Au-base Component Patents (Class 428/672)
  • Patent number: 6780527
    Abstract: The present invention includes a personal ornament having a white coating layer and a method for making the same. The base article is made of metal and the white-colored stainless steel coating layer is formed by a dry plating process. The base metal may be ferrous or non-ferrous.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: August 24, 2004
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Koichi Naoi, Akiyoshi Takagi, Yukio Miya, Fumio Tase, Kazumi Hamano
  • Patent number: 6777110
    Abstract: A layered article having a curved surface made of a supporting metal metallurgically bonded to a supported metal.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: August 17, 2004
    Assignees: E. I. du Pont de Nemours and Company, Engelhard-CLAL
    Inventors: John James Barnes, Joseph Gerard Biondo, Peter Gideon Gelblum, Richard Delbert Lanam, Charles Joseph Noelke, David Archer Wells
  • Publication number: 20040146767
    Abstract: A separator for fuel cells which has a gold covering layer on the surface of a metal plate and is formed by plastic working, wherein the relationship (R+D)/R≦=1.025 (50 &mgr;m≦R≦1000 &mgr;m) is satisfied assuming the minimum bending radius R at a plastic worked portion is R (&mgr;m), and the thickness of the gold covering layer is D (&mgr;m). According to the separator for fuel cells, exfoliation or cracking is prevented in the gold covering layer after plastic working, whereby corrosion resistance and durability can be remarkably improved.
    Type: Application
    Filed: November 7, 2003
    Publication date: July 29, 2004
    Inventors: Teruyuki Ohtani, Makoto Tsuji, Masao Utsunomiya
  • Patent number: 6730415
    Abstract: A film is formed on the surface of a soft metal portion (2) such that the film contains phosphorus and either platinum or palladium, and further, at least one element having homogeneous solubility with platinum or palladium, with the content of the phosphorus being in a range of about 15 to 25 atomic %, or contains boron and iron with the content of the boron being in a range of from about 15 to 25 atomic %. Thus, a soft metal is made up by turning the film into a hard layer (3) made of an amorphous alloy.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: May 4, 2004
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Yoshitsugu Shibuya, Eigou Hashimoto, Junji Satoh, Masahiro Satoh, Seiichi Hiroe
  • Patent number: 6727007
    Abstract: A magneto-optical recording medium includes at least a reflective layer and a recording layer formed in this order on a substrate, in which record and reproduction of information are carried out by irradiating the medium with laser beam from a recording layer side. The reflective layer includes two or more thin film layers different in surface roughness, of which one near the substrate has a surface tension smaller than a surface tension of one near the recording layer. The medium exhibits a coercive force and CNR of a recording layer of a magneto-optical recording medium to realize high density recording by contriving the constitution of the recording layer.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: April 27, 2004
    Assignee: Fujitsu Limited
    Inventors: Takuya Kamimura, Tsutomu Tanaka, Koji Matsumoto
  • Patent number: 6723450
    Abstract: A magnetic recording medium for data storage uses a magnetic recording layer having at least two ferromagnetic films with different remanent magnetization-thickness (Mrt) values that are coupled antiparallel across a nonferromagnetic spacer film predominantly by the dipole field (Hd) from the grains of the higher-Mrt ferromagnetic film. The material compositions and thicknesses of the ferromagnetic films and the nonferromagnetic spacer film are selected so that Hd predominates over any antiferromagnetic exchange coupling field (Haf) and is greater than the coercive field of the lower-Mrt ferromagnetic film. As a result, the magnetizations of the two ferromagnetic films are antiparallel in the two remanent magnetic states, and thus the net remanent magnetization-thickness product (Mrt) of the recording layer is the difference in the Mrt values of the two ferromagnetic films.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: April 20, 2004
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hoa Van Do, Mary F. Doerner, Eric Edward Fullerton, David Thomas Margulies, William G. McChesney, Manfred Ernst Schabes, Kai Tang
  • Patent number: 6711925
    Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: March 30, 2004
    Assignee: Asep Tec Co., Ltd.
    Inventor: Pen-Tien Liao
  • Publication number: 20040048097
    Abstract: A layered article having a curved surface made of a supporting metal metallurgically bonded to a supported metal.
    Type: Application
    Filed: September 11, 2003
    Publication date: March 11, 2004
    Inventors: John James Barnes, Joseph Gerard Biondo, Peter Gideon Gelblum, Richard Delbert Lanam, Charles Joseph Noelke, David Archer Wells
  • Patent number: 6699593
    Abstract: A highly corrosion-resistant material and a corrosion-resistant member which are improved in corrosion resistance, adhesion, contact electrical resistance, electrical conductivity, airtightness, etc. and are suitable for use as, e.g., a metallic separator for polymer electrolyte fuel cells (PEFC); and a process for producing them. A thin noble-metal layer is formed on the desired part of the surface of a metallic base and then subjected to compression working. The coated base may further be subjected to anticorrosive treatment with a liquid phase containing a peroxide or ozone or with an active gas atmosphere.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: March 2, 2004
    Assignee: Daido Tokushuko Kabushiki Kaisha
    Inventors: Yasushi Kaneta, Shinobu Takagi, Hiroaki Yoshida, Yoshihisa Suzuki, Masaki Shinkawa
  • Publication number: 20040038072
    Abstract: A terminal of the present invention includes a ruthenium layer formed on conductive substrate entirely or partially, and a surface metal layer made of at least one of the metals selected from the group consisting of Au, Pt, Ag, Pd, Rh, Co, Ni, In and Sn, or made of an alloy containing at least one of the metals selected from the group, which is formed on the ruthenium layer entirely or partially.
    Type: Application
    Filed: August 14, 2003
    Publication date: February 26, 2004
    Inventor: Shigeki Miura
  • Publication number: 20030224201
    Abstract: A decorative article with a whitish gold color that can retain an exceptionally beautiful appearance over a long period of time, a surface processing method manufacturing such decorative articles, and a timepiece having such decorative parts. The surface processing method includes forming a primary coat on at least part of a surface of base material, and forming a film composed of an Au—Pd—Fe—In alloy containing about 0.1 to about 10 wt % Pd, about 0.1 to about 8 wt % Fe, and about 0.1 to about 10.0 wt % In using a dry plating method. The primary coat preferably is, or includes, a buffer layer for buffering the potential difference between the base material and the film. The film is preferably formed in a dry plating method using multiple targets of different metal compositions.
    Type: Application
    Filed: January 16, 2003
    Publication date: December 4, 2003
    Inventors: Atsushi Kawakami, Yoshiyuki Obi, Yuzuru Tsukamoto
  • Publication number: 20030224197
    Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
    Type: Application
    Filed: March 7, 2003
    Publication date: December 4, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Tasao Soga, Hanae Hata, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
  • Patent number: 6656613
    Abstract: Materials including alternating magnetic layers and spacer layers for use as hard magnetic recording layers of magnetic recording media are disclosed. The spacer layers and the magnetic layers are treated in an oxygen-containing atmosphere in order to form oxidized boundary layers between adjacent granular columns extending through the layers. The columnar microstructure extends through the entire thickness of the multilayer structure to thereby exchange decouple the magnetic layers as well as the spacer layers. The spacer and magnetic layers may include additives which are present in grain boundary regions throughout the layers. The presence of the additives in the grain boundary regions may facilitate diffusion and oxidization between the adjacent granular columns. In a particular embodiment, the magnetic layers comprise Co, the spacer layers comprise Pd, and the additives comprise Cr, Pt, B, Ta, Nb or combinations thereof.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: December 2, 2003
    Assignee: Seagate Technology LLC
    Inventors: Dmitri Litvinov, Sakhrat Khizroev, James Kent Howard
  • Publication number: 20030207149
    Abstract: There is provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably for any use of contact, sliding, fitting-in or ornament, and a method for manufacturing the same. The surface treatment structure 1 having a plating layer formed on the surface of a substrate 2 comprises a lubrication plating layer 5 made of a plating layer of a metal matrix containing fine particles 4 having lubricating property, and a noble metal plating layer 7 formed on the lubrication plating layer 5. Preferably, an anti-diffusive plating layer 3 made of a metal plating layer is formed under the lubrication plating layer 5, and a joining layer 6 made of a strike plating layer of noble metal is formed between the lubrication plating layer 5 and the noble metal plating layer 7.
    Type: Application
    Filed: May 3, 2002
    Publication date: November 6, 2003
    Applicant: TSUNEKI METAL PLATING INDUSTRIES CO., LTD.
    Inventors: Heihachi Kobayashi, Masato Takeshita, Minori Sugi
  • Patent number: 6638573
    Abstract: As a method of treating a frame of spectacles which enables fine color modulation with ease, good reproducibility, and at low cost, there is provided a method of treating the surface of a frame of spectacles characterized in that a surface treating composition comprising a metal complex is used to form a coating layer on part or the whole of the surface of the frame of spectacles.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: October 28, 2003
    Assignees: Osaka Municipal Government, Hoya Corporation
    Inventors: Masami Nakamoto, Toshihisa Akaba
  • Patent number: 6635358
    Abstract: A composite member includes a ceramic base and a metallic member which are bonded to each other. An active metal foil is disposed on the surface of the ceramic base and a solder material including Au or a solder material including an Au—Ag alloy is disposed on the active metal foil. The active metal foil and the solder material are heated to form a bonding layer and the metallic member is disposed on the surface of the bonding layer, and these are pressed and heated to bond the bonding layer and the metallic member through solid phase bonding. Since in this composite member the bonding layer and the metallic member are bonded by solid phase bonding, the composite members can be effectively inhibited from breakage caused by residual stress at the time of bonding and, moreover, is excellent in thermal cycle characteristics and thermal shock characteristics.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: October 21, 2003
    Assignee: NGK Insulators, Ltd.
    Inventor: Masayuki Shinkai
  • Patent number: 6630255
    Abstract: Materials including alternating magnetic layers and spacer layers for use as a hard magnetic recording layer of a magnetic recording media are disclosed. The spacer layers as well as the magnetic layers are exchange decoupled. The spacer and magnetic layers include additives which are present in grain boundary regions throughout the layers. In a particular embodiment, the magnetic layers comprise Co, the spacer layers comprise Pd, and the additives comprise Cr, Pt, B, Ta, Nb or combinations thereof. In addition to forming grain boundaries that exchange decouple the magnetic and spacer layers, the additives may act as grain refiners.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: October 7, 2003
    Assignee: Seagate Technology LLC
    Inventors: Dmitri Litvinov, Sakhrat Khizroev
  • Patent number: 6627329
    Abstract: A plated material having a substrate, and a plating formed on the substrate, or on an undercoating formed on the substrate further has a layer formed on the plating from an organic compound capable of combining chemically with a component of the plating, and a lubricating layer formed on the layer of an organic compound. The lubricating layer is substantially a fluid film of a high molecular compound.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: September 30, 2003
    Assignee: Japan Aviation Electronics Industry
    Inventor: Tadashi Shintani
  • Patent number: 6623842
    Abstract: In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes. Further, at least the lowermost layer is made of a sintered silver conductor which is partly buried in the ceramic multi-layer substrate, a nickel or a nickel alloy layer being contained as an intermediate layer, and the topmost layer being a gold layer. Thus, a surface electrode structure on a ceramic multi-layer substrate is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: September 23, 2003
    Assignee: TDK Corporation
    Inventors: Fumio Uchikoba, Tomoyuki Goi
  • Patent number: 6613445
    Abstract: A method for forming a metal-containing layer on a substrate is disclosed. A slurry of the metal is first deposited on the substrate; followed by heating to remove volatile material from the slurry, and to form a layer of the metal. In another embodiment, a slurry of aluminum is deposited over the slurry of the metal, before or after the metal has been heat-treated to some degree. A diffusion heat treatment results in a coating which includes the noble-metal aluminide compound. Related articles are also disclosed.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: September 2, 2003
    Assignee: General Electric Company
    Inventors: D. Sangeeta, Howard John Farr
  • Patent number: 6607847
    Abstract: An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises a first metallic element and a second metallic element, wherein the first metallic element is one of titanium, palladium, zirconium, niobium, and hafnium, and wherein the second metallic element is one of titanium, palladium, zirconium, niobium, hafnium, aluminum, chromium, vanadium, platinum, gold, iron, nickel, and cobalt, the first metallic element being different from the second metallic element.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: August 19, 2003
    Assignee: General Electric Company
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay
  • Publication number: 20030143419
    Abstract: A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a, 21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.
    Type: Application
    Filed: January 8, 2003
    Publication date: July 31, 2003
    Inventor: Satoshi Nakamura
  • Publication number: 20030134142
    Abstract: An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au5Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.
    Type: Application
    Filed: December 21, 2001
    Publication date: July 17, 2003
    Applicant: The Governors of the University of Alberta
    Inventors: Douglas G. Ivey, Barbara M. Djurfors, Jacobus Cornelius Doesburg
  • Patent number: 6586118
    Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece is a semi-solid braze that comprises a first component and a second component.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: July 1, 2003
    Assignee: General Electric Company
    Inventors: Melvin Robert Jackson, Bernard Patrick Bewlay, Ji-Cheng Zhao
  • Publication number: 20030113576
    Abstract: The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.
    Type: Application
    Filed: December 19, 2001
    Publication date: June 19, 2003
    Applicant: Intel Corporation
    Inventors: Ramanan V. Chebiam, Valery M. Dubin
  • Publication number: 20030113574
    Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 19, 2003
    Applicant: Asep Tec Co., Ltd.
    Inventor: Pen-Tien Liao
  • Patent number: 6572974
    Abstract: Changes in the infrared reflection spectrum of a thin film of silica-like resinous material sandwiched between metal electrodes can be induced by applying an electric potential to a top electrode which is semitransparent. Characteristic infrared absorption lines change in proportion to a small electric current flowing through the material. These changes occur with response times of the order of seconds, and show time constants of the order of minutes to reach stationary values.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: June 3, 2003
    Assignee: The Regents of the University of Michigan
    Inventors: Mark Angelo Biscotte, Mark Monroe Banaszak Holl, Bradford Grant Orr, Udo C. Pernisz
  • Patent number: 6572955
    Abstract: High-frequency ceramics containing SiO2, Al2O3, MgO, ZnO and B2O3 as constituent components, said ceramics comprising: 30 to 50% by weight of a crystal phase containing ZnO and Al2O3; 5 to 15% by weight of a crystal phase containing SiO2 and MgO; and 40 to 60% by weight of an amorphous phase comprising substantially SiO2 or SiO2 and B2O3; wherein the content of the SiO2 crystal phase is suppressed to be not larger than 6% by weight. The ceramics has a dielectric loss at 60 GHz of not larger than 15×10−4, exhibiting excellent high-frequency characteristics, and is very useful as an insulating substrate for the wiring boards that deal with high-frequency signals.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: June 3, 2003
    Assignee: Kyocera Corporation
    Inventors: Yoshitake Terashi, Masahiro Tomisako, Satoshi Hamano, Kazuyoshi Kodama, Katsuhiko Onitsuka
  • Publication number: 20030096135
    Abstract: A composite material that is usefull in the manufacture of jewelry components has a precious metal layer laminated to an age hardenable non-precious metal-base alloy support layer. In one embodiment, the precious metal layer is a 10 k, or higher, gold alloy and the support layer is a copper-base spinodal alloy. The composite material is formed by laminating the precious metal layer to the support layer, forming the composite material into a desired shape and then age hardening the jewelry component.
    Type: Application
    Filed: November 19, 2002
    Publication date: May 22, 2003
    Applicant: Stern Leach Company, a corporation of the State of Delaware
    Inventors: Paul J. Dion, Richard V. Carrano
  • Patent number: 6565989
    Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises one of germanium and silicon, and one of chromium, titanium, gold, aluminum, palladium, platinum, and nickel. This abstract is submitted in compliance with 37 C.F.R. 1.72(b) with the understanding that it will not be used to interpret or limit the scope of or meaning of the claims.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: May 20, 2003
    Assignee: General Electric Company
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay
  • Patent number: 6565990
    Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite. The second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The diffusion bond is formed from a first metallic element disposed on a first surface of the first piece and a second metallic element disposed on at least one of the first surface and a second surface of the second piece, the second surface contacting the first surface, wherein the first and second metal form a composition having a melting temperature less than about 1400° C. This abstract is submitted in compliance with 37 C.F.R. 1.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: May 20, 2003
    Assignee: General Electric Company
    Inventors: Bernard Patrick Bewlay, Melvin Robert Jackson, Ji-Cheng Zhao
  • Publication number: 20030068523
    Abstract: A highly corrosion-resistant material and a corrosion-resistant member which are improved in corrosion resistance, adhesion, contact electrical resistance, electrical conductivity, airtightness, etc. and are suitable for use as, e.g., a metallic separator for polymer electrolyte fuel cells (PEFC); and a process for producing them. A thin noble-metal layer is formed on the desired part of the surface of a metallic base and then subjected to compression working. The coated base may further be subjected to anticorrosive treatment with a liquid phase containing a peroxide or ozone or with an active gas atmosphere.
    Type: Application
    Filed: February 28, 2002
    Publication date: April 10, 2003
    Inventors: Yasushi Kaneta, Shinobu Takagi, Hiroaki Yoshida, Yoshihisa Suzuki, Masaki Shinkawa
  • Publication number: 20030064273
    Abstract: A separator for a fuel cell comprising a gold covering layer formed on the surface of stainless steel plate a method for producing a separator, in which exfoliation and fracture of the gold covering layer can be prevented and corrosion resistance and durability can be obtained, are provided. Voids are formed by intergranular corrosion treatment at a surface of the stainless steel plate, and the gold covering layer is formed so as to be embedded in the voids. Limit value of radius of curvature in bends in which exfoliations or fractures in the gold covering layer is formed can be reduced by satisfying the equation 0.2≦4/d/L≦80 wherein L(&mgr;m) is the average grain size of the surface of stainless steel plate, and d(&mgr;m) is the thickness of the gold covering layer.
    Type: Application
    Filed: September 18, 2002
    Publication date: April 3, 2003
    Applicant: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Teruyuki Ohtani, Makoto Tsuji, Masao Utsunomiya
  • Publication number: 20030059634
    Abstract: A personal ornament having a white coating layer comprises a base article made of a metal, and a white-colored stainless steel coating layer formed by a dry plating process on at least a part of the surface of the base article. Another personal ornament having a white coating layer comprises a base article made of a nonferrous metal, an underlying plating layer formed on the surface of the base article, and a white-colored stainless steel coating layer formed by a dry plating process on at least a part of the surface of the underlying plating layer.
    Type: Application
    Filed: February 26, 2002
    Publication date: March 27, 2003
    Inventors: Koichi Naoi, Akiyoshi Takagi, Yukio Miya, Fumio Tase, Kazumi Hamano
  • Patent number: 6528185
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewelry, spectacle frames and metal buttons.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 4, 2003
    Assignees: Hong Kong Polytechnic University, Hong Kong Productivity Council
    Inventors: Hau-chung Man, Wing-yan Ng, Chi-hung Yeung, Chi-yung Lee, Cho-lung Siu, Rick Y. C. Tsui, Kinny L. K. Yeung
  • Patent number: 6528184
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 4, 2003
    Assignees: Hong Kong Polytechnic University, Hong Kong Productivity Council
    Inventors: Hau-chung Man, Wing-yan Ng, Chi-hung Yeung, Chi-yung Lee, Cho-lung Siu, Rick Y. C. Tsui, Kinny L. K. Yeung
  • Patent number: 6514628
    Abstract: The object of the invention is to provide a reflector in which a reduction in high reflection factor of Ag is restricted, a stable wheatherability can be attained in a continuous manner even if it is exposed in a severe environment of high temperature and high humidity and further a high practical effect with the connecting characteristic being effectively enforced can be attained and also a high reliability is provided. The alloy reflective film made of AgPdCu alloy or AgPdTi alloy with Ag being applied as major component, with Pd being added in a range of 0.5 to 3.0 wt %, with either Cu or Ti, for example, in Al, Au, Pt, Cu, Ta, Cr, Ti, Ni, Co, Si as the third element being added in a range of 0.1 to 3.0 wt % is formed on the substrate in a predetermined film thickness (nm). As its pre-treatment, the organic ground film is applied on the substrate and the reflective film is formed on the film to enforce effectively the connecting characteristic.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: February 4, 2003
    Assignee: Furuya Metal Co., Ltd.
    Inventor: Takashi Ueno
  • Patent number: 6514630
    Abstract: To provide a contact material suitable for a commutator of a micromotor which can improve wear resistance and prolong the life of the micromotor by improving an Au-based clad composite material provided at an outermost layer with Au or an Au alloy. The present invention provides the Au-based clad composite material including a surface of a contact substrate having an Ag—Cu—Si alloy layer cladded with Au or the Au alloy, wherein an intermetallic compound Cu—Si is dispersed and deposited in Au or the Au alloy.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: February 4, 2003
    Assignees: Sankyo Seiki Mfg. Co., Ltd., Tanaka Kikinzoku Kogyo K.K.
    Inventors: Mii Matsuzawa, Hirotaka Sakamaki, Osamu Matsuzawa
  • Publication number: 20030022017
    Abstract: A nickel-gold plating exhibiting high resistance to corrosion, which has a nickel plating layer formed on a base metal (1) and a gold plating layer (3) formed thereon, characterized in that the nickel plating layer (2) has a corrosion potential being brought close to that of the gold plating layer (3) through the reduction of the sulfur content of the nickel plating layer; or which has a first nickel plating layer (6) formed on a base metal, a second nickel plating layer (7) formed on the first nickel plating layer and a gold plating layer formed thereon, characterized in that the first nickel plating layer has a corrosion potential nobler (higher)than that of the second nickel plating layer.
    Type: Application
    Filed: August 26, 2002
    Publication date: January 30, 2003
    Inventor: Yoshihiro Minamikawa
  • Publication number: 20020192488
    Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.
    Type: Application
    Filed: February 27, 2002
    Publication date: December 19, 2002
    Inventors: Yasutoshi Kurihara, Yasuo Kondo, Takumi Ueno, Toshiaki Morita, Kenji Koyama, Takashi Suzumura, Kazuhiko Nakagawa, Kunihiro Fukuda
  • Patent number: 6495272
    Abstract: A method of producing high quality optical surfaces is disclosed. The invention allows for the production of optical surfaces with complex geometry while retaining the high quality of the optical surface. A top layer is provided on a substrate. In order to adhere the top layer to the substrate, an adhesion layer is applied first. In the preferred embodiment, the substrate is an aluminum substrate, the adhesion layer includes a layer of zinc and a layer of nickel and the top layer is gold. The substrate is generally stress free in order to provide a flat surface with no undulations. This allows a relatively thin layer of gold to be applied which then can be diamond turned in order to achieve a reflective layer.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: December 17, 2002
    Assignee: B-Con Engineering Inc.
    Inventors: Brian W. Creber, Kirk Guttin
  • Patent number: 6475646
    Abstract: A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m2, which impede a wire bonding property or solder wettability of the lead frame.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: November 5, 2002
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Se-chul Park, Dong-il Shin, Sung-il Kang, Sang-hoon Lee, Bae-soon Jang
  • Patent number: 6475629
    Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: November 5, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
  • Publication number: 20020160222
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 31, 2002
    Inventors: Hau-chung Man, Wing-yan Ng, Chi-hung Yeung, Chi-yung Lee, Cho-lung Siu, Ricky Y. C. Tsui, Kinny L. K. Yeung
  • Publication number: 20020155315
    Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 24, 2002
    Inventors: Hau-Chung Man, Wing-Yan Ng, Chi-Hung Yeung, Chi-Yung Lee, Cho-Lung Siu, Rick Y. C. Tsui, Kinny L. K. Yeung
  • Publication number: 20020127460
    Abstract: A protective coating for fuel cell interconnects particularly for metal interconnects used in stacked solid oxide fuel cells, for preventing corrosion problems at high temperature. The protective coating is composed of precious metals such as platinum, palladium, and silver, which are highly conductive and are stable in both oxidizing and reducing atmosphere. While silver is the most economical, platinum and palladium have a high performance. Silver is cheap enough that its use in form of their film does not drive up the fuel cell costs significantly, and can be readily deposited on the metal interconnect using electrochemical techniques, such as electroplating.
    Type: Application
    Filed: September 28, 2001
    Publication date: September 12, 2002
    Applicant: The Regents of the University of California
    Inventors: Ai Quoc Pham, Brandon W. Chung, Robert S. Glass
  • Patent number: 6428880
    Abstract: A gold paste for painting glass or a ceramic, exhibits gold color by being sintered. The gold paste comprises metal components having a metal composition within the following range: gold 82.0-99.1% by weight, bismuth 5.0-0.4% by weight, silicon 3.0-0.2% by weight, and the total amount of zirconium and/or aluminum 10.0-0.3% by weight. According to this, it is possible to provide a gold paste making it possible to form a gold-decorated portion which does not generates conductivity, neither generates spark nor is damaged even if it is exposed to a microwave that a microwave oven emits, is good in a massive feel and development of gold color, and has high-class feeling; and a gold-decorated product using this paste.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: August 6, 2002
    Assignee: Narumi China Corporation
    Inventors: Koichi Ito, Katsushi Sugita
  • Patent number: 6428908
    Abstract: What is described here is an electrical and mechanical contact consisting of a rigid background, a flat thin bond structure and a bond connection, as well as a method of electrically and mechanically connecting a flat thin bond structure with a rigid background by means of a bond head. In an approach to permit the production of bond contacts on a minimum of space with the smallest pitch spacings possible up to 50 &mgr;m it is proposed that the bond structure presents a hole and that the bond connection is substantially a bond element which extends from the background through the hole in the bond structure up to a zone located above the bond structure, and that the bond element, in the area located above said bond structure, extends laterally at least partially beyond said hole in said bond structure, thus ensuring the contact of the background with the underside of said bond structure.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: August 6, 2002
    Assignee: Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung e.V.
    Inventor: Hansjorg Beutel
  • Publication number: 20020094449
    Abstract: A laminated structure for electronic equipment includes a printed circuit board having copper foil, an undercoat plating layer made of tin or silver, formed on the printed circuit board, and a gold plating layer formed on the undercoat plating layer by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer, the printed circuit board is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.
    Type: Application
    Filed: November 23, 2001
    Publication date: July 18, 2002
    Inventors: Isamu Takeuchi, Masaaki Morimitsu
  • Patent number: 6413649
    Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: July 2, 2002
    Assignee: The Morgan Crucible Company plc
    Inventors: David J. Kepniss, Toshimasa Oyama