexibility which is important to maintain integrity of the finish.

Abstract: A composition useful as a gel coat, binder, laminating resin or molding resin comprising (A) unsaturated polyester resin which is the reaction product of one or more polyols and one or more ethylenically unsaturated polycarboxylic acids, anhydrides, or amides, and optionally one or more polyethylenically unsaturated monomers, and/or a vinyl ester resin, (B) one or more first monomer selected from the group consisting of styrene, vinyl toluene, methyl methacrylate, N-vinyl pyrolidone, ethylene glycol dimethacrylate and the dimethacrylate of alkoxylated Bisphenol A, and (C) a second monomer selected from the group consisting of metal salts of an alpha, beta-ethylenically unsaturated carboxylic acids without a loss in heat distortion temperature properties.

Abstract: The electrochromic devices have an ion conductive layer formed by curing a composition comprising a bipyridinium compound represented by the formula 1

Abstract: Curable mixtures suitable for the manufacture of moldings, coatings and foams comprises a) an epoxy resin having more than one 1,2-epoxy group per molecule, b) as curing catalyst, an imidazole compound of formula I wherein R1, R2 and R3 are each independently of the others a hydrogen atom, a halogen atom, alkyl having from 1 to 20 carbon atoms, alkoxy having from 1 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms, or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, and R4 is alkyl having from 1 to 20 carbon atoms, alkenyl having from 2 to 20 carbon atoms, alkynyl having from 2 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms; and c) curing agent such as dicyadiami

Abstract: A surfaced wood-based board comprises a substrate (1) made of wood material and, on it, a surfacing (2) comprising at least one thermoplastic layer. The surfacing incorporates a polyamide film (2b), which has been glued to the surface of the substrate (1) by means of a reactive adhesive layer (2a). The adhesive layer (2a) is based on phenolic resin, polyester resin, epoxy resin, isocyanate adhesive or polyurethane adhesive, and it is an adhesive film impregnated with reactive adhesive, such as an impregnated paper. A surfaced board is produced by hot-pressing, which is used to attach the films to each other and the substrate.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.

Abstract: In accordance with the present invention, an insulating sealing structure useful in physical vapor deposition apparatus is provided. The insulating sealing structure is capable of functioning under high vacuum and high temperature conditions. The apparatus is a three dimensional structure having a specifically defined range of electrical, chemical, mechanical and thermal properties enabling the structure to function adequately as an insulator which does not break down at voltages ranging between about 1,500 V and about 3,000 V, which provides a seal against a vacuum of at least about 10−6 Torr, and which can function at a continuous operating temperature of about 300° F. (148.9° C.) or greater.

Abstract: A resin composition including from about 1 to about 100 weight percent of a thermoplastic oxazolidone ring-containing compound having a molecular weight of at least 5000, which is the reaction product of: a) from about 20 to about 43 weight percent, based on the polyepoxide and polyisocyanate reactants, of a polyisocyanate having an isocyanate-functionality of from about 1.8 to about 2.2; b) from about 80 to about 57 weight percent, based on the polyepoxide and polyisocyanate reactants, of a polyepoxide having an epoxide functionality of from about 1.8 to about 2.2; and optionally, c) a chain extender. The resin composition is used as an adhesive to adhere a copper foil to a prepreg or a laminate, with improved peel strength and Tg.

Abstract: The invention relates to a substrate provided with a multilayer coating. The invention additionally relates to a process for its preparation, in which the body to be coated passes via the entry 1 into the pretreatment stage 2. This is followed by electrodeposition coating 3 and the baking 4 of the electrodeposition coat. In stage 5 preparation takes place for coating with powder coating material (stage 6). In stage 7 drying is carried out with IR irradiation. This is followed by the cooling stage 7. The powder coating material is applied to the powder coat in stage 9. Following passage through the intermediate drying stage 10 a protective coat is applied in stage 11 and then is baked in stage 12. The body is transported out of the unit via the exit 11.

Abstract: The present invention relates to a method of coating substrates, preferably of metal, by cleaning the substrate surface, applying, if desired, an organic and/or inorganic pretreatment composition, applying a primer, applying a coating material by spraying, dipping, knifecoating, rollercoating or brushing, the coating material comprising an amine-modified epoxy resin and a crosslinking agent suitable for crosslinking.

Abstract: Epoxy resin compositions which comprise, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, are useful for making adhesive films formed by coating the epoxy resin composition on a supporting base film. Such compositions are also useful for making prepregs, by coating and/or impregnating a sheet-shaped reinforced base material made of a fiber with the resin composition, as well as multilayer printed-wiring boards made with such prepregs. Such epoxy resin compositions are also useful for forming conductor layers with excellent adhesiveness without requiring, in the insulating layer, a roughening component which deteriorates performance, as well as multilayer printed-wiring boards.

Abstract: A non-slip, water resistant, oil resistant surface structure for use where water and/or oil are likely to create a slippery surface, including a rubber-bottom mat upon which a thrice coated, non-slip surfaced substrate is fastened, the coating on the substrate including crushed walnuts, or the equivalent, to provide for a non-slip surface and the coating comprising a thermosetting epoxy resin material with an amine hardener.

Abstract: A microelectronic multilayer ceramic package combines a high temperature cofired ceramic (HTCC) module or carrier with a low temperature cofired ceramic (LTCC) module or carrier using a bonding interface layer of electrically nonconductive epoxy having electrically conductive regions for providing electrical interconnection between carriers. The bonding layer also has regions of thermally conductive material for interfacing heat sources on one carrier with heat dissipators on another carrier. The bonding layer also has apertures which allow prominent structures extending from one carrier to pass though and into a corresponding cavity in another carrier.

Abstract: The present invention provides a transparent laminate comprising a laminate substrate obtained by bonding a Second substrate composed of a polycarbonate-based resin to a first surface of a first substrate composed of an acrylic resin via a first bonding layer composed of a resin having a glass transition temperature(Tg) of about 50° C. or less, and a surface layer composed of a polycarbonate-based resin bonded via a surface bonding layer composed of an acrylic resin to a second surface of the first substrate, which laminate is light and excellent in transparency and excellent in impact resistance when it repeatedly receives an impact.

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.

Abstract: The present invention relates to epoxy compositions; in particular the present invention relates to stable low temperature curing epoxy-based compositions.

Abstract: A veneer-based product is made of a plurality of veneer layers, a resin binding the layers, and a filler having a high thermal conductivity.

Abstract: Provided are a halogen-free and phosphorus-free prepreg having good flame retardancy and having excellent electric characteristics and heat resistance, and a laminated board. The prepreg is formed of a resin composition comprising, as essential components, a phenol compound (I) having a structural unit of the formula (1), wherein R1 is hydrogen or phenol, R2 is a hydrogen or methyl and n is an integer of 0 to 10, an epoxy resin (II) prepared by epoxidizing the same phenol compound as said phenol compound, a metal hydrate (III) and a molybdenum compound (IV), and a substrate which is impregnated with said resin composition or to which said resin composition is applied. The laminated board for an insulating material, which is formed of the prepreg.

Abstract: Multilayer composite materials with at least one aerogel-containing layer and at least one other layer, a process for producing the same and their use are disclosed. The aerogel-containing layer(s) further contain at least one binder.

Abstract: A non-silicone, form-in-place gasket produced using automated placement followed by curing of a pattern of an extrudable thixotropic material comprising a liquid polyolefin oligomer a reactive diluent a thixotropic filler and a curative. The form-in-place gasket, after curing, has a compression set of about 7% to about 20%, a level of outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g and a Shore A hardness from about 45 to about 65.

Abstract: An improved dental adhesive device to hold prosthetic devices in the human mouth is made as a laminate of webs which are bonded together by deforming a film of thermoplastic ethylene oxide polymer and having an external adhesive coating on the laminate. The dental adhesive is produced by continuously applying thermoplastic ethylene oxide polymer between moving webs of cellulose acetate fibers, applying additional thermoplastic ethylene oxide polymer to the external surface of the webs, and then passing said webs in superimposed relationship between a pair of dry heated calender rolls for thermoplastically bonding said webs into a unitary structure. A dry water-activated adhesive material, such as sodium alginate, may be employed with the thermoplastic ethylene oxide polymer by being dissolved or dispersed in the polymer. Synthetic fibers are applied to the webs so as to extend transversely through the webs.

Abstract: Master discs and similar devices used in the production of digital data storage and recording discs and the like are produced with a substrate member which is provided with a layer of material which is applied to the substrate member in liquid form of a thickness greater than the surface roughness of the substrate member and of a thickness greater than any particulates present on the substrate member. The material layer is preferably a polymer such as epoxy, acrylic or styrene and is hardenable by exposure to UV light, heat, air circulation or catalytic reaction to provide a substantially smooth flat surface for receiving a data bearing film. The film may be treated to generate bumps or pits representing digital signals, for example, which are free of any defects resulting from surface roughness or contamination of the substrate member.

Abstract: The present invention provides a method of adhering adherends, including (i) providing at least two adherends at least one of which is made of a flexible material, and (ii) joining the adherends together to form a structure using a heat-resistant adhesive composition containing mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. The heat-resistant adhesive composition can be applied under mild conditions, and the resultant structure has excellent heat resistance and chemical resistance, and has superior adhesion strength particularly at high temperatures.

Abstract: A polymeric composition having self-extinguishing properties is disclosed which is useful as both an adhesive or coating. The composition contains 9-45 weight percent of an organic polymeric component and 16-50 weight percent of quaternary ammonium silicate as a fire-retarding component. Fillers and hardening agents may also be a part of the self-extinguishing polymeric composition.

Abstract: The invention pertains to thermo-resistant and light-resistant dichroic polarizers based on thin films of dichroic matters, in particular organic dyestuffs, in which molecules are ordered in a crystalline structure and applied on the surface of the substrate. The dichroic polarizer is characterized by the fact that it contains at least one anisotropically absorbing film comprised of oriented molecules.

Abstract: A composite structure is made by first furnishing a skin layer made of a composite material of quartz fibers embedded in an uncured cyanate ester-resin matrix. A transition layer of a first epoxy resin is applied to the skin layer. The skin structure including the skin layer and transition layer is cured at a first temperature and post cured at a second temperature greater than the first temperature. A bonding layer of a second epoxy resin is thereafter applied to the bonding surface of the transition layer, and a substrate is contacted to the exposed face of the bonding layer. The second epoxy resin is cured at a third temperature no greater than the first temperature.