Au-base Component Patents (Class 428/672)
  • Patent number: 10610982
    Abstract: A method of making a weld filler metal for a superalloy for welding is disclosed. The method includes enclosing a welding rod in a first foil layer and sintering the welding rod and the first foil layer. Related processes and articles are also disclosed.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: April 7, 2020
    Assignee: General Electric Company
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, Brian Lee Tollison
  • Patent number: 10372083
    Abstract: A method for treating a surface (2) of a base (1) of a timepiece component (10), in particular a balance spring, e.g. a balance spring made of a paramagnetic NbZr alloy, includes: a first step of depositing a first layer (41) of a first oxide or first nitride or first carbide; and a second step of depositing a second layer (51) of a second oxide or second nitride or second carbide.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: August 6, 2019
    Assignee: ROLEX SA
    Inventor: Susana del Carmen Tobenas Borron
  • Patent number: 9702059
    Abstract: Invention for producing an orderly aligned horizontally planar array of nanowires comprising: step 1) providing a template for producing nanowires in which the template comprises an alternating multilayer stack of substrate and inert insulating thin film layers; and step 2) fabricating an orderly aligned, horizontally planar array of nanowires by depositing atoms and/or molecules along the outer edges of the thin film substrate layers on at least one side of the template with the use of atomic layer deposition.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: July 11, 2017
    Inventor: Steven Howard Snyder
  • Patent number: 9427937
    Abstract: The invention relates to an anti-wear coating, specifically for components which are subject to erosion under mechanical loading, in particular for gas turbine components, said coating comprising at least two different individual layers which preferably alternate with one another multiply and are applied to a surface of a component which is to be coated. The individual layers comprise a ceramic main layer (45, 46, 47, 48) and a quasi-ductile, non-metallic intermediate layer (41, 42, 43, 44).
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: August 30, 2016
    Assignee: MTU AERO ENGINES AG
    Inventors: Thomas Uihlein, Wolfgang Eichmann, Falko Heutling, Annegret Brendel
  • Patent number: 9254505
    Abstract: A variety of methods, devices, systems and arrangements are implemented involving nanowire meshes. One such method is implemented to include synthesizing metal nanowires in a solution containing a structure-directing agent. The metal nanowires are deposited on a substrate to form a sheet of nanowires. The deposited metal nanowires are heated to a temperature less than about 200 degrees Celsius and for a period of time of about 10 minutes to 60 minutes, thereby removing the structure-directing agent and modifying the electrical conductivity and optical transmittance of the sheet of nanowires.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: February 9, 2016
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Steve T. Connor, Jung-Yong Lee, Yi Cui, Peter Peumans
  • Patent number: 9064613
    Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: June 23, 2015
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: George Jyh-Shann Chou, Robert Daniel Hilty
  • Publication number: 20150030878
    Abstract: The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness.
    Type: Application
    Filed: September 28, 2012
    Publication date: January 29, 2015
    Applicant: GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
    Inventor: Su Zhi
  • Patent number: 8940403
    Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: January 27, 2015
    Assignee: Wire Technology Co., Ltd.
    Inventors: Jun-Der Lee, Hsing-Hua Tsai, Tung-Han Chuang
  • Publication number: 20150010778
    Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.
    Type: Application
    Filed: September 24, 2014
    Publication date: January 8, 2015
    Applicant: Xtalic Corporation
    Inventors: John Cahalen, Alan C. Lund, Christopher A. Schuh
  • Publication number: 20140353030
    Abstract: The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core.
    Type: Application
    Filed: May 15, 2014
    Publication date: December 4, 2014
    Applicant: Feindrahtwerk Adolf Edelhoff GmbH & Co. KG
    Inventors: Gerhard BÜRSTNER, Mathias FIOLKA
  • Publication number: 20140311769
    Abstract: A composite conductor 10, including an internal layer 11 having a conductive material A, the conductive material A having fatigue strength of at least 150 MPa after being subjected to 106 cycles of cyclic loading in a fatigue test, and an external layer 12 having a conductive material B, the external layer coating the internal layer 11, the conductive material B having tensile strength higher than that of the conductive material A, the tensile strength being at least 250 MPa, in which the composite conductor 10 has fracture resistance to a sudden load and impact as well as bending durability.
    Type: Application
    Filed: December 6, 2012
    Publication date: October 23, 2014
    Applicants: DYDEN CORPORATION, FUKUOKA PREFECTURAL GOVERNMENT, NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY
    Inventors: Hiroyuki In, Fumiyo Annou, Daisuke Matsunaga, Hiromoto Kitahara, Shinji Ando, Masayuki Tsushida, Toshifumi Ogawa
  • Publication number: 20140141278
    Abstract: The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: Frederick Goldman, Inc.
    Inventor: Andrew Derrig
  • Publication number: 20140141277
    Abstract: The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: Frederick Goldman, Inc.
    Inventor: Andrew Derrig
  • Patent number: 8652649
    Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: February 18, 2014
    Assignee: Xtalic Corporation
    Inventors: John Cahalen, Alan C. Lund, Christopher A. Schuh
  • Patent number: 8637165
    Abstract: A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: January 28, 2014
    Assignee: Apple Inc.
    Inventors: Edward Siahaan, John B. Ardisana, II, Mathias Schmidt, Jason Sloey, Albert J. Golko, Eric Jol
  • Publication number: 20140023880
    Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.
    Type: Application
    Filed: September 27, 2013
    Publication date: January 23, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: GEORGE JYH-SHANN CHOU, Robert Daniel Hilty
  • Publication number: 20140023876
    Abstract: The process of forming a partial gold-plating pattern on a stainless substrate includes a first plating step, a second plating step, and a stripping step. In the first plating step, pretreatment is applied to a stainless substrate including opposite main planes and a processing site formed of a plane different from the main planes, after which a first gold-plating layer is formed all over the surface of the stainless substrate using a hydrochloric acid plating solution. In the second plating step, mask plating is used to form a second gold-plating layer on the first gold-plating layer that covers the processing site in a desired pattern, and in the stripping step, a portion of the first gold-plating layer in an area where there is none of the second gold-plating layer is stripped off using an alkaline stripping solution.
    Type: Application
    Filed: February 8, 2012
    Publication date: January 23, 2014
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Masahiro Nagata
  • Patent number: 8574722
    Abstract: An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: November 5, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: George Jyh-Shann Chou, Robert Daniel Hilty
  • Patent number: 8551623
    Abstract: Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap (10) is used for an electronic component storing package (100) which includes an electronic component storing member (20) for storing an electronic component (40). The airtightly sealing cap is provided with a base material (1); a base layer (2) which is formed on the surface of the base material and contains Ni; and a soldering material layer (6), which is formed on the base layer, has a thickness of 10 ?m or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: October 8, 2013
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Masaharu Yamamoto, Takayuki Furujo
  • Publication number: 20130171470
    Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
    Type: Application
    Filed: June 13, 2012
    Publication date: July 4, 2013
    Inventors: Jun-Der LEE, Hsing-Hua TSAI, Tung-Han CHUANG
  • Publication number: 20130164556
    Abstract: An exemplary method for manufacturing a circuit board includes, firstly, providing a substrate made of heat conductive, electrically insulative material. Then a copper layer is formed on the substrate. After that, nickel is plated on the copper layer to form a nickel layer. Finally, gold is and plated on the nickel layer to form a gold layer.
    Type: Application
    Filed: August 15, 2012
    Publication date: June 27, 2013
    Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.
    Inventors: SUNG-HSIANG YANG, WEI-CHUN YEH, CHENG-CHAO CHAO
  • Publication number: 20130130059
    Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventor: TDK CORPORATION
  • Patent number: 8445116
    Abstract: Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.
    Type: Grant
    Filed: November 27, 2011
    Date of Patent: May 21, 2013
    Assignee: Xtalic Corporation
    Inventors: Nazila Dadvand, Christopher A. Schuh, Alan C. Lund, Jonathan C. Trenkle, John Cahalen
  • Patent number: 8404359
    Abstract: A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layer 14 free from lead and formed on a substrate 11 or an electronic device bonding substrate 10 having such a solder layer, the solder layer 14 has a specific resistance of not more than 0.4 ?·?m. The electronic device bonding substrate 10 can have a thermal resistance of not more than 0.5 K/W and a thickness of not more than 10 ?m. Then, voids contained in the solder layer 14 have a maximum diameter of not more than 0.5 ?m and the substrate can be a submount substrate.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: March 26, 2013
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yoshikazu Oshika, Masayuki Nakano
  • Publication number: 20130025366
    Abstract: A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).
    Type: Application
    Filed: July 23, 2012
    Publication date: January 31, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Toshio OIKE, Kenichi TANAKA, Ryo HIROSE, Takafumi SHIMIZU
  • Publication number: 20130003332
    Abstract: Disclosed herein are an electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein each of the electroless nickel, palladium, and gold plated coatings has a thickness of 0.02 to 1 ?m, 0.01 to 0.3 ?m, and 0.01 to 0.5 ?m. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 ?m, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.
    Type: Application
    Filed: June 25, 2012
    Publication date: January 3, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jun Lee, Dong Ju Jeon, Jung Youn Pang, Seong Min Cho, Chi Seong Kim
  • Publication number: 20130004792
    Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.
    Type: Application
    Filed: September 6, 2012
    Publication date: January 3, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Warren M. Farnworth, Rick C. Lake, William M. Hiatt
  • Patent number: 8329311
    Abstract: The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer (30) constituting the base of the point and an upper layer (31) constituting the point itself.
    Type: Grant
    Filed: September 25, 2005
    Date of Patent: December 11, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: François Marion, Cécile Davoine
  • Publication number: 20120285627
    Abstract: An item, such as a sputtering target assembly or an electrostatic chuck, comprised of a first substrate; a metallization layer adhered to a surface of the first substrate; a second substrate; and an elastomer layer positioned between the metallization layer and the second substrate. In another embodiment, a debonding layer, such as a solder material, is positioned between the elastomer layer and the second substrate for allowing the item to be disassembled after use by heating the item up to the approximate melting point of the debonding layer.
    Type: Application
    Filed: May 8, 2012
    Publication date: November 15, 2012
    Applicant: THERMAL CONDUCTIVE BONDING, INC.
    Inventors: Ryan A. Scatena, Wayne R. Simpson
  • Patent number: 8226810
    Abstract: The invention concerns a galvanic deposition method for an anthracite colored coating for metallic parts, including a first step of depositing a gold-nickel alloy by means of an electrolytic bath, characterized in that it includes a second step of treating said gold-nickel alloy by means of a diluted acid bath, containing an acid selected from among hydrochloric, hydrofluoric, phosphoric, nitric and sulphuric acid.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: July 24, 2012
    Assignee: Universo S.A.
    Inventor: Christophe Henzirohs
  • Patent number: 8198976
    Abstract: A flexible thin metal film thermal sensing system is provided. A thermally-conductive film made from a thermally-insulating material is doped with thermally-conductive material. At least one layer of electrically-conductive metal is deposited directly onto a surface of the thermally-conductive film. One or more devices are coupled to the layer(s) to measure an electrical characteristic associated therewith as an indication of temperature.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: June 12, 2012
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Donald Laurence Thomsen
  • Publication number: 20120129005
    Abstract: It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 ?m or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine.
    Type: Application
    Filed: April 15, 2011
    Publication date: May 24, 2012
    Inventors: Takanobu Asakawa, Tomoyuki Fujinami
  • Publication number: 20120077054
    Abstract: Electronic assemblies including coreless substrates having a surface finish, and their manufacture, are described. One method includes electrolytically plating a first copper layer on a metal core in an opening in a patterned photoresist layer. A gold layer is electrolytically plated on the first copper layer in the opening. An electrolytically plated palladium layer is formed on the gold layer. A second copper layer is electrolytically plated on the palladium layer. After the electrolytically plating the second copper layer, the metal core and the first copper layer are removed, wherein a coreless substrate remains. Other embodiments are described and claimed.
    Type: Application
    Filed: September 25, 2010
    Publication date: March 29, 2012
    Inventors: Tao WU, Charavanakumara Gurumurthy
  • Patent number: 8133632
    Abstract: An Au plated film 12 is formed on the surface of a plate-formed metal base 13 composed of a metal less noble than Au, and the product is cut along a planned cutting line 18 reflecting a contour of a desired component, to thereby form a separator 10. Thus-formed separator 10 has the Au plated film 12 formed on the main surface 10a thereof, and has a cutting plane 16 formed as an end face 16 stretched up to the main surface 10a. The metal base 13 exposes in a part of the cutting plane 16, in a width of the exposed region of 1 mm or less. This is successful in providing a metal component for fuel cell which is satisfactory in the corrosion resistance and allows easy fabrication at low costs, a method of manufacturing the same, and also in providing a fuel cell having thus-fabricated metal component for fuel cell.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: March 13, 2012
    Assignee: Daido Tokushuko Kabushiki Kaisha
    Inventors: Shinobu Takagi, Masaki Shinkawa, Mikio Ura, Shinichi Yagi, Yasushi Kaneta, Tatsuo Hisada
  • Publication number: 20120021248
    Abstract: A method for fabricating nanostructures, which includes the steps of forming a multi-segmented nanowire; and performing a galvanic displacement reaction on the multi-segmented nanowire. The method utilizes template directed electrodeposition to fabricate nanowires with alternating layers of sacrificial/noble metal, enabling a new level of control over particle spacing, aspect ratio, and composition. Moreover, by exploiting the redox potential dependent reaction of galvanic displacement, nanopeapod materials can be extended (semiconductor/metal, p-type/n-type, metal/metal, ferromagnetic/nonmagnetic, etc.) beyond the fundamental metal/metal-oxide nanopeapods synthesized by high temperature techniques. In accordance with an exemplary embodiment. Co/Au and Ni/Au multisegmented nanowires were used to create Te/Au nanopeapods by galvanic displacement, producing Te nanotubes and nanowires with embedded Au particles, respectively.
    Type: Application
    Filed: May 23, 2011
    Publication date: January 26, 2012
    Applicant: The Regents of the University of California
    Inventors: Nosang Vincent Myung, Carlos Maldonado Hangarter
  • Patent number: 8043719
    Abstract: A metal member is manufactured that has a plating layer of precious metal on the surface of a bare metal portion formed of a predetermined metal. First, a surface layer of the bare metal portion is removed. Then, a plating of precious metal is applied to the portion where the surface layer of the bare metal portion was removed. Then, the metal member is heat treated in an inert atmosphere. As a result, a metal member can be manufactured that has less carbide and hydrogen near a boundary surface of the plating layer and the bare metal portion than it would if the removing step and the heat treating step were not performed. With a metal member manufactured in this way, the plating layer does not easily peel away.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: October 25, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Naotaka Aoyama
  • Patent number: 8039119
    Abstract: Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (?? and ??) in the textured metal layer surface and orientation degrees (?? and ??) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: October 18, 2011
    Assignees: Chubu Electric Power Co., Inc., Tanaka Kikinzoku Kogyo K.K.
    Inventors: Naoji Kashima, Shigeo Nagaya, Kunihiro Shima, Shuichi Kubota
  • Publication number: 20110240279
    Abstract: The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.
    Type: Application
    Filed: March 30, 2010
    Publication date: October 6, 2011
    Applicant: International Business Machines Corporation
    Inventors: BRUCE K. Furman, Paul A. Lauro, Yves C. Martin, Robert L. Sandstrom, Da-Yuan Shih, Theodore G. Van Kessel
  • Publication number: 20110200842
    Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48 M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.
    Type: Application
    Filed: October 1, 2009
    Publication date: August 18, 2011
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
  • Patent number: 7998593
    Abstract: A process for the manufacture of a metallic seal comprising applying a first intermediate layer to a base metal, applying a second intermediate layer overlying the first intermediate layer, applying a first coating layer comprising silver overlying the second intermediate layer, applying a second coating layer comprising indium overlying the first coating layer, baking the base metal with applied intermediate and coating layers at a temperature to diffuse the coating layers to form a silver indium alloy coating layer. A seal comprising a substrate having a metal surface, a first intermediate layer overlying the base metal, a second intermediate layer overlying the first intermediate layer, an alloy coating layer overlying the second intermediate layer, wherein the alloy coating layer comprises a silver indium alloy.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: August 16, 2011
    Assignee: Parker-Hannifin Corporation
    Inventors: Christopher D. Mahoney, James E. Beach
  • Patent number: 7989086
    Abstract: A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: August 2, 2011
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Sunil G. Warrier, Richard S. Bailey, Willard H. Sutton
  • Patent number: 7985487
    Abstract: Disclosed is a corrosion resistant conductive part, which is made by forming a thin plated gold layer of thickness 100 nm or less on a stainless steel sheet, and for which high corrosion resistance is guaranteed even with a very thin gold layer. The part is characterized in that the maximum value “v” of atomic concentration of gold given by Auger analysis is at least 98% of the total atomic concentrations of all the elements, which is deemed to be 100%, in the thin gold layer ranging from the surface to the interface of the gold layer and the metal substrate, at which the descending curve of gold crosses the ascending curve of the most predominant component of the substrate metal.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: July 26, 2011
    Assignee: Daido Steel Co., Ltd.
    Inventors: Takeo Hisada, Yasushi Kaneta, Shinobu Takagi, Naoki Fuse
  • Publication number: 20110171137
    Abstract: A process of preparing a plurality of nanostructures, each being composed of at least one target material is disclosed. The process comprises sequentially electrodepositing a first material and the at least one target material into pores of a porous membrane having a nanometric pore diameter, to thereby obtain within the pores nanometric rods, each of the nanometric rods having a plurality of segments where any two adjacent segments are made of different materials. The process further comprises and etching the membrane and the first material, thereby obtaining the nanostructures.
    Type: Application
    Filed: September 10, 2009
    Publication date: July 14, 2011
    Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTD.
    Inventors: Fernando Patolsky, Roey Elnathan, Raisa Kantaev
  • Patent number: 7964291
    Abstract: A magnesium alloy compound type thermal metal material includes a heat dissipation surface layer formed of a magnesium alloy, a contact surface layer formed of gold, platinum, silver, or copper alloy, and a fusion layer, which is an eutectic structure joined between the heat dissipation surface layer and the contact surface layer under and formed therebetween subject to application of a high temperature and a high pressure, such that the thermal conductivity metal alloy of the contact surface layer absorbs heat energy quickly from the heat source and transfers absorbed heat energy to the heat dissipation surface layer for quick dissipation; the internal molecules of the product are joined tightly together subject to the applied pressure, and the surface of the product allows for electroplating.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: June 21, 2011
    Assignee: Jiing Tung Tec. Metal Co., Ltd.
    Inventors: Ying Hung Kao, Emily Hsiao
  • Publication number: 20110132655
    Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi layer is formed on the first sealing frame and an Au layer is formed on the second sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are close contact with each other to form the bonding section. The bonding section is constituted by a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au2Bi.
    Type: Application
    Filed: February 8, 2011
    Publication date: June 9, 2011
    Inventors: Hiroki Horiguchi, Yuji Kimura
  • Patent number: 7923576
    Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming intermolecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: April 12, 2011
    Assignee: Sony Deutschland GmbH
    Inventors: Jurina Wessels, William Ford, Akio Yasuda
  • Publication number: 20110048774
    Abstract: The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×?×100)/X is 10 or less, where X and ? are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Applicant: TDK CORPORATION
    Inventors: Atsushi SATO, Hisayuki Abe, Takashi Ota, Miyuki Yanagida, Masumi Kameda
  • Patent number: 7876017
    Abstract: An object of the present invention is to provide a commutator or brush material for a small electric DC motor which enables a lengthened operating life of a spindle motor for a DVD controlled using a pulse current. A commutator material for a small electric DC motor in accordance with the present invention is characterized by being composed of 6.0 to 10.0 wt % of Cu, 1.0 to 5.0 wt % of ZnO, and a balance of Ag and in that Cu metal particles and ZnO particles are dispersed in an AgCu matrix. A brush material for a small electric DC motor in accordance with the present invention is characterized by being composed of 0.1 to 5.0 wt % of MgO and a balance of Ag and in that MgO particles are dispersed in an Ag matrix, or is characterized by being composed of 5.0 to 15.0 wt % of Ni and a balance of Pt and in that Ni is dissolved in a Pt matrix.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: January 25, 2011
    Assignees: Mabuchi Motor Co., Ltd., Tanaka Kikinzoku Kogyo K.K.
    Inventors: Keiji Nakamura, Makoto Takabatake, Masahiro Takahashi, Shuichi Kubota, Takao Asada, Toshiya Yamamoto
  • Patent number: 7824777
    Abstract: “Corrosion” performance of an optical filter is enhanced when a relatively thick zinc-based film functions as a seed layer for a subsequently formed silver-based film. At least two pairs of dielectric and metallic layers are included within the optical filter, where the zinc-based film is a second film of the dielectric layer and where the silver-based film is the metallic layer. The zinc-based film has a zinc content of at least 80 percent and has a thickness of at least 15 nm. In order to further improve the corrosion performance, gold may be incorporated into the silver-based film.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: November 2, 2010
    Assignee: Southwall Technologies, Inc.
    Inventors: Chris H. Stoessel, Andrew Wahl, Roland Thielsch, Matthew Coda, Julius Kozak, Richard T. Wipfler, Lee Boman
  • Patent number: RE44510
    Abstract: The invention relates to tuned multifunctional linker molecules for charge transport through organic-inorganic composite structures. The problem underlying the present invention is to provide multifunctional linker molecules for tuning the conductivity in nanoparticle-linker assemblies which can be used in the formation of electronic networks and circuits and thin films of nanoparticles. The problem is solved according to the invention by providing a multifunctional linker molecule of the general structure CON1-FUNC1-X-FUNC2-CON2 in which X is the central body of the molecule, FUNC1 and FUNC2 independently of each other are molecular groups introducing a dipole moment and/or capable of forming inter-molecular and/or intramolecular hydrogen bonding networks, and CON1 and CON2 independently of each other are molecular groups binding to nanostructured units comprising metal and semiconductor materials.
    Type: Grant
    Filed: September 15, 2012
    Date of Patent: September 24, 2013
    Assignee: Sony Deutschland GmbH
    Inventors: Jurina Wessels, William E. Ford, Akio Yasuda