Abstract: A method for forming a polycrystalline semiconductor layer includes forming a plurality of spacers over a dielectric layer, etching the dielectric layer using the plurality of spacers as an etch mask to form a recess in the dielectric layer, depositing an amorphous semiconductor layer over the plurality of spacers and the dielectric layer to fill the recess, and recrystallizing the amorphous semiconductor layer to form a polycrystalline semiconductor layer.

Abstract: A treatment method is provided that includes an embedding step of embedding an organic film in an undercoat film in which a depression is formed; and an etching step of performing etching, after the embedding step, until at least a portion of a top of the undercoat film is exposed.

Abstract: Improved process flows and methods are provided herein for trimming structures formed on a patterned substrate. In the disclosed process flows and methods, a self-aligned multiple patterning (SAMP) process is utilized for patterning structures, such as mandrels, on a substrate. After the structures are patterned, an atomic layer deposition (ALD) process is used to form a spacer layer on the patterned structures. In the SAMP process disclosed herein, a critical dimension (CD) of the patterned structures is trimmed concurrently with, and as a result of, the formation of the spacer layer by controlling various ALD process parameters and conditions. By trimming the patterned structures in situ of the ALD chamber used to form the spacer layer on the patterned structures, the improved process flows and methods described herein provide a CD trim method that does not adversely affect the pattern profile or process throughput.

Abstract: Memory devices and methods of manufacturing memory devices are provided. The device and methods described suppress oxidation of metal layers exposed to ambient oxygen. After an opening is formed, a nitridation process occurs to nitridate the surface of the exposed metal layer inside the opening. The nitridated region formed on the surface of metal layer inside the opening works as a barrier layer for oxygen diffusion. In addition, the nitridated region works as an electrode for charge trap memory cells.

Abstract: A semiconductor structure includes a metal gate structure comprising a gate dielectric layer and a gate electrode, a conductive layer disposed over the metal gate structure, and a contact feature in direct contact with the top portion of the conductive layer, where the conductive layer includes a bottom portion disposed below a top surface of the metal gate structure and a top portion disposed over the top surface of the metal gate structure, and where the top portion laterally extends beyond a sidewall of the bottom portion.

Abstract: A wiring circuit substrate includes a glass base, insulating resin layers, wire groups, a first inorganic adhesive layer, a through electrode, and second conductive layers. The glass base has a through-hole. The insulating resin layers are laminated to the glass base and each have a conductive via formed therein. The wire groups are laminated to the insulating resin layers. The first inorganic adhesive layer is laminated to the inner surface of the through-hole. The through electrode is formed of a first conductive layer laminated to the first inorganic adhesive layer. The second conductive layers are formed on the through electrode and the glass base and electrically connected to the upper and lower ends of the through electrode. The glass base has a surface roughness Ra of 100 nm or less, and the second conductive layers each have an amount of dishing of 5 ?m or less above the through electrode.

Abstract: A method of forming a photonic device structure comprises forming a photoresist over a photonic material over a substrate. The photoresist is exposed to radiation through a gray-tone mask to form at least one photoexposed region and at least one non-photoexposed region of the photoresist. The at least one photoexposed region of the photoresist or the at least one non-photoexposed region of the photoresist is removed to form photoresist features. The photoresist features and unprotected portions of the photonic material are removed to form photonic features. Other methods of forming a photonic device structure, and a method of forming an electronic device are also described.

Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a material layer over a substrate, wherein the material layer is soluble in a solvent; forming a blocking layer on the material layer; and forming a photoresist layer on the blocking layer, wherein the photoresist layer includes a photosensitive material dissolved in the solvent. The method further includes exposing the photoresist layer; and developing the photoresist layer in a developer.

Abstract: Methods of forming an interconnect structure include depositing a first conductive material on a substrate. Aspects include subtractively etching the conductive material to form a patterned first conductive layer, and depositing a dielectric layer on interconnect structure. Aspects also include depositing a second conductive material on the dielectric layer and removing the second conductive material through the top of the second metal liner.

Abstract: A vertical-type semiconductor device includes a first source/drain (S/D) region on an upper surface of a semiconductor substrate. A channel region is on an upper surface of the first S/D region, and extends along the vertical axis to define a channel length. A second S/D region is on an upper surface of the channel region, and separates the second S/D region from directly contacting the semiconductor substrate. An electrically conductive gate wraps around all outer surfaces of the channel region. The gate extends along the vertical axis to define a gate length that is less than the channel length. Dielectric gate elements are interposed between an upper surface of the gate and a lower surface of the second S/D region, and are configured to electrically insulate the gate from the second S/D region.

Abstract: A method of manufacturing a semiconductor device includes: preparing a wafer in which a first cell area and a second cell area are defined; forming a bottom electrode structure in the first cell area and a dummy structure located in the second cell area; and sequentially forming a dielectric layer and a top electrode on the bottom electrode structure and the dummy structure, wherein the bottom electrode structure includes a plurality of bottom electrodes extending in a first direction in the first cell area and first and second supporters to support the plurality of bottom electrodes, wherein the dummy structure includes a first mold film, a first supporter film, a second mold film, and a second supporter film that are sequentially formed to cover the second cell area, and the second supporter and the second supporter film are at a same level relative to the wafer.

Abstract: Methods of forming an interconnect structure include depositing a first conductive material on a substrate. Aspects include subtractively etching the conductive material to form a patterned first conductive layer, and depositing a dielectric layer on interconnect structure. Aspects also include depositing a second conductive material on the dielectric layer and removing the second conductive material through the top of the second metal liner.

Abstract: An insulating layer is deposited over a transistor structure. The transistor structure comprises a gate electrode over a device layer on a substrate. The transistor structure comprises a first contact region and a second contact region on the device layer at opposite sides of the gate electrode. A trench is formed in the first insulating layer over the first contact region. A metal-insulator phase transition material layer with a S-shaped IV characteristic is deposited in the trench or in the via of the metallization layer above on the source side.

Abstract: Methods are described for forming a flowable low-k dielectric layer on a patterned substrate. The film may be a silicon-carbon-oxygen (Si—C—O) layer in which the silicon and carbon constituents come from a silicon and carbon containing precursor while the oxygen may come from an oxygen-containing precursor activated in a remote plasma region. A similarly deposited silicon oxide layer may be deposited first to improve the gapfill capabilities. Alternatively, or in combination, the flow of a silicon-and-carbon-containing precursor may be reduced during deposition to change the properties from low-k to high strength roughly following the filling of features of the patterned substrate.

Abstract: A method for forming a semiconductor interconnect structure includes forming a dielectric layer on a substrate and patterning the dielectric layer to form an opening therein. A metal layer fills the opening and covers the dielectric layer. The metal layer is planarized so that it is co-planar with a top of the dielectric layer. A treating process is performed on the metal layer to convert a top surface thereof into a metal oxide layer. A copper-containing layer is then formed over the metal oxide layer and the dielectric layer. The copper-containing layer is etched to form interconnect features, wherein the etching stops at the metal oxide layer and does not etch into the underlying metal layer. A radiation exposure process is thereafter performed on the metal oxide layer to convert it into a non-oxidized metal layer.

Abstract: Provided are methods and systems for providing silicon carbide class of films. The composition of the silicon carbide film can be controlled by the choice of the combination of precursors and the ratio of flow rates between the precursors. The silicon carbide films can be deposited on a substrate by flowing two different organo-silicon precursors to mix together in a reaction chamber. The organo-silicon precursors react with one or more radicals in a substantially low energy state to form the silicon carbide film. The one or more radicals can be formed in a remote plasma source.

Abstract: A semiconductor device has a semiconductor die with an active surface. A first conductive layer is formed over the active surface. A first insulating layer is formed over the active surface. A second insulating layer is formed over the first insulating layer and first conductive layer. A portion of the second insulating layer is removed over the first conductive layer so that no portion of the second insulating layer overlies the first conductive layer. A second conductive layer is formed over the first conductive layer and first and second insulating layers. The second conductive layer extends over the first conductive layer up to the first insulating layer. Alternatively, the second conductive layer extends across the first conductive layer up to the first insulating layer on opposite sides of the first conductive layer. A third insulating layer is formed over the second conductive layer and first and second insulating layers.

Abstract: A semiconductor device includes a semiconductor substrate having two surfaces. First side faces second side and includes recesses, and a plurality of through silicon vias (TSV), which penetrate through the semiconductor substrate, are exposed by the recesses. Even when the TSVs have different heights from each other or the degree of back-grinding is changed, due to a process parameters, yield of the semiconductor device is improved by reducing failure caused when a TSV is not exposed.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: The present disclosure provides a method of semiconductor fabrication including forming a dielectric layer is formed on and interposing a first feature and a second feature. A first CMP process is performed on the dielectric layer to removing the dielectric layer from a top surface of the first feature to expose an underlying layer and decreasing a thickness of the dielectric layer disposed on a top surface of the second feature such that a portion of the dielectric layer remains disposed on the top surface of the second feature. Thereafter, a second CMP process is performed which removes the dielectric layer remaining on the top surface of the second feature.

Abstract: A method for cleaning a dielectric and metal structure within a microelectronic structure uses an oxygen containing plasma treatment, followed by an alcohol treatment, in turn followed by an aqueous organic acid treatment. Another method for cleaning a dielectric and metal structure within a microelectronic structure uses an aqueous surfactant treatment followed by an alcohol treatment and finally followed by an aqueous organic acid treatment. The former method may be used to clean a plasma etch residue from a dual damascene aperture. The second method may be used to clean a chemical mechanical polish planarizing residue from a dual damascene structure. The two methods may be used sequentially, absent any intervening or subsequent sputtering method, to provide a dual damascene structure within a microelectronic structure.

Abstract: A semiconductor device is manufactured by forming a lower structure on a substrate including first and second regions, simultaneously forming a first interconnection on the lower structure of the first region and a first portion of a second interconnection on the lower structure of the second region, forming a first interlayer insulating layer on the first interconnection and on the first portion of the second interconnection, forming a trench exposing a top surface of the first portion of the second interconnection in the first interlayer insulating layer, and forming a second portion of the second interconnection in the trench. Related structures are also disclosed.

Abstract: One or more integrated circuit structures and techniques for forming such integrated circuit structures are provided. The integrated circuit structures comprise a conductive structure that is formed within a trench in a dielectric layer on a substrate. The conductive structure is formed over a barrier layer formed within the trench, or the conductive structure is formed over a liner formed over the barrier layer. At least some of the dielectric layer, the barrier layer, the liner and the conductive structure are removed, for example, by chemical mechanical polishing, such that a step height exists between a top surface of the substrate and a top surface of the dielectric layer. Removing these layers in this manner removes areas where undesired interlayer peeling is likely to occur. A conductive cap is formed on the conductive structure.

Abstract: A method of producing a metal gate structure. The method includes forming a gate structure above a semiconductor substrate and performing one or more chemical metal planarization (CMP) processes to planarize the formed gate structure using a CMP tool. An in situ gate etching process is performed in a CMP cleaner of the CMP tool to form a gate recess. A contact etch stop layer (CESL) can then be deposited in the formed gate recess and one or more CMP processes performed to planarize the CESL.

Abstract: A method for forming a semiconductor structure includes providing a semiconductor substrate and forming a dielectric layer over the semiconductor substrate. An opening is formed in the dielectric layer. A conductive line is formed in the opening, wherein the conductive line has an open void formed therein. A sealing metal layer is formed overlying the conductive line, the dielectric layer, and the open void, wherein the sealing metal layer substantially fills the open void. The sealing metal layer is planarized so that a top surface thereof is substantially level with a top surface of the conductive line. An interconnect feature is formed above the semiconductor substrate, wherein the interconnect feature is electrically coupled with the conductive line and the sealing metal layer-filled open void.

Abstract: A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate.

Abstract: An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.

Abstract: A method of forming a semiconductor device may include, but is not limited to, the following processes. A multi-layered structure is prepared over a semiconductor substrate. The multi-layered structure may include, but is not limited to, first and second patterns of a first insulating film, a second insulating film covering the first pattern of the first insulating film, and a first conductive film covering the second pattern of the first insulating film. The second insulating film and the first conductive film are polished under conditions that the first and second insulating films are greater in polishing rate than the first conductive film, to expose the first and second patterns of the first insulating film.

Abstract: Processes for forming integrated circuits and integrated circuits formed thereby are provided in which a first dielectric layer including a first dielectric material is formed on an underlying substrate. A first etch mask having at least two patterned recesses is patterned over the first dielectric layer. At least one first-level via is etched in the first dielectric layer through one patterned recess in the first etch mask with a first etchant, and the first-level via is filled with electrically-conductive material. A second dielectric layer including a second dielectric material is formed over the first dielectric layer. A second etch mask having patterned recesses corresponding to the patterned recesses of the first etch mask is patterned over the second dielectric layer. Second-level vias are etched in the second dielectric layer through the patterned recesses in the second etch mask with a second etchant and exposed to the first etchant.

Abstract: Devices and methods for forming a self-aligned airgap interconnect structure includes etching a conductive layer to a substrate to form conductive structures with patterned gaps and filling the gaps with a sacrificial material. The sacrificial material is planarized to expose a top surface of the conductive layer. A permeable cap layer is deposited over the conductive structure and the sacrificial material. Self-aligned airgaps are formed by removing the sacrificial material through the permeable layer.

Abstract: A method for forming a semiconductor interconnect structure includes forming a dielectric layer on a substrate and patterning the dielectric layer to form an opening therein. A metal layer fills the opening and covers the dielectric layer. The metal layer is planarized so that it is co-planar with a top of the dielectric layer. A treating process is performed on the metal layer to convert a top surface thereof into a metal oxide layer. A copper-containing layer is then formed over the metal oxide layer and the dielectric layer. The copper-containing layer is etched to form interconnect features, wherein the etching stops at the metal oxide layer and does not etch into the underlying metal layer. A radiation exposure process is thereafter performed on the metal oxide layer to convert it into a non-oxidized metal layer.

Abstract: A variable resistance memory device includes: a pair of first electrodes and a second electrode interposed between the pair of first electrodes; a first variable resistance material layer interposed between one of the first electrodes and the second electrode; and a second variable resistance material layer interposed between the other of the first electrodes and the second electrode, wherein the pair of first electrodes are electrically connected to each other, and a first set voltage and a first reset voltage of the first variable resistance material layer are different from a second set voltage and a second reset voltage of the second variable resistance material layer, respectively.

Abstract: One illustrative method disclosed herein includes forming at least one layer of insulating material above a conductive structure, forming a patterned hard mask comprised of metal above the layer of insulating material, performing at least one etching process to define a cavity in the layer of insulating material, forming a layer of sacrificial material so as to overfill the cavity, performing at least one planarization process to remove a portion of the layer of sacrificial material and the patterned hard mask while leaving a remaining portion of the layer of sacrificial material within the cavity, and removing the remaining portion of the layer of sacrificial material positioned within the cavity.

Abstract: A fin field-effect transistor structure comprises a substrate, a fin channel, a source/drain region, a high-k metal gate and a plurality of slot contact structures. The fin channel is formed on the substrate. The source/drain region is formed in the fin channel. The high-k metal gate formed on the substrate and the fin channel comprises a high-k dielectric layer and a metal gate layer, wherein the high-k dielectric layer is arranged between the metal gate layer and the fin channel. The slot contact structures are disposed at both sides of the metal gate.

Abstract: A semiconductor device is fabricated by forming a lower conductor in a first interlayer dielectric film. A second interlayer dielectric film is formed on the lower conductor and the first interlayer dielectric film. A first hard mask pattern is formed on the second interlayer dielectric film. The first mask pattern has a first opening extending in a first direction. A planarization layer is formed on the first hard mask pattern. A mask pattern is formed on the planarization layer. The mask pattern has a second opening extending in a second direction perpendicular to the first direction. The lower conductor is positioned under an region where the first opening and the second opening overlap. A via hole and a trench connected to the via hole is formed using the first hard mask pattern and the mask pattern. The via hole exposes an upper surface of the lower conductor.

Abstract: Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 ?m. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

Abstract: A method for fabricating integrated circuits includes providing a substrate including a protecting layer over an oxide layer and etching a recess through the protecting layer and into the oxide layer. A barrier material is deposited over the substrate to form a barrier layer including a first region in the recess and a second region outside the recess. A conductive material is deposited over the barrier layer and forms an embedded electrical interconnect in the recess and an overburden region outside the recess. The overburden region of the conductive material is removed and a portion of the embedded electrical interconnect is recessed. Thereafter, the barrier layer is etched to remove the second region of the barrier layer and to recess a portion of the first region of the barrier layer. After etching the barrier layer, the protecting layer is removed from the oxide layer.

Abstract: A selective conductive cap is deposited on exposed metal surfaces of a metal line by electroless plating selective to exposed underlying dielectric surfaces of a metal interconnect structure. A dielectric material layer is deposited on the selective conductive cap and the exposed underlying dielectric layer without a preclean. The dielectric material layer is planarized to form a horizontal planar surface that is coplanar with a topmost surface of the selective conductive cap. A preclean is performed and a dielectric cap layer is deposited on the selective conductive cap and the planarized surface of the dielectric material layer. Because the interface including a surface damaged by the preclean is vertically offset from the topmost surface of the metal line, electromigration of the metal in the metal line along the interface is reduced or eliminated.

Abstract: Techniques disclosed herein prevent wire flaking (collapse). One aspect is an improved way of forming wires over trenches, which may be located in a hookup region of a 3D memory array, and may be used to form electrical connections between conductive lines in the memory array and drivers. The trenches are formed between CMP dummy structures. The trenches are partially filled with a flowable oxide film, which leaves a gap in the trench that is at least as wide as the total pitch of the wires to be formed. A capping layer is formed over the flowable film. After forming a conductive layer over the dielectric layer, the conductive layer is etched to form conductive wires. Some of the capping layer, as well as the CMP dummy structures may be removed. Thus, the conductive wires may be at least temporarily supported by lines of material formed from the capping layer.

Abstract: A method for forming a semiconductor interconnect structure includes forming a dielectric layer on a substrate and patterning the dielectric layer to form an opening therein. A metal layer fills the opening and covers the dielectric layer. The metal layer is planarized so that it is co-planar with a top of the dielectric layer. A treating process is performed on the metal layer to convert a top surface thereof into a metal oxide layer. A copper-containing layer is then formed over the metal oxide layer and the dielectric layer. The copper-containing layer is etched to form interconnect features, wherein the etching stops at the metal oxide layer and does not etch into the underlying metal layer. A radiation exposure process is thereafter performed on the metal oxide layer to convert it into a non-oxidized metal layer.

Abstract: A method is provided which includes providing a dielectric material having a dielectric constant of about 4.0 or less and at least one conductive material embedded therein, the at least one conductive material has an upper surface that is coplanar with an upper surface of the dielectric material and the upper surface of the at least one conductive material has hollow-metal related defects that extend inward into the at least one conductive material; and filling the hollow-metal related defects with a surface repair material.

Abstract: Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is then removed from the assembly.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: Embodiments of a method for fabricating integrated circuits are provided, as are embodiments of an integrated circuit. In one embodiment, the method includes the steps of depositing an interlayer dielectric (“ILD”) layer over a semiconductor device, depositing a barrier polish stop layer over the ILD layer, and patterning at least the barrier polish stop layer and the ILD layer to create a plurality of etch features therein. Copper is plated over the barrier polish stop layer and into the plurality of etch features to produce a copper overburden overlying the barrier polish stop layer and a plurality of conductive interconnect features in the ILD layer and barrier polish stop layer. The integrated circuit is polished to remove the copper overburden and expose the barrier polish stop layer.

Abstract: A test pad structure in a back-end-of-line metal interconnect structure is formed by repeated use of the same mask set, which includes a first line level mask, a first via level mask, a second line level mask, and a second via level mask. The test pad structure includes a two-dimensional array of test pads such that a first row is connected to a device macro structure in the same level, and test pads in another row are electrically connected to another device macro structure of the same design at an underlying level. The lateral shifting of electrical connection among pads located at different levels is enabled by lateral extension portions that protrude from pads and via structures that contact the lateral extension portions. This test pad structure includes more levels of testable metal interconnect structure than the number of used lithographic masks.

Abstract: A damascene process incorporating a GCIB step is provided. The GCIB step can replace one or more CMP steps in the traditional damascene process. The GCIB step allows for selectable removal of unwanted material and thus, reduces unwanted erosion of certain nearby structures during damascene process. A GCIB step may also be incorporated in the damascene process as a final polish step to clean up surfaces that have been planarized using a CMP step.

Abstract: A contact for memory cells and integrated circuits having a conductive layer supported by the sidewall of a dielectric mesa, memory cells incorporating such a contact, and methods of forming such structures.

Abstract: A method for making a semiconductor device comprises forming an electrical interconnect layer, forming a first dielectric layer over the interconnect layer, forming an opening in the first dielectric layer over a first electrical interconnect of the interconnect layer, forming an aluminum layer over the first dielectric layer, etching the aluminum layer to form an aluminum die pad, forming a second dielectric layer over the aluminum die pad and the first dielectric layer, and forming a conductive via through the first and second dielectric layers to contact a second electrical interconnect of the interconnect layer.

Abstract: Disposable gate structures are formed on a semiconductor substrate. A planarization dielectric layer is deposited over the disposable gate structures and planarized to provide a top surface that is coplanar with top surface of the disposable gate structures. The planarization dielectric layer at this point includes gap-fill keyholes between narrowly spaced disposable gate structures. A printable dielectric layer is deposited over the planarization dielectric layer to fill the gap-fill keyholes. Areas of the printable dielectric layer over the gap-fill keyholes are illuminated with radiation that cross-links cross-linkable bonds in the material of the printable dielectric layer. Non-crosslinked portions of the printable dielectric layer are subsequently removed selective to crosslinked portions of the printable dielectric layer, which fills at least the upper portion of each gate-fill keyhole. The disposable gate structures are removed to form gate cavities.

Abstract: An integrated circuit includes electrical components that include one or more electrical elements on one or more dielectric layers. The electrical element has a geometric shape that exceeds prescribed integrated circuit manufacturing limits in at least one dimension. To achieve compliance with foundry rules, the electrical element is fabricated to include a non-conducting region that negligibly effects the electrical characteristics. The non-conducting region includes a hole, a series of holes, a slot and/or a series of slots spaced within the electrical element at dimensions that are less than the integrated circuit manufacturing limits.