Abstract: An organic light-emitting display apparatus including a substrate, a display unit arranged on the substrate, an encapsulation substrate arranged on the display unit, a first filler provided between the substrate and the encapsulation substrate, a second filler provided between the substrate and the encapsulation substrate and separate from the first filler, and a sealant provided between the first filler and the second filler and bonding the substrate and the encapsulation substrate.

Abstract: A light-emitting device includes a case including a first substrate and a sidewall on the first substrate, a light-emitting, element that is mounted on the first substrate in a region surrounded by the sidewall and includes a second substrate and a crystal layer, the light-emitting element being formed rectangular in a plane viewed in a direction perpendicular to the first substrate, and a low-refractive-index layer that is located between the light-emitting element and the sidewall and has a smaller refractive index than the second substrate. A side surface along a longitudinal direction of the second substrate is provided with a tapered portion on a side of the first substrate.

Abstract: A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located.

Abstract: Provided are a substrate moving unit for use with a deposition apparatus that allows a deposition material to be precisely deposited on a target site of a substrate. The substrate moving unit includes an electrostatic chuck having a first surface on which a substrate is fixable and a magnetic force applying unit disposed on a second surface of the electrostatic chuck. A deposition apparatus including the substrate moving unit, a method of manufacturing an organic light-emitting display apparatus, and an organic light-emitting display apparatus manufactured by using the method are also presented.

Abstract: An organic light-emitting display apparatus includes a substrate; a device/wiring layer formed on the substrate, including a plurality of thin film transistors (TFTs); an emitting layer formed on the device/wiring layer, including a lower electrode of a capacitor and a plurality of organic light-emitting diodes (OLEDs); an encapsulating layer formed to cover the emitting layer; and an upper electrode of the capacitor formed on the encapsulating layer.

Abstract: An organic light-emitting display apparatus and a fabrication method thereof are disclosed. The organic light-emitting display apparatus may include, for example, a flexible substrate, a plurality of barrier layers formed on the flexible substrate, a thin film transistor (TFT) formed on the barrier layers, the TFT including a semiconductor active layer, and at least one thermal emission layer formed between the barrier layers, an organic light-emitting device (OLED) electrically connected to the TFT, formed on the barrier layers, and an encapsulation portion encapsulating the OLED.

Abstract: A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. The active region is arranged between a first semiconductor layer and a second semiconductor layer. The semiconductor layer sequence includes at least one recess, which extends from a major face of the semiconductor layer sequence facing the carrier through the active region into the first semiconductor layer and is provided for electrical contacting of the first semiconductor layer. The carrier includes a plurality of switches, which are each provided for controlling at least one pixel.

Abstract: An OLED display includes a substrate, an organic light emitting element formed on the substrate, and an encapsulation body formed on the organic light emitting element, and the encapsulation body includes a first structure having a receiving portion and a second structure having thermal conductivity and received in the receiving portion.

Abstract: Provided is an organic light emitting display apparatus. The apparatus may include a substrate including a display region where an image is realized and a non-display region surrounding the display region. The apparatus includes an organic light emitting unit including a first electrode, an intermediate layer, and a second electrode, which are disposed in the display region and are sequentially stacked on the substrate. The apparatus also includes a first inorganic film including a first low temperature viscosity transition (LVT) inorganic material having a first viscosity transition temperature, and covering the organic light emitting unit; and a second inorganic film including a second LVT inorganic material having a second viscosity transition temperature lower than the first viscosity transition temperature, and formed in the non-display region.

Abstract: A product and method for packaging high power integrated circuits or infrared emitter arrays for operation through a wide range of temperatures, including cryogenic operation. The present invention addresses key limitations with the prior art, by providing temperature control through direct thermal conduction or active fluid flow and avoiding thermally induced stress on the integrated circuits or emitter arrays. The present invention allows for scaling of emitter arrays up to extremely large formats, which is not viable under the prior art.

Abstract: Provided is an organic light-emitting display apparatus including a hybrid protective film. The organic light-emitting display apparatus includes a substrate, a display unit disposed on the substrate and including an organic light-emitting device (OLED), and an encapsulation unit encapsulating the display unit and including the hybrid protective film. The hybrid protective film includes an inorganic part layer where carbon is removed, an organic part layer where carbon is contained in a predetermined amount, and a gradient part layer disposed between the inorganic part layer and the organic part layer and increasing an amount of carbon as being more contiguous to the organic part layer.

Abstract: An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.

Abstract: In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.

Abstract: A method of applying a conversion means to an optoelectronic semiconductor chip includes preparing the optoelectronic semiconductor chip having a main radiation face, preparing the conversion means, the conversion means being applied to a main carrier face of a carrier, arranging the conversion means such that it faces the main radiation face and has a spacing relative to the main radiation face, and releasing the conversion means from the carrier and applying the conversion means to the main radiation face by irradiation and heating of an absorber constituent of the conversion means and/or of a release layer located between the conversion means and the carrier with a pulsed laser radiation which passes through the carrier.

Abstract: A photodiode may include an anode, a cathode, a photoelectric conversion layer between the anode and the cathode, and a buffer layer between the photoelectric conversion layer and the anode. The buffer layer may have a dual-layered structure including an organic layer and an inorganic layer.

Abstract: An organic light emitting diode display includes: a flexible substrate configured to be bent at least once; a first display part on the flexible substrate and including a plurality of first light emitting elements; and a second display part on the flexible substrate and including a plurality of second light emitting elements. Each of a first light emitting element and a second light emitting element among the plurality of first and second light emitting elements includes a first electrode, an emission layer and a second electrode, the first electrode of the first light emitting element includes a transparent layer or a semi-transparent layer, the first electrode of the second light emitting element includes a reflective layer, and the second electrode of the first light emitting element and the second light emitting element, includes the transparent layer or the semi-transparent layer.

Abstract: An electro-optical device includes: a pixel region that is formed on a substrate and in which a light emitting element that has a first electrode, a second electrode and a light emitting layer formed between the first electrode and the second electrode is arranged; a partition wall portion that is formed above the substrate and located on an outer side of the pixel region; a connecting line that is formed above the substrate and located on an outer side of the partition wall portion; and a connecting section that is formed above the substrate and electrically connects the second electrode to the connecting line, wherein the second electrode covers and extends over the pixel region and the partition wall portion and does not overlap the connecting line in a planar view.

Abstract: A method to fabricate monolithically-integrated optoelectronic module apparatuses (100) comprising at least two series-interconnected optoelectronic components (104, 106, 108). The method includes deposition and scribing on an insulating substrate or superstate (110) of a 3-layer stack in order (a, b, c) or (c, b, a) comprising: (a) back-contact electrodes (122, 124, 126, 128), (b) semiconductive layer (130), and (c) front-contact components (152, 154, 156, 158). Via holes (153, 155, 157) are drilled so that heat of the drilling process causes a metallization at the surface of said via holes that renders conductive the semi-conductive layer's surface (132, 134, 136, 138) of said via holes, thereby establishing series-interconnecting electrical paths between optoelectronic components (104, 106, 108) by connecting first front-contact components (154, 156) to second back-contact electrodes (124, 126).

Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.

Abstract: An organic light-emitting apparatus includes a lower substrate comprising a display area and a peripheral area around the display area; a first insulating layer on the display area and the peripheral area of the lower substrate, wherein a plurality of penetration holes are formed in the first insulating layer in the peripheral area; an upper substrate on the lower substrate; and a sealant in the plurality of penetration holes bonding the lower substrate to the upper substrate.

Abstract: Disclosed is an organic light emitting display device in which water is prevented from externally permeating thereinto. The organic light emitting display device comprises a first substrate on which an organic light emitting diode and a driving device designed to drive the organic light emitting diode are formed; a second substrate facing the first substrate; a viscosity layer interposed between the first substrate and the second substrate to cover entire areas of the first substrate and the second substrate, the viscosity layer including a filler capable of water absorption; and a first adhesion layer arranged to adhere the viscosity layer to the first substrate, wherein the viscosity layer is a material including a cross-linkage functional group and having a viscosity characteristic at room temperature.

Abstract: The present invention provides a light-emitting element, display panel and manufacturing method thereof. The light-emitting element includes a cathode and an anode, disposed oppositely; and a light-emitting layer, disposed between the cathode and the anode; the light-emitting layer comprising a mixture of organic material and blue quantum dot material. As such, the present invention improves the stability and luminance of the light-emitting element, and the light-emitting element has the advantages of ultra-thin, transparent and easy to bend.

Abstract: The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

Abstract: The present invention addresses the issue of providing a surface sealing agent which can be cured at low temperatures and which exhibits excellent storage stability. In order to resolve this issue, provided is a surface sealing agent for an organic EL element, the surface sealing agent including an epoxy resin (A) having at least two epoxy groups in a molecule, and a curing accelerator (B) which is a salt of a specific quaternary ammonium ion, wherein 0.1-10 parts by weight of the curing accelerator (B) is contained relative to 100 parts by weight of the surface sealing agent.

Abstract: An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary method of making a liquid or gel suspension of diodes comprises: adding a viscosity modifier to a plurality of diodes in a first solvent; and mixing the plurality of diodes, the first solvent and the viscosity modifier to form the liquid or gel suspension of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.

Abstract: An electro-optic device includes a substrate that has a first surface and an end face crossing the first surface; a light emitting element that is disposed on the first surface; a planarization layer that covers the light emitting element; and a first inorganic sealing layer that is disposed on the planarization layer. An outer edge of the first inorganic sealing layer is disposed between an outer edge of the planarization layer and a first region where the light emitting element is disposed.

Abstract: A substrate assembly on which a first conduction-type semiconductor layer, an active layer and a second conduction-type semiconductor layer are formed is disclosed, the substrate assembly comprising a first substrate, a second substrate and a bonding layer interposed there between. In the substrate assembly, the thermal expansion coefficient of the bonding layer is smaller than or equal to that of at least one of the first and second substrates.

Abstract: The present disclosure relates generally to semiconductor techniques. More specifically, embodiments of the present disclosure provide methods for efficiently dicing substrates containing gallium and nitrogen material. Additionally, the present disclosure provides techniques resulting in an optical device comprising a substrate having a dislocation bundle center being used as a conductive region for a contact.

Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.

Abstract: An organic light emitting diode (OLED) display device having a built-in touch panel and a manufacturing method thereof in which an OLED array and a touch array are formed on a flexible substrate and thus the OLED display device has flexibility, and a flexible printed circuit board for driving the touch array is integrally formed with a printed circuit board for driving the OLED array and thus manufacturing costs are reduced are disclosed. The OLED display device includes an OLED array formed on a lower flexible substrate, a touch array formed on an upper flexible substrate, and an adhesive layer adhering the upper flexible substrate to the lower flexible substrate such that the touch array and the OLED array face each other.

Abstract: Light emitting elements (110) are situated on a film (210), then surrounded by a reflective structure (250) that is placed or formed on the film (210). Thereafter, the reflective structure (250) is filled with an encapsulant (270), affixing the light emitting element (110) within the reflective structure (250). The film (210) may then be removed, exposing the contacts (230) for coupling the light emitting element (110) to an external power source. The encapsulated light emitting elements (110) within the reflective structure (250) are diced/singulated to provide the individual light emitting devices. The encapsulant (270) may be molded or otherwise shaped to provide a desired optical function.

Abstract: A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.

Abstract: A method for forming a light emitting device includes forming a monocrystalline III-V emissive layer on a monocrystalline substrate and forming a first doped layer on the emissive layer. A first contact is deposited on the first doped layer. The monocrystalline substrate is removed from the emissive layer by a mechanical process. A second doped layer is formed on the emissive layer on a side from which the substrate has been removed. The second doped layer has a dopant conductivity opposite that of the first doped layer. A second contact is deposited on the second doped layer.

Abstract: A method for manufacturing a light-emitting device, comprises the steps of: providing a carrier; performing a coating step comprises coating a film on the carrier; performing a baking step comprises baking the film at a first temperature; and forming a thick film by repeating the coating step and the baking step a predetermined number of times.

Abstract: The present invention relates to an AC light emitting diode. An object of the present invention is to provide an AC light emitting diode wherein various designs for enhancement of the intensity of light, prevention of flickering of light or the like become possible, while coming out of a unified method of always using only one metal wire with respect to one electrode when electrodes of adjacent light emitting cells are connected through metal wires. To this end, the present invention provides an AC light emitting diode comprising a substrate; bonding pads positioned on the substrate; a plurality of light emitting cells arranged in a matrix form on the substrate; and a wiring means electrically connecting the bonding pads and the plurality of light emitting cells, wherein the wiring means includes a plurality of metal wires connecting an electrode of one of the light emitting cells with electrodes of other electrodes adjacent to the one of the light emitting cells.

Abstract: A method for depositing a layer of phosphor-containing material on a plurality of LED (light-emitting diode) dies on a wafer includes disposing a layer of dry photoresist film over a plurality of LED dies on a wafer, disposing a mask layer over the dry photoresist film, and patterning the dry photoresist film to form a plurality of openings in the dry photoresist film to expose a top surface of each of the LED dies. The method also includes depositing a phosphor-containing material on the exposed top surface of each the LED dies using a screen printing process, and removing the patterned dry photoresist film.

Abstract: The present invention relates to a method of assembling VCSEL chips (1) on a sub-mount (2). A de-wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub-mount (2). A further de-wetting layer (13) is deposited on a connecting side of the sub-mount (2) which is to be connected to the VCSEL chips (1). The de-wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub-mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub-mount (2) and soldered to the sub-mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub-mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub-mount (2) is achieved without time consuming measures.

Abstract: Disclosed is an organic light emitting diode display including an organic light emitting display panel configured to display an image, and a lower passivation film attached to a bottom of the organic light emitting diode display panel. The lower passivation film includes a support film that is in contact with the organic light emitting diode display panel, and a stress adjustment layer formed beneath the support film and configured to reduce a bending stress to be induced in the organic light emitting display panel when the organic light emitting display panel and the lower passivation film are bent.

Abstract: An organic light-emitting display apparatus includes a flexible substrate. The organic light-emitting display apparatus includes a first plastic layer. A first barrier layer is formed on the first plastic layer. A second plastic layer is formed on the first barrier layer. An organic light-emitting device layer is formed on the second plastic layer. A thin film encapsulating layer encapsulates the organic light-emitting device layer. The first barrier layer is patterned to correspond to an area where the organic light-emitting device layer is formed.

Abstract: A light-emitting element package includes plural substrates and plural light-emitting elements disposed on each of the substrates. The light-emitting elements are arranged on each substrate so that an arrangement of the light-emitting elements on each substrate becomes same in an arrangement state in which the substrates are arranged with a regular pitch along a first direction and a second direction which are directions perpendicular to the substrate. The light-emitting elements are arranged on each substrate so that a pitch of the light-emitting elements on each substrate is equal to a pitch of the light-emitting elements between the neighboring substrates in the arrangement state of the substrates.

Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Abstract: A display apparatus and a method of manufacturing the same. The display apparatus includes a substrate, an encapsulation substrate disposed to face the substrate, a display unit formed between the substrate and the encapsulation substrate and displaying an image, and a sealing unit disposed between the substrate and the encapsulation substrate to bond the substrate and the encapsulation substrate to each other and containing a filler containing Cr, Cu, and Mn and a glass frit mixed with the filler.

Abstract: Provided is an organic light-emitting diode (OLED) display including: a first plastic layer; a first barrier layer formed on the first plastic layer; a first intermediate layer formed on the first barrier layer; a second plastic layer formed on the intermediate layer; an OLED layer formed on the second plastic layer; and a thin-film encapsulation layer encapsulating the OLED layer.

Abstract: A compact LED module and a method of manufacturing such an LED module are provided. The LED module includes a first-pole first lead, a first-pole second lead, a first-pole third lead, a second-pole first lead, a second-pole second lead, a second-pole third lead, a first LED chip, a second LED chip, a third LED chip, and a housing. A distal end of the first-pole first lead is offset toward a second-pole side in a first direction with respect to both a distal end of the second-pole second lead and a distal end of the second-pole third lead.

Abstract: A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract: Provided is a method of transferring semiconductor elements formed on a non-flexible substrate to a flexible substrate. Also, provided is a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. A semiconductor element grown or formed on the substrate may be efficiently transferred to the resin layer while maintaining an arrangement of the semiconductor elements. Furthermore, the resin layer acts as a flexible substrate supporting the vertical semiconductor elements.

Abstract: A chip on film for a flexible display device is disclosed. In one aspect, the chip on film includes a base film, a semiconductor chip provided to the base film, and a wire part provided to the base film and electrically connected to the semiconductor chip. The wire part includes a first region and a second region connected to the first region, and a first interval between the wires disposed at an outermost of the first region is different from a second interval between the wires disposed at an outermost area of the second region.

Abstract: The present disclosure is directed to circuitry configurable based on device orientation. Example circuitry may comprise at least one device location and configurable conductors. The at least one device location may include at least two conductive pads onto which a device may be populated by a manufacturing process. The configurable conductors may be coupled to each of the at least two conductive pads. The configurable conductors may be configured by adding conductive material to at least one configurable conductor or subtracting at least part of at least one configurable conductor. For example, conductive material may be added to close a space between two segments of a configurable conductor to form a conduction path. Alternatively, at least part of at least one of a plurality of configurable conductors coupled to a conductive pad may be subtracted (e.g., cut) to stop conduction in the at least one configurable conductor.

Abstract: A laminate capable of emitting light comprises a reflective layer. The reflective layer increases the amount of light output from the laminate. A lighting apparatus containing the improved laminate is also provided.