Abstract: A semiconductor substrate etching masking layer onto which the pattern to be etched can be transferred by photolithography at extreme ultraviolet light wavelengths from 10 to 100 nm and which is resistant to plasma etching. An ultraviolet light semiconductor integrated circuit photolithography process and the use for fabricating a double masking layer for semiconductor substrate etching of a photo-ablation layer sensitive to extreme ultraviolet light and resistant to deep ultraviolet light and/or ultraviolet light coupled to a polymer resin layer resistant to extreme ultraviolet light and to plasma etching when the resin has been developed and sensitive to deep ultraviolet light and/or to ultraviolet light.

Abstract: The present invention provides methods and apparatus for selectively patterning surfaces using radical species generated with a photocatalyst. The photocatalyst may comprise a photocatalytic semiconductor or a photosensitizer. The radical species are brought into contact with an oxidizable coating disposed on the surface, thereby locally oxidizing and selectively patterning the surface. The photocatalyst is preferably disposed on a delivery device, such as a stamp, mask, or scanning probe, that is brought into close proximity or contact with the coated surface. The photocatalyst is then excited in a manner capable of generating radical species, for example, oxygen-containing radical species, in appropriate media. It is expected that these radical species will be transferred to the coated surface along a substantially shortest distance path, thereby locally oxidizing and patterning the surface.

Abstract: The present invention relates to a copolymer resin for a photoresist used in far ultraviolet ray such as KrF or ArF, process for preparation thereof, and photoresist comprising the same resin. The copolymer resin according to the present invention is easily prepared by conventional radical polymerization due to the introduction of mono-methyl cis-5-norbonen-endo-2,3-dicarboxylate unit to a structure of norbornene-maleic anhydride copolymer for photoresist. The resin has high transparency at 193 nm wavelength, provides increased etching resistance and settles the problem of offensive odor occurred in the course of copolymer resin synthesis. Further, as the resin composition can be easily controlled due to the molecular structure, the resin can be manufactured in a large scale.

Abstract: A method of forming a device pattern of a semiconductor device. The method includes the steps of carrying out an over-exposure to a resist film using a mask which has transmission regions which are positioned about a circumference of each of intended patterns of a resist film. Then carrying out a development of the resist film to form a resist pattern having the intended patterns. And then forming a device pattern of a semiconductor device by use of the resist pattern.

Abstract: The present invention also includes an imageable element, comprising a substrate and a thermally imageable composition comprising a thermally sensitive polymer which exhibits an increased solubility in an aqueous developer solution upon heating. The thermally sensitive polymer includes at least one covalently bonded unit and at least one thermally reversible non-covalently bonded unit, which includes a two or more centered H-bond within each of the non-covalently bonded unit. The present invention also includes a method of producing the imaged element. The present invention still further includes a thermally imageable composition comprising comprising a thermally sensitive polymer according to the present invention and a process for preparing the thermally sensitive polymer, which is a supramolecular polymer.

Abstract: An imaging element including in order an upper image, at least one transmission and reflection device providing optical transmission of between 35% and 55%, and a lower image, wherein at least the upper and lower images are on separate supports.

Abstract: Provided is a process for lithographically patterning a material on a substrate comprising the steps of (a) depositing a radiation sensitive material on the substrate by chemical vapor deposition; (b) selectively exposing the radiation sensitive material to radiation to form a pattern; and (c) developing the pattern using a supercritical fluid (SCF) as a developer. Also disclosed is a microstructure formed by the foregoing process. Also disclosed is a process for lithographically patterning a material on a substrate wherein after steps (a) and (b) above, the pattern is developed using a dry plasma etch. Also disclosed is a microstructure comprising a substrate; and a patterned dielectric layer, wherein the patterned dielectric layer comprises at least one two-dimensional feature having a dimensional tolerance more precise than 7%.

Abstract: Described are chiral liquid crystalline polymer materials and polymerizable compounds used for preparing them. The polymer materials can serve as a carrier material or are coated onto a carrier material. Also described are methods of making such materials and using them to make pigment flakes used in paints, printing inks, spray paints, cosmetic products, colored plastics, optical elements and security applications.

Abstract: New methods and compositions are provided that enable application and processing of photoresist as thick coating layers, e.g. at dried layer (post soft-bake) thicknesses of in excess of 2 microns. Resists can be imaged at short wavelengths in accordance with the invention, including 248 nm.

Abstract: A process for making an element for forming a final image with an overall attribute by exposure to actinic radiation, the process comprising: providing a support element having a surface; applying a first layer having a first surface and a second surface to the surface of the support element, the first surface of the first layer being adjacent to the surface of the support element and the second surface of the first layer being opposite the first surface; applying, prior to image-wise exposure to actinic radiation, a second layer adjacent to the second surface of the first layer, the second layer having an inner surface and an outer surface, the first layer comprising a photosensitive composition and a feature which imparts a dominant attribute to the first layer, the feature being selected from the group consisting of a fluorescent feature, a metallic feature, an opacity enriching feature or a combination of at least two of the foregoing features, the second layer comprising a first colorant; wherein the

Abstract: A ceramic decal which can be transferred to a ceramic substrate. The decal comprises a desired digital graphic image. The decal is prepared in a one-step process without the need for either a film separation step or a screen-printing or similar printing step. The digital graphic image is printed, by using ceramic toner in a color laser printer, onto suitable decal paper. The decal paper is then over coated by screen-printing or hot laminating.

Abstract: The present invention provides new high resolution resists applicable to next generation lithographies, methods of making these novel resists, and methods of using these new resists in lithographic processes to effect state-of-the-art lithographies. New nanocomposite resists comprising nanoparticles in a polymer matrix are provided in this invention. New chemically amplified resists that incorporate inorganic moieties as part of the polymer are presented herein, as are new chemically amplified resists that incorporate photoacid generating groups within the polymeric chain. Novel non-chemically amplified yet photosensitive resists, and new organic-inorganic hybrid resists are also provided herein. This invention and the embodiments described herein constitute fundamentally new architectures for high resolution resists.

Abstract: A fluid purging assembly (10) that purges a first fluid (16) from an assembly cavity (12) of an optical assembly (14). The fluid purging assembly (10) includes a control housing (22) that defines a housing chamber (78) which is sized and shaped to enclose at least a portion of the optical assembly (14). The fluid purging assembly (10) also includes a housing pressure controller (24) for controlling a housing pressure in the housing chamber (78). As provided herein, during the fluid purging process, the fluid purging assembly (10) controls the housing pressure in the housing chamber (78) so that the housing pressure is substantially equal to a cavity pressure in the assembly cavity (12). This prevents damage to optical elements (32) within the optical assembly (14). Preferably, a cavity control system (90) is used to control the cavity pressure in the assembly cavity (12) of the optical assembly (14) so that the cavity pressure is substantially equal to an atmospheric pressure near the optical assembly (14).

Abstract: A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.

Abstract: A support assembly (12) for an exposure apparatus (10) is provided herein. The support assembly (12) supports the components of the exposure apparatus (10) above a mounting base (32). The exposure apparatus (10) includes noisy components (42) and quiet components (44). The support assembly (12) includes an outer frame (34) and an inner frame (36). As provided herein, the outer frame (34) supports some of the components of the exposure apparatus (10) and the inner frame (36) supports some of the components of the exposure apparatus (10). Preferably, the outer frame (34) is used to support the quiet components (44) while the inner frame (36) is used to support the noisy components (42). Uniquely, a portion of the inner frame (36) is positioned within a portion of the outer frame (34). As a result of this design, both frames (34) (36) can effectively be mounted at the same mounting locations 37 of the mounting base (32). Further, the overall space taken up by the frames (34) (36) is minimized.

Abstract: The invention relates generally to photolithographic techniques, and particularly, but not by way of limitation, to a method for preventing the collapse of the image pattern during the stage of drying the image. The invention also relates to structures fabricated using the inventive method.

Abstract: Patterned articles, such as RFID antenna, are made by subablation, a process comprising the steps of: A. providing a substrate having a coating, such as a metal or metal oxide, and an interface comprising the thin region where the coating and the substrate are closest to each other; B. exposing at least one part of the total area of the coating to a flux of electromagnetic energy, Such as a focused excimer laser beam, sufficient to disrupt the interface but insufficient to ablate the coating, and C. removing the parts of the coating in registry with the portion of the interface area that was disrupted, by means such as ultrasonic agitation. The process has advantages over photo-resist processes in that there is no residual chemical resist left on the product and no undercutting of the pattern or image. It has advantages over laser ablation processes in that higher throughput is possible at the same energy level and there is no microscopic debris left on the product surface.

Abstract: An electrophotographic OHP sheet comprising a transparent support and a toner-receiving layer formed on one side of the support, with the toner-receiving layer having suitability for toner fixation at a temperature in the neighborhood of 160° C. to 200° C. and comprising (a) a resin having a softening point of from 180° C. to about 190° C., (b) a resin having a softening point of from 110° C. to 140° C. and (c) a plasticizer having a plasticizing efficiency of 1.1 or below.

Abstract: A system and method is disclosed that provides an automated, flow-through, dual side, laser direct imaging process and apparatus. This provides the capability to simultaneously register and image both sides of a substrate in a continuous flow-through process. The present invention provides efficiency improvements over the prior art on several levels. First, the prior art is batch process in which substrates are imaged one (or a batch) at a time in contrast with the present invention is a continuous, flow through, sequential process whereby a first substrate is followed into the apparatus by a second substrate which is, in turn followed by a third and so forth and the second substrate begins the process through the apparatus before the first substrate completes the process through the apparatus. Second, the process time per substrate is reduced as compared to the prior art.

Abstract: Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing photosensitive polymer obtained by the reaction of a copolymer of (a) a compound containing an unsaturated double bond and a carboxyl group and (b) an unsaturated double bond-containing compound with (c) a compound containing an unsaturated double bond and an epoxy group, (B) a diluent, (C) a photopolymerization initiator, (D) an inorganic powder, and (E) a stabilizer. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photosensitive composition is in the form of a dry film, the film is laminated on the substrate.

Abstract: The invention relates to a photographic member comprising a planar partitioning member having adhesively attached to each planar surface thereof a photographic image element comprising a polymer base and a photographic image wherein said element is a unitary article folded to cover both planar surfaces of said partitioning member.

Abstract: In order that CAD processing time required for modifying an input design pattern to compensate for optical proximity effects is reduced, increases in the number of base shapes when corrected data are converted into EB data are restricted, and false detection of defects in a photomask inspection process is restricted, the following steps are taken. At a shape selection step, rectangular shapes are divided into a dense rectangular shape group and a non-dense rectangular shape group according to the distance of each rectangular shape to an adjacent rectangular shape. At a number-of-shapeas comparison step, the number of shapes included in the dense rectangular shape group is compared to the number of shapes included in the non-dense rectangular shape group to select either shape group for correction. At a correction process selection step, a correction process suited for the selected shape group is selected. At a shape correction step, optical proximity correction is made.

Abstract: An exposed film package for preserving one strip of exposed photographic film includes a film sheath, which has plural pockets. Plural film pieces are formed by cutting the one strip of the exposed film, and contained respectively in the pockets in the film sheath. An index photograph is constituted of photographic paper, on which positive images of frames from the one strip of the exposed film are printed. The photographic paper has a size substantially equal to the film pieces. The positive images are formed in reducing a size of the frames, and grouped in association with the film pieces. Groups of the positive images are arranged in consideration of an order of exposure of the frames. The index photograph is contained in one of the pockets in association with the film pieces constituting the one strip.

Abstract: Patterned articles, such as RFID antenna, are made by subablation, a process comprising the steps of:

Abstract: A printing method directed to a plurality of pieces of slip paper which have been bound into a book and to the outer surface, of which ink containing an initiator and either one of coloring matter and a precursor of coloring matter is applied are placed. A printing plate has a through portion through which radiation penetrates and whose shape corresponds to a pattern to be printed. The printing plate is placed ont he stacked slip paper and X-rays are irradiated upon the printing plate fro the above direction so as to print the pattern of a character on each pieces of the slip paper at a desired are thereof.

Abstract: An exposed film package for preserving one strip of exposed photographic film includes a film sheath, which has plural pockets. Plural film pieces are formed by cutting the one strip of the exposed film, and contained respectively in the pockets in the film sheath. An index photograph is constituted of photographic paper, on which positive images of frames from the one strip of the exposed film are printed. The photographic paper has a size substantially equal to the film pieces. The positive images are formed in reducing a size of the frames, and grouped in association with the film pieces. Groups of the positive images are arranged in consideration of an order of exposure of the frames. The index photograph is contained in one of the pockets in association with the film pieces constituting the one strip.

Abstract: A paper emulsion film product and method for producing the same is shown. The film product includes a first layer of editing tape, a second layer of editing tape, and a layer of paper emulsion formed from a paper reproduction of a photograph sandwiched between the respective layers of editing tape.

Abstract: A method of manufacturing an element with a concentric pattern by use of a photolithographic process is disclosed, wherein the method includes preparing masks having segment patterns corresponding to fan-shaped regions, respectively, of the pattern which fan-shaped regions can be defined by dividing the pattern by at least one circle concentric with the pattern to provide plural zones and then by dividing each zone equiangularly, and exposing regions of a substrate corresponding to the plural zones, respectively, by using the masks corresponding to the zones, respectively, while rotating the substrate by regular angles.

Abstract: There is provided a photosensitive conductor paste comprising at least a polymer, a monomer, a photopolymerization initiator, a conductive powder, a glass frit, and a solvent, the total content of the polymer, the monomer, and the photopolymerization initiator occupying 9 to 30% by weight on a solid basis of the photosensitive conductor paste, the conductive powder occupying 60 to 90% by weight on a solid basis of the photosensitive conductor paste, the glass frit occupying 1 to 10% by weight on a solid basis of the photosensitive conductor paste, the polymer having an alcoholic hydroxyl group and a carboxyl group.

Abstract: Patterned articles, such as RFID antenna, are made by subablation, a process comprising the steps of: A. providing a substrate having a coating, such as a metal or metal oxide, and an interface comprising the thin region where the coating and the substrate are closest to each other; B. exposing at least one part of the total area of the coating to a flux of electromagnetic energy, such as a focused excimer laser beam, sufficient to disrupt the interface but insufficient to ablate the coating; and C. removing the parts of the coating in registry with the portion of the interface area that was disrupted, by means such as ultrasonic agitation. The process has advantages over photo-resist processes in that there is no residual chemical resist left on the product and no undercutting of the pattern or image. It has advantages over laser ablation processes in that higher throughput is possible at the same energy level and there is no microscopic debris left on the product surface.

Abstract: A cutable topcoat composition and apparatus useful for preparing stable data carrying devices, such as multi-layered laminates, and methods for preparing and using the composition. The composition includes a polymerizable composition and a polymeric binder. The polymerizable composition includes hard and flexible polymerizable subunits in a ratio that optimizes flexibility while retaining good adhesion and plasticizer resistance. In a preferred embodiment, a polymerization initiator is also included in the composition. Optionally, a chain transfer agent may also be added to the composition. The composition is substantially plasticizer free. The methods of using the composition include incorporating the composition into a topcoat film useful for storing the topcoat composition prior to use in preparing data-carrying devices, such as cards.

Abstract: The present invention relates to a novel maleimide- or alicyclic olefin-based monomer, a copolymer resin of these monomers and a photoresist using the copolymer resin. The maleimide-introduced copolymer resin according to the present invention can easily be copolymerized with alicyclic olefin unit, has a physical property capable of enduring in 2.38% TMAH developer and increases adhesion of ArF or KrF photoresist. The photoresist film using a copolymer resin according to the present invention can be applied to highly integrate semiconductor devices.

Abstract: A thermosensitive composition consisting of a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorbent and modifiers such as additional polymers and fillers. Both the water solubility and affinity to water and oil are changed when composition is heated.

Abstract: This invention discloses a method of planarizing a top surface with variations of profile heights above a substrate of a semiconductor chip. The method includes a step producing a polish-differentiating surface which has polishing rates proportional to the variations of the profile heights of the polish-differentiating surface above the substrate provided for performing a planarization process by applying a polishing process thereon. With the polishing differentiating surface the dishing effects of the semiconductor chip is substantially reduced when a one-time chemical mechanical polishing (CMP) process is applied for semiconductor chip planarization.

Abstract: A curable topcoat composition and apparatus useful for preparing stable data carrying devices, such as multi-layered laminates, and methods for preparing and using the composition. The composition includes a polymerizable composition and a polymeric binder. The polymerizable composition includes hard and flexible polymerizable subunits in a ratio that optimizes flexibility while retaining good adhesion and plasticizer resistance. In a preferred embodiment, a polymerization initiator is also included in the composition. Optionally, a chain transfer agent may also be added to the composition. The composition is substantially plasticizer free. The methods of using the composition include incorporating the composition into a topcoat film useful for storing the topcoat composition prior to use in preparing data carrying devices, such as cards.

Abstract: Radiation curable ink compositions and coating compositions contain an aliphatic (meth)acrylate functional macromonomer, a reactive acrylate monomer, and a photoinitiator. Ink compositions also contain an effective amount of a colorant or pigment. These inks, when cured by exposure to actinic radiation, have excellent durability, weatherability, and adhesion to acrylate substrates such as polymethylmethacrylate.

Abstract: A photographic material comprising a cassette containing a processed photographic element, the photographic element comprising a support, at least one light sensitive silver halide layer and a protective overcoat layer on the light sensitive layer, the protective overcoat layer comprising a hydrophilic binder and permanent matte particles, the permanent matte particles comprising greater than 80 mole percent methyl methacrylate and having a mean particle size of from 1 to 1.8 .mu.m and a coating weight of from 70 to 250 mg/m.sup.2.

Abstract: A structure formed during processing of an integrated circuit. Two layers of photoresist are formed over a conductive layer to be patterned. The lower layer is thinner than the upper layer, and is dyed to have a lower transmittance. Both layers are used as a masking pattern for the underlying conductive layer.

Abstract: A focus/exposure matrix comprises a series of patterns disposed on a wafer. The patterns are arranged in rows and columns. The patterns in a row are characterized by having been formed with substantially the same exposure time and an effective focus that increments between successive row patterns by an amount substantially corresponding to half the focus resolution of the photostepper. The patterns in a column are characterized by having been formed with substantially the same effective focus and an exposure time that increments between successive column patterns by a finite amount.

Abstract: There is described a method of chemically depositing a substance. The method is of utility in the direct manufacture of integrated circuits and in the manufacture of a photomask for use in production of integrated circuits. The method involves the use of a compound which degrades into a deposit and a residue when a radiant beam (e.g., a laser beam) or a particle beam (e.g., an electron beam) is applied. The residue and any unreacted compound may be washed off the substrate to which it has been applied. Nanoscale dimensions of the deposit can be achieved. A particularly suitable organometallic compound is tetra-sec butyl diaurum difluoride.

Abstract: The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured.

Abstract: Transfer paper for outputting color images, suitable for use as a transfer member used in a color electrophotographic apparatus capable of forming a multi-color toner image by using at least two colors of single-color toner. The paper has a whiteness degree of 85% or more and an opaqueness degree of 90% or more. A method of forming a color image includes the steps of transferring a color toner image to transfer paper having a whiteness degree of 85% or more and an opaqueness degree of 90% or more, and heatingly fixing the color toner image.

Abstract: A process is disclosed for forming multilayered polyimide structure from negative photosensitive polyimide precursors. An initial polyimide layer is deposited and imagewise exposed. The unexposed portions of the initial polyimide layer are inhibited and then a second polyimide layer is deposited and likewise imagewise exposed. The films are developed, thereby forming a multilayer polyimide structure. After formation of the multilayer polyimide structure, a conductive material is applied on a substrate and then the polyimide layers are lifted off thereby forming a desired pattern of metallization.

Abstract: A latent image printing method and apparatus uses a substrate with one main surface having a covering comprising only one of a first pair of a color developer and color former dye in at least one selected latent imaging area defining a background color in conjunction with the one main surface, wherein the color developer and the color former dye react when mixed to produce a first spectral response which is visible relative to the background color and a continuous coating over the covering which is non-porous with respect to the other of the pair and solvent-resistant to the other of the pair. The coating above selected portions of the covering corresponding to a desired latent image is removed.

Abstract: A photographic imaging element comprising a support, at least one light-sensitive silver halide layer, and a light-insensitive layer comprising a polymer particle of the formula:(A).sub.x (B).sub.y (C).sub.z (I)where A is a polyfunctional ethylenically unsaturated crosslinking monomer, B is an ethylenically unsaturated monomer containing carboxylic acid groups, C is a monofunctional ethylenically unsaturated monomer other than B, x is about 0.1 to 2 mole percent, y is about 35 to 70 mole percent and z equals 100-(x+y) mole percent.

Abstract: A method of fabricating a patterned polyimide film on a semiconductor wafer including spin coating the wafer with a polyimide precursor solution, baking the polyimide precursor solution in order to remove solvents from and to slightly cure the solution to form a polyimide film, and rinsing the polyimide film with deionized water immediately following the baking step prior to further processing. The rinsing in part serves to further remove solvents associated with the polyimide film. The process continues with photolithography techniques in which the wafer spin coated with a selected photoresist to form a photoresist film immediately following the rinsing step, and a baking of the photoresist film. Thereafter, the photoresist film is exposed to radiation through a photomask, and developed with a solution to form a pattern. The pattern is then etched into the polyimide film with the solution. The remaining portions of the photoresist are removed with a chemical stripper.

Abstract: A method of identifying an object by a machine readable image applied to it in which the image is produced by a plurality of fine particles embossed with a machine readable pattern produced by replicating contact with a diffraction grating having from about 5,000 to about 11,000 grooves per cm.

Abstract: A method for forming a resist pattern comprising the steps of: placing a transparent mask substrate on an object coated with a resist; drawing a mask pattern directly on the transparent mask substrate with an ink jetter; exposing the resist to light with intervention of the mask pattern; peeling off the mask substrate; and developing the resist, thereby forming a predetermined resist pattern.

Abstract: A conformal mask permits the manufacture of precision frequency selective surfaces (FSS) that have patterns on complexly curved surfaces. These FSSs are used in precision radomes. The mask has a transparent substrate and a patterned opaque layer on the substrate. The layer may be patterned by laser ablation. Alternatively, the patterning of the opaque layer can be accomplished by applying a layer of photosensitive material over the opaque layer and then defining temporary and permanent areas thereof. The temporary areas of the photosensitive layer and the opaque layer are removed sequentially to define the transparent portions of the mask. Parts are made by intimately mating the mask and a part body to which a layer of metal and a layer of photosensitive material have been applied, and exposing the part to radiation through the mask.

Abstract: A method for electrophoretically depositing a layer of photoresist on a non-planar silicon structure and a method for forming a non-planar silicon structure using electrophoretic deposition are provided. The method comprises forming a silicon substrate with a non-planar topography and forming a conductive layer on the substrate. The substrate is then submerged in an electrolytic bath containing a photoresist solution comprising a polymer and a charged carrier group. At the same time the conductive layer is connected to a voltage source and to a non-sacrificial electrode and electrically biased. The biased conductive layer attracts the carrier group and causes a layer of photoresist to uniformly deposit on the conductive layer. The layer of photoresist can then be exposed and developed to form a photomask for etching the conductive layer. In an illustrative embodiment the silicon structure is an interconnect for testing unpackaged semiconductor dice.