Abstract: A pattern forming method comprises (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing: (A) a resin containing a repeating unit having a group capable of decomposing by the action of an acid to produce a polar group, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a solvent, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern, wherein the content of a repeating unit represented by the following formula (I) is less than 20 mol % based on all repeating units in the resin (A) and the resin (A) contains a repeating unit having a non-phenolic aromatic group other than the repeating unit represented by the specific formula.

Abstract: A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer, a mercaptopropionic acid compound and a solvent. The coating layer is exposed to a light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.

Abstract: A photocurable relief image printing element is described. The photocurable relief image printing element comprises (a) a support layer; (b) one or more photocurable layers disposed on the support layer, wherein the one or more photocurable layers comprise: (i) a binder; (ii) one or more monomers; (iii) a photoinitiator; and (iv) an additive selected from the group consisting of phosphites, phosphines, thioether amine compounds, and combinations of one or more of the foregoing; (c) a laser ablatable masking layer disposed on the one or more photocurable layers, the laser ablatable masking layer comprising a radiation opaque material; and (d) optionally, a removable coversheet. The photocurable relief image printing element provides improved surface cure in digital relief image printing elements.

Abstract: A material for a planarization film, a spacer, and a microlens that satisfies heat resistance and transparency requirements without impairing a refractive index. A negative photosensitive composition includes a photopolymerizable polymer (A) having a fluorene skeleton, a monomer (B) having a fluorene skeleton and a photopolymerization initiator (C). The photopolymerizable polymer (A) having a fluorene skeleton may include a moiety that is soluble in an alkaline developer solution, or a unit structure of Formula (1): herein each R1 is independently a C1-10 alkyl group or a halogen atom; each L is an integer of 0 to 4; X is an organic group having an unsaturated bond at a terminal thereof; and Y is a linking group including a portion that is obtained by removing an acid radical from a tetracarboxylic dianhydride.

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.

Abstract: A polymerizable composition contains: (A) a polymer compound having (a1) a repeating unit having a structure represented by the following formula (a1-1) in a side chain thereof; and (B) a polymerization initiator, and in the formula (a1-1), R11 and R12 each independently represents a hydrogen atom, an alkyl group, an aryl group, a heterocyclic group, a sulfo group, an alkylsulfonyl group, a arylsulfonyl group, an acyl group, an aryloxycarbonyl group, an alkoxycarbonyl group or a carbamoyl group, R13, R14 and R15 each independently represents a hydrogen atom, an alkyl group or an aryl group, L1 represents a divalent connecting group, Y1 represents a single bond or a divalent connecting group selected from the group consisting of —CO—, —O—, —HN—, a divalent aliphatic group, a divalent aromatic group and a combination of these groups, and * indicates a site connecting to a main chain of the polymer compound.

Abstract: A positive photoresist composition including a novolac resin, a photo active compound (PAC), a melamine crosslinking agent, and a solvent.

Abstract: A resist pattern forming method contains: in the following order, (1) forming a resist film by using a negative chemical amplification resist composition containing (A) a polymer compound having a repeating unit represented by formula (1) as defined in the specification, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and (C) a crosslinking agent capable of crosslinking the polymer compound (A) by an action of an acid; (2) exposing the resist film, so as to form an exposed resist film; and (4) developing the exposed resist film by using a developer containing an organic solvent.

Abstract: A process for making a relief printing plate is provided, the process including a layer formation step of forming a relief-forming layer from a resin composition containing (Component A) a compound having a hydrolyzable silyl group and/or a silanol group and (Component B) a conjugated diene monomer unit-containing polymer, and at least either further containing (Component C) a vulcanizing agent having a sulfur atom or Component A above being a compound further having a sulfur atom, a crosslinking step of thermally crosslinking the relief-forming layer to thus obtain a relief printing starting plate having a crosslinked relief-forming layer, and an engraving step of laser-engraving the relief printing starting plate having a crosslinked relief-forming layer to thus form a relief layer.

Abstract: The present invention provides a colored curable composition including a phthalocyanine pigment, a dioxazine pigment, a dye, a polymerization initiator, a polymerizable compound and a solvent; and a colored curable composition including a phthalocyanine pigment, a dye multimer having a polymerizable group and a group derived from a dipyrromethene dye, a polymerization initiator, a polymerizable compound and a solvent.

Abstract: A method of forming an image having multiple phases is disclosed herein. The method includes forming exposed and unexposed areas, the exposed areas comprising a first polymer network exhibiting first and second phases that are chemically connected and have different refractive indices, the first phase being continuous, and the second phase comprising a plurality of structures dispersed within the first phase, and the unexposed areas comprising a second polymer network comprising third and fourth phases that are chemically connected and have different refractive indices, the third phase being continuous, and the fourth phase comprising a plurality of structures dispersed within the third phase. The first and second polymer networks are chemically connected, and morphology formed by the first and second phases is different than that formed by the third and fourth phases.

Abstract: A lithographic printing plate precursor includes: a support; and an image-recording layer containing (A) a polymerization initiator, (B) a sensitizing dye and (C) a polymerizable compound, and the image-recording layer or an undercoat layer which is optionally provided between the support and the image-recording layer comprises (D) a polymer compound comprising (a1) a repeating unit having a side chain having a structure represented by the following formula (a1-1) and (a2) a repeating unit having a side chain having at least one structure of the formulae (a2-1), (a2-2), (a2-3), (a2-4), (a2-5) and (a2-6) as defined herein.

Abstract: A method for making a lithographic printing plate precursor is disclosed comprising the steps of a. providing a lithographic printing plate precursor including a support having a hydrophilic surface or which is provided with a hydrophilic layer, a photopolymerizable coating comprising a photopolymerizable composition, and an overcoat layer comprising a water soluble low molecular weight acid, wherein said overcoat layer has a surface pH-value ranging between 1 to 6; b. image-wise exposing the precursor; c. optionally heating the exposed precursor; d. processing the obtained precursor by applying a gum solution and optionally brushing the precursor, and/or by mounting the precursor on a plate cylinder of a lithographic printing press and rotating the plate cylinder while feeding dampening liquid and/or ink to the coating.

Abstract: Lithographic printing plate precursor comprising (a) a lithographic substrate with a hydrophilic surface and (b) a radiation-sensitive coating on the hydrophilic surface comprising (i) one or more types of monomers and/or oligomers and/or polymers, each comprising at least one ethylenically unsaturated group accessible to a free-radical polymerization, (ii) at least one sensitizer, and (iii) at least one coinitiator capable of forming free radicals together with the sensitizer, said coinitiator being other than metallocenes, characterized in that the at least one sensitizer comprises a compound of formula (I) wherein at least one of the groups R9 to R12 is a bulky group which has a van der Waals volume of at least 55 ?3.

Abstract: A lithographic printing plate precursor comprises an imageable layer comprising a free radically polymerizable component, an initiator composition capable of generating free radicals upon exposure to imaging infrared radiation, an infrared radiation absorbing dye that is defined by Structure (I) shown in the disclosure, which dyes comprise one or more ethylenically unsaturated polymerizable groups in an organic group that is attached to the methine chain. These infrared radiation absorbing dyes exhibit a reduced tendency to crystallize in the imageable layers in the presence of tetraaryl borate counter anions and therefore provide improved shelf life.

Abstract: Provided are a photosensitive resin composition which is soluble in an alkaline aqueous solution and which has a good propagation loss in a visible light wavelength region, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same. Provided are, to be specific, a photosensitive resin composition comprising (A) a vinyl polymer having at least one chain-polymerizable functional group in a molecule, (B) a polymerizable compound and (C) a polymerization initiator, wherein the component (C) is at least one selected from the group consisting of 2-[2-oxo-2-phenylacetoxyethoxy]ethyl oxyphenylacetate, 2-(2-hydroxyethoxy)ethyl oxyphenylacetate and oligo{2-hyroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]}propanone, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same.

Abstract: Disclosed is a resin composition for a protective layer of a color filter including an acrylate-based resin including a repeating unit represented by each of Chemical Formulae 1 to 3, a melamine-based resin represented by Chemical Formula 4, a thermal acid generator (TAG), and a solvent.

Abstract: A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.

Abstract: The invention relates to a positive photosensitive resin composition without color off after etching. The invention also provides a method for manufacturing a thin-film transistor array substrate, a thin-film transistor array substrate and a liquid crystal display device.

Abstract: A nanoimprint resist includes a hyperbranched polyurethane oligomer, a perfluoropolyether, a methylmethacrylate, a diluent solvent, and a photo initiator. The hyperbranched polyurethane oligomer can be polymerized by a copolymerization of trimellitic anhydride, ethylene mercaptan, and epoxy acrylic acid. The hyperbranched polyurethane oligomer can also be polymerized by a ring-opening copolymerization epoxy acrylic acid and ethylene glycol.

Abstract: A method of forming a polarizing material is provided including exposing a layer of dichroic material to activating light illumination to provide an ordered structure with a distinguished absorption axis and thus photo-induce polarization, and fixing the induced polarization by polymerization of the dichroic layer. Novel polarizing materials formed thereby are also provided. By selectively exposing regions of the dichroic material to differing activating radiation, different regions with different polarization axes can be created. The polarizing material can also be provided with a coating or coatings to alter the spectral responses, and a stack formed of a plurality if dichroic layers can be provided.

Abstract: A photosensitive resin composition which has satisfactory compatibility in dry-film formation, has sensitivity equally to two lights of i-line and h-line, is excellent in resolution and adhesion, and can be developed with an alkaline aqueous solution. Also provided are: a layered photosensitive-resin product including the photosensitive resin composition; a method of forming a resist pattern on a substrate with the layered photosensitive-resin product; and a use of the resist pattern. The photosensitive resin composition comprises: (a) 20-90 mass % thermoplastic copolymer which includes comonomer units derived from an ?,?-unsaturated monomer having a carboxy group and which has an acid equivalent of 100-600 and a weight-average molecular weight of 5,000-500,000; (b) 5-75 mass % addition-polymerizable monomer having at least one ethylenically unsaturated terminal group; (c) 0.01-30 mass % photopolymerization initiator comprising a triarylimidazolyl dimer; and (d) 0.

Abstract: To provide a negative photosensitive composition applicable to preparation of partition walls which can maintain excellent ink repellency even after ink affinity-imparting treatment, and partition walls for an optical device using such a composition. A negative photosensitive composition comprising the following ink repellent (A) in an amount of from 0.

Abstract: A relief printing plate precursor for laser engraving is provided that includes above a support, as a crosslinked relief-forming layer, a thermally crosslinked layer of a resin composition for laser engraving that includes (Component A) a compound containing a hydrolyzable silyl group and/or a silanol group and that does not include (Component B) a binder polymer or includes it at less than 2 wt % relative to the total weight on a non-volatile component basis. There are also provided a process for making a relief printing plate that includes a step of preparing the relief printing plate precursor for laser engraving and a step of forming a relief layer by laser-engraving the crosslinked relief-forming layer, and a relief printing plate that includes a relief layer formed by the process for making a relief printing plate.

Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: A photo-curing polysiloxane composition includes a polysiloxane, a quinonediazidesulfonic acid ester, a fluorene-containing compound, and a solvent. The polysiloxane is obtained by subjecting a silane monomer component to condensation. A protective film formed from the photo-curing polysiloxane composition, and an element containing the protective film, are also discussed.

Abstract: A relief printing plate precursor for laser engraving, including a relief forming layer formed by thermally crosslinking a resin composition including (A) a polymer having an ethylenically unsaturated bond in a side chain wherein the polymer is an acrylic resin or a polyvinyl acetal, (B) carbon black, and (C) a thermopolymerization initiator.

Abstract: A polybenzoxazole precursor is represented by the following formula (1): wherein R1a to R4a, R1b to R4b, X1, Y1 and m are defined in the specification.

Abstract: Disclosed is a method of producing a thin film transistor substrate having high light sensitivity, heat-resistance, impact resistance, and a photosensitive composition used by the same, the method including forming data wires on an insulating substrate, forming an organic insulating film on the data wires by applying a photosensitive composition comprising a terpolymer, where the terpolymer is derived from monomers of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof, an unsaturated epoxy group-containing compound, and an olefinic compound.

Abstract: A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR1)3 in general formula (1) and the silane compound represented by Si(OR1)4 in general formula (2) in the presence of a basic catalyst, and a pre-baked film of which has a dissolution rate of 1,000 ?/second or less in a 5 wt % TMAH aqueous solution; a polysiloxane (Ib), which is obtained by hydrolyzing and condensing at least the silane compound represented by general formula (1) in the presence of an acid or basic catalyst, and a pre-baked film of which has a dissolution rate of 100 ?/second or more in a 2.38 wt % TMAH aqueous solution; and a diazonaphthoquinone derivative and solvent.

Abstract: The present invention provides a silicon-containing surface modifier wherein the modifier contains one or more of a repeating unit shown by the following general formula (A) and a partial structure shown by the following general formula (C).The present invention has an object to provide a resist underlayer film applicable not only to a negatively developed resist pattern formed by a hydrophilic organic compound but also to a conventional positively developed resist pattern formed by a hydrophobic compound.

Abstract: The invention relates to use of a diacetylene compound as a color former wherein the diacetylene compound has one of general formulae (I) to (V). The invention also includes methods of imparting color to a material including a compound as defined above, which comprises subjecting the material to irradiation.

Abstract: A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.

Abstract: A lithographic printing plate precursor is provided that exhibits less blooming without using a specific polymerization initiator, infrared radiation absorbing agent and the like. The lithographic printing plate precursor comprises a substrate having thereon an image forming layer comprising a radiation-sensitive composition which comprises a radical polymerizable component, an infrared radiation absorbing agent and a radical polymerization initiator, wherein the radiation-sensitive composition comprises a fluorinated copolymer substantially having no hydrophilic moiety.

Abstract: The present invention relates to a curable composition, which comprises a) at least one radiation-curable resin, b) at least one specific anti-oxidant and c) at least one photoinitiator salt. The invention further relates to a cured product made from the curable composition. The curable compositions and/or the cured products thereof are particularly suitable as laminating adhesives, sealants, and/or encapsulants for electronic or optoelectronic devices.

Abstract: A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.

Abstract: A curable composition containing (A) a polymerizable compound having an alkyleneoxy group having two or more carbon atoms, (B) a polymerizable compound lacking an alkyleneoxy group having two or more carbon atoms, (C) an i-line absorber, (D) a photopolymerization initiator, (E) an alkali-soluble resin, and (F) a pigment, wherein a mass ratio [(A)/((A)+(B))] is from 0.5 to 0.9, and an i-line transmittance obtainable when the curable composition is formed into a coating film having a thickness of 0.7 ?m, is 10% or less. The curable composition of the invention has enhanced adhesiveness upon forming a micro pattern, and can reduce development residues in unexposed non-cured areas. The curable composition of the invention is suitable for the use in color filters.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.

Abstract: Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.

Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.

Abstract: There is provided a photosensitive resin composition comprising: (a) 100 parts by weight of a polyorganosiloxane obtained by a method of combining at least one silanol compound represented by the following formula (1): R12Si(OH)2??(1) {the groups in the formula being defined in the claims}, at least one alkoxysilane compound represented by the following formula (2): R2aR3bSi(OR4)4-a-b??(2) {the groups in the formula being defined in the claims} and a catalyst, and polymerizing them without active addition of water; (b) 1-50 parts by weight of a photopolymerization initiator; (c) 40-600 parts by weight of a fluorene compound represented by the following formula (3): {the groups in the formula being defined in the claims}; and (d) 20-300 parts by weight of a compound other than component (c), having one or two (meth)acryloyl groups in the molecule.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.

Abstract: The invention relates to a positive photosensitive resin composition with good temporal stability. The invention also provides a method for manufacturing a thin-film transistor array substrate, a thin-film transistor array substrate and a liquid crystal display device.

Abstract: A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) a fluoroalkyl-containing amine compound. The resist composition can form a fine pattern, specifically a fine hole or space pattern which has a positive taper (or forward taper) profile in which the size of top is greater than the size of bottom or improves the overhang profile with extremely projected top.

Abstract: A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.

Abstract: A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having an ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor is 20-100 ppm by mass based on the total solid content of the composition.

Abstract: A polysiloxane composition includes a polysiloxane, and a first compound. The first compound includes a nitrogen-containing heterocyclic ring structure, and a polar group, an ester group or a combination thereof. A pattern-forming method includes coating the polysiloxane composition on a substrate to be processed to provide a silicon-containing film. A resist composition is coated on the silicon-containing film to provide a resist coating film. The resist coating film is selectively irradiated with a radioactive ray through a photomask to expose the resist coating film. The exposed resist coating film is developed to form a resist pattern. The silicon-containing film and the substrate to be processed are sequentially dry etched using the resist pattern as a mask.

Abstract: A composition for radical polymerization includes a photosensitive material, a photoinitiator, a solvent, and a material for adjusting a size of a pattern. A method of forming a pattern using the composition is also disclosed.

Abstract: A resist pattern formed by a method including forming a resist film by applying, on a substrate, a resist composition containing a base material having a solubility, in a developer liquid containing an organic solvent, that decreases according to an action of an acid, a compound which generates an acid upon irradiation, and a solvent; exposing the resist film; developing the exposed resist film; forming a first coating film by applying, on the resist pattern, a first coating forming agent containing a resin having a solubility in an organic solvent that decreases under action of an acid, and a solvent; and heating the resist pattern on which the first coating forming agent has been applied.