Abstract: A power module comprises: first and second terminals; first and second switching elements having a first electrode and a second electrode which is connected to the second terminal; first and second wirings respectively connecting the first electrodes of the first and second switching elements to the first terminal; and a third wiring directly connecting the first electrode of the first switching element to the first electrode of the second switching element, wherein parasitic inductances of the first and second wiring are different or switching characteristics of the first and second switching elements are different.

Abstract: In a P-channel transistor comprising a high-k metal gate electrode structure, a superior dopant profile may be obtained, at least in the threshold adjusting semiconductor material, such as a silicon/germanium material, by incorporating a diffusion blocking species, such as fluorine, prior to forming the threshold adjusting semiconductor material. Consequently, the drain and source extension regions may be provided with a high dopant concentration as required for obtaining the target Miller capacitance without inducing undue dopant diffusion below the threshold adjusting semiconductor material, which may otherwise result in increased leakage currents and increased risk of punch through events.

Abstract: The method for manufacturing a memory device is provided. The method includes: implanting a first impurity into the substrate adjacent to the gate conductor structure to form a source region on a first side of the gate conductor structure and a drain region on a second side of the gate conductor structure; implanting a second impurity into the substrate to form a halo implantation region disposed adjacent to the source region, wherein the halo implantation region has a doping concentration which does not degrade a data retention time of the memory device; and performing an annealing process to the drain region, forming a diffusion region under the drain region, wherein the process temperature of the annealing process is controlled to ensure that the diffusion region has a doping concentration substantially equal to a threshold concentration which maintains an electrical connection between the drain and the deep trench capacitor.

Abstract: An area-efficient, high voltage, single polarity ESD protection device (300) is provided which includes an p-type substrate (303); a first p-well (308-1) formed in the substrate and sized to contain n+ and p+ contact regions (310, 312) that are connected to a cathode terminal; a second, separate p-well (308-2) formed in the substrate and sized to contain only a p+ contact region (311) that is connected to an anode terminal; and an electrically floating n-type isolation structure (304, 306, 307-2) formed in the substrate to surround and separate the first and second semiconductor regions. When a positive voltage exceeding a triggering voltage level is applied to the cathode and anode terminals, the ESD protection device triggers an inherent thyristor into a snap-back mode to provide a low impedance path through the structure for discharging the ESD current.

Abstract: When forming sophisticated multiple gate transistors and planar transistors in a common manufacturing sequence, the threshold voltage characteristics of the multiple gate transistors may be intentionally “degraded” by selectively incorporating a dopant species into corner areas of the semiconductor fins, thereby obtaining a superior adaptation of the threshold voltage characteristics of multiple gate transistors and planar transistors. In advantageous embodiments, the incorporation of the dopant species may be accomplished by using the hard mask, which is also used for patterning the self-aligned semiconductor fins.

Abstract: Punch-through in a transistor device is reduced by forming a well layer in an implant region, forming a stop layer in the well layer of lesser depth than the well layer, and forming a doped layer in the stop layer of lesser depth than the stop layer. The stop layer has a lower concentration of impurities than the doped layer in order to prevent punch-through without increasing junction leakage.

Abstract: Generally, the present disclosure is directed to methods for adjusting transistor characteristics by forming a semiconductor alloy in the channel region of the transistor during early device processing. One disclosed method includes forming an isolation structure in a semiconductor layer of a semiconductor device and in a threshold voltage adjusting semiconductor alloy formed on the semiconductor layer, the isolation structure laterally separating a first active region and a second active region.

Abstract: Various embodiments provide methods for fabricating dual supply voltage CMOS devices with a desired I/O transistor threshold voltage. The dual supply voltage CMOS devices can be fabricated in a semiconductor substrate that includes isolated regions for a logic NMOS transistor, a logic PMOS transistor, an I/O NMOS transistor, and an I/O PMOS transistor. Specifically, the fabrication can first set and/or adjust the threshold voltage (VT) of each of the I/O NMOS transistor and the I/O PMOS transistor to a desired level. Logic NMOS and logic PMOS transistors can then be formed with I/O NMOS and I/O PMOS transistors masked without affecting the set/adjusted VT of the I/O transistors.

Abstract: Semiconductor structures and devices including strained material layers having impurity-free zones, and methods for fabricating same. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent portions of the semiconductor. When impurities are present in certain regions of the strained material layers, there is degradation in device performance. By employing semiconductor structures and devices (e.g., field effect transistors or “FETs”) that have the features described, or are fabricated in accordance with the steps described, device operation is enhanced.

Abstract: CMOS transistors are formed incorporating a gate electrode having tensely stressed spacers on the gate sidewalls of an n channel field effect transistor and having compressively stressed spacers on the gate sidewalls of a p channel field effect transistor to provide differentially stressed channels in respective transistors to increase carrier mobility in the respective channels.

Abstract: A manufacturing method for a high voltage transistor includes the following steps. A substrate is provided. A P-type epitaxial (P-epi) layer is provided above the substrate. An N-well is formed in the P-epi layer. A P-well is formed in the P-epi layer. Field oxide (FOX) layers are formed above the P-epi layer. A gate oxide (GOX) layer is formed between the FOX layers. P-type implants are doped into the P-well or N-type implants are doped into the N-well to adjust an electrical function of the high voltage transistor.

Abstract: A device having a salicide block spacer on a second side of a gate is disclosed. The use of the salicide block spacer indirectly reduces the blocking effects during the implantation processes, thereby lowering the Rdson without compromising the breakdown voltage of the device.

Abstract: The present application discloses a method for manufacturing a gate-all-around field effect transistor, comprising the steps of: forming a suspended fin in a semiconductor substrate; forming a gate stack around the fin; and forming source/drain regions in the fin on both sides of the gate stack, wherein an isolation dielectric layer is formed in a portion of the semiconductor substrate which is adjacent to bottom of both the fin and the gate stack. The present invention relates to a method for manufacturing a gate-all-around device on a bulk silicon substrate, which suppress a self-heating effect and a floating-body effect of the SOI substrate, and lower a manufacture cost. The inventive method is a conventional top-down process with respect to a reference plane, which can be implemented as a simple manufacture process, and is easy to be integrated into and compatible with a planar CMOS process. The inventive method suppresses a short channel effect and promotes miniaturization of MOSFETs.

Abstract: A method of forming a semiconductor device includes: forming a channel of a field effect transistor (FET) in a substrate; forming a heavily doped region in the substrate; and forming recesses adjacent the channel and the heavily doped region. The method also includes: forming an undoped or lightly doped intermediate layer in the recesses on exposed portions of the channel and the heavily doped region; and forming source and drain regions on the intermediate layer such that the source and drain regions are spaced apart from the heavily doped region by the intermediate layer.

Abstract: The growth rate in a selective epitaxial growth process for depositing a threshold adjusting semiconductor alloy, such as a silicon/germanium alloy, may be enhanced by performing a plasma-assisted etch process prior to performing the selective epitaxial growth process. For example, a mask layer may be patterned on the basis of the plasma-assisted etch process, thereby simultaneously providing superior device topography during the subsequent growth process. Hence, the threshold adjusting material may be deposited with enhanced thickness uniformity, thereby reducing overall threshold variability.

Abstract: The semiconductor device includes a first transistor including a first impurity layer containing boron or phosphorus, a first epitaxial layer formed above the first impurity layer, a first gate electrode formed above the first epitaxial layer with a first gate insulating film formed therebetween and first source/drain regions, and a second transistor including a second impurity layer containing boron and carbon, or arsenic or antimony, a second epitaxial layer formed above the second impurity layer, a second gate electrode formed above the second epitaxial layer with a second gate insulating film thinner than the first gate insulating film formed therebetween, and second source/drain regions.

Abstract: A structure to diminish high voltage instability in a high voltage device when under stress includes an amorphous silicon layer over a field oxide on the high voltage device.

Abstract: A method of forming an integrated circuit includes forming a gate structure over a substrate. Portions of the substrate are removed to form recesses adjacent to the gate structure. A dopant-rich layer having first type dopants is formed on a sidewall and a bottom of each of the recesses. A silicon-containing material structure is formed in each of the recesses. The silicon-containing material structure has second type dopants. The second type dopants are opposite to the first type dopants.

Abstract: A transistor which includes halo regions disposed in a substrate adjacent to opposing sides of the gate. The halo regions have upper and lower regions. The upper region is a crystalline region with excess vacancies and the lower region is an amorphous region. Source/drain diffusion regions are disposed in the halo regions. The source/drain diffusion regions overlap the upper and lower halo regions. This architecture offers the minimal extension resistance as well as minimum lateral diffusion for better CMOS device scaling.

Abstract: A structure and method of fabricating a semiconductor field-effect transistor (MOSFET) such as a strained Si n-MOSFET where dislocation or crystal defects spanning from source to drain is partially occupied by heavy p-type dopants. Preferably, the strained-layer n-MOSFET includes a Si, SiGe or SiGeC multi-layer structure having, in the region between source and drain, impurity atoms that preferentially occupy the dislocation sites so as to prevent shorting of source and drain via dopant diffusion along the dislocation. Advantageously, devices formed as a result of the invention are immune to dislocation-related failures, and therefore are more robust to processing and material variations. The invention thus relaxes the requirement for reducing the threading dislocation density in SiGe buffers, since the devices will be operable despite the presence of a finite number of dislocations.

Abstract: When forming sophisticated high-k metal gate electrode structures in an early manufacturing stage on the basis of a silicon/germanium semiconductor alloy for adjusting appropriate electronic conditions in the channel region, the efficiency of a strain-inducing embedded semiconductor alloy, such as a silicon/germanium alloy, may be enhanced by initiating a crystal growth in the silicon material of the gate electrode structure after the gate patterning process. In this manner, the negative strain of the threshold voltage adjusting silicon/germanium alloy may be reduced or compensated for.

Abstract: The present disclosure provides a method of fabricating that includes providing a semiconductor substrate; forming a gate structure on the substrate; performing an implantation process to form a doped region in the substrate; forming spacers on sidewalls of the gate structure; performing an first etching to form a recess in the substrate, where the first etching removes a portion of the doped region; performing a second etching to expand the recess in the substrate, where the second etching includes an etchant and a catalyst that enhances an etching rate at a remaining portion of the doped region; and filling the recess with a semiconductor material.

Abstract: A semiconductor device includes a gate insulator and a gate electrode stacked on a substrate, a source/drain pattern which fills a recess region formed at opposite sides adjacent to the gate electrode, the source/drain pattern being made of silicon-germanium doped with dopants and a metal germanosilicide layer disposed on the source/drain pattern. The metal germanosilicide layer is electrically connected to the source/drain pattern. Moreover, a proportion of germanium amount to the sum of the germanium amount and silicon amount in the metal germanosilicide layer is lower than that of germanium amount to the sum of the germanium amount and silicon amount in the source/drain pattern.

Abstract: A multi-bit memory cell includes a substrate; a multi-bit charge-trapping cell over the substrate, the multi-bit charge-trapping cell having a first lateral side and a second lateral side; a source region in the substrate, a portion of the source region being under the first side of the multi-bit charge-trapping cell; a drain region in the substrate, a portion of the drain region being under the second side of the multi-bit charge-trapping cell; and a channel region in the substrate between the source region and the drain region. The channel region has one of a p-type doping and an n-type doping, and the doping is configured to provide a highest doping concentration near the central portion of the channel region.

Abstract: Methods of manufacturing semiconductor devices include providing a substrate including a NMOS region and a PMOS region, implanting fluorine ions into an upper surface of the substrate, forming a first gate electrode of the NMOS region and a second gate electrode of the PMOS region on the substrate, forming a source region and a drain region in portions of the substrate, which are adjacent to two lateral surfaces of the first gate electrode and the second gate electrode, respectively, and performing a high-pressure heat-treatment process on an upper surface of the substrate by using non-oxidizing gas.

Abstract: A depletion type DMOS transistor comprises a gap in electrode material allowing incorporation of a well dopant species into the underlying semiconductor material. During subsequent dopant diffusion a continuous well region is obtained having an extended lateral extension without having an increased depth. The source dopant species is implanted after masking the gap. Additional channel implantation is performed prior to forming the gate dielectric material.

Abstract: A method for forming a transistor includes providing a substrate, forming a well region in the substrate, and forming a gate structure on a surface of the well region. The gate structure includes a gate oxide layer on the surface of the well region and a gate on the gate oxide layer. The method further includes forming source/drain regions in the substrate at opposite sides of the gate structure and performing an ion doping to the substrate to adjust a threshold voltage. The ion doping is performed after the source/drain regions are formed to reduce the impact to the diffusion of the ions caused by heat treatments performed before the ion doping. The method further includes heating the substrate after the ion doping at a temperature from about 400° C. to about 500° C.

Abstract: A semiconductor structure and a manufacturing method for the same are provided. The semiconductor structure includes a first doped well, a first doped electrode, a second doped electrode, doped strips and a doped top region. The doped strips are on the first doped well between the first doped electrode and the second doped electrode. The doped strips are separated from each other. The doped top region is on the doped strips and extended on the first doped well between the doped strips. The first doped well and the doped top region have a first conductivity type. The doped strips have a second conductivity type opposite to the first conductivity type.

Abstract: A high voltage (HV) device includes a gate dielectric structure over a substrate. The gate dielectric structure has a first portion and a second portion. The first portion has a first thickness and is disposed over a first well region of a first dopant type in the substrate. The second portion has a second thickness and is disposed over a second well region of a second dopant type. The first thickness is larger than the second thickness. An isolation structure is disposed between the gate dielectric structure and a drain region disposed within the first well region. A gate electrode is disposed over the gate dielectric structure.

Abstract: An electrostatic discharge protection device includes a substrate where an active region is defined by an isolation layer, a gate electrode simultaneously crossing both the isolation layer and the active region, and a junction region formed in the active region at both sides of the gate electrode and separated from the isolation layer by a certain distance in a direction where the gate electrode is extended. The electrostatic discharge protection device is able to prevent the increase of a leakage current while securing an electrostatic discharge protection property that a semiconductor device requires.

Abstract: Semiconductor structures are disclosed that have embedded stressor elements therein. The disclosed structures include at least one FET gate stack located on an upper surface of a semiconductor substrate. The at least one FET gate stack includes source and drain extension regions located within the semiconductor substrate at a footprint of the at least one FET gate stack. A device channel is also present between the source and drain extension regions and beneath the at least one gate stack. The structure further includes embedded stressor elements located on opposite sides of the at least one FET gate stack and within the semiconductor substrate.

Abstract: Disclosed are a system and a method of correcting systematic, design-based, parametric variations on integrated circuit chips to minimize circuit limited yield loss. Processing information and a map of a chip are stored. The processing information can indicate an impact, on a given device parameter, of changes in a value for a specification associated with a given process step. The map can indicate regional variations in the device parameter (e.g., threshold voltage). Based on the processing information and using the map as a guide, different values for the specification are determined, each to be applied in a different region of the integrated circuit chip during the process step in order to offset the mapped regional parametric variations. A process tool can then be selectively controlled to ensure that during chip manufacturing the process step is performed accordingly and, thereby to ensure that the regional parametric variations are minimized.

Abstract: In a replacement metal gate process flow, sacrificial gates are exposed and removed subsequent to the formation of source and drain regions for various transistor devices. Sidewalls formed adjacent to the sacrificial gates remain. By using an angled implant such that, for a short-channel device, the remaining sidewalls shadow and protect the exposed short-channel region, a designer may adjust the threshold voltage on long-channel devices without affecting the threshold voltage of the short-channel device.

Abstract: An MOS device having a selectively formed channel region and methods for its fabrication are provided. One such method includes forming a mask defining a gate region overlying a surface of a semiconductor substrate. Source and drain regions are formed in the semiconductor substrate in alignment with the gate region and an enhanced doping sub-surface impurity region is formed in the semiconductor substrate using the mask as a doping mask. A gate electrode is then formed overlying the semiconductor substrate in alignment with the gate region by using the mask as a gate alignment mask.

Abstract: Semiconductor structures and methods for manufacturing the same are disclosed. The semiconductor structure comprises: a gate stack formed on a semiconductor substrate; a super-steep retrograde island embedded in said semiconductor substrate and self-aligned with said gate stack; and a counter doped region embedded in said super-steep retrograde island, wherein said counter doped region has a doping type opposite to a doping type of said super-steep retrograde island. The semiconductor structures and the methods for manufacturing the same facilitate alleviating short channel effects.

Abstract: The present invention includes methods for stressing transistor channels of semiconductor device structures. Such methods include the formation of so-called near-surface “nanocavities” adjacent to the source/drain regions, forming extensions of the source/drain regions adjacent to and including the nanocavities, and implanting matter of a type that will expand or contract the volume of the nanocavities, depending respectively upon whether compressive strain is desirable in transistor channels between the nanocavities, as in PMOS field effect transistors, or tensile strain is wanted in transistor channels, as in NMOS field effect transistors, to enhance carrier mobility and transistor speed. Semiconductor device structures and semiconductor devices including these features are also disclosed.

Abstract: The semiconductor device includes a first transistor including a first impurity layer containing boron or phosphorus, a first epitaxial layer formed above the first impurity layer, a first gate electrode formed above the first epitaxial layer with a first gate insulating film formed therebetween and first source/drain regions, and a second transistor including a second impurity layer containing boron and carbon, or arsenic or antimony, a second epitaxial layer formed above the second impurity layer, a second gate electrode formed above the second epitaxial layer with a second gate insulating film thinner than the first gate insulating film formed therebetween, and second source/drain regions.

Abstract: Methods of forming nonvolatile memory devices include forming first and second floating gate electrodes of first and second nonvolatile memory cells, respectively, at side-by-side locations on a substrate. The substrate is selectively etched to define a trench therein extending between the first and second floating gate electrodes. The trench is at least partially filled with a first electrical insulation pattern. An inorganic polysilazane-type spin-on-glass (SOG) layer is conformally deposited on the first and second floating gate electrodes and on the first electrical insulation pattern and then partially removed.

Abstract: MOS structures that exhibit lower contact resistance and methods for fabricating such MOS structures are provided. In one method, a semiconductor substrate is provided and a gate stack is fabricated on the semiconductor substrate. With the gate stack serving as a mask, impurity dopants are implanted into a semiconductor material having a first surface and disposed proximate to the gate stack. A trench is etched into the semiconductor material such that the semiconductor material has a trench surface within the trench. Further, a metal silicide layer is formed on the first surface of the semiconductor material and on the trench surface. Also, a contact to at least a portion of the metal silicide layer on the first surface and at least a portion of the metal silicide layer on the trench surface is fabricated.

Abstract: The present invention, provides a semiconductor device including a substrate including a semiconductor layer overlying an insulating layer, wherein a back gate structure is present underlying the insulating layer and a front gate structure on the semiconductor layer; a channel dopant region underlying the front gate structure of the substrate, wherein the channel dopant region has a first concentration present at an interface of the semiconductor layer and the insulating layer and at least a second concentration present at the interface of the front gate structure and the semiconductor layer, wherein the first concentration is greater than the second concentration; and a source region and drain region present in the semiconductor layer of the substrate.

Abstract: A method of manufacturing semiconductor devices includes forming a plurality of patterns spaced apart from each other on a semiconductor substrate, forming a filling layer, not removed in a subsequent process of forming a mask pattern and where the filling layer formed to have a lower height than the plurality of patterns, between the plurality of patterns, forming a mask layer on the entire structure where the filling layer is formed, and forming the mask pattern by removing some of the mask layer so that some of the plurality of patterns is removed.

Abstract: A static RAM cell may be formed on the basis of two double channel transistors and a select transistor, wherein a body contact may be positioned laterally between the two double channel transistors in the form of a dummy gate electrode structure, while a further rectangular contact may connect the gate electrodes, the source regions and the body contact, thereby establishing a conductive path to the body regions of the transistors. Hence, compared to conventional body contacts, a very space-efficient configuration may be established so that bit density in static RAM cells may be significantly increased.

Abstract: Provided is a semiconductor device formed to an SOI substrate including a MOS transistor in which a parasitic MOS transistor is suppressed. The semiconductor device formed on the SOI substrate by employing a LOCOS process is structured such that a part of a polysilicon layer to becomes a gate electrode includes: a first conductivity type polysilicon region corresponding to a region of the silicon active layer which has a constant thickness and is to become a channel; and second conductivity type polysilicon regions corresponding to LOCOS isolation edges in each of which a thickness of the silicon active layer decreases.

Abstract: A semiconductor structure and a method for forming the structure are provided. The semiconductor structure has a STI structure which has a top surface higher than or as high as that of source/drain stressors. A dummy gate and a spacer are added on the STI structure. The method comprises: providing a semiconductor substrate; embedding a STI structure in the semiconductor substrate in order to form isolated active areas; forming a gate stack on the active area, and forming a dummy gate on the STI structure; forming a first spacer on sidewalls of the dummy gate, wherein a part of the first spacer lands on the active area; and embedding source/drain stressors in the semiconductor substrate and at opposite sides of the gate stack, wherein the top surface of the STI structure is higher than or as high as that of the source/drain stressor.

Abstract: A flash memory device and methods of forming a flash memory device are provided. The flash memory device includes a doped silicon nitride layer having a dopant comprising carbon, boron or oxygen. The doped silicon nitride layer generates a higher number and higher concentration of nitrogen and silicon dangling bonds in the layer and provides an increase in charge holding capacity and charge retention time of the unit cell of a non-volatile memory device.

Abstract: A semiconductor device, comprising a substrate, a plurality of polysilicon portions formed on the substrate, wherein the polysilicon portions are spaced apart from each other, a plurality of source/drain regions formed in the substrate between adjacent polysilicon portions, and a dielectric layer formed on the polysilicon portions and on the source/drain regions, wherein the dielectric layer includes a cavity filled with conductive material to form a contact area, the contact area overlapping part of a source/drain region and part of a polysilicon portion to electrically connect the polysilicon portion with the source/drain region, and wherein part of the contact area extends below an upper surface of the substrate to contact an implant region with the same doping as the source/drain region. The implant region is next to the source/drain region and includes part of a channel region in the substrate under the polysilicon portion.

Abstract: A method for fabricating an NMOS transistor includes providing a substrate; forming a gate dielectric layer structure on the substrate and forming a gate electrode on the gate dielectric layer structure. The method further includes performing a fluorine ion implantation below the gate dielectric layer and an annealing process in an atmosphere comprising hydrogen or hydrogen plasma. The method also includes forming a source region and a drain region on both sides of the gate electrode before or after the fluorine ion implantation.

Abstract: Adverse tradeoff between BVDSS and Rdson in LDMOS devices employing a drift space (52, 152) adjacent the drain (56, 156), is avoided by providing a lightly doped region (511, 1511) of a first conductivity type (CT) separating the first CT drift space (52, 152) from an opposite CT WELL region (53, 153) in which the first CT source (57, 157) is located, and a further region (60, 160) of the opposite CT (e.g., formed by an angled implant) extending through part of the WELL region (53, 153) under an edge (591, 1591) of the gate (59, 159) located near a boundary (531, 1531) of the WELL region (53, 153) into the lightly doped region (511, 1511), and a shallow still further region (66, 166) of the first CT Ohmically coupled to the source (57, 157) and ending near the gate edge (591, 159) whereby the effective channel length (61, 161) in the further region (60, 160) is reduced to near zero.

Abstract: A high breakdown voltage MOS transistor capable of reducing a leakage current while reducing an element size as compared with conventional ones is realized. On a P type well, with a channel area ch in between, an N type first impurity diffusion area including a drain area and drain side drift area, and an N type second impurity diffusion area including a source area and a source side drift area are formed. Moreover, a gate electrode is formed, via a gate oxide film, above a part of the first impurity diffusion area, above the channel area and above a part of the second impurity diffusion area. The gate electrode is doped with an N type, and an impurity concentration of portions located above the first and the second impurity diffusion areas is lower than an impurity concentration of a portion located above the channel area.

Abstract: An electrostatic discharge protection device includes a substrate where an active region is defined by an isolation layer, a gate electrode simultaneously crossing both the isolation layer and the active region, and a junction region formed in the active region at both sides of the gate electrode and separated from the isolation layer by a certain distance in a direction where the gate electrode is extended. The electrostatic discharge protection device is able to prevent the increase of a leakage current while securing an electrostatic discharge protection property that a semiconductor device requires.