Abstract: According to mask layout data created for a particular factory facility, transistors constituting a semiconductor device are classified into multiple groups depending on the gate length. Thereafter, the concentration of impurity introduced into a channel layer is set for each group, and thereby the gate length-threshold characteristics of a transistor are controlled. An overlapping area of a gate electrode and an element region of a certain group is extracted from mask layout data. The overlapping area is expanded to determine the shape of a mask used in injecting impurity in a channel layer. The data on the mask shape is then added to the mask layout data.

Abstract: A method of manufacturing a semiconductor device includes: performing, in a case of manufacturing a first semiconductor device which operates by a first power supply voltage, at least one step from among channel ion implantation, gate oxide film formation, and gate electrode patterning according to a process of forming an element which operates with the first power supply voltage; performing, in a case of manufacturing a second semiconductor device which operates by a second power supply voltage, at least one step from among the channel ion implantation, the gate oxide film formation, and the gate electrode patterning according to a process of forming an element which operates with the second power supply voltage; and commonly performing at least diffusion region formation in the case of manufacturing the first semiconductor device and in the case of manufacturing the second semiconductor device.

Abstract: A semiconductor structure includes a semiconductor substrate; an n-type tub extending from a top surface of the semiconductor substrate into the semiconductor substrate, wherein the n-type tub comprises a bottom buried in the semiconductor substrate; a p-type buried layer (PBL) on a bottom of the tub, wherein the p-type buried layer is buried in the semiconductor substrate; and a high-voltage n-type metal-oxide-semiconductor (HVNMOS) device over the PBL and within a region encircled by sides of the n-type tub.

Abstract: A semiconductor device and method for manufacturing the device with a planar halo profile is provided. The semiconductor device can be a MOSFET. The method of forming the structure includes forming an angled spacer adjacent a gate structure and implanting a halo implant at an angle to form a halo profile having low dopant concentration near a gate dielectric under the gate structure. The structure includes an underlying wafer or substrate and an angled gate spacer having an upper portion and an angled lower portion. The upper portion is structured to prevent halo dopants from penetrating an inversion layer of the structure. The structure further includes a low concentration halo dopant within a channel of a gate structure.

Abstract: The present invention is a method for forming super steep doping profiles in MOS transistor structures. The method comprises forming a carbon containing layer (110) beneath the gate dielectric (50) and source and drain regions (80) of a MOS transistor. The carbon containing layer (110) will prevent the diffusion of dopants into the region (40) directly beneath the gate dielectric layer (50).

Abstract: Methods of enhancing the performance of a field-effect transistor (FET) by providing a percolating network of metallic islands to the inversion layer of the FET so as to effectively reduce the channel length of the FET. The metal islands can be provided in a number of ways, including Volmer-Weber metallic film growth, breaking apart continuous metallic film, patterning metallic coating, dispersing metallic particles in a semiconducting material, applying a layer of composite particles having metallic cores and semiconducting shells and co-sputtering metallic and semiconducting materials, among others. FETs made using disclosed methods have a novel channel structures that include metallic islands spaced apart by semiconducting material.

Abstract: A semiconductor field effect transistor can be used with RF signals in an amplifier circuit. The transistor includes a source region and a drain region with a channel region interposed in between the source and drain regions. The transistor is structured such that the threshold voltage for current flow through the channel region varies at different points along the width direction, e.g., to give an improvement in the distortion characteristics of the transistor.

Abstract: A nonvolatile semiconductor memory has a semiconductor substrate, a first insulating film formed on a channel region on a surface portion of the semiconductor substrate, a charge accumulating layer formed on the first insulating film, a second insulating film formed on the charge accumulating layer, a control gate electrode formed on the second insulating film, and a third insulating film including an Si—N bond that is formed on a bottom surface and side surfaces of the charge accumulating layer.

Abstract: A method for fabricating a semiconductor device including implanting a selected material at a desired target depth below a surface of a silicon substrate, performing an annealing process to create a band of precipitates formed from the selected material and the silicon of the silicon substrate at the desired target depth, and forming a source region and a drain region in the substrate such that a channel region there between is positioned above the band of precipitates, wherein the desired target depth is such that a desired separation distance is achieved between the channel region and the band of precipitates, and wherein an average lattice constant of the band of precipitates is different from the average lattice constant of the silicon substrate so as to cause a stress in the channel region.

Abstract: Disclosed are embodiments of a p-type, silicon germanium (SiGe), high-k dielectric-metal gate, metal oxide semiconductor field effect transistor (PFET) having an optimal threshold voltage (Vt), a complementary metal oxide semiconductor (CMOS) device that includes the PFET and methods of forming both the PFET alone and the CMOS device. The embodiments incorporate negatively charged ions (e.g., fluorine (F), chlorine (Cl), bromine (Br), iodine (I), etc.) into the high-k gate dielectric material of the PFET only so as to selectively adjust the negative Vt of the PFET (i.e., so as to reduce the negative Vt of the PFET).

Abstract: By introducing a atomic species, such as carbon, fluorine and the like, into the drain and source regions, as well as in the body region, the junction leakage of SOI transistors may be significantly increased, thereby providing an enhanced leakage path for accumulated minority charge carriers. Consequently, fluctuations of the body potential may be significantly reduced, thereby improving the overall performance of advanced SOI devices. In particular embodiments, the mechanism may be selectively applied to threshold voltage sensitive device areas, such as static RAM areas.

Abstract: A semiconductor body includes a substrate, a buried zone having a first conductivity type that is formed in the substrate, a first zone having the first conductivity type that is above the buried zone, a second zone having a second conductivity type that is different from the first conductivity type and above the first zone, and a third zone having the first conductivity type that is above the second zone. The buried zone includes first and second implantation regions that are formed via first and second implantations that are performed using a mask. The buried zone, the first zone, the second zone and the third zone are parts of a first transistor structure.

Abstract: A molecular detection chip including a metal oxide silicon-field effect transistor (MOSFET) on sidewalls of a micro-fluid channel and a molecular detection device including the molecular detection chip are provided. A molecular detection method, particularly, qualification methods for the immobilization of molecular probes and the binding of a target sample to the molecular probes, using the molecular detection device, and a nucleic acid mutation assay device and method are also provided. The formation of the MOSFET on the sidewalls of the micro-fluid channel makes easier to highly integrate a molecular detection chip. In addition, immobilization of probes directly on the surface of a gate electrode ensures the molecular detection chip to check for the immobilization of probes and coupling of a target molecule to the probes in situ.

Abstract: A semiconductor structure is provided that includes a first device region including a first threshold voltage adjusting layer located atop a semiconductor substrate, a gate dielectric located atop the first threshold voltage adjusting layer, and a gate conductor located atop the gate dielectric. The structure further includes a second device region including a gate dielectric located atop the semiconductor substrate, and a gate conductor located atop the gate dielectric; and a third device region including a gate dielectric located atop the semiconductor substrate, a second threshold voltage adjusting layer located atop the gate dielectric, and a gate conductor located atop the second threshold voltage adjusting layer.

Abstract: A fabrication method of a semiconductor device includes: forming a gate insulating film and a gate electrode on an N type well; forming first source/drain regions by implanting a first element in regions of the N type well on both sides of the gate electrode, the first element being larger than silicon and exhibiting P type conductivity; forming second source/drain regions by implanting a second element in the regions of the N type well on the both sides of the gate electrode, the second element being smaller than silicon and exhibiting P type conductivity; and forming a metal silicide layer on the source/drain regions.

Abstract: A short channel Lateral MOSFET (LMOS) and method are disclosed with interpenetrating drain-body protrusions (IDBP) for reducing channel-on resistance while maintaining high punch-through voltage. The LMOS includes lower device bulk layer; upper source and upper drain region both located atop lower device bulk layer; both upper source and upper drain region are in contact with an intervening upper body region atop lower device bulk layer; both upper drain and upper body region are shaped to form a drain-body interface; the drain-body interface has an IDBP structure with a surface drain protrusion lying atop a buried body protrusion while revealing a top body surface area of the upper body region; gate oxide-gate electrode bi-layer disposed atop the upper body region forming an LMOS with a short channel length defined by the horizontal length of the top body surface area delineated between the upper source region and the upper drain region.

Abstract: A high withstand voltage transistor is capable of preventing its gate oxidized film from being damaged by a surge voltage/current, and includes: a gate electrode provided in a trench formed on a semiconductor substrate; a source and a drain which are respectively formed on a side of the gate electrode and another side of the gate electrode, and which are a predetermined distance away from the gate electrode; first electric field relaxation layers one of which is formed on a wall of the trench on the side of the source and another one of which is formed on a wall of the trench on the side of the drain; and second electric field relaxation layers one of which is formed between the source and the gate electrode, and another one of which is formed between the drain and the gate electrode.

Abstract: A device is annealed in a deuterium atmosphere. Deuterium penetrates the device to a boundary, which is passivated by the deuterium.

Abstract: The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.

Abstract: A semiconductor structure is provided that includes an asymmetric gate stack located on a surface of high k gate dielectric. The asymmetric gate stack includes a first portion and a second portion, wherein the first portion has a different threshold voltage than the second portion. The first portion of the inventive asymmetric gate stack includes, from bottom to top, a threshold voltage adjusting material and at least a first conductive spacer, while the second portion of the inventive asymmetric gate stack includes at least a second conductive spacer over the gate dielectric. In some embodiments, the second conductive spacer is in direct contact with the underlying high k gate dielectric, while in other embodiments, in which the first and second conductive spacers are comprised of different conductive materials, the base of the second conductive spacer is in direct contact with the threshold adjusting material.

Abstract: A semiconductor device which includes both an E-FET and a D-FET and can facilitate control of the Vth in an E-FET and suppress a decrease in the Vf, and a manufacturing method of the same are provided. A semiconductor device which includes both an E-FET and a D-FET on the same semiconductor substrate includes: a first threshold adjustment layer for adjusting threshold of the E-FET; a first etching stopper layer formed on the first threshold adjustment layer; the second threshold adjustment layer formed on the first etching stopper layer for adjusting threshold of the D-FET; a second etching stopper layer formed on the second threshold adjustment layer; a first gate electrode penetrating through the first etching stopper layer, the second threshold adjustment layer, and the second etching stopper layer, which is in contact with the first threshold adjustment layer; and the second gate electrode penetrating through the second etching stopper layer, which is in contact with the second threshold adjustment layer.

Abstract: An electrostatic discharge protection device includes a substrate where an active region is defined by an isolation layer, a gate electrode simultaneously crossing both the isolation layer and the active region, and a junction region formed in the active region at both sides of the gate electrode and separated from the isolation layer by a certain distance in a direction where the gate electrode is extended. The electrostatic discharge protection device is able to prevent the increase of a leakage current while securing an electrostatic discharge protection property that a semiconductor device requires.

Abstract: A junctionless metal-oxide-semiconductor transistor is described. In one aspect, a transistor device comprises a semiconductor material. The semiconductor material comprises first, second, and third portions. The second portion is located between the first and third portions. The first, second, and third portions are doped with dopants of the same polarity and the same concentration. The transistor device further comprises an electrode connected to the second portion. A current flows between the first and third portions when a voltage is applied to the electrode.

Abstract: A field effect transistor is provided having a source region, a drain region formed in a first well region, and a channel region. The first well region is doped with doping atoms of a first conductivity type. At least a part of the channel region which extends into the first well region is doped with doping atoms of a second conductivity type, the second conductivity type being a different conductivity type than the first conductivity type.

Abstract: A semiconductor structure, which serves as the core of a semiconductor fabrication platform, has a combination of empty-well regions and filled-well regions variously used by electronic elements, particularly insulated-gate field-effect transistors (“IGFETs”), to achieve desired electronic characteristics. A relatively small amount of semiconductor well dopant is near the top of an empty well. A considerable amount of semiconductor well dopant is near the top of a filled well. Some IGFETs (100, 102, 112, 114, 124, and 126) utilize empty wells (180, 182, 192, 194, 204, and 206) in achieving desired transistor characteristics. Other IGFETs (108, 110, 116, 118, 120, and 122) utilize filled wells (188, 190, 196, 198, 200, and 202) in achieving desired transistor characteristics.

Abstract: According to an embodiment of a method for manufacturing a MISFET device, in a semiconductor wafer, a semiconductor layer is formed, having a first type of conductivity and a first level of doping. A first body region and a second body region, having a second type of conductivity, opposite to the first type of conductivity, and an enriched region, extending between the first and second body regions are formed in the semiconductor layer. The enriched region has the first type of conductivity and a second level of doping, higher than the first level of doping. Moreover, a gate electrode is formed over the enriched region and over part of the first and second body regions, and a dielectric gate structure is formed between the gate electrode and the semiconductor layer, the dielectric gate structure having a larger thickness on the enriched region and a smaller thickness on the first and second body regions.

Abstract: Recessed channel array transistor (RCAT) structures and method of formation are generally described. In one example, an electronic device includes a semiconductor substrate, a first fin coupled with the semiconductor substrate, the first fin comprising a first source region and a first drain region, and a first gate structure of a recessed channel array transistor (RCAT) formed in a first gate region disposed between the first source region and the first drain region, wherein the first gate structure is formed by removing a sacrificial gate structure to expose the first fin in the first gate region, recessing a channel structure into the first fin, and forming the first gate structure on the recessed channel structure.

Abstract: An integrated circuit having field effect transistors and manufacturing method. One embodiment provides an integrated circuit including a first FET and a second FET. At least one of source, drain, gate of the first FET is electrically connected to the corresponding one of source, drain, gate of the second FET. At least one further of source, drain, gate of the first FET and the corresponding one further of source, drain, gate of the second FET are connected to a circuit element, respectively. A dopant concentration of a body along a channel of each of the first and second FETs has a peak at a peak location within the channel.

Abstract: An apparatus and method for manufacturing rotated field effect transistors. The method comprises providing a substrate including a first gate structure and a second gate structure, which are not parallel to each other. The method further includes performing a first ion implant substantially orthogonal to an edge of the first gate structure to form a first impurity region and performing a second ion implant at a direction different than that of the first ion implant and substantially orthogonal to an edge of the second gate structure to form a second impurity region under the edge of the second gate structure.

Abstract: A method of manufacturing a semiconductor device forms an N? diffusion layer to be a source/drain region of a grooved transistor simultaneously with an N? diffusion layer of a channel region directly under a gate electrode of an antifuse element. The formation of the N? diffusion layer directly under the gate electrode of the antifuse element stabilizes electrical connection between the gate electrode and the source/drain diffusion region even during writing with a low write voltage.

Abstract: Methods for forming high performance gates in MOSFETs and structures thereof are disclosed. One embodiment includes a method including providing a substrate including a first short channel active region, a second short channel active region and a long channel active region, each active region separated from another by a shallow trench isolation (STI); and forming a field effect transistor (FET) with a polysilicon gate over the long channel active region, a first dual metal gate FET having a first work function adjusting material over the first short channel active region and a second dual metal gate FET having a second work function adjusting material over the second short channel active region, wherein the first and second work function adjusting materials are different.

Abstract: In a method of manufacturing a high withstanding voltage MOSFET, a region to be doped with impurities and a region to be doped with no impurity are provided when ion implantation of the impurities is performed in the channel forming region, for controlling a threshold voltage. The region to be doped with no impurity is suitably patterned so that impurity concentration of the channel forming region near boundaries between a well region and a source region and between the well region and a drain region having the same conductivity type as the well region may be increased, to thereby induce a reverse short channel effect. By canceling a short channel effect with the reverse short channel effect induced by the above-mentioned method, the short channel effect of the high withstanding voltage MOSFET may be suppressed.

Abstract: The present invention provides a method for fabricating a MOS transistor (100) with suppression of edge transistor effect. In one embodiment of an NMOS, an elongate implant limb (110, HOa, 114) extends from each of two sidewalls (14a, 14b) of a p-type well (14) to partially wrap around each respective longitudinal end of the gate (20) and to overlay a portion thereof. In another embodiment, the elongate implant limb (110, 110a) extends into the drain/source drift region (32, 42). The NMOS transistor (100) thus fabricated allows the NMOS transistor to operate at relatively high voltages with reduced drain leakage current but with no additional masks or process time in the process integration.

Abstract: A field effect structure and a method for fabricating the field effect structure include a germanium containing channel interposed between a plurality of source and drain regions. The germanium containing channel is coplanar with the plurality of source and drain regions, and the germanium containing channel includes a germanium containing material having a germanium content greater than the germanium content of the plurality of source and drain regions.

Abstract: Embodiments of the invention relate to an electrostatic discharge (ESD) device and method for forming an ESD device. An embodiment is an ESD protection device comprising a p well disposed in a substrate, an n well disposed in the substrate, a high voltage n well (HVNW) disposed between the p well and the n well in the substrate, a source n+ region disposed in the p well, and a plurality of drain n+ regions disposed in the n well.

Abstract: A method and structure for modulating the threshold voltage of transistor is provided. An opening for an isolation region is formed within a substrate using a masking layer. The masking layer is then pulled back from the opening, and dopants are implanted into the substrate through the exposed surface of the substrate and the sidewalls of the opening. This implantation can be tailored to modulate the threshold voltage of transistors with smaller gate widths without modulating the threshold voltage of other transistors with larger gate widths.

Abstract: A semiconductor device and fabrication method thereof are disclosed. An example semiconductor device includes a semiconductor substrate having a device isolation area defining an active area; a gate oxide layer formed on the active area of the substrate; a gate on the gate oxide layer; a spacer provided to a sidewall of the gate; and a well region provided within the active area. The well region includes a threshold voltage adjustment doped region, a halo region, a source region, a drain region, an additional doped region, and a channel stop region, the additional doped region provided between the well region and each of the source and drain regions.

Abstract: The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.

Abstract: A semiconductor process and apparatus includes forming PMOS transistors (90) with enhanced hole mobility in the channel region by forming a hydrogen-rich silicon nitride layer (91, 136) on or adjacent to sidewalls of the PMOS gate structure as either a hydrogen-rich implant sidewall spacer (91) or as a post-silicide hydrogen-rich implant sidewall spacer (136), where the hydrogen-rich dielectric layer acts as a hydrogen source for passivating channel surface defectivity under the PMOS gate structure.

Abstract: Methods and apparatus are provided for semiconductor device (60, 95, 100, 106). The semiconductor device (60, 95, 100, 106), comprises a first region (64, 70) of a first conductivity type extending to a first surface (80), a second region (66) of a second, opposite, conductivity type forming with the first region (70) a first PN junction (65) extending to the first surface (80), a contact region (68) of the second conductivity type in the second region (66) at the first surface (80) and spaced apart from the first PN junction (65) by a first distance (LDS), and a third region (82, 96-98, 108) of the first conductivity type and of a second length (LBR), underlying the second region (66) and forming a second PN junction (63) therewith spaced apart from the first surface (80) and located closer to the first PN junction (65) than to the contact region (68). The breakdown voltage is enhanced without degrading other useful properties of the device (60, 95, 100, 106).

Abstract: A structure comprises at least one transistor on a substrate, an insulator layer over the transistor, and an ion stopping layer over the insulator layer. The ion stopping layer comprises a portion of the insulator layer that is damaged and has either argon ion damage or nitrogen ion damage.

Abstract: The threshold voltage of a sophisticated transistor may be adjusted by providing a specifically designed semiconductor alloy in the channel region of the transistor, wherein a negative effect of this semiconductor material with respect to inducing a strain component in the channel region may be reduced or over-compensated for by additionally incorporating a strain-adjusting species. For example, a carbon species may be incorporated in the channel region, the threshold voltage of which may be adjusted on the basis of a silicon/germanium alloy of a P-channel transistor. Consequently, sophisticated metal gate electrodes may be formed in an early manufacturing stage.

Abstract: A method for fabricating a PMOS transistor is disclosed herein. In one embodiment, the method can include forming a gate insulation layer and a polysilicon layer over a semiconductor substrate; asymmetrically etching the polysilicon layer; doping the asymmetrically etched polysilicon layer with a P-type dopant; diffusing the dopant in the asymmetrically etched polysilicon layer towards the semiconductor substrate; planarizing the asymmetrically etched polysilicon layer; forming a gate metal layer over the planarized polysilicon layer; forming a hard mask, which delimits a region to be formed with a gate of the PMOS transistor, over the gate metal layer; forming a gate stack by patterning the gate metal layer, the planarized polysilicon layer, and the gate insulation layer; and forming a source/drain in the semiconductor substrate at both sides of the gate stack.

Abstract: A threshold adjusting semiconductor material, such as a silicon/germanium alloy, may be provided selectively for one type of transistors on the basis of enhanced deposition uniformity. For this purpose, the semiconductor alloy may be deposited on the active regions of any transistors and may subsequently be patterned on the basis of a highly controllable patterning regime. Consequently, threshold variability may be reduced.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device. A method may include forming a first well by injecting first conduction type impurity ions on and/or over a semiconductor substrate, forming an extended drain region overlapped with a region of said first well by injecting second conduction type impurities on and/or over a semiconductor substrate, and/or forming a first conduction type second well on and/or over a semiconductor substrate under an extended drain region to overlap with another region of a first well by injecting second conduction type impurities on and/or over a semiconductor substrate. A method may include forming a gate over a first well overlapped with an extended drain region, and/or forming a drain region by injecting second conduction type impurities on and/or over an extended drain region at one side of a gate.

Abstract: An embodiment of a MOS device resistant to ionizing-radiation, has: a surface semiconductor layer with a first type of conductivity; a gate structure formed above the surface semiconductor layer, and constituted by a dielectric gate region and a gate-electrode region overlying the dielectric gate region; and body regions having a second type of conductivity, formed within the surface semiconductor layer, laterally and partially underneath the gate structure. In particular, the dielectric gate region is formed by a central region having a first thickness, and by side regions having a second thickness, smaller than the first thickness; the central region overlying an intercell region of the surface semiconductor layer, set between the body regions.

Abstract: A stressed film applied across a boundary defined by a structure or a body (e.g. substrate or layer) of semiconductor material provides a change from tensile to compressive stress in the semiconductor material proximate to the boundary and is used to modify boron diffusion rate during annealing and thus modify final boron concentrations. In the case of a field effect transistor, the gate structure may be formed with or without sidewalls to regulate the location of the boundary relative to source/drain, extension and/or halo implants. Different boron diffusion rates can be produced in the lateral and vertical directions and diffusion rates comparable to arsenic can be achieved. Reduction of junction capacitance of both nFETs and pFETs can be achieved simultaneously with the same process steps.

Abstract: A method for fabricating a semiconductor structure. The semiconductor structure comprises first and second source/drain regions; a channel region disposed between the first and second source/drain regions; a buried well region in physical contact with the channel region; and a buried barrier region being disposed between the buried well region and the first source/drain region and being disposed between the buried well region and the second source/drain region, wherein the buried barrier region is adapted for preventing current leakage and dopant diffusion between the buried well region and the first source/drain region and between the buried well region and the second source/drain region.

Abstract: A contact efuse structure includes a silicon layer and a contact contacting the silicon layer with one end. When a voltage is applied to the contact, a void is formed at the end of the contact, and thus the contact is open. Such structure may be utilized in an efuse device or a read only memory. A method of making a contact efuse device and a method of making a read only memory are also disclosed.

Abstract: The present disclosure relates to semiconductor devices and a process sequence in which a semiconductor alloy, such as silicon/germanium, may be formed in an early manufacturing stage, wherein other performance-increasing mechanisms, such as a recessed drain and source configuration, possibly in combination with high-k dielectrics and metal gates, may be incorporated in an efficient manner while still maintaining a high degree of compatibility with conventional process techniques.