Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.

Abstract: A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the enlargement rate of the diameter of the via hole formed in each of the glass-containing layers is close to those in the other layers, so that it is possible to prevent a short circuit defect due to the mutual short circuit of the conductors in the via hole from occurring, and the warp of the substrate is reduced. The multilayer circuit component is provided with at least two glass-containing layers on a substrate, differentiating the softening temperature of glass compounded in the first glass-containing layer formed on the substrate from the softening temperature of glass compounded in the second glass-containing layer formed on the first glass-containing layer.

Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Abstract: A method for adhering windshield sealants directly over a basecoat/clearcoat finish in which the clearcoat comprises a carbamate polymer or oligomer.

Abstract: An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine oxide and an alpha hydroxy ketone. The formulation can cure rapidly, such as in about 20 minutes. The cured formulation can have a Tg above 150° C.

Abstract: The invention provides protective articles comprising a backing that comprises a fluorinated polymer and a curable adhesive on at least one layer of the backing. The protective articles of the invention may be used to provide substrates or articles of the invention having a fluorinated surface. The invention also provides methods of preparing such articles, methods of repairing appliqués, and methods of edge sealing appliqués.

Abstract: A printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition which comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: Panel assemblies that include a core sandwiched between face sheets made from composite material. A pigmented topcoat layer is applied directly to the composite material without the need for a separate adhesive. The pigmented topcoat layer includes a thermoplastic binder resin/pigment mixture that can be cured with the composite material in a single step. The topcoat may include permanent and/or temporary substrates for carrying the binder resin/pigment mixture and for providing a surface finish to the panel assembly.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.

Abstract: Resin sheets which are thin and lightweight and have an antiglare function for preventing the so-called ghost phenomenon in which an illuminating light, such as fluorescent light or sunlight, or part of the surrounding objects, e.g., the keyboarder, is reflected on the display and/or a light-diffusing function for preventing the glittering attributable to an illuminating light or to the built-in backlight in the liquid crystal display; processes for producing the resin sheets; and liquid crystal displays using the resin sheets. One of the resin sheets comprises a gas barrier layer, a base layer, and two hard coat layers respectively as the outermost layers, wherein one of the hard coat layers has recesses and protrusions on the outer surface thereof and at least one of the hard coat layers contains transparent particles.

Abstract: A method of making an optical element that includes a thermoplastic power portion, the method including laminating a first thermoplastic sheet to one side of a functional film, laminating a second thermoplastic sheet to a second side of the functional film, and affixing either the first thermoplastic sheet or the second thermoplastic sheet to the power portion, with the other of the first or second thermoplastic sheets being open to atmosphere.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film. A layer: a heat-resistant resin layer with a thickness of from 2 to 250 ?m which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, and B layer: a roughenable cured resin layer with a thickness of from 5 to 20 ?m which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.

Abstract: There is provided a low dielectric constant material, which is excellent in thermal resistance, has low dielectric constant, and is applicable to a semiconductor device or electric appliances, an insulation film between semiconductor layers using the same, and the semiconductor device. The material is the low dielectric constant material having thermal resistance, which contains borazine skeletal molecules shown by the following formula (1) and the like in an inorganic or organic material molecule.

Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract: Corrosion- and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating powder composition of “toughened” epoxy resin. In a single coat embodiment, the entire coating is loaded with at least 75 phr zinc powder. In a dual coat embodiment, an inner coat is loaded with at least 75 phr zinc and an outer, zinc-free coating is reinforced by the addition of fibers and/or by a foaming agent which renders it porous.

Abstract: Provided are an organic coated steel having an epoxy resin layer coated on the surface of the steel product, which is formed by curing an epoxy resin composition comprising an epoxy resin and an epoxy resin curing agent as principal components and which has an oxygen permeability coefficient of 2 ml-mm/m2·day·MPa or less at a temperature of 23° C. and a relative humidity of 60% RH, an organic coated steel having the above epoxy resin layer and a polymer resin layer laminated in order on the surface of a steel product and a rust preventing method for metal in which a coating layer of the above epoxy resin layer is formed on the surface of metal.

Abstract: A new damage resistant and tolerant optical element is disclosed. Prior art solid or liquid host matrices are replaced by a soft crosslinked polymer or similar host material. The viscoelastic properties of the matrix host material are controlled during formation so that there are regions of different softness, of stiffness, within the matrix, to form a stiffness gradient. Preferably, the matrix will be softest at a preselected focal plane where maximum electromagnetic radiation or energy output may be expected. The host matrix is doped with an appropriate dopant having a concentration distribution, preferably such that the concentration of dopant is highest in the region where the host matrix material is most soft. Two important disclosed example embodiments are an optical limiter and a solid state dye laser.

Abstract: A composite insulator containing means for providing early warning of impending failure due to stress corrosion cracking, flashunder, or destruction of the rod by discharge activity conditions is described. A composite insulator comprising a fiberglass rod surrounded by a polymer housing and connected with metal end fittings on either end of the rod is doped with a dye-based chemical dopant. The dopant is located around the vicinity of the outer surface of the fiberglass rod. The dopant is formulated to possess migration and diffusion characteristics, and to be inert in dry conditions and compatible with the insulator components. The dopant is positioned within the insulator such that upon the penetration of moisture through the housing to the rod through a permeation pathway in the outer surface of the insulator, the dopant will become activated and will leach out of the same permeation pathway or diffuse through the housing.

Abstract: A polymer composite structure having resin matrix interlayers reinforced with shape memory alloy (SMA) particles. In one preferred form Nitinol® alloy particles are used for the SMA particles. The Nitinol® alloy particles may comprise cylindrical, oval or spherical shaped particles and are intermixed in the resin of the resin matrix interlayer(s) of the composite structure. The SMA particles provide superelastic, reversible strain properties that significantly improve the damage resistance, damage tolerance (e.g. compression-after-impact (CAI) strength) and elevated temperature performance of the composite structure without negatively affecting the hot-wet compression strength of the composite structure. The polymer composite structure is ideally suited for aerospace and aircraft applications where lightweight and structurally strong materials are essential.

Abstract: A laminate formed from a first fiber-reinforced ply joined by a laminating resin composition to a second fiber-reinforced ply. The laminating resin composition is the cured residue of a polyester resin being end-terminated with an alkyl acrylate group and diluted with less than about 35 wt-% styrene. The first fiber-reinforced ply is laminated to the second fiber-reinforced ply with the laminating resin composition by coating a surface of the first ply with an adhesive composition. The coated first ply surface is joined with a surface of the second ply and the adhesive cured. In making the laminating resin composition, unreacted alkyl acrylate can be reacted with an epoxy to push the reaction to completion.

Abstract: A fibrous core material is disposed between and bonded to metal skins to form a structural laminate having comparable strength to steel sheets of greater weight.

Abstract: A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).

Abstract: A composite insulator containing means for providing early warning of impending failure due to stress corrosion cracking, flashunder, or destruction of the rod by discharge activity conditions is described. A composite insulator comprising a fiberglass rod surrounded by a polymer housing and fitted with metal end fittings on either end of the rod is doped with a dye-based chemical dopant. The dopant is located around the vicinity of the outer surface of the fiberglass rod. The dopant is formulated to possess migration and diffusion characteristics correlating to those of water, and to be inert in dry conditions and compatible with the insulator components. The dopant is placed within the insulator such that upon the penetration of moisture through the housing to the rod through a permeation pathway in the outer surface of the insulator, the dopant will become activated and will leach out of the same permeation pathway.

Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract: A laminate composite that includes a phosphoric acid anodized metal layer that includes an anodic film of from between about 0.005 mils to about 0.015 mils thick as measured through standard acid dissolution testing; an adhesive layer; a top layer adhered to the metal layer at least in part by the adhesive layer; and wherein the metal includes a metal chosen from the group that includes an aluminum and an aluminum alloy.

Abstract: A method to reduce undesirable outgassing includes bonding at least two optical components with a bonding material and encapsulating the bonding material with a capping material. The capping material inhibits the outgassing of species that would otherwise be emitted from the bonding material to the surrounding. In one example, the bonding material is silicone and the capping material is epoxy.

Abstract: A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.

Abstract: This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably degradable when subjected to appropriate conditions.

Abstract: A process for painting integrated automobile and commercial vehicle bodies or cabins which comprise plastic parts. The metal parts of the body/cabin are provided with an electrocoat and are integrated with the plastic parts. These plastic parts either already have an electrically conductive aqueous primer coat or an uncured electrically conductive aqueous primer film or are unpainted. Primers are applied to the metal and plastic parts. Atop the primers, a basecoat and a clearcoat are applied.

Abstract: A method for bonding DVD layers which comprises EB bonding at least two layers of a DVD with an EB curable adhesive composition which consists essentially of at least one epoxy resin and at least one aryl iodonium salt (cationic) photoinitiator and DVDs produced by this method.

Abstract: Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 ?m and optionally non-conductive particles having a particle size of 0.1 to 1 ?m; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.

Abstract: The present invention relates to a fiber-reinforced plastic molded article including a surface layer (A) composed of a polymer material, an intermediate layer (B) and a fiber-reinforced plastic layer (C); wherein (1) said intermediate layer (B) is composed of the cured product of an intermediate layer composition comprising a curable resin composition including a polymerizable unsaturated monomer and a polymerization curable unsaturated resin, a filler and a thixotropic agent, (2) said curable resin composition is able to form a casting plate having tensile elongation percentage of 2 to 50% and Barcol hardness (B value) of 50 or more by its curing, (3) the content of said filler is 30 to 150 parts by weight relative to 100 parts by weight of curable resin composition, and (4) the content of said thixotropic agent is 1 to 4 parts by weight relative to 100 parts by weight of curable resin composition.

Abstract: Provided is a gas barrier film in which in coating or laminating a single layer film or a multiplayer film comprising at least one (a) thermoplastic resin layer on which an inorganic compound is vapor deposited or (b) layer comprising metal foil, wherein 40% by weight or more of a skeletal structure represented by the following Formula (1) is contained in an epoxy resin-cured product formed from an epoxy resin composition comprising an epoxy resin and an epoxy resin curing agent as principal components.

Abstract: A powder coating composition contains solid particulates of a mixture of a solid material having at least two epoxide groups, each beta to a urethane or urea group, and a solid crosslinker reactive with epoxide groups.

Abstract: There is disclosed a process of priming a surface (preferably part of a vehicle) comprising; i) applying a UV radiation curable primer to the area to be primed; ii) curing the primer with UV radiation provided by one or more UV lamps having a UV-B:UV-A ratio of 1:1 or less and substantially no UV-C content, the UV radiation curable primer containing: A. 0-84% by weight of one or more compounds containing one ethylenically unsaturated free-radically polymerisable group per molecule; B. 5-50% by weight of one or more compounds containing two or more ethylenically unsaturated free radically polymerisable groups per molecule; C. 10-70% by weight of one or more pigments, fillers and/or dyes; D. 1-8% by weight of one or more photoinitiators; E. 0-20% by weight of volatile organic solvent and; F. 0-15% by weight of customary additives. Preferably the process also includes sanding the primer and topcoating the primer with one or more topcoats.

Abstract: An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.

Abstract: A medical material having a surface which is safe and excellent in stability with the lapse of time and has a high durability as needed in establishing a long-lasting surface lubricity in a wet state and an excellent compatibility with blood, and a method for producing the same. These materials are obtained by forming a coating layer with a coating material containing a polymeric substance (A) having a heterocyclic group represented by the formula (1) on at least a part of a surface of a medical material base, and then ring-opening the heterocyclic group remaining in the coating layer by a nucleophilic compound (N): wherein X represents O, NH or S; and R1 represents H or CH3.

Abstract: The present invention provides a coating which contains a primer layer on a substrate with a scratch resistant layer adhered to the primer, wherein the primer layer contains a hardened epoxy resin prepared from a hardener and a multi epoxy-functional compound and the scratch resistant layer contains an epoxide group containing hydrolyzable silane. The coating may find use in coated products such as sheets, spectacles, optical lenses, automobile screens and plastic spray screens.

Abstract: A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

Abstract: Encapsulated electrical component assemblies and methods of electrically connecting an electrical component having a plurality of component electrical terminations to a component carrying substrate having a plurality of substrate electrical terminations at surface mount reflow soldering conditions is described. The electrical and substrate components have an encapsulant-forming composition sandwiched therebetween and encasing said pluralities of component and substrate electrical connections. The described invention relates to using an encapsulant-forming composition comprising a thermosetting resin (preferably an epoxy resin) and a cross-linking agent (preferably an anhdride) for said resin that cross-links said resin and that also acts as a fluxing agent and optionally includes a catalyst for initiating cross-linking at required conditions. The gel point of the encapsulant-forming composition is reached after solder melt.

Abstract: Provided is an anisotropic conductive paste in which an aqueous solution obtained by admixing the anisotropic conductive paste with purified water has an ionic conductivity of 1 mS/m or less; the B stage-reduced composition has a viscosity of 50 to 10000 Pa.s at 80 to 100° C.; and the cured matter of the anisotropic conductive paste has a linear expansion coefficient of 10×10−5 mm/mm/° C. or less at 0 to 100° C., a heat deformation temperature Tg of 100° C. or higher, a water absorption coefficient of 2 mass % or less and a specific resistance of 1×109&OHgr;.cm or more.

Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, wherein the epoxy resin (A) contains a phosphorus atom, and wherein 5 to 50 parts by weight of the phenoxy resin (C) and 0.05 to 10 parts by weight of the curing accelerator (D) are mixed with 100 parts by weight in total of the epoxy resin (A) and the phenolic curing agent (B).

Abstract: A protective garment for protection molten metals is provided with a laminated fabric including a surface layer of an heat-resistant fabric, an intermediate layer of a carbon fabric, one or more heat insulating layers of non-woven heat-resistant fabrics laminated inside of the intermediate layer and a lining of an heat-resistant fabric configured to be moisture-absorbing.

Abstract: A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.

Abstract: An inexpensive electrically conductive roll which is easily produced compared with conventional rolls, offers stable adhesion at the interface with time lapse after mixing adhesive components, which is not affected by environment during storage of the core after being applied with an adhesive. The electrically conductive roll comprises a shaft 11, an adhesive layer 12 formed on an outer periphery of the shaft and a base rubber layer 13 formed on an outer periphery of the adhesive layer, wherein the base rubber layer includes an addition reaction curing silicone elastomer and the adhesive layer includes a one part epoxy adhesive.