Abstract: Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons.

Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewelry, spectacle frames and metal buttons.

Abstract: A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.

Abstract: A lead frame for a semiconductor device includes a sheet-like body and a Pd coating plated on the sheet-like body. The Pd coating includes Ni in an amount of not more than 2%. In another embodiment, the Pd coating includes Cu in an amount of not more than 0.12%. By virtue of limiting the amount of Ni or Cu to these particular levels, the solderability of the lead frame is remarkably enhanced.

Abstract: A nickel-gold plating exhibiting high resistance to corrosion, which has a nickel plating layer formed on a base metal (1) and a gold plating layer (3) formed thereon, characterized in that the nickel plating layer (2) has a corrosion potential being brought close to that of the gold plating layer (3) through the reduction of the sulfur content of the nickel plating layer; or which has a first nickel plating layer (6) formed on a base metal, a second nickel plating layer (7) formed on the first nickel plating layer and a gold plating layer formed thereon, characterized in that the first nickel plating layer has a corrosion potential nobler (higher)than that of the second nickel plating layer.

Abstract: The coated device contains a coating for use with corrosive environments at high temperatures. The device has a bond coat consisting essentially of, by weight percent, 0 to 5 carbon, 20 to 40 chromium, 0 to 5 nickel, 0 to 5 iron, 2 to 25 total molybdenum plus tungsten, 0 to 3 silicon 0 to 3 boron and balance cobalt and essential impurities to provide sulfidation resistance at high temperatures. A zirconia-base ceramic coating covers the bond coat for heat resistance. Optionally, a boride or carbide coating covers the zirconia for additional resistance to erosion.

Abstract: A high-conductivity electrode wire for wire electric discharge machining, which comprises a core having an aggregate structure containing not less than 35% by volume of [111] crystal grain, and a covering layer formed on the core at a covering ratio of 2 to 30% and containing Zn or a Zn alloy with Zn content of not less than 30% by weight.

Abstract: A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

Abstract: Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.

Abstract: A composite multilayer material is described, which exhibits a relatively high specific load carrying capacity and relatively low wear. The composite multilayer material for plain bearings comprises a backing layer, a bearing metallayer (1), a first intermediate layer (2) of nickel, a second intermediate layer (3) of tin and nickel together with an overlay (4) consisting of copper and tin. The overlay (4) comprises a tin matrix (5), into which tin-copper particles (6) are incorporated, which consist of 39 to 55 wt. % copper, the rest being tin. At high temperatures, as occur in the case of plain bearings used in internal combustion engines, the tin migrates into the second intermediate layer (3) therebelow, resulting in concentration of the tin-copper particles (6).

Abstract: The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.

Abstract: A component for a gauge comprising a bourdon tube having a first end and a second end. A socket is joined to the first end of the bourdon tube and a closure member is joined to the second end of the bourdon tube. At least one of the bourdon tube and the closure member comprises a copper nickel alloy and/or the socket comprises a nickel silver alloy. In addition, a low temperature soldering material, such as a tin-bismuth soldering material, was used to affix the socket to the bourdon tube and the closure member to the bourdon tube. Preferably, the components contain substantially no free copper. Such a component resists corrosion, especially corrosion formed when certain fluids are used with such components.

Abstract: A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printed circuit board warping caused by the mismatch in the coefficients of thermal expansion between the conventional solder mask and the printed circuit board. A native nickel-oxide layer that forms on the surface of the exposed portions of the plated nickel layer functions as a solder dam.

Abstract: A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy phase and the soft copper alloy phase coexist in a mixture state. On the surface of the sliding material, the soft copper alloy phase comes to have a shape more concave than that of the hard copper alloy phase when receiving a load or when being in a sliding wear relation, in which concave portions is retained lubricant with the result that the anti-seizure property is enhanced. Further, since the soft phase and the hard phase are made of the same copper alloy, the wettability thereof becomes good, and Ni and etc. contained in the hard copper alloy phase are diffused into the soft copper alloy phase, so that the hardness of the boundary portion defined between the phases come to be gradually varied.

Abstract: A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m2, which impede a wire bonding property or solder wettability of the lead frame.

Abstract: A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 &mgr;m; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 &mgr;m. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared.

Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a release force for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. The metal foil layer may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent coating a side of the metal foil layer. The enhanced surface is subsequently bonded to a dielectric and the carrier layer then removed.

Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.

Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.

Abstract: A copper foil for a TAB tape carrier, comprising (a) a copper foil having a shiny surface and a mat surface; and (b) an alloy layer comprising nickel, cobalt and molybdenum, which is formed at least on the shiny surface; a TAB carrier tape, comprising a flexible insulating film and the copper foil for a TAB tape carrier applied onto the flexible insulating film with a surface on the side of the mat surface facing the flexible insulating film; and a TAB tape carrier, which is produced from the TAB carrier tape by etching the copper foil for a TAB tape carrier to form a copper lead pattern.

Abstract: A method for producing a laminated metal ribbon comprises the steps of (a) vapor-depositing a third metal layer on at least one welding surface of a first metal ribbon 4 and a second metal ribbon 5 in a vacuum chamber 1, the third metal being the same as or different from a metal or an alloy of the first and second metal ribbons 4, 5; (b) pressure-welding the first metal ribbon 4 to the second metal ribbon 5; and (c) subjecting the resultant laminate 9 to a heat treatment for thermal diffusion.

Abstract: A lead-free multilayer material for plain bearings and a process for the production of corresponding bearing shells for improved emergency running and mechanical load-carrying capacity characteristics. The multilayer bearing material comprises a lead-free copper alloy having a copper content ranging from 50 to 95 wt. %, and an overlay formed of a lead-free tin and copper having a tin content ranging from 70 to 97 wt. % and a copper content ranging from 3 to 20 wt. %.

Abstract: A terminal material is composed of a base material and a plurality of plating layers provided on the base material and containing an Sn-plating layer as its outermost layer. When the plating layers include an Ni-plating layer, the plating layers are formed so that the Sn-plating layer does not come in contact with the Ni-plating layer. A crimp portion of a crimp terminal is formed of the terminal material.

Abstract: There is provided a copper-base alloy useful for coinage that has a golden visual appearance. The material has a transverse electrical conductivity substantially similar to that of copper alloy C713 and when clad to a copper alloy C110 core, a transverse electrical conductivity substantially similar to both sides of a Susan B. Anthony United States dollar coin. The copper-base alloy is a copper-manganese-zinc-nickel alloy.

Abstract: A personal ornament having its surface covered with a colored coating, the colored coating formed by dry-plating, which personal ornament comprises a basis material for personal ornament, composed of a copper alloy or zinc; a nickel plating layer on a surface of the basis material, or a nickel plating layer on a surface of a copper plating layer on a surface of the basis material; an amorphous nickel/phosphorus alloy plating layer on a surface of the nickel plating layer; and at least one colored coating layer on a surface of the amorphous nickel/phosphorus alloy plating layer, the colored coating layer formed by dry-plating, and wherein the amorphous nickel/phosphorus alloy plating layer has a phosphorus content of 11 to 16% by weight. As compared with conventional personal ornaments, this personal ornament is furnished with a colored coating having excellent corrosion resistance and can be produced at low cost.

Abstract: A nanolaminate structure comprises a plurality of adjacent metal layers with each layer having a thickness of less than about 1000 nanometers. The composition of the adjacent metal layers alternates between a first metal and a second metal, where at least one mechanical property of the nanolaminate is improved over the same mechanical property of the first and second metal.

Abstract: A plated material for connectors, having superior insertion and withdrawal properties, comprises an intermediate layer consisting of Ni alloy plating having a Vickers hardness of 450 to 750 Hv and a thickness of 0.3 to 2 &mgr;m provided on a base metal consisting of Cu or Cu alloy, a reflowed Sn or Sn alloy plated surface layer provided thereon, and an alloy layer consisting primarily of Sn—Ni and having a thickness of 0.05 to 2 &mgr;m formed by diffusion between the intermediate layer and the surface layer, in which average grain size of said Sn—Ni compound is 0.05 to 1 &mgr;m.

Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or iron alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 &mgr;m to about 300 &mgr;m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 &mgr;m.

Abstract: Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting the polymeric foam with an activation solution; and (d) forming at least one metallic layer on the polymeric foam with an electroless plating process. Also provided are electrically conductive polymeric foams formed by such methods. The present methods and foams have particular applicability to the manufacture of EMI (electromagnetic interference) shielding devices.

Abstract: An article includes a colored electroplated metallic coating comprising both nickel and zinc, on an underplate of copper, brass, bright nickel or matt nickel, supported on a metallic or plastic substrate, various colors in the electroplated coating being exemplified. The electrolyte contains Ni2+, Zn2+, (NH4)+ and thiocyanate ions in specified concentrations, but no oxidative ion, color variation of the coating being achieved exclusively by variation of current density, time of the electroplating step and current quantity, provided that the current density at the cathode underplate is within the range of 0.01 to 0.5 A/dm2.

Abstract: A protective layer for load-transferring contact surfaces of gas turbine components, especially titanium turbine components is capable to take up alternating loads at higher temperatures. The protective layer is formed of an alloy having the following composition in percent by weight: aluminum (Al) 4-8%; chromium (Cr) 2-5%; iron (Fe) 0-3.5%; and copper (Cu) remainder.

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.

Abstract: Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the matte surface of the base foil and which has a peak count greater than the peak count of the matte surface of the base foil. In the electrodeposition there are used a unique electrolyte composition and plating conditions effective to control the micro-throwing process of the plating process so that the surface roughness of the corrective is substantially constant from one batch of base foil to another.

Abstract: A lead-free multilayer material for plain bearings and a process for the production of corresponding bearing shells for improved emergency running and mechanical load-carrying capacity characteristics. The multilayer bearing material comprises a lead-free copper alloy having a copper content ranging from 50 to 95 wt. %, and an overlay formed of a lead-free tin and copper having a tin content ranging from 70 to 97 wt. % and a copper content ranging from 3 to 20 wt. %.

Abstract: Processes for preparing copper-INVAR-copper (CIC) for use in making chip packaging and the CIC created. One process comprises annealing a CIC section at a temperature in a range of 1475° F. to 1625° F. for a time in a range of 40 to 120 seconds. Another process includes heat treating a CIC section at a temperature in a range of 1275° F. to 1425° F. for a time in a range of 40 to 120 seconds. The above processes can be combined. The CIC section created exhibits unique electrical, physical, and mechanical properties.

Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

Abstract: A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate.

Abstract: There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits.

Abstract: Copper precursors useful in liquid delivery CVD for forming a copper-containing material on a substrate. The disclosed copper precursors are particularly useful for metallization of interconnections in semiconductor device structures.

Abstract: In accordance with the invention, a metal substrate is coated with a multilayer surface finish comprising, in succession, an amorphous metal underlayer, a corrosion-resistent metal middle layer and one or more outer layers of precious metal. In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni—P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.

Abstract: A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 Å and about 10,000 Å. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Å and about 4,000 Å.

Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g.

Abstract: A copper foil for a TAB tape carrier, comprising (a) a copper foil having a shiny surface and a mat surface; and (b) an alloy layer comprising nickel, cobalt and molybdenum, which is formed at least on the shiny surface; a TAB carrier tape, comprising a flexible insulating film and the copper foil for a TAB tape carrier applied onto the flexible insulating film with a surface on the side of the mat surface facing the flexible insulating film; and a TAB tape carrier, which is produced from the TAB carrier tape by etching the copper foil for a TAB tape carrier to form a copper lead pattern.

Abstract: There are disclosed copper-base and/or iron-base contact materials which contain a Pb intermetallic compound dispersedly precipitated therein and which have highly improved sliding properties. Double layered contact elements improved in oil impregnation and lubricity are formed by sinter bonding the above contact materials to an iron-base metal backing, respectively. Economical producing methods for such double layered contact materials are also disclosed. In the copper-base and/or iron-base contact materials, one or more kinds of Pb intermetallic compounds are dispersedly precipitated.

Abstract: To establish a technique of further improving the oxidation resistance of the glossy surface of a copper foil that has a composite layer containing chromium, zinc, and phosphorus on its glossy surface is achieved by a copper foil having excellent oxidation resistance characterized by a composite layer containing chromium, zinc, phosphorus, and nickel formed on the glossy surface of the foil and also to a method of manufacturing the same by electrolysis.

Abstract: An article having deposited on at least a portion of its surface a decorative and protective multi-layer coating comprising at least one nickel layer, a tin-nickel alloy layer, a chrome layer, and sandwich layer comprised of layers comprised of titanium or titanium alloy alternating with layers comprised of titanium compound such as titanium nitride or titanium alloy compound such as titanium nitride. The coating provides abrasion and corrosion protection to the underlying substrate and also protects the substrate from attack by chemicals such as acids and bases while being crack resistant and resistant to galvanic corrosion.

Abstract: A sliding bearing, which comprises a lining and a bismuth or bismuth-alloy overlay having improved compatibility and fatigue resistance is provided. The overlay is characterized by the following orientation. The relative ratio of the X-ray diffraction intensity I[hkl] of the bismuth or bismuth-alloy overlay defined below satisfies the following conditions (a) and (b): (a) the relative ratio of the X-ray diffraction intensity I[hkl] of planes other than the {012} planes is from 0.2 to 5 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.2I[012]≦I[hkl]≦5I[012] (b) the relative ratio of the X-ray diffraction intensity I[hkl] of three or more planes other than {012} planes ranges from 0.5 to 2 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.5I[012]≦2I[012].

Abstract: A Ni plating layer 3, a Cu plating layer 11, a Zn—Ni alloy plating layer 4 and a chromate layer 5 are formed sequentially in that order on the outer surface of a steel base 2. The Cu plating layer 11 interposed between the Ni plating layer and the Zn—Ni plating layer seals up pinholes in the Ni plating layer and enhances the sacrificial corroding action of the Zn—Ni alloy plating layer.

Abstract: A composite multilayer material is described, which exhibits a relatively high specific load carrying capacity and relatively low wear. The composite multilayer material for plain bearings comprises a backing layer, a bearing metal layer (1), a first intermediate layer (2) of nickel, a second intermediate layer (3) of tin and nickel together with an overlay (4) consisting of copper and tin. The overlay (4) comprises a tin matrix (5), into which tin-copper particles (6) are incorporated, which consist of 39 to 55 wt. % copper, the rest being tin. At high temperatures, as occur in the case of plain bearings used in internal combustion engines, the tin migrates into the second intermediate layer (3) therebelow, resulting in concentration of the tin-copper particles (6).

Abstract: A method is taught for protecting copper and copper-based composites from high temperature oxidation, by the application thereto of a cobalt-based alloy diffusion barrier and a copper-aluminum alloy protective outer layer.