Abstract: An infrared radiation reflecting substrate, having deposited thereon a first layer formed from a metal or an alloy, and a second layer deposited on the first layer and consisting of a solar radiation absorbing amorphous material, such as amorphous carbon. The substrate can be formed from an infrared radiation reflecting layer deposited on a primary substrate.

Abstract: Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.

Abstract: A very thin gold coating (e.g., 270 to 3,500 Angstroms) is vapor deposited on the surface of a nickel substrate. A short radiant energy pulse from a laser having a pulse length of about 130 nanoseconds is directed at the coated surface to melt portions of the gold coating and the nickel substrate therebelow. The energy pulse is removed to permit the melted material to resolidify as an alloy with a high concentration of gold at the surface thereof.

Abstract: Case for a semiconductor component, including at least two parts, one of the parts being a cap, at least the cap being formed of a material having low hydrogen permeability and a weak catalytic effect for an oxyhydrogen gas reaction.

Abstract: Electrical contact tape having a base portion of nickel, copper or nickel-copper alloy and an overlay of metallic material on said base portion is improved by utilizing for such overlay a gold-nickel alloy of which the precentage by weight of nickel is in the range of from about 1.8% to 2.3%, the balance of the alloy being gold with or without one or more other metals other than nickel in trace amounts insufficient to produce precipitation thereof out of solution in the gold. Nibs of such tape are bonded to a leaf spring to form an electromechanical junction therewith, the gold-nickel alloy overlay of the nib being on its side away from the spring to provide an improved electrical contact surface for the spring contact assembly formed by such nib and spring.

Abstract: This invention relates to brazing alloys for use primarily in jewellery manufacture having compositions consisting of 30 to 80 weight % gold, 0 to 20 weight % silver, 20 to 60 weight % copper, 5 to 20 weight % zinc, 0 to 5.0.% of a group VIII metal as a grain refiner for gold, and 0.5 to 3.0 weight % indium. These alloys have desirable properties, particularly in the 14 karat gold range, without the health hazards associated with the use of cadmium.

Abstract: Gold-plated electronic components are disclosed, as well as a process for producing the same, wherein an alloy of nickel and cobalt or an alloy containing these elements as essential ingredients is used as an undercoat for the gold-plated layer.

Abstract: A molybdenum disc suitable for the use as a semiconductor. The disc has a thickness of about 0.5 to several mm and is coated with a noble metal that is applied to the molybdenum in a layer thickness of 0.02.mu. via an intermediate layer of chromium having a layer thickness of 0.5 to 10.0.mu..

Abstract: The present invention relates to a stratified, corrosion-resistant complex comprising a metal substrate and an outer layer made of a noble material. According to the invention the substrate is composed of an alloy having, by weight at least 45% nickel, at least 7% chromium, and at least 7% molybdenum, all the other components of the substrate representing at most 15% of the alloy.The invention is particularly useful for making the backs of watch cases.

Abstract: A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.

Abstract: A thin film of magnetic recording material is sputter deposited over a base layer of gold and tantalum on a polished substrate. A protective layer of gold and tantalum is deposited overlaying the magnetic recording film. A solid lubricant layer such as carbon, preferably in the form of graphite, gold, silver, tin, molybdenum disulfide, and tungsten disulfide is sputter deposited or ion plated over the protective layer to reduce wear. The recording contacting portion of the recording head is similarly coated with a solid lubricant material. Other suitable protective materials include tantalum, niobium, tungsten and nitrides and carbides of such metals. In a preferred method for making such recording members, the layers are successively sputter deposited in an evacuated sputter chamber, whereby the recording layers and protective coatings are formed in a continuous process requiring only one pump down.

Abstract: A method of electrodepositing a gold alloy layer having improved corrosion protection is disclosed. Prior to the gold layer an underlayer of ductile, low-stress nickel is electrodeposited from a solution containing ortho-formyl benzene sulfonic acid and perfluorocyclohexyl potassium sulfonate.

Abstract: Disclosed is a silver-cadmium-nickel alloy coating including small but effective amounts of cadmium and nickel, namely, at least, about 6 weight percent cadmium and 0.5 weight percent nickel, to impart a gold-color to the coating substantially equivalent to that of a 12-16 karat gold layer of similar thickness. The gold-colored alloy coating can replace a 12 karat gold inner layer in a duplex coating having a 22 karat gold outer layer, and thereby provide substantial savings in gold.A highly alkaline aqueous cyanide plating bath is employed in the electroplating process in conjunction with increased current density to ensure that a critical minimum amount of cadmium is deposited in the alloy coating.

Abstract: The invention relates to a process of deposition of a coating of a gold compound on a solid substrate. In a vacuum chamber (1), the substrate is fixed on a first substrate electrode (2). A composite target (5) essentially consists of gold and at least one of the metal compounds, such as nitride, carbide and boride of the metals of group IV b of the periodic classification of elements and tantalum. A high-purity argon atmosphere at pressure ranging between 4.times.10.sup.-4 and 3.times.10.sup.-2 Torr is then established in the chamber. The deposition of the coating is then carried out by ionic deposition or evaporation in vapor phase at a given rate. The invention may find application to coat articles of jewelry or of watch cases.

Abstract: A method of bonding a graphite fiber reinforced glass matrix composite to a metal structure comprising depositing a layer of eutectic alloy metal component to the bond surfaces of the metal and composite followed by placing the thus treated bond surfaces of the metal and composite together with a layer of eutectic alloy containing such metal therebetween. The metal-bond-composite is then heated to melt the alloy and bond the composite to the metal. Articles formed by such a process are also described. The method has particular utility in bonding cooling channel containing metal bases to graphite-glass composite laser mirrors.

Abstract: This invention relates to an alloy for bonding gold-plated substrates together. In a more specific aspect, it relates to a braze alloy for bonding gold-plated lids to gold-plated seal rings or gold-plated Kovar substrates. In another aspect, it deals with a method for bonding gold-plated lids to gold-plated Kovar substrates.

Abstract: A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.

Abstract: A heat-reflecting panel having a neutral-color outer appearance has a transparent film support, such as a glass pane, an interference film having a refractive index >2 disposed on the support, a heat reflecting gold film of a thickness of 70-105 A disposed on the side of the interference film remote from the support, and neutralization film formed from chromium, iron, nickel, titanium or alloys thereof, or an alloy of chromium, aluminium and iron, the neutralization film disposed on the side of the gold film remote from the interference film.

Abstract: In a heat wave-reflective or electrically conductive laminated structure composed of(A) a shaped solid substrate,(B) a transparent thin layer having a high refractive index in contact with one or both surfaces of a layer (C) below, wherein when the layer (B) is provided on both surfaces of the layer (C), it may, at one surface, be a transparent thin layer (B) whose refractive index is not high,(C) a transparent heat wave-reflective thin layer of an electrically conductive metal in contact with the substrate (A) or with the transparent thin layer (B), and(D) optionally, a transparent top layer; the improvement wherein said layer (C) is a layer composed of at least about 50% by weight of Ag, about 3 to about 30% by weight of Au and about 0.5 to about 30% of Cu, the amounts being based on the total weight of Ag, Au and Cu.

Abstract: Lead frame of sufficient mechanical strength, lowered cost, excellent plating affinity and enhanced anticorrosion is obtained through increased contents of P and Cu and remarkably reduced content of Ni or Cr even without employment of the preparative Ni strike plating necessitated in the prior art.

Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a substrate of a non-catalytic metal or non-catalytic alloy. The process comprises contacting the surface of the non-catalytic substrate with a promotor composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with an electroless plating bath comprising hypophosphite for metallic build-up.

Abstract: A semiconductor ion emitter for a mass spectrometer, comprises an electrode having semiconductor whiskers provided on the conductive surface of a base. A process for manufacturing such semiconductor ion emitter, includes steps of evaporating gold onto a wire having a diameter of about 60 .mu.m, preheating the coated wire, and supplying a gas containing the semiconductor for growth of the whiskers on the gold plated wire. An apparatus for such process comprises a vacuum vessel for enclosing the wire, means for controllably heating the wire and means for controllably supplying a gas containing the semiconductor into the vacuum vessel.

Abstract: Gold alloy wire for the production of jewelry, especially jewelry chains, is made of a gold solder containing nucleus and a jacket of a gold alloy wherein the solder containing nucleus has a core of fine gold which is surrounded by a layer of a ductile, lower melting gold solder alloy.

Abstract: The interdiffusion at the interface between a metallic-type conductor or semiconductor and a second metallic-type conductor or semiconductor in intimate contact therewith due to elevated temperatures is reduced by subjecting a surface of at least one of the materials when at an elevated temperature to a gas which contains at least one component which changes the surface potential and work function of the surface which is subjected to the gas in a direction according to the relative electronegativities of the materials.

Abstract: A method of applying solder to gold by applying a gold-tin intermediate layer to the gold and applying the solder over at least a portion of the intermediate layer. The method can be employed to produce a printed circuit unit composed of a printed circuit board, at least one gold member mounted on the board, a gold-tin intermediate layer bonded to at least a portion of the gold member, and solder bonded onto the intermediate layer.

Abstract: A laminated conductor includes a lower thin film of nickel-X alloy or pseudo alloy deposited upon a substrate containing silicon or upon a substrate intended for use as a magnetic bubble storage device. Upon the film of nickel-X alloy, a thicker film of gold is deposited as the conductive portion of the conductor. On the upper surface of the gold layer is deposited a thin film of nickel-X alloy. Failure of the conductor because of electromigration is reduced dramatically as compared with use of molybdenum instead of nickel in the laminated structure. The nonmagnetic nickel-X alloy does not interfere with magnetic fields or produce unwanted magnetic fields.

Abstract: Zirconium-base alloy channels, fuel cladding tubes and other components are made resistant to accelerated pustular corrosion in a boiling water reactor environment by coating them with a small amount of a suitable electronically conducting material.

Abstract: An externally ornamental golden color part such as a wrist watch case, band or bezel comprising a thermal resistance substrate and a titanium nitride coating deposited on said substrate and including in a portion of the thickness of said coating at least one member selected from the group comprising Al, Si, V, Cr, Fe, Co, Ni, Cu, Zn, Ge, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Ti, Hf, Ta, W, Ir, Pt and Au.

Abstract: A multilayered thin film structure comprising layers of resistive and conductive materials on a substrate, said layers including tantalum nitride, palladium and gold. A layer of titanium nitride, is used between the tantalum nitride and palladium layers to act as an adhesive layer, to prevent undercutting during etching, and to allow all metal depositing to be performed during one step.

Abstract: A new and improved magnetic recording disk can be prepared by interposing between an aluminum substrate disk and a recording alloy layer a support layer located on the substrate disk and a shield layer located between the support layer and the recording layer. The support layer is a hard, semi-crystalline nickel alloy layer having magnetic properties which is of such a character that if it is contacted by a recording head during the use of the disk it will tend to form a powder which will not interfere with subsequent use of the disk or recording head. The shield layer is of a nonmagnetic metal and serves to reflect signals from the recording head so that they do not reach the support layer.

Abstract: A solid state laser rod and a mount through which heat is dissipated from the rod are joined together at a bond comprised of a reflective layer on the surface of the rod, a barrier layer over the reflective layer, and a solder layer between the barrier layer and the mount. The reflective layer may be applied by sputter or other deposition procedures and is highly reflective in the region of the spectrum at which the laser operates, thus insuring optimum efficiency for the rod. The barrier layer may be applied to the reflective layer by the same deposition procedure, and it is impervious to the solder so that the solder does not penetrate it and scavenge the reflective layer. The solder should have a low melting point so as to avoid setting up excessive mechanical stresses in the rod when the solder solidifies. Both the mount and the barrier layer may be covered with a wetting layer prior to soldering to achieve better adhesion of the solder.

Abstract: The disclosure relates to an improved sputter target for use in the deposition of hard coatings. An exemplary target is given wherein titanium diboride is brazed to a tantalum backing plate using a gold-palladium-nickel braze alloy.

Abstract: High stability thin film resistors are made from an alloy comprising selected portions of nickel, chromium, and gold selected in a ratio to provide the desired temperature coefficient of resistance (TCR). The resistors are made by co-depositing gold with the nickel chromium alloy by a flash evaporation process. The evaporation process is carried out by feeding a nickel chromium wire, having a gold wire extending therealong to provide the desired composition, onto a heated tungsten strip within a vacuum system with substrates disposed in a position to obtain uniform deposition of the evaporated material thereon.

Abstract: A composite superconductor having both filamentary and film conductors for carrying the pure and impure components of direct current, respectively, or for alternating current, is disclosed, together with a method of making it, and a preferred arrangement for its use in high power transmission lines.

Abstract: Uniform gold films having an intense pure gold color and superior abrasion and adhesion properties are prepared by first depositing a gold film on a nonmetallic substrate by a known method, preferably electroless deposition, then depositing a silver film over the gold by electroless deposition.

Abstract: An electroless gold plating process in which the workpiece to be plated has a nickel coating, the process resulting in formation of a nickel/gold alloy that exhibits the majority of the physical characteristics exhibited by pure gold plating.

Abstract: The material is applied to a substrate, for example, terminal bronze, brass, or the like, and comprises, preferably, 50 to 55% gold, 24 to 28% palladium, 15 to 20% silver, 2.5 to 3% tin, 0.08 to 0.15% iridium, 0.08 to 0.15% ruthenium, 0.1 to 0.3% copper and 0.6 to 1% indium.

Abstract: A contact for a silicon device comprises a layer of gold on the silicon, and a layer of cobalt on the gold layer. The contact is made by depositing gold on the silicon, depositing cobalt on the gold and heating the structure at a temperature between about 300.degree. and about 370.degree. C in a reducing gas atmosphere.

Abstract: The invention relates to a process for heat diffusion of an electrodeposited gold layer on a chromium surface by simultaneously depassivating and cathodically gold plating a chromium surface by immersion and electroplating into an acid gold bath solution and diffusing the gold-chromium coating by heat to form a gold-chromium alloy which is abrasion resistant and which has a hardness substantially greater than that of a gold plated coating on a chromium surface which has not been heat diffused.