Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

Abstract: A multilayer composite tubular structure for use as a stent in surgical procedures has an outer layer of biocompatible material, a middle layer of radiopaque material, and an inner layer of biocompatible material. The layers are metallurgically bonded, to form a composite stent which is ductile and permits large deformation without delamination between the biocompatible and radiopaque layers. The composite structure formed is visible on a fluoroscope, yet does not obstruct the details of the stent itself, or of the anatomical features surrounding the stent.A process of forming a multilayer composite tubular structure is also disclosed. A tube formed from radiopaque material is coaxially surrounded by a tube of biocompatible material. The tubes are simultaneously reduced, such as by tube drawing, swaging, or deep drawing, until a composite structure of a desirable diameter and wall thickness is formed. The tubes are then heat treated to cause diffusion bonding of the biocompatible and radiopaque layers.

Abstract: A structure and method for fabricating circuits which use field effect transistors (FETs), bipolar transistors, or BiCMOS (combined Bipolar/Complementary Metal Oxide Silicon structures), uses low temperature germanium gas flow to affect metals and alloys deposited in high aspect ratio structures including lines and vias. By using a germanium gas flow, germanium (Ge) will be introduced in a surface reaction which prevents voids and side seams and which also provides a passivating layer of CuGe. If a hard cap is needed for surface passivation or a wear-resistance application, the GeH.sub.4 gas followed by WF.sub.6 can be used to produce an in-situ hard cap of W.sub.x Ge.sub.y. Further, high aspect ratio vias/lines (aspect ratio of 3 or more) can be filled by utilizing low pressures and high temperatures (i.e., below 450.degree. C.) without degrading the underlying metals.

Abstract: A component of aluminum nitride metallized with a metallizing paste containing: (i) a pulverulent glass of the MnO--Al.sub.2 O.sub.3 --SiO.sub.2 system as an adhesion promotor having a mean particle size of 2-15 .mu.m; (ii) a refractory metal powder having a mean particle size of 1-4 .mu.m; and (iii) an organic resin dissolved in a suitable solvent and/or a screen printing oil is disclosed. The metallizing paste preferably has a viscosity of 50-100 Pa.multidot.s when applied by screen printing, and a viscosity of <5 Pa.multidot.s when applied by dipping. The component of aluminum nitride metallized with the metallizing paste has at least one metal layer deposited on the metallizing paste, and the at least one metal layer applied has a bonding strength given by mean pull-off values of .gtoreq.3.5 kN/cm.sup.2.

Abstract: A method for joining rhenium to columbium and columbium based alloys that minimizes the formation of brittle intermetallics. First, a layer of ruthenium is applied to both the rhenium and columbium and then heated until the ruthenium diffuses with the rhenium and columbium respectively. A braze foil is place between the two outer ruthenium layers and the assembly is heated in a range of 50.degree. C. to 100.degree. C. above the liquidus of the braze, thereby joining the rhenium to the columbium. Alternatively, the ruthenium coated surfaces are placed in contact and diffused together under a compressive load of at least 1000 psi.

Abstract: A unique multi-layered coating process that includes coating the base metal with a layer of strike copper, a subsequent layer of bright copper, a barrier layer of palladium or related element, and a thin surface layer of a precious metal such as gold. The bright copper layer is produced by a special acid copper bath.

Abstract: A process for electroplating palladium or a palladium alloy onto an iron-nickel alloy substrate, which comprises the steps of: i) electroplating a metal selected from the group consisting of copper, tin, a nickel-tin alloy and a copper-tin alloy onto the substrate to form a first primer layer; ii) electroplating nickel or a gold alloy onto the first primer layer to form a second primer layer; and iii) electroplating palladium or a palladium alloy onto the second primer layer to from a palladium or a palladium alloy electroplating layer.

Abstract: A thin silver layer is deposited on the surface of a nonconducting substrate using an electroless process. The surface is cleaned and activated in aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt in the absence of an electric current, but in the presence of a deposition control agent. Optionally, the silver layer is stabilized with an aqueous solution of a platinum-group metal and/or gold. The resulting silver layer is uniform and of 2-2000 .ANG. thickness; it strongly adheres to the substrate.

Abstract: A multilayer comprising magnetic layers and nonmagnetic layers, which are stacked in a manner to produce a magnetoresistance effect, is formed on a main surface of a substrate having at least the surface portion formed of a single crystal of cubic system. The (110) plane of said single crystal constituting the main surface of the substrate. The magnetic layers are distorted such that a uniaxial easy axis of magnetization is formed within a plane.

Abstract: Disclosed is a magneto-resistance effect element indicating a larger magneto-resistance effect at room temperature under impression of low magnetic field is obtained with the construction wherein the characteristics of artificial metallic lattice membrane are exploited.

Abstract: In the present invention, electrons flow through a free or excitable magnet, or reflect from it, to make its magnetization respond. To accomplish this, the spin vectors of the flowing electrons are preferentially polarized by an auxiliary ferromagnet, whose moment orientation is fixed. The electrons flow between the fixed and free ferromagnets through a non-magnetic metallic spacer which is thick enough to make the static inter-magnetic exchange coupling negligible. While transmitting thru or reflecting from the free ferromagnet, the spins of the moving electrons interact by quantum-mechanical exchange with the local, permanently present, spontaneously-polarized electron spins of the free magnet. This interaction causes a transfer of vectorial angular momentum between the several metallic layers in the device which causes the magnetization vector of the free magnet to change its direction continually with time. Thus excited, the magnetization vector will precess about its original axis.

Abstract: An article is coated with a multilayer coating comprising a semi-bright nickel layer deposited on the surface of the article, a bright nickel layer deposited on the bright nickel layer, a gold layer deposited on the semi-bright nickel layer, a ruthenium layer deposited on the gold layer, a refractory metal, preferably zirconium, strike layer deposited on the ruthenium layer, and a refractory metal compound, preferably zirconium nitride, deposited on the refractory metal strike layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.

Abstract: It is an object of the present invention to provide a magnetoresistance effect element which has a film with a spin valve structure or an artificial lattice film having good soft magnetic characteristics, and which can be applied to a high-sensitivity magnetic head. The present invention provides a magnetoresistance effect element including a stacked film formed on a substrate by sequentially stacking a ferromagnetic film containing as its main constituents at least one elements selected from the group consisting of Co, Fe, and Ni, a nonmagnetic film, and the ferromagnetic film, wherein the two ferromagnetic films are not coupled with each other, and the closest packed plane of each ferromagnetic film is oriented in a direction perpendicular to the film surface.

Abstract: A metallized ceramic substrate having a smooth plating layer comprises a ceramic substrate containing aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate; and a nickel-based plating layer formed on the metallized layer wherein the plating layer has a thickness of not greater than 2 .mu.m and a surface roughness (Ra) of not greater than 2 .mu.m. Alternatively, the plating layer on the ceramic substrate may comprise a first nickel-based plating layer having a thickness of not greater than 2 .mu.m and a second gold-based plating layer having a thickness of not greater than 1 .mu.m wherein the gold-based plating layer has a surface roughness (Ra) of 2 .mu.m or less.

Abstract: A magneto-optical recording medium in which direct overwriting can be done by only modifying the power level and/or the pulse width of applied optical pulses, and without changing the direction of the bias magnetic field. The recording layer comprises first and second magnetic recording layers. The first magnetic layer is a rare-earth transition metal-amorphous alloy and has a perpendicular easy magnetization axis, a thickness of 10 to 200 nm, and a compensation temperature above room temperature. The second magnetic layer comprises an alloy of a first component of Co and/or Fe and a second component of a rare earth metal and/or a noble metal or an alloy of Co and at least one metal selected from Ti, Cr, Mn, Cu, Zn, Ga and Ge. The second magnetic layer is a material having an in-plane easy magnetization axis such that it has a magnetization axis parallel to the second magnetic layer if formed independently on a dielectric layer, the second magnetic layer having a thickness of not more than 3 nm.

Abstract: A [(Pt/Co/Pt)/Pd] multilayer thin film (40) provides improved perpendicular anisotropy and magnetic coercivity relative to Pt/Co multilayer thin films (10) without reducing the Kerr rotations provided by the component Pt/Co layers (44, 48, 46). [(Pt/Co/Pt)/Pd] multilayer thin films (40) comprise a substrate (26), an optional underlayer (110) including a crystallographically textured layer (114) of Pt and a crystallographically textured layer (116) of Pd, and several quadlayers (42) of Pt, Co, and Pd forming a periodic array (43) in the direction of the normal to the substrate (26). Each quadlayer (42) of the periodic array (43) typically comprises a first layer (44) of Pt atoms approximately one to two atomic monolayers thick, a layer (46) of Co between one and three atomic monolayers thick, a second layer (48) of Pt of substantially the same thickness as the first layer (44) of Pt, and a layer (50) of Pd that is at least as thick as the Pt layers.

Abstract: In an artificial superlattice magnetoresistance effect element in which two or more of magnetic thin film layers having different coercive forces are stacked with intervening of a non-magnetic film layer and resistance changes depending on directions of magnetization in adjacent magnetic thin film layers by utilizing differences in the coercive forces, an anisotropy magnetic field Hk is increased by reducing a thickness of a soft magnetic layer, anisotropy in the magnetic thin film layer is obtained by forming the magnetic thin film layer in a magnetic field to thus increase the Hk, a material having large Hk is used as a soft magnetic material for the soft magnetic layer, and further the anisotropy is obtained by reducing a pattern width into 1-30 .mu.m to thus increase the Hk, whereby the resistance change is achieved in the neighborhood of a zero magnetic field and thus no bias mechanism is required.

Abstract: Disclosed is a magneto-resistance effect element indicating a larger magneto-resistance effect at room temperature under impression of low magnetic field is obtained with the construction wherein the characteristics of artificial metallic lattice membrane are exploited.

Abstract: A magnetic material of at least two component parts arranged to have respective structures which mutually are not homogenous, the structure of one part cooperating with the structure of the other to assist the magnetostrictive behaviour of the material. The cooperation can be the structure of one part altering the atomic spacing of the other part. The alteration can be an increase from the usual atomic spacing. There can be contiguous component parts and the cooperation can be a pseudo free surface on at least one part or a reduced restriction of the local moment otherwise achieved by the contiguous component parts. A component can be at least partly an alloy and the alloy can have a ratio other than the usual one for the alloy. One of the components can be non-magnetic.

Abstract: Disclosed is an artificial multilayer in which ferromagnetic layers and nonmagnetic layers are alternatively laminated, wherein a uniaxial magnetic anisotropy is introduced into the ferromagnetic layers in a predetermined direction, thereby controlling the gradient of the relative change of resistivity to the change of external magnetic field. The uniaxial magnetic anisotropy is introduced into the ferromagnetic layers by applying a magnetic field along the surface of ferromagnetic layers during the formation thereof.

Abstract: A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.

Abstract: A thermal barrier coating for superalloy turbine engine vanes and blades that are exposed to high temperature gas is disclosed. The coating includes a ceramic layer applied to an Aluminide or MCrAlY bond coat by electron beam physical vapor deposition. The ceramic layer has a first portion having unstabilized porosity, a second portion, overlying the first portion, with stabilized porosity, and an outer portion wherein the pores are coated with a noble metal. The stabilized porosity portion along with the noble metal coating reduce the thermal conductivity of the ceramic layer. Stabilizing the porosity renders it more resistant to sintering densification at high temperatures.

Abstract: A lead frame material comprises a base plate consisting of copper or copper alloys, and a protective coating formed on the upper or the both surface of the base plate. The protective coating is composed of at least one metal selected from the group consisting of gold, gold alloy, silver, silver alloy, palladium and palladium alloy, and has a thickness of 10-500 angstrom. The protective coating is formed by means of vapor deposition. It is possible to form an intermediate coating of nickel or nickel alloys between the surface of the base plate and the protective coating, by means of vapor deposition or wet plating. The suitable thickness of the intermediate coating is within the range of 50-20000 angstrom.

Abstract: A rotary seal member, such as a gas turbine engine blade, is provided with an improved surface layer which has an elastic modulus matched with the elastic modulus of a substrate of the member. Also, the surface layer does not form a brittle intermetallic with the substrate at an intended operating temperature. In one form, the surface layer includes abrasive particles adapted to inhibit chemical reaction with the layer material. One specific example is a Ti-alloy substrate having a metallurgically bonded layer based on Nb, and including cubic boron nitride abrasive particles coated with cobalt entrapped in the layer.

Abstract: A method of combining a metal component and a base metal of an article to form a pattern of the article. The method comprises applying the metal component to a carrier, the metal component shaped like the pattern; placing the metal component against the base metal; and supplying heat such that the base metal and the metal component alloy.

Abstract: A reflecting film for use in an optical recording medium, which essentially consists of gold. The reflecting film also is capable of including a second reflecting layer essentially made of aluminum. An optical recording medium includes a recording film, the reflecting layer(s), an adhesive layer, and a cover layer for covering a surface of the adhesive layer, which are formed on one surface of a transparent substrate in this order.

Abstract: The present invention relates to a composite film. More particularly, the present invention relates to a composite compound film and composite compound multilayered film, comprising a metal, an alloy and/or an inorganic substance with an organic substance, which is excellent in decorative properties, protection and functionality. Methods applicable for forming such a composite compound film include the technique of evaporating a metal, an alloy, and/or an inorganic substance and an organic substance, simultaneously exciting the evaporated particles, and causing vapor-deposition in the state of ionized particles, neutral particles or radicals, and a method of sputtering, without excitation, etc.

Abstract: A ductile brazing material containing, by weight, 75-98% gold, 0.5-20% nickel, 0.5-6% vanadium, 0.25-5.9% molybdenum and, optionally chromium is disclosed for directly bonding ceramic/ceramic, ceramic/metal or metal/metal systems over an optimum temperature range.

Abstract: A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.

Abstract: A clad bonding wire for electrically connecting the bonding pad of a semiconductor device to an external lead comprises a core wire formed on one of high-purity Pd or a Pd alloy, high-purity Au or a Au alloy, high-purity Pt or a Pt alloy, and high-purity Ag or a Ag alloy, and a cladding cladding the core wire and formed of another one of the foregoing materials other than that forming the core wire. The wire-to-cladding diameter ratio D.sub.2 /D.sub.1 is in the range of 15% to 60% or 85% to 99. When the tip of the clad bonding wire is heated to form a ball, part of the core wire and part of the cladding in a neck formed behind the ball diffuse into each other to form an alloy of the materials forming the core wire and the cladding between the core wire and the cladding to enhance the mechanical strength of the neck beyond that of other portion of the clad bonding wire.

Abstract: Two pieces (42, 46) are Joined together by providing a gold bonding layer (44) overlying a nickel layer (40) on a first piece (42) to be bonded and providing a gold bonding layer (50) on a second piece (46) to be bonded. The gold layer (50) on the second piece (46) may optionally overlie a nickel layer (48) on the second piece (46). The gold layers (44, 50) are pressed together in a facing relation at a temperature of from about 125 C. to about 250 C. for a time sufficient to permit the layers (40, 44, 50, 46) to interdiffuse.

Abstract: Disclosed herein is a ceramic superconductor comprising a ceramic superconductive member, and a high-conductivity metal layer covering the ceramic superconductive member. At least one portion of the metal layer having low electrical conductivity or low thermal conductivity. Also disclosed is a method of manufacturing a ceramic superconductor, comprising the steps of filling a ceramic superconductor or a precursor thereof in a high-conductivity metal pipe, thereby forming a composite member, rolling the composite member into a ceramic superconductor element of a desired shape, which comprises a ceramic superconductive member and a high-conductivity metal layer covering the ceramic superconductive member, performing a predetermined heat treatment on the ceramic superconductor element, and alloying a predetermined portion of the high-conductivity metal layer, thereby rendering the portion less conductive either electrically or thermally.

Abstract: An improved thin film barrier with three layers where an interlayer is between barrier layers on each side, the interlayer serving as an atom energy sink. The improved barrier in the diffusion of Cu through Ni into Au where the barrier layers are Ni and the interlayer is Au, making a stack of AuNiAuNiCu, reduces the Cu present in the external Au layer after prolonged annealing in the vicinity of 0.2% atomic.

Abstract: This invention relates to a method for producing a smooth continuous and adherent pressure bonded or cold welded layer of a metal containing composite on a base or target material through the driving force of a pulsed laser. The method includes the steps of selecting a laser transparent substrate, applying thereto a thin laser absorptive polymeric film characterized by a high optical coefficient of absorption to the wavelength of said laser, applying the metal containing composite to the absorptive polymeric film, and placing the base or target material in close proximity to said composite. The composite is a multilayered composite comprising laser absorptive polymer, gold, nickel and gold-flash, and the pulsed laser energy is directed through the transparent substrate toward said composite and is absorbed by the polymeric film causing heating and vaporization thereof while leaving portions of the polymeric film unvaporized.

Abstract: The present invention is designed to improve a method of deposition of coatings upon a metal or alloy substrate. The coating comprises aluminum or aluminide material interdiffused with a transition metal deposited by chemical vapor deposition which utilizes organometallic precursors to facilitate the deposition of the transition metal. The improvement permits better control of the process and permits coating of complex substrates including those with internal passages or holes. In the embodiment involving a first deposition of aluminum or aluminide coating, applicants have achieved deposition thereon of the transition metal. Platinum is the preferred transition metal to be used in the subject method. A product is taught. This product can be a component from a gas turbine engine.

Abstract: A ductile brazing material containing gold, nickel, vanadium and, optionally chromium or molybdenum is disclosed for directly bonding ceramic to ceramic or ceramic to metal over an optimum temperature range.

Abstract: A method of producing durable, structurally strong, investment quality gold articles of high troy weight, excellent color and revealing properties and the method of their production are described, including the formation of a structural base from an alloy containing not over 8.33% of a strengthening material such as chromium, titanium or vanadium, which can provide the required strength and hardness in low concentrations, and overlayment or "overarching" with a gold alloy coating in a manner such that both alloys are visible. The structural base provides the support, strength and resistance to corrosion in articles of various shapes, while retaining a high degree of gold purity.

Abstract: A metal electrode formed on an oxide superconductor for electric connection to the oxide superconductor, includes a first layer of Ag in direct contact with the oxide superconductor, and a second layer formed on the first layer. The second layer is formed of noble metal excluding Ag.The metal electrode can be formed by forming a first layer of Ag to cover a whole surface of the oxide superconductor layer, and forming a second layer of noble metal excluding Ag, to cover a whole surface of the first layer, thereby to form a double metal layer, and patterning the double metal layer so as to form a metal electrode composed of the double metal layer.

Abstract: There has been provided an electrical component having resistance to oxidation and wear. The component has a copper or copper alloy substrate coated with a relatively thick layer of silver. A thin layer of gold may be deposited on the external surface of the silver coating layer to improve oxidation resistance, lubricity and to serve as a diffusion barrier.

Abstract: Gold, copper, silver, palladium or aluminum and their alloys, but preferably gold or gold alloy, which may be in the form of a wire, has deposited thereon or contained within the wire, a material such as metals or metal alloys which diffuse into the gold or into the other listed metals. With the passage of time and exposure to temperature the deposited metal or metal alloy continues to diffuse into the gold forming intermetallics with the gold and thereby causing the resistivity of the gold to increase and causing the gold to become progressively more brittle until such time as the gold wire ruptures at a stress point. At a given temperature, the elapsed time until rupture takes place depends upon the metal or metal alloys deposited on or contained within the gold. Lead, indium, gallium, tin, bismuth and aluminum and the alloys of these metals diffuse into and form intermetallics with the gold.

Abstract: The present invention provides a process for the electroless plating of easily reducible metals onto ultrafine, usually inert, particles. Such plating is achieved through careful and accurate control of such parameters as the feed rates of the various solutions, the control of pH of the solution, the temperature, pressure and the rate of agitation of the solution in which the plating is taking place. The plated ultrafine composite particles and the powders made from the particles produced by the process are also a part of the invention. There is also provided a metal article of manufacture consisting of a metal such as copper, silver, gold, ruthenium, rhodium, palladium, osmium and platinum with a plurality of spherical shaped ultrafine particles with a diameter of less than about 10 microns dispersed substantially evenly through the metal article.

Abstract: Nickel or cobalt diffusion is suppressed in ceramic articles having a nickel or cobalt underlayer followed by a gold overlayer, by heat-treating the article in a reducing atmosphere at a temperature of at least about 650.degree. C. and subsequently depositing a final gold layer. By suppressing the diffusion of nickel or cobalt, the adhesion of hermetic lids attached thereto by soldering is improved.

Abstract: A multilayer wiring substrate which includes a glass ceramic section, a wiring layer section having a plurality of wiring layers electrically insulated from each other by a polyimide material, and an intermediate layer made of an inorganic material and arranged between the ceramic section and the wiring layer section.

Abstract: A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit pattterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective conductive layers or material.

Abstract: The present invention relates to a composite film. More particularly, the present invention relates to a composite compound film and composite compound multilayered film, comprising a metal, an alloy and/or an inorganic substance with an organic substance, which is excellent in decorative properties, protection and functionality. Methods applicable for forming such a composite compound film include the technique of evaporating a metal, an alloy, and/or an organic substance and an organic substance, simultaneously exciting the evaporated particles, and causing vapor-deposition in the state of ionized particles, neutral particles or radicals, and a method of sputtering, without excitation, etc.

Abstract: A tool comprising a blank and shank, bonded at a low temperature through a bonding layer of gold formed by thermocompression bonding between the blank and shank is provided which can be used at a high temperature independently of the temperature at which the blank and shank were bonded.

Abstract: In an electric contact having a Cu-based layer, a Ni-based layer formed on the Cu-based layer, and a Pd-based layer formed on the Ni-based layer, the Ni-based layer having a thickness of at least 0.8 .mu.m is so formed as to include a noncrystal nickel alloy layer having a thickness of at least 0.08 .mu.m, in order to reduce the thickness of the Pd-based layer down to about 0.08 .mu.m, that is, the cost of the contact without deteriorating the contact durability, as compared with a 0.6 to 2 .mu.m thick prior-art Pd-based layer.

Abstract: Disclosed herein is a process for the electrodepositing multiple layers of fine gold and bright nickel upon a substrate layer. Fine gold is defined as being 99.99% pure. By insulating bright nickel between layers of fine gold, the galvanic effect is substantially reduced. This process is uniquely suited to jewelry products, where the substrate layers are ordinarily composed of brass.

Abstract: A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved color consistency and increased ductility.

Abstract: Gold-plated electronic components are disclosed, as well as a process for producing the same, wherein an alloy of nickel and cobalt or an alloy containing these elements as essential ingredients is used as an undercoat for the gold-plated layer.