Abstract: The invention consists of a process for electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.

Abstract: The present invention provides novel magnetic recording media wherein the magnetic recording material is an alloy consisting essentially of a major amount of cobalt and either or both of a minor amount of a nonmagnetic element soluble in cobalt which reduces the face-centered cubic phase, or a minor amount of another element which increases the coercive force of the alloy by isolating grain boundaries. The presence of either or both of these additives increases the coercive force of the alloy with attendant improvement in digital recording performance.

Abstract: An electrically conductive composite material is formed by dispersing in a matrix metal the other metal which is not solid soluble with the matrix metal. The other metal is finely divided to an extent of not excessively lowering the conductivity and is mixed in the matrix metal in a particle amount with which respective particles keep a mutual distance effective to strengthen the composite material, whereby the material is sufficiently improved in the mechanical strength and wear resistance and remarkably reduced in the high temperature deformation. Such conductive composite material can be obtained through a melt atomization.

Abstract: An integral solder back contact is provided over a semiconductor circuit. The solder contact includes a pair of layers which form an alloy at elevated temperatures. A semiconductor device having the integral solder back contact is mounted on the carrier and disposed at an elevated temperature which causes one of the layers to melt. The material of the other layer is dissolved in the melted layer until such melted layer has a sufficient amount of the material of the other layer dissolved therein to form an alloy which hardens. After the alloy hardens the circuit is firmly bonded to the carrier even while the carrier is exposed to the elevated temperature.

Abstract: The invention consists of a process for pulse electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85.degree. C. and 85% R.H.

Abstract: A direct (metal-metal compound eutectic) bond process is improved by disposing a eutectic/substrate-wetting enhancement layer on the substrate prior to performing the direct bond process to bond a metal foil to the substrate. Where the metal is copper, the direct bond process is rendered more effective than prior art direct bond processes on alumina and beryllia and makes the direct bond process effective on tungsten, molybdenum and aluminum nitride, all of which were unusable with the prior art direct bond copper process. A variety of new, useful structures may be produced using this process. The eutectic/substrate-wetting enhancement layer is preferably a noble-like metal or includes a noble-like metal such as platinum, palladium and gold.

Abstract: Structurally strong, investment quality gold articles of high troy weight, excellent color and revealing properties and the method of their production are described, including the formation of a structural base from an alloy containing not over 8% of a strengthening material such as chromium, titanium or vanadium, which can provide the required strength and hardness in low concentrations, and overlayment or "overaching" with a gold alloy coating in a manner such that both alloys are visible. The structural base provides the support, strength and resistance to corrosion in articles of various shapes, while retaining a high degree of gold fineness.

Abstract: Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, cooper and/or aluminum. Directly on the base metallurgy is a layer of cobalt. The structure may also include a layer of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.

Abstract: A storage medium comprising a multilayer system with at least one magnetic layer, of magneto-optical storage material, and at least one reflector layer, with an index of refraction n<1, which is at least as thick as one of the magnetic layers. The maximum thickness of each of the magnetic layers is inversely proportional to its absorption coefficient, K. In the magneto-optical multilayer system of the present invention, a large Kerr angle O.sub.K is obtained.

Abstract: The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.

Abstract: A musical instrument (for example, a flute) or a musical instrument segment (for example, a flute headjoint) having tubing made of a mechanically unitary laminated metal tube which has at least one layer of precious metal alloy bonded to another layer of metal alloy.

Abstract: A dental crown restoration which comprises a metal coping and a relatively thick outer coating of a ceramic dental veneer. The metal coping is composed of a lamination of a low fusing temperature precious metal component substantially or entirely of gold and a high-fusing temperature precious metal component. The high fusing component is formed from three layers with one layer composed of from 90 to 100% palladium bounded on both sides by a gold based layer.

Abstract: Coating of crystalline metals (Ag, Au, Cu, Al) are formed on amorphous melic alloys (glassy metals) by cathode magnetron sputtering. The process can be used to produce new products such as copper coated amorphous metallic alloy wires for torpedo controls, shielding materials for electromagnetic waves, and anticorrosion coatings for Fe-metalloid magnetostrictive elements.

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Abstract: A multiple-layered metallic article useful for example, as costume jewelry having an intermediate "brightening layer" of bronze. A barrier layer selected from the group comprising palladium, tin, tin/zinc, rhodium, or platinum is disposed between the bronze "brightening layer" and a "top coat" layer to avoid migration of the copper component in the bronze layer to the outer surface of the article which, if left unimpeded eventually would result in a tarnishing effect to the article. As a result of the bronze intermediate layer, the article is hypo-allergenic with respect to those people having a skin sensitivity to nickel-plated or nickel-underplated metallic articles.

Abstract: A surface for providing an electrically conductive surface coating on an electrical contact body. The process resulting in such a coating comprises the steps of depositing upon the body surface in sequence, (a) a nickel layer, (b) a first gold layer, (c) a palladium/nickel alloy layer which may be an alloy containing nickel up to a proportion of 50% by weight, and (d) a second gold layer. All the layers may be deposited by an electrodeposition process.The resulting surface coating has excellent corrosion and wear resistance properties.

Abstract: An article of jewelry of platinum and fine gold of the type wherein the two metals are connected to one another by applying the fine gold in the solid state on the platinum and heating the fine gold to its melting temperature. The article of jewelry includes area portions of thin sheets of fine gold and reinforcements of platinum bordering the area portions of fine gold.

Abstract: A sputtered titanium oxynitride film is disclosed, as well as a low emissivity coated article comprising a titanium oxynitride film in combination with a highly infrared reflective metal film, such as silver.

Abstract: A lid or cover for a ceramic enclosure is formed of a substrate of an iron-based alloy, e.g., Kovar, alternately plated and coated with electrolytic nickel and electroless nickel, with an outer gold electroplate. The alternate electroplate and electroless nickel layers render the lid highly corrosion resistant without the need for an expensive, unrecoverable buried gold layer.

Abstract: A magneto-optical recording medium comprises a transparent substrate and a magneto-optical recording layer overlaid on the transparent substrate. The magneto-optical recording layer is formed by alternately overlaying a plurality of thin layers containing a rare earth metal-transition metal alloy for magneto-optical recording, and a plurality of thin layers containing at least one metal selected from the group consisting of gold, silver, lead, magnesium, copper, and iridium which are solid solution non-formable metals.

Abstract: In construction of a Ti core type clad material for ornamental applications presence of one or more intermediate layers made of Cr and/or Mo well deters evolvement of intermetallic compound at the border between core and sheath, thereby significantly improving bonding strength of the product.

Abstract: A technique for metallizing a substrate while providing stress relief for the metallization on the substrate is disclosed. Chrome conductive metallization (22) is deposited on a top surface (21) of an insulating glass substrate (20). An interior gold conductive metallization (23) is deposited on the chrome, and metallization (24) having a substantial nickel composition is deposited on the gold. Subsequently, an additional outer gold metallization (25) is provided on the nickel, and solder is provided on the additional gold metallization. Prior to the application of solder to the outer gold layer 25, the metallization layers are subjected to anodic bonding temperatures and voltage potentials. The gold layer between the nickel and chrome layers diffuses along the grain boundaries of the nickel and chrome layers, thus reducing the ability to transmit stress through these metallizations induced by the solder.

Abstract: The inability of conventional adhesion/diffusion barrier Ti-TiN laminates to secure a narrow linewidth electrodeposited gold layer to a silicon structure and prevent unwanted gold diffusion during anneal cycles at temperatures greater than 370.degree. C. for substantial periods of time is overcome by the addition of a medium thickness (.gtoreq.1,500.ANG.) layer of tungsten over the exposed silicon prior to formation of the titanium/titanium nitride laminate structure.

Abstract: A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.

Abstract: The article is provided with a coating resisting wear and corrosion, such coating being for the most part made of a precious metal or alloy of a precious metal, for example gold or an alloy containing gold.The coating is made up of a first layer of such precious metal or alloy thereof comprising discrete inclusions of a metallic compound such as titanium nitride. These inclusions are deposited along with the precious metal in vapor phase and distributed in a substantially homogeneous manner through the entire thickness of the layer, said thickness being equal to or greater than 0.4 .mu.m. A second layer of precious metal or alloy thereof is located between the article and said first layer.The article may be a watch case, a bracelet link or a piece of jewelry.

Abstract: In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the substrate, the bonding of the gold alloy to the substrate and to the gold coating of the cavity in a device package is improved. Scrubbing of the jumper chip on the gold coating of the cavity is obviated. The additional gold layers applied to the gold alloy are distinct and visible on a photograph of a cross-section of the jumper chip.

Abstract: A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.

Abstract: The invention is directed to a substrate for manufacturing single crystal thin films wherein the substrate is a replica pattern of a monocrystalline or single crystal cleavage plane. Such replica pattern may be formed by pressing a material in a softened state against the cleavage plane of the single crystal, with subsequent hardening, and also, by subjecting the single crystal cleavage plane to vapor deposition or plating, and thereafter removing the formed layer from the single crystal cleavage plane.

Abstract: Methods are disclosed for the manufacture of optical conductive transparent windows and coatings having high transparency over a wide bandwidth combined with a large acceptance angle of incidence. Particulars for making windows and coatings with gold films of high transparency and low sheet resistance using specified nucleating and barrier layers are given. Examples include windows and coatings constructed for operation in the infrared and ultraviolet.

Abstract: A magneto optical recording medium comprising laminating a reflective layer, a dielectric undercoat layer and a hexagonal magnetoplumbite-type metal oxide magnetic layer on a substrate in order, characterized by that said magnetic layer is made an excellently C axis - orientated perpendicular magnetic film by putting the crystal misfit between said reflective layer and said dielectric undercoat layer formed thereon within .+-.30% and the crystal misfit between said dielectric undercoat layer and said hexagonal magnetoplumbite -type metal oxide magnetic layer formed thereon within .+-.30%, and thus various characteristics are widely improved.

Abstract: A magnetic recording member with a thin metallic antifriction protection overcoat formed over a magnetic layer. The overcoat is soft ductile and low stress and includes a metal selected from the group consisting of palladium, platinum, silver, gold, cadmium, indium, tin and lead or an alloy of one or more of these metals, and may include less than 20 percent by weight of antimony, bismuth, thallium or copper to improve wear resistance or impede corrosion. In one preferred embodiment the antifriction overcoat is an alloy of silver, lead and antimony formed with N layers where 10.ltoreq.N.ltoreq.40. The even layers are richer in a selected metal of the alloy than the odd layers in order to produce adjacent layers with different lattice or microstructural and associated mechanical properties so that there tends to be parallel shear between adjacent layers under shearing stress of head impact or friction.

Abstract: A ceramic package for semiconductor devices comprises a ceramic base, a gold-plated die-bonding area formed on the base for mounting thereon a semiconductor die, a gold-plated wire-bonding area, and a plurality of outerlead portions for electrically connecting the package to external printed circuits or the like. Cobalt or cobalt alloy, instead of nickel, is plated on the die-bonding and wire-bonding areas as underlayers of the gold-plated layers. Cobalt can also be plated on the outerlead portions, which may or may not have gold plated thereon.

Abstract: Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second layer of gold is electroplated onto the second layer of nickel. The resultant plated parts exhibit higher salt atmosphere corrosion resistance than parts plated with a single nickel-gold set. Other metals can be used as the plating layers.

Abstract: The bond strength between a silicon carbide substrate and a metal layer comprised of a series of metal films is improved without detrimentally affecting other properties of such a device by interposing a layer of silicon, Si.sub.2 Mo or mixtures thereof between the substrate and the first metal film in the layer which is preferably Ti, Zr or Hf.

Abstract: Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of copper to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. A copper preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing material to add Ni and copper to the melt.

Abstract: This invention relates to electrical devices in which the electrical contact areas are plated with a nickel/indium alloy comprising 0.1-9 percent indium, balance nickel. The nickel/indium alloy layer may be coated with a precious metal such as gold.

Abstract: A surface metal layer composed mainly of gold is formed on the surface of a metallized metal layer on an insulating substrate through a first intermediate metal layer composed of a nickel/boron alloy and a second intermediate metal layer composed of a nickel/phosphorus alloy. In this surface layer, appearance of stains or occurrence of blistering is prevented, and this surface metal layer is excellent in appearance characteristics, electric characteristics and durability.

Abstract: A process for metal plating a stainless steel comprising the first step of treating the stainless steel by a cathode electrolysis in an aqueous solution containing free HCl in an amount at least 30 g/l and at least one species of Ni and Co in an amount at least 0.1 g/l; the second step of metal plating the same by Ni or a Ni alloy in a weakly acidic Ni plating bath; and the third step of subsequently plating the same by a noble metal, Cu or an alloy thereof.

Abstract: Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second layer of gold is electroplated onto the second layer of nickel. The resultant plated parts exhibit higher salt atmosphere corrosion resistance than parts plated with a single nickel-gold set. Other metals can be used as the plating layers.

Abstract: A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.

Abstract: The formation of metal oxide contaminants on the surfaces of thin metal films by out-diffusion primarily through the grain boundaries thereof of metal from an underlayer is inhibited by conducting heat cycling of such layered metal structures in an ambient gas mixture composed of inert gas, such as nitrogen, containing a sufficient amount of active gas, such as, hydrogen, carbon monoxide, or the like, substantially to suppress such out-diffusion.

Abstract: To prevent interference from secondary electron emission, a base member, as of a waveguide, which in operation is exposed to high frequency electric fields is provided with a coating comprising a rough surface layer having a thickness less than its skin depth, and a further layer of high electrical conductivity between said rough layer and said base member, the thickness of said further layer being substantially larger than its skin depth. The rough layer preferably has a ratio of mean depth to mean pitch of its random corrugations substantially larger than 1:2.

Abstract: Leveling of amorphous nickel-phosphorus electroplating is achieved by the combined synergistic action of a class II brightener and an organic acid having the formulaR--COOHwherein R is hydrogen, alkyl having 1-5 carbon atoms, NH.sub.2 CH.sub.2 --, CH.sub.3 CHOH--, HOCH.sub.2 --, or ClCH.sub.2 --. The bright, leveled, amorphous nickel-phosphorus coating may be made brighter by overplating with chromium, or other metals, to produce an object (such as cutlery, watch bezels and the like) having the desired properties.

Abstract: A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

Abstract: An ornamental composite material has a covering of an Ni-, Au-, Ag- or Cu-base alloy, and a core of a mineral powder aggregate. A layer of a metal different from the metals of the alloy of the covering can be clad on the inner surface of the covering as needed. The ornamental composite material is preferably used for various parts of a spectacle frame.

Abstract: Composite materials comprising, inter alia, a dispersion strengthened platinum-palladium-dispersion strengthened platinum sandwich have comparable properties of strength, ductility and electrical conductivity to the rhodium-platinum alloys used for fibre-glass bushings in the glass industry.

Abstract: Shielding means comprising a non-conductive base material having thereon a combined electrolessly-deposited metal layer of copper over lain with a second layer.

Abstract: A process for producing a composite material comprising a base having a nickel surface and a gold layer metallurgically bonded to the nickel of the base and having sufficient nickel to increase the hardness of the gold layer but insufficient to significantly destroy the distinctive color of the gold layer comprises depositing the gold layer on the nickel and annealing the composite structure to provide the metallurgical bond between the nickel and gold and to interdiffuse said metals, and the composite structure obtained by said process. The composite material is particularly useful as a coinage structure.

Abstract: A minimal corrosion resistor structure and deposition technique for superconductive circuits, with mutually protective niobium oxide passivation ring, gold corrosion barrier film and titanium resistive layer. Niobium has an intrinsic oxide of Nb.sub.2 O.sub.5, which must be removed from a contact area designated by an opening in photoresist; the development process leaves a photoresist overhang. The corrosion barrier film is deposited through the opening. The resistive metal layer is deposited over the corrosion barrier film through the same opening. The gold corrosion barrier film prevents the titanium resistive metal layer from making corrosive contact with the niobium. The titanium resistive metal layer encapsulates the gold corrosion barrier film to prevent diffusion between the gold and further layers to be deposited subsequently. It would normally be possible for the titanium to spill over the gold and make corrosive intimate contact with the niobium; a self-alignment technique prevents such contact.

Abstract: A thin film of magnetic recording material is sputter deposited over a base layer of gold and tantalum on a polished substrate. A protective layer of gold and tantalum is deposited overlaying the magnetic recording film. A solid lubricant layer such as carbon, preferably in the form of graphite, gold, silver, tin, molybdenum disulfide, and tungsten disulfide is sputter deposited or ion plated over the protective layer to reduce wear. The recording contacting portion of the recording head is similarly coated with a solid lubricant material. Other suitable protective materials include tantalum, niobium, tungsten and nitrides and carbides of such metals. In a preferred method for making such recording members, the layers are successively sputter deposited in an evacuated sputter chamber, whereby the recording layers and protective coatings are formed in a continuous process requiring only one pump down.