Abstract: A fire, heat and high voltage cable wrap system for protecting wires and cables. The protective cable wrap system includes a support layer for strength being selected from the group consisting of woven, non-woven, knitted, netted or matted materials; a high voltage arc resistant layer for protection against high voltage; a fire protective coating layer for protecting the cable wrap system against fire; and a top coating layer for resistance to water, chemicals, gases, environmental factors and mechanical damage. The support layer, the high voltage arc resistant layer, the fire protective coating layer and the top coating layer are laminated together for forming a composite laminate structure having a plurality of concentric layers for the protection of transmission wires, electrical wires and cables that provides for high voltage isolation up to 50 kV.

Abstract: A laminate sheet that can be easily produced together with improving the heat resistance and the water absorbency. Provided is a laminate sheet prepared by laminating plural sheet materials by a resin composition, wherein the resin composition is comprised of an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule, and the resin composition is a polyamide resin composition that contains 30 to 50% by mass of the epoxy group-containing phenoxy resin.

Abstract: Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.

Abstract: A sealant is provided. The sealant includes an acrylic type compound having at least two acrylic groups per one molecule, an epoxy type compound having at least one epoxy group per one molecule, and a dihydrazide compound. The dihydrazide compound includes 4-isopropyl-2,5-dioxoimidazolidin-1,3-di(propyonohydrazide) and adipic acid dihydrazide. A display device is also provided. The display device includes a pair of substrates and a sealing pattern between the pair of substrates. The sealing pattern includes the sealant.

Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.

Abstract: The present invention provides a transparent conductor comprising a substrate, and a conductive layer containing conductive particles and a conductive polymer.

Abstract: Lithographic substrate comprising (a) a dimensionally stable plate- or foil-shaped support, (b) an aluminum oxide layer provided on at least one side of the support (a), and (c) an interlayer applied onto the aluminum oxide layer comprising a hydrophilic polymer comprising structural units derived from the following compounds: (a1) at least one compound comprising both polyalkylene oxide chains and at least one structural unit which is free-radical polymerizable, and (a2) at least one monomer capable of copolymerizing with the free-radical polymerizable structural unit of (a1) and furthermore comprising at least one acidic functional group with pKs<5, wherein the acidic functional group can be present as a free acid group or in the form of a salt.

Abstract: There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (?1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.

Abstract: An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface; at least one I/O contact located on the first surface of the electronic device; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; a first metal layer disposed on the I/O contact; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, and located adjacent to the first metal layer. The base insulative layer secures to the electronic device through the first metal layer and removable layer, wherein the first metal layer and removable layer are capable of releasing the base insulative layer from the electronic device when the first metal layer and removable layer are exposed to a temperature higher than their softening points or melting points.

Abstract: A composition for making flexible articles includes a hydraulic component of at least 50 weight % fly ash, a water-soluble, film-forming polymer and water. Articles are made from this composition by making a slurry of the components, forming the article and allowing it to set.

Abstract: Multilayer composite materials with at least one aerogel-containing layer and at least one other layer, a process for producing the same and their use are disclosed. The aerogel-containing layer(s) further contain at least one binder.

Abstract: Epoxy resins that are suitable for forming epoxy laminates that meet a UL-94 rating of V-0 comprise a hydroxy-terminated oligomeric phosphonate comprising the repeating structure —OP(?O)(R)OArylene-, where R is alkyl, as a flame retardant.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: A first variant of an adhesive composition for making a lignocellulosic composite includes soy protein and/or lignin; at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein; and at least one compound selected from a boron compound, a group IA oxide or hydroxide, or a group IIA oxide or hydroxide. A second variant of an adhesive composition includes a first component selected from soy protein and/or lignin; and at least one substantially formaldehyde-free curing agent selected from a reaction product of epichlorohydrin with ethylenediamine, a reaction product of epichlorohydrin with bis-hexamethylenetriamine, or a reaction product of epichlorohydrin with hexamethylenediamine.

Abstract: An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. Advantageously, a mixture of amines will be used in the curative including multifunctional aliphatic amines that improve adhesion and strength build; tertiary amines which are used to enhance adhesion and strength build, polyamides which can be used to provide flexibility; and amine-terminated rubbers (ATBN) which can improve toughness and impact resistance to the cured system. The preferred short chain diol is glycerin. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating.

Abstract: A method for producing a device and a device is disclosed. In one embodiment, a component is surrounded by a material. A fluoropolymer-containing compound is produced at a surface of the material. A molding is produced from a material and a fluoropolymer-containing compound is produced at a surface of the molding by a vapor deposition.

Abstract: A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.

Abstract: Provided is an adhesive composition useful for electronic assembly comprising a curable epoxy resin, a plurality of polymer particles having at least one of a plurality of acid functional groups or a composition which swells in the presence of the epoxy resin at a first temperature and a thermally activated cure agent and/or a thermally activated cure catalyst which becomes active at a second, temperature, wherein the second temperature is higher than the first temperature. Also provided are assemblies including such adhesives and methods of assembling same.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: A composite layered sheet, comprising at least a) a fire-protection layer A with an intumescent composition based on an alkali metal silicate and, applied on the two sides, b) protective layers B and B?, and c) a substrate layer C composed of wood, fiberboard, gypsum plasterboard, or calcium silicate board, paper, metal, plastic, or of another fire-protection layer, and production process, and use as core material for a fire-protection door.

Abstract: An electrical device includes two electrodes and a conductive polymer layer, containing a mixture of a polymer and a conductive filler, separating the electrodes. A oxygen barrier material containing a thermosetting polymer component is present on the exposed surface of the conductive polymer layer that is not in contact with the laminar electrodes. The oxygen barrier material may be a polyamine-polyepoxide material, and may provide for acceptable barrier properties over a wide range of humidity levels.

Abstract: A slip-resistant coating composition comprising (i) a binder comprising a polyepoxide and a polyamine; (ii) a micaceous pigment selected from the group consisting of mica and micaceous iron oxide and blends thereof; (iii) at least one other pigment; wherein the micaceous pigment is present at a level of at least 4% PVC based on total volume solids and wherein the total PVC of the coating is at least 35%. The slip-resistant coating would have a slip coefficient of at least 0.50 after cure and is especially useful in the manufacture of structural joints.

Abstract: A corrosion resistant epoxy primer comprises a epoxy resin, a curing agent, and a non-chromate containing corrosion-inhibiting pigment.

Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.

Abstract: An aqueous coating material comprising at least one epoxy resin as binder and at least one polyamine as curing agent, wherein said epoxy resin or at least one of the epoxy resins (i) is solid per se at room temperature and/or is present in a powder coating material, and (ii) the solid epoxy resin and/or the epoxy resin powder coating material is or are present in fine dispersion in an aqueous dispersion comprising the polyamine or polyamines; and the use of the aqueous coating material to produce antistonechip primers.

Abstract: Novel anti-reflective coatings comprising small molecules (e.g., less than about 5,000 g/mole) in lieu of high molecular weight polymers and methods of using those coatings are provided. In one embodiment, aromatic carboxylic acids are used as the chromophores, and the resulting compounds are blended with a crosslinking agent and an acid. Anti-reflective coating films prepared according to the invention exhibit improved properties compared to high molecular weight polymeric anti-reflective coating films. The small molecule anti-reflective coatings have high etch rates and good via fill properties. Photolithographic processes carried out with the inventive material result in freestanding, 110-nm profiles.

Abstract: Transparent panels having unidirectional bullet-resisting characteristics contain at least one sheet of glass, several intermediate sheets formed of an acrylic resin or further glass sheets, and an inner sheet formed of a polycarbonate resin. A transparent adhesive bonds the sheets to each other to form the panel. The level of bullet resistance capability is measured according to NIJ standards and the panels have a Level III or Level IV rating.

Abstract: Disclosed is the preparation of a laminated composite structure. Such laminate composites comprise a base layer comprising a base substrate; at least one polymeric layer laminated onto a surface of the base substrate. The polymeric layer is preferably decorative on an exterior surface and is preferably bonded to the base substrate using a thermosetting adhesive interposed between the substrate surface and the polymeric layer. The polymeric layer comprises an opaque, polymeric, e.g., polypropylene-based, film which has a cavitated core and a coating thereon, which is preferably an acrylic-based coating applied to both sides of the film. Such laminated structures can be produced by passing the requisite base layer, polymeric layer film and adhesive through sets of rollers or drums which supply the heat and/or pressure needed to adhesively bond the layers together.

Abstract: The invention relates to an adhesive containing two components A and B, whereby component A comprises both a functional group which can be polymerized by means of irradiation with UV beams as well as at least one functional group which is able to react with a compound having at least one acidic hydrogen atom and component B comprises at least two functional groups which can be polymerized by means of irradiation with UV beams or with electron beams. The adhesive is suitable for the production of composite materials and exhibits a high flexibility with a good initial bonding.

Abstract: An article includes a first substrate, a functional coating deposited over at least a portion of the substrate, and a protective coating deposited over the functional coating. The functional coating and the protective coating define a coating stack. A polymeric material is deposited over at least a portion of the protective coating. The protective coating has a refractive index that is substantially the same as the refractive index of the polymeric material.

Abstract: An initial surface is provided. An overlay of colored grout is provided. The colored grout is on the initial surface. In this manner an intermediate surface is created. An acid stain is provided. The acid stain is on the intermediate surface. A two part clear epoxy resin is provided. The epoxy resin is provided on the intermediate surface. In this manner an exterior surface is created.

Abstract: A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: Compositions capable of rapidly curing to a strong substrate bond are removable from both surfaces between which the compositions are disposed without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.

Abstract: The present invention relates to a cationic electrodeposition coating composition substantially free of lead compounds, which is excellent in curability and can be finish-coated with a splendid appearance, and an article coated with the composition. The invention provides a lead-free electrodeposition coating composition excellent in curability and a coated article, the composition being capable of forming a coating film, which emits less tin compounds to have no influence on appearance of a finish coating film and film performances.

Abstract: An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine oxide and an alpha hydroxy ketone. The formulation can cure rapidly, such as in about 20 minutes. The cured formulation can have a Tg above 150° C.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract: A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional compound having at least one acyl group which is capable of forming amide group moiety by reaction with a polyamine to form an oligomeror or (A), (B) and (C)monocarboxylic acid having 1 to 8 carbon atoms and/or derivative thereof and a coating and a coated film a gas barrier property the same.

Abstract: A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional compound having at least one acyl group which is capable of forming amide group moiety by reaction with a polyamine to form an oligomeror or (A), (B) and (C) monocarboxylic acid having 1 to 8 carbon atoms and/or derivative thereof and a coating and a coated film a gas barrier property the same.

Abstract: The present invention is directed to a practically universal surface modification process and the materials thereby obtained. In general, the process includes initial epoxy modification of a substrate surface by attachment of an epoxy-containing polymer to the surface. Following attachment of the polymer, still-existing epoxy groups on the polymer may then cross-link the polymer to form a unified anchoring layer on the surface. Other epoxy groups in the anchoring layer, not utilized in forming the layer may be used to graft surface modifying materials to the surface. For instance, macromolecules, biomolecules, polymers, and polymerization initiators may be grafted to the surface via the anchoring layer.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.

Abstract: The present invention provides inexpensively an article with a hard coat excellent in anti-staining property, lubricity, scratch resistance and abrasion resistance. The present invention also provides a method for forming the hard coat.

Abstract: Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.

Abstract: A high refractive index layer of a cured first coating composition comprising (A) metal oxide fine particles selected from among titanium oxide, aluminum oxide, zirconium oxide, cerium oxide, iron oxide, tin oxide, and compound oxides thereof and (B) a compound having an acrylic, methacrylic, vinyl or styryl group, and a low refractive index layer of a cured second coating composition comprising (D) voided silica-base inorganic oxide fine particles and (C) a compound having at least two epoxy and/or oxetane groups are successively stacked on a substrate to form an antireflection film.

Abstract: The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.

Abstract: The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 ?m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.

Abstract: Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, based on the total weight of the epoxy resin component, and an epoxy curative component, including at least one curing agent and at least one flexibilizer present in the range of about 55 to about 65 weight percent, based on the total weight of the epoxy curative component.