Abstract: The present invention relates to a photoactive compound having a novel structure and a photosensitive resin composition including the same, and the photoactive compound according to the present invention has excellent sensitivity due to efficient absorption to a UV light source by including a nitro group and a phosphonate structure, and has excellent retention rate, mechanical strength, heat resistance, chemical resistance and developing resistance by improving solubility of the photosensitive resin composition by excellent compatibility of the phosphonate structure and a binder resin. Therefore, the photosensitive resin composition according to the present invention is useful to cure a column spacer, an overcoat, a passivation material and the like of a liquid crystal display device, and is useful in view of a high temperature process property.

Abstract: There is provided a pattern forming method comprising (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin capable of increasing the polarity by the action of an acid to decrease the solubility for an organic solvent-containing developer, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin substantially free from a fluorine atom and a silicon atom and different from the resin (A), (ii) a step of exposing the film, and (iii) a step of performing development by using an organic solvent-containing developer to form a negative pattern.

Abstract: Provided is a radiation-sensitive colored composition which exhibits excellent developability, has excellent heat resistance and solvent resistance, and is capable of forming a colored pattern with less color transfer and color unevenness. The radiation-sensitive colored composition includes a colorant multimer (A), a polymerizable compound (B), a photopolymerization initiator (C), and an organic solvent (D), wherein the content of an inorganic metal salt (X) including no colorant skeleton is 0.1% by mass or less with respect to a dye solid contents.

Abstract: Provided is a copolymer. The copolymer, when incorporated into a resist composition, can provide a satisfactory resist pattern with high sensitivity, high resolution, high etching resistance and a reduced amount of outgas.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, which is excellent in sensitivity, resolution, a pattern profile and a depth of focus (DOF), and, an actinic ray-sensitive or radiation-sensitive film and a pattern forming method, each using the same, are provided. The actinic ray-sensitive or radiation-sensitive resin composition includes a nitrogen-containing compound and a resin (Ab) capable of varying a polarity or an alkali solubility thereof by the action of an acid.

Abstract: The invention relates to a photosensitive resin composition; especially relates to a photosensitive resin composition that has good heat-yellowing resistance, surface roughness resistance, developability and brightness. The invention also provides a white matrix, a color filter and a reflective display element.

Abstract: A photosensitive resin composition which is high in thermal decomposition property of a photocured product thereof even in a case of being subjected to heat treatment in a non-oxygen atmosphere and is less likely to generate a residue of carbon and a photosensitive paste composed of the same are provided. The composition contains (a) a photopolymerization initiator, (b) an acryl monomer, and (c) polyalkylene carbonate, in which a ratio of polyalkylene carbonate to a total amount of the acryl monomer and polyalkylene carbonate is not lower than 50 weight % and not higher than 90 weight %. Polypropylene carbonate is used as polyalkylene carbonate. The photosensitive paste is obtained by blending the photosensitive composition, a solvent, and inorganic powders. Insulating inorganic material powders or conductive metal powders are employed as the inorganic powders.

Abstract: Disclosed are an actinic ray-sensitive or radiation-sensitive resin composition including (A) a compound capable of generating an acid by irradiation of actinic rays or radiation, and (B) a resin of which solubility in an alkali developer increases by being decomposed by the action of an acid, and, a resist film, a pattern forming method, an electronic device manufacturing method, and an electronic device, each using the composition, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains at least one type of a specific compound represented by General Formula (A-I) and at least one type of a specific compound represented by General Formula (A-II) as the compound (A).

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: The present disclosure relates to novel methanofullerene derivatives, negative-type photoresist compositions prepared therefrom and methods of using them. The derivatives, their photoresist compositions and the methods are ideal for fine pattern processing using, for example, ultraviolet radiation, beyond extreme ultraviolet radiation, extreme ultraviolet radiation, X-rays and charged particle rays. Negative photosensitive compositions are also disclosed.

Abstract: The invention relates to a photosensitive resin composition that has good heat resistance and good humidity resistance. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.

Abstract: A pattern forming method including: (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) having a repeating unit having a group generating a polar group upon being decomposed by the action of an acid, and a repeating unit having an aromatic group, a compound (B) generating an acid upon irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film; and (iii) developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the resin (A) is a resin having a repeating unit having a naphthyl group, and the like, and/or the actinic ray-sensitive or radiation-sensitive resin composition contains a compound (D) having a naphthalene ring, and the like.

Abstract: A colored dispersion according to the present invention comprises a resin including monomers of Formulas 1 to 4, as a binder resin. Accordingly, a photoresist composition for a black matrix of a high light shielding property, which has the dispersion stability of the colored dispersion according to the present invention, could be provided, and a black matrix of high sensibility having an uniform process characteristic while maintaining a high light-shielding property could be produced.

Abstract: Disclosed is a photosensitive resin composition for a color filter that includes (A) an acrylic-based copolymer including a structural unit represented by the following Chemical Formula 1, wherein R1, R2, Q, and n are the same as defined in the specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent.

Abstract: Disclosed is a flexographic printing plate precursor in which formation of cracks and wrinkles in an infrared ablation layer is suppressed and the scratch resistance of the layer is improved. The precursor includes a support, photosensitive resin layer, and an infrared ablation layer that are laminated in the order presented. The binder polymer contained in the infrared ablation layer contains a polymer (A) and an acrylic resin (B). The polymer (A) contains the same structural unit as the structural unit contained in the binder polymer in the photosensitive resin layer. The mass ratio (A/B) of the component (A) with respect to the component (B) is within a range of 1/3 to 3/1. The difference between a plastic hardness (Ha) of the infrared ablation layer and a plastic hardness (Hb) of the photosensitive resin layer is 30 mN/mm2 or smaller.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound (A) that contains a structure (P) containing at least one phenolic hydroxyl group and a structure (Q) containing at least one phenolic hydroxyl group whose hydrogen atom is replaced by a group (S) with a cyclic structure containing an acid crosslinking group, characterized in that the group (S) with a cyclic structure containing an acid crosslinking group is a group with a polycyclic structure or a group with a cyclic structure containing a hydroxymethyl group and/or an alkoxymethyl group.

Abstract: A polymer for resist use is obtainable from a monomer having formula (1) wherein R1 is H, CH3 or CF3, R2 and R3 are a monovalent hydrocarbon group, R4 to R9 are hydrogen or a monovalent hydrocarbon group, R10 is a monovalent hydrocarbon group or fluorinated hydrocarbon group, A1 is a divalent hydrocarbon group, k1 is 0 or 1, and n1A is 0, 1 or 2. A resist composition comprising the polymer displays a high dissolution contrast during organic solvent development.

Abstract: An I-line photoresist composition, having excellent thermal stability at high temperature of 200-250° C., by which fine photoresist patterns form using an acid diffusion layer and a method for forming a fine pattern using the same, comprising: a polymer containing 1-99 mol % of repeating unit selected from a group consisting of 1-99 mol % of repeating unit represented by Formula 1, repeating unit represented by Formula 2, repeating unit represented by Formula 3 and mixture thereof; a photo active compound containing at least two diazonaphtoquinone (DNQ) groups; and an organic solvent. Formulas 1-3 are located in the specification. R* and R** are independently a hydrogen atom or a methyl group. R1 is a hydrogen atom or linear, branch or cyclic hydrocarbonyl group of 3-15 carbon atoms, containing or not containing 1-4 oxygen atoms. R2 is linear, branch or cyclic hydrocarbonyl group of 1-30 carbon atoms, containing or not containing 1-4 oxygen atoms.

Abstract: A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract: A photosensitive resin composition includes: an acrylic copolymer comprising a polymerization product of a first monomer comprising at least one selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a second monomer comprising an olefin-based unsaturated compound; a photosensitive component comprising at least one 1,2-quinonediazide-5-sulfonic acid ester compound selected from compounds represented by Chemical Formulae 1 to 4; a coupling agent; and a solvent, wherein a total amount of asymmetric compounds in the photosensitive component is greater than or equal to 45 area percent as determined by high performance liquid chromatography: wherein R1 is a hydroxyl group or a methyl group, and NQD is a 1,2-quinonediazide 5-sulfonyl group.

Abstract: Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a dye represented by the following Chemical Formula 1, (B) an alkali soluble resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (Aa) containing at least one repeating unit (Aa1) derived from monomers of general formula (aa1-1) below and at least one repeating unit (Aa2) derived from monomers of general formula (aa2-1) below and comprising a resin (Ab) that when acted on by an acid, changes its alkali solubility.

Abstract: A pattern forming method contains: (i) a step of forming a bottom anti-reflective coating on a substrate by using a first resin composition (I), (ii) a step of forming a resist film on the bottom anti-reflective coating by using a second resin composition (II), (iii) a step of exposing a multi-layered film having the bottom anti-reflective coating and the resist film, and (iv) a step of developing the bottom anti-reflective coating and the resist film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract: The present invention relates to a photoactive compound having a novel structure and a photosensitive resin composition including the same, and the photoactive compound according to the present invention has excellent sensitivity due to efficient absorption to a UV light source by including a nitro group and a phosphonate structure, and has excellent retention rate, mechanical strength, heat resistance, chemical resistance and developing resistance by improving solubility of the photosensitive resin composition by excellent compatibility of the phosphonate structure and a binder resin. Therefore, the photosensitive resin composition according to the present invention is useful to cure a column spacer, an overcoat, a passivation material and the like of a liquid crystal display device, and is useful in view of a high temperature process property.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, including a base component containing a polymeric compound having a structural unit derived from a compound represented by general formula (a0-1). R1 and R2 each independently represents a group represented by general formula (a0-2) or a functional group; V1 and V2 each represents a single bond or an alkylene group of C1 to C10 which may have a substituent; Y1 represents a single bond or a divalent linking group; Y2 represents a fluorinated alkylene group of C1 to C4 which may have a substituent; L1 represents O or a group represented by —NR?1—(R?1 represents H or an alkyl group of C1 to C5); Mm+ represents an organic cation having a valency of m; and m represents an integer of 1 or more.

Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an electron beam-sensitive or extreme ultraviolet-sensitive resin composition, (2) a step of exposing the film by using an electron beam or an extreme ultraviolet ray, and (3) a step of developing the exposed film by using an organic solvent-containing developer, wherein the electron beam-sensitive or extreme ultraviolet-sensitive resin composition contains (A) a resin containing (R) a repeating unit having a structural moiety capable of decomposing upon irradiation with an electron beam or an extreme ultraviolet ray to generate an acid, and (B) a solvent.

Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid, (B) a compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation, (C) a resin having one or more groups selected from the specific group as defined in the specification and (D) a solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern.

Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.

Abstract: The present application relates to a fluorine-based resin having a novel structure and a photosensitive resin composition including the same. The photosensitive resin composition including the fluorine-based resin according to an exemplary embodiment of the present application has excellent photosensitivity and developability and can increase a contact angle of a coating film to prevent a water stain. Accordingly, the photosensitive resin composition including the fluorine-based resin according to the exemplary embodiment of the present application may be applied to various photosensitive materials, and particularly, may be preferably applied when a color filter pattern for LCD is manufactured.

Abstract: A polymer comprising recurring units (a) of styrene having an HFA group and an ester group adjacent thereto and recurring units (b) having a hydroxyl group is used as base resin to formulate a negative resist composition. The negative resist composition has a high dissolution contrast in alkaline developer, high sensitivity, high resolution, good pattern profile after exposure, and a suppressed acid diffusion rate.

Abstract: Provided are a coating composition for deep ultraviolet (DUV) filtering during an extreme ultraviolet (EUV) exposure, the coating composition including about 100 parts by weight of a solvent including a first solvent (the first solvent being an alcoholic solvent); and about 0.05 parts by weight to about 5 parts by weight of a coating polymer having a degree of absorption of about 50%/?m or greater with respect to 193-nm incident light.

Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid and (B) a low molecular weight compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and decomposing by an action of an acid to decrease a solubility of the low molecular weight compound (B) in an organic solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern.

Abstract: A negative pattern is formed by applying a resist composition onto a substrate, prebaking, exposing to high-energy radiation, PEB, and developing the exposed resist film in an organic solvent developer to dissolve the unexposed region of resist film. The resist composition comprising a polymer adapted to form a lactone ring under the action of an acid so that the polymer may reduce its solubility in an organic solvent displays a high dissolution contrast. A fine hole or trench pattern can be formed therefrom.

Abstract: A colorant multimer includes, as a partial structure of a colorant moiety, a dipyrromethene metal complex compound or tautomer thereof obtained from: (i) a dipyrromethene compound represented by the following Formula (M); and (ii) a metal or a metal compound: wherein in Formula (M), R4, R5, R6, R7, R8, R9, and R10 each independently represent a hydrogen atom or a monovalent substituent.

Abstract: A radiation-sensitive resin composition includes a polymer that includes a structural unit represented by a formula (1), and an acid generator. R1 is a hydrogen atom, a fluorine atom, or the like. R2 is a hydrogen atom or a monovalent hydrocarbon group. R3 is a hydrogen atom, a monovalent chain hydrocarbon group, or the like. R4 is a hydrogen atom, a monovalent chain hydrocarbon group, or the like. R5 is a hydrogen atom, a monovalent chain hydrocarbon group, or the like. R6 is a monovalent chain hydrocarbon group. R6 is bonded to R3 to form a first alicyclic structure, or R6 is bonded to R5 to form a second alicyclic structure. At least one hydrogen atom of R2, R3, or R4 is optionally substituted with a fluorine atom.

Abstract: Dendritic compounds are provided. The dendritic compounds include an anionic dendron that has a focal point having an anionic group and a linking group, and a photoreactive cation. The dendritic compounds find particular use as photoacid generators. Also provided are photoresist compositions that include such a dendritic compound, as well as methods of forming electronic devices with the photoresist compositions. The dendritic compounds, photoresist compositions and methods find particular applicability in the manufacture of semiconductor devices.

Abstract: A resist composition having excellent lithography properties, which generates an acid upon exposure and exhibits changed solubility in a developing solution by the action of an acid, the resist composition containing a base material component (A) which exhibits changed solubility in a developing solution by the action of an acid, and the base material component (A) containing a high-molecular weight compound (A1) having a constituent unit (a0) derived from a compound represented by the following general formula (a0-1); a method for forming a resist pattern using the resist composition; and a high-molecular weight compound (A1) having a constituent unit (a0) derived from a compound represented by the following general formula (a0-1), are disclosed.

Abstract: The present invention provides a resin comprising a structural unit derived from a compound represented by the formula (I): wherein R1 represents a hydrogen atom or a methyl group, A2 represents a divalent fluorine-containing C1-C12 hydrocarbon group, and A1 represents a group represented by the formula (a-g1): A10-X10sA11-??(a-g1) wherein A10 is independently in each occurrence a C1-C5 aliphatic hydrocarbon group, A11 represents a C1-C5 aliphatic hydrocarbon group, X10 is independently in each occurrence —O—, —CO—, —CO—O— or —O—CO—, and s represents an integer of 0 to 2, and a photoresist composition comprising the resin and an acid generator.

Abstract: An additive polymer comprising recurring styrene units having an ester group bonded to a CF3—C(OR2)—R3 group (wherein R2 is H, acyl or acid labile group, R3 is H, CH3 or CF3) such as 1,1,1,3,3,3-hexafluoro-2-propanol is added to a polymer capable of increasing alkali solubility under the action of acid to formulate a resist composition. The resist composition can minimize outgassing from a resist film during the EUV lithography and form a resist film having a hydrophilic surface sufficient to prevent formation of blob defects on the film after development.

Abstract: A phontosensitive polysiloxane composition for forming a protective film having superior sensitivity is disclosed. A protective film formed from the phontosensitive polysiloxane composition and an element including the protective film are also disclosed. The phontosensitive polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonic acid ester, a urethane(meth)acrylate compound having at least six (meth)acryloyl groups in a molecule, and a solvent.

Abstract: There is herein described curable coatings for use in a photoimaging process. In particular, there is described curable coatings in the form of 100% or substantially 100% solids energy curable coatings for use in a photoimaging process wherein a substrate is covered with a wet curable photopolymer and the photoimaged substrate is used to form images such as electrical circuits or other features used in the Photochemical Machining Industry (PCMI) such as for example lines, squares, spirals, circles, or other geometric and non-geometric shapes.

Abstract: The invention relates to a photosensitive polysiloxane composition that has good thermal transmittance, good chemical resistance and good sensitivity and good refractivity. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.

Abstract: An additive polymer comprising recurring units derived from a fluorosulfonamide-substituted styrene and recurring units derived from a stilbene, styrylnaphthalene, dinaphthylethylene, acenaphthylene, indene, benzofuran, or benzothiophene derivative is added to a polymer capable of increasing alkali solubility under the action of acid to formulate a resist composition. The resist composition can minimize outgassing from a resist film during the EUV lithography and form a resist film having a hydrophilic surface sufficient to prevent formation of blob defects on the film after development.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, including a base component (A) which exhibits changed solubility in a developing solution under action of acid, and a photo-decomposable quencher (D0) containing a compound represented by general formula (d0) shown below. In the formula, R1 represents a hydrocarbon group of 4 to 20 carbon atoms which may have a substituent; Y1 represents a single bond or a divalent linking group; R2 and R3 each independently represents a substituent of 0 to 20 carbon atoms other than a fluorine atom; one of R2 and R3 may form a ring with Y1; Mm+ represents an organic cation having a valency of m; and m represents an integer of 1 or more.

Abstract: The present invention provides a polymer compound represented by the following Formula (1) and a method for production thereof, a pigment dispersant, a pigment dispersion composition, and a photocurable composition respectively using the polymer compound, and a color filter and a method for production thereof [R1: an organic linking group having a valency of (m+n); R2: a single bond or a divalent organic linking group; A1: a monovalent organic group containing at least one moiety selected from an organic dye structure, a heterocyclic structure, an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, an alkoxysilyl group, an epoxy group, an isocyanate group, and a hydroxyl group; m=1 to 8, n=2 to 9 (m+n=3 to 10); and P1: polymer skeleton].

Abstract: A photosensitive resin composition for a color filter includes (A) a binder resin including a cardo-based resin represented by the following Chemical Formula 1, (B) a photopolymerization initiator represented by the following Chemical Formula 14, (C) a photopolymerizable monomer, (E) a colorant, and (F) a solvent and a color filter using the same.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the following formula (1-1); an actinic ray-sensitive or radiation-sensitive film using the composition; and a pattern forming method: in the formula, R1, R2, R3, R4 and Y? are the same as those in formula (1-1) set forth in the description.

Abstract: The invention provides a positive resist composition, wherein a polymer compound having the weight-average molecular weight in the range of 1,000 to 500,000 and comprising a repeating unit having a hydrogen atom in a carboxyl group and/or in a phenolic hydroxy group therein been substituted by an acid-labile group and a repeating unit “a” having a cyclopentadienyl complex shown by the following general formula (1) is used as a base resin therein. There can be a positive resist composition having not only small edge roughness (LER and LWR) while having a higher resolution than conventional positive resist compositions, but also a good pattern form after exposure and an extremely high etching resistance, especially a positive resist composition using a polymer compound suitable as a base resin for a chemically amplifying resist composition; and a patterning process.

Abstract: The objects of the present invention are to provide a coloring composition that is less likely to remain on a pattern of other colors as residues and can inhibit occurrence of coating defects, a colored pattern, a color filter, a method of producing a color filter, a pattern forming method, a solid-state imaging device, and an image display device, each using the same. In order to achieve the above objects, the present invention provides a coloring composition containing a resin (A) having a dye structure, in which in a peak area of the total molecular weight distribution of the resin (A) measured by gel permeation chromatography, a proportion of a peak area of a component having a molecular weight of 20,000 or more is 10% or less.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under the action of acid, the resist composition including: a base component (A) which exhibits changed solubility in a developing solution under the action of acid and an acid generator component (B) which generates an acid upon exposure, the base component (A) including a polymeric compound (A1) having a structural unit (a0) containing an acid decomposable group that exhibits increased polarity by the action of acid and a lactone-containing cyclic group, an —SO2— containing cyclic group or a carbonate-containing cyclic group, and the acid generator component (B) including an acid generator (B1) containing a compound having a nitrogen atom exhibiting a proton acceptor property and an acid generating site capable of generating an acid upon exposure in the same molecule thereof.