Abstract: An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.

Abstract: Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

Abstract: In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Abstract: A method is provided for making a crystalline silicon solar cell on a low purity substrate by depositing p+-p-n+, or n+-n-p+ layers of amorphous silicon, depending on the type of wafer, on a crystalline silicon substrate, such as an upgraded metallurgical grade silicon substrate, with substrate vias of varying diameters formed thereon, annealing the stack of amorphous silicon layers to cause solid phase epitaxial crystallization, and metallizing the substrate assembly using standard metallization techniques. One embodiment of the present invention provides depositing a passivation layer onto the third deposited silicon layer subsequent to the crystallization. Another embodiment provides depositing a passivation layer on the back side of the substrate subsequent to crystallization and punching selected regions at the substrate vias prior to back metallization.

Abstract: A method for creating graded or tapered dopant profiles in a semiconductor layer or layers. Preferably, a sub-micron horizontal tip feature is used to control the doping of the layer beneath the feature.

Abstract: Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.

Abstract: A solid state imaging device includes: a substrate having an opening portion; a solid state imaging element mounted to the substrate through a flip-chip process; and a resin mold portion formed on a rear surface of the solid state imaging element. The resin mold portion has a surface of an uneven shape.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract: Nanostructures and photovoltaic structures are disclosed. Method for creating nanostructures are also presented. A method according to one embodiment includes adding a template to a substrate; depositing conductive material in the template thereby forming an array of conductive nanocables on the substrate; removing at least part of the template; and depositing at least one layer of photovoltaic material on exposed portions of the conductive nanocables. A nanostructure according to one embodiment includes an array of nanocables extending from a substrate, the array of nanocables having physical characteristics of having been formed using an at least partially removed template; an insulating layer extending along the substrate; and at least one layer of photovoltaic material overlaying portions of the nanocables.

Abstract: An optical functional device-mounted module and a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.

Abstract: According to an embodiment, a solar cell receiver for converting solar energy to electricity includes a ceramic substrate, a solar cell and a heat sink. The ceramic substrate has a first metallized surface and an opposing second metallized surface. The first metallized surface of the ceramic substrate has separated conductive regions. The solar cell has a conductive first surface connected to a first one of the conductive regions of the ceramic substrate and an opposing second surface having a conductive contact area connected to a second one of the conductive regions. The heat sink is bonded to the second metallized surface of the ceramic substrate with a thermally conductive attach media, such as a metal-filled epoxy adhesive or solder.

Abstract: A method for manufacturing a photovoltaic module can include depositing a heavy metal-immobilizing agent proximate to one or more components of a photovoltaic module.

Abstract: A photovoltaic cell for converting a light source into electricity, including an at least partially transparent cell wall having an intenor surface, an electrolyte, disposed within the cell wall, containing a redox species, and at least partially transparent conductive coating disposed on the intenor surface, an anode adapted to convert photons to electrons, including a porous titania film disposed on the conductive coating and adapted to contact the redox species, the film having a plurality of continuous areas separated by gaps disposed along a length of the film, and a dye, absorbed on a surface of the film, a cathode disposed opposite the anode, to effect electrolytic communication, via the electrolyte, with the porous film, and at least two conductor structures, disposed within the gaps, electrically connected to the anode and to the conductive coating, and abutting the film

Abstract: An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

Abstract: The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.

Abstract: Methods of forming a substrate for microelectronic packaging may include electroplating a metal seed layer onto a sidewall of a trench extending through the substrate. The sidewall may be patterned to have at least one slot therein that extends through the substrate. This slot is formed to be sufficiently narrow to block plating of the metal seed layer onto sidewalls of the slot. Thereafter, the at least a pair of electrodes are selectively electroplated onto side-by-side portions of the metal seed layer on the sidewall of the trench. During this electroplating step, the slot is used to provide a self-aligned separation between the pair of electrodes.

Abstract: An image capture unit and its manufacturing method. The image capture unit includes a thinned-down integrated circuit chip having an image sensor on its upper surface side. A wall extends above a peripheral upper surface ring-shaped area, and a lens rests on the high portion of the wall.

Abstract: Methods and devices are provided for improved environmental protection for photovoltaic devices and assemblies. In one embodiment, the device comprises of an individually encapsulated solar cell, wherein the encapsulated solar cell includes at least one protective layer coupled to at least one surface of the solar cell and the protective layer may be formed from a substantially inorganic material. The protective layer has a chemical composition that prevents moisture from entering the solar cell and wherein light passes through the protective layer to reach an absorber layer in the solar cell.

Abstract: A solar cell module 1 includes a plurality of solar cells 30. Each of the plurality of solar cells 30 is disposed on a corresponding one of a plurality of pad sections in such a manner that the each of the plurality of solar cells 30 is electrically connected to the corresponding one of the plurality of pad sections. The each of the plurality of solar cells 30 is electrically connected to a corresponding inner lead section 120. A cathode section 114 and an anode section 116 feed an electric current generated by the plurality of solar cells 30. A metal lead frame is provided such that the plurality of pad sections, the inner lead sections 120, the cathode section 114 and the anode section 116 are provided therein as a part of the lead frame itself. This configuration enables the solar cell module 1 to endure against bending stress and to be curved. As a result, it is possible to provide a solar cell module which can be disposed along a curved surface of an electronics device.

Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

Abstract: A degradation-resistant photovoltaic device is provided. The device includes an active area and at least one photovoltaic cell located in the active area. The photovoltaic cell has an elongated shape with a characteristic width and a characteristic length. The characteristic length is greater than the characteristic width and an average distance from the photovoltaic cell to any edge of the active area is greater than the characteristic width.

Abstract: A device includes an integrated circuit (IC) and at least one ultra-small resonant structure formed on said IC. At least the ultra-small resonant structure portion of the device is vacuum packaged. The ultra-small resonant structure portion of the device may be grounded or connected to a known electrical potential. The ultra-small resonant structure may be electrically connected to the underlying IC, or not.

Abstract: A housing comprises a transparent exterior coating, a photoelectric conversion coating bonded with the exterior coating and a substrate molded on the photoelectric conversion coating. The photoelectric conversion coating has electrode contacts thereon. The photoelectric conversion coating is used to convert light energy to electrical energy. The disclosure also describes an electronic device using the housing and a method for making the housing there.

Abstract: A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: The present invention relates to a back sheet for solar cell and a method of manufacturing the same. The back sheet for solar cell comprises a substrate and a fluoropolymer layer, wherein the components by weight of the fluoropolymer layer are as follows: 25˜45 parts of fluororesin; 1.5˜3 parts of modified resin; 0.5˜3 parts of polymeric filler; 0.1˜1 parts of inorganic filler; and 50˜70 parts of solvent. The back sheet for solar cell provided by the present invention has low cost and excellent performances, such as high peeling strength, good waterproof performance, and good weathering resistance. The method of manufacturing the back sheet for solar cell provided by the present invention is simple in process, and thus can achieve continuous industrial production.

Abstract: A photovoltaic module includes an encapsulated photovoltaic element and an infrared transmissive decorative overlay simulating conventional roofing.

Abstract: A solar cell device. The device has a housing member. The device also has a lead frame member coupled to the housing member. In a preferred embodiment, the lead frame member has at least one photovoltaic strip thereon, which has a surface region and a back side region. The device has an optical elastomer material having a first thickness overlying the surface region of the photovoltaic surface. The device has a second substrate member comprising at least one optical concentrating element thereon. The optical concentrating element has a first side and a second side. The device has a first interface within a vicinity of the surface region and the first thickness of the optical elastomer material and a second interface within a vicinity of the second side and the optical elastomer material.

Abstract: In an image sensor chip package method, a transparent substrate having an upper surface, a lower surface, and through holes is provided. The through holes pass through the transparent substrate. Conductive posts are formed in the through holes. A sealing ring is formed on the lower surface of the transparent substrate. A chip having an active surface, an image sensitive area, and die pads is provided. The image sensitive area and the die pads are located on the active surface. Conductive bumps are formed and respectively disposed on the die pads for respectively connecting the conductive posts. At the time the active surface of the chip is turned to face toward the lower surface of the transparent substrate. The chip is assembled to the transparent substrate and electrically connected with the conductive posts via the die pads. The sealing ring surrounds the image sensitive area and the die pads.

Abstract: An ultrahigh durability solar cell module that can be used semi-permanently, with an ultrahigh durability transparent substrate, solar cell element and filler, wherein the solar cell element and a liquid substance or a gel obtained by reacting the liquid substance as the filler, are sealed by a fast sealed structure comprising a high durability crosslinking reactive adhesive provided between a glass panel and back side protective substrate, and a hot-melt adhesive. The module is produced by placing the sealing compound, solar cell element and liquid substance on the glass panel and finally laying the back side protective substrate to form a provisional laminated body, and then compression bonding the provisional laminated body at room temperature in a vacuum for sealing.

Abstract: The invention relates generally to methods of fabricating photovoltaic stack structures. Methods of the invention find particular use in solar cell fabrication. The performance of a photovoltaic stack can be improved by independent control of fabrication conditions during stack formation, particularly depositing window layers after formation of absorber layers where fabrication conditions of absorber layers would otherwise detrimentally affect quantum grain structures of window layers.

Abstract: The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite ends of the device through a nonconductive molding material used to package the device. The thermal clip and source pad can be either top or bottom-exposed. The gate, source and drain leads are exposed through the molding material, and all leads are coplanar with the bottom-exposed surface. The device can have multiple semiconductor dies or various sized dies while still having a single, constant footprint. The method of manufacturing requires attaching the semiconductor die to a thermal clip, and then attaching the die with the attached thermal clip to a lead frame. The resulting device is then molded, marked, trimmed and singulated, in this order, creating a packaged semiconductor device with dual exposed surfaces.

Abstract: Thin semiconductor die packages and associated systems and methods are disclosed. A package in accordance with a particular embodiment includes a semiconductor die having die bond sites, a conductive structure positioned proximate to the semiconductor die and having first bond sites and second bond sites spaced apart from the first bond sites, and conductive couplers connected between the first bond sites of the conductive structure and the die bond sites of the semiconductor die. A cover can be positioned adjacent to the semiconductor die, and can include a recess in which the conductive couplers are received.

Abstract: A fingerprint sensor chip package method and the package structure thereof are disclosed. The invention includes: providing a substrate; arranging a sensor chip on the substrate, with an active surface of the sensor chip facing upward; forming a patterned conductive colloid on the sensor chip, wherein the patterned conductive colloid extends from the periphery of the active surface of the sensor chip along the side wall of the sensor and electrically connects with the circuit layer of the substrate; forming a non-conductive film to cover the sensor chip, the patterned conductive colloid and a portion of the substrate; and forming a conductive film on the non-conductive film. The patterned conductive colloid replaces the conventional bond wires to improve the product yield and to omit the molding process. The conductive film is electrically connected with the grounding point/area on the substrate to dissipate the static charges for protecting the chip.

Abstract: A photovoltaic device comprising a photovoltaic cell and at least one layer, the photovoltaic ceil and at least one layer wrapped from the inside out to form the photovoltaic device having a vertical geometry is provided. The photovoltaic device can be a variety of shapes. These shapes include a cylinder, square, oval, rope, ribbon, oblong and rectangular. Generally, the photovoltaic cell has at least on semiconductor, a hirfi work-function electrode and a low work-function electrode.

Abstract: A radiation detecting apparatus according to the present invention includes: pixels including switching elements arranged on an insulating substrate and conversion elements arranged on the switching elements to convert a radiation into electric carriers, the switching elements and the conversion elements are connected with each other, the pixels two-dimensionally arranged on the insulating substrate in a matrix; gate wiring commonly connected with a plurality of switching elements arranged in a row direction on the insulating substrate; signal wiring commonly connected with a plurality of switching elements arranged in a column direction; and a plurality of insulating films arranged between the switching elements and the conversion elements, wherein at least one of the gate wiring and the signal wiring is arranged to be put between the plurality of insulating films.

Abstract: A photoelectronic element having a transparent adhesion structure includes a supporting substrate; a first transparent adhesion layer formed on the supporting substrate; a second transparent adhesion layer formed on the first transparent adhesion layer; and a first semiconductor stack layer formed on the second transparent adhesion layer wherein the first semiconductor stack layer includes a first active layer; wherein the interface between the first transparent adhesion layer and the second transparent adhesion layer contains hydrogen-oxygen bond after being treated by an activator.

Abstract: Methods for forming photovoltaic modules, and the photovoltaic modules produced by such methods are provided. A back-electrode layer is disposed on an elongated substrate. A first patterning is performed on the back-electrode layer using a laser scriber or a mechanical scriber. A semiconductor junction layer is disposed on top of the back-electrode layer. A second patterning is performed on the semiconductor junction layer using a mechanical scriber. A transparent conductor layer is disposed on top of the semiconductor junction layer. A third patterning is performed on the transparent conductor layer using a mechanical scriber thereby forming at least a first solar cell and a second solar cell, where the first solar cell and the second solar cell each comprise an isolated portion of the back-electrode layer, the semiconductor junction layer, and the transparent conductor layer.

Abstract: A semiconductor device includes a pair of power chips, an IC chip, a plurality of leads one of which having a die pad on which the power chips are mounted and another one having a die attach portion on which the IC chip is mounted, a resin sheet firmly adhered to one side of the die pad, and a resin casing made by molding operation to encapsulate the power chips, the IC chip and the resin sheet by a resin in such a manner that one surface of the resin sheet opposite the die pad is exposed to the exterior of the resin casing. The resin casing has a groove formed in one surface opposite the exposed surface of the resin sheet, the groove extending parallel to the resin sheet and perpendicular to a runner through which the resin was supplied in the molding operation.

Abstract: A method for fabricating a photovoltaic element with stabilised efficiency is proposed. The method comprises the following steps: preparing a boron-doped, oxygen-containing silicon substrate; forming an emitter layer on a surface of the silicon substrate; and a stabilisation treatment step. The stabilisation treatment step comprises keeping the temperature of the substrate during a treatment time within a selectable temperature range having a lower temperature limit of 50° C., preferably 90° C., more preferably 130° C. and even more preferably 160° C. and an upper temperature limit of 230° C., preferably 210° C., more preferably 190° C. and even more preferably 180° C., and generating excess minority carriers in the silicon substrate during the treatment time, for example, by illuminating the substrate or by applying an external voltage. This method can be used to fabricate a photovoltaic element, e.g.

Abstract: A sealed photovoltaic module comprising: a first substrate, a second substrate, at least one photovoltaic element positioned between the first and second substrates, and an edge seal between the first and second substrates positioned at or near an edge of and between the substrates, the edge seal comprising a moisture resistive material.

Abstract: A method of forming a multijunction solar cell including an upper subcell, a middle subcell, and a lower subcell by providing a first substrate for the epitaxial growth of semiconductor material; forming a first solar subcell on the substrate having a first band gap; forming a second solar subcell over the first solar subcell having a second band gap smaller than the first band gap; forming a graded interlayer over the second subcell; forming a third solar subcell over the graded interlayer having a fourth band gap smaller than the second band gap such that the third subcell is lattice mismatched with respect to the second subcell; attaching a surrogate second substrate over the third solar subcell and removing the first substrate; and etching a first trough around the periphery of the solar cell to the surrogate second substrate so as to form a mesa structure on the surrogate second substrate and facilitate the removal of the solar cell from the surrogate second substrate.

Abstract: The present invention relates to a functional device capable of providing a functional device such as a dye-sensitized solar cell or the like, which is capable of maintaining high characteristics, and a method for manufacturing the functional device. A dye-sensitized solar cell serving as a functional device includes a transparent substrate 12a on which a transparent conductive film 13a is formed; a substrate 12b on which a conductive film 13b is formed; an electrolyte solution 16 filled between the two substrates; an inner main seal 15a composed of a first ultraviolet-curable resin so as to seal the electrolyte solution and bond the two substrates together; and an outer main seal 17a composed of a second ultraviolet-curable resin so as to bond the two substrates together outside the inner main seal.

Abstract: A method for wafer-to-wafer bonding of a sensor readout circuitry separately fabricated with a silicon substrate to a photodiode device made of non-silicon materials grown from a separate substrate. In preferred embodiments the non-silicon materials are epitaxially grown on a silicon wafer. The bonding technique of preferred embodiments of the present invention utilizes lithographically pre-fabricated metallic interconnects to connect each of a number of pixel circuits on a readout circuit wafer to each of a corresponding number of pixel photodiodes on a photodiode wafer. The metallic interconnects are extremely small (with widths of about 2 to 4 microns) compared to prior art bump bonds with the solder balls of diameter typically larger than 20 microns. The present invention also provides alignment techniques to assure proper alignment of the interconnects during the bonding step.

Abstract: A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.

Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a sensor element disposed in a semiconductor substrate; an inter-level dielectric (ILD) disposed on the semiconductor substrate; and a trench disposed in the ILD, overlying and enclosing the sensor element, and filled with a first dielectric material.

Abstract: A method of manufacturing the solar cell module 100 according to the embodiment of the present invention includes: a step of forming the plurality of thin line-shaped electrodes and the connecting electrode connected to one end portion of each of the plurality of thin line-shaped electrodes; a step of disposing the first resin layer on the blanket; and a step of transferring the first resin layer onto the blanket by pressing the blanket against the photoelectric conversion part. In the disposing step, the plurality of concave portions is formed in the first resin layer along the outer edge of the connecting electrode. In the transferring step, each concave portion is disposed at one end portion of each thin line-shaped electrode.

Abstract: A photoelectric transmitting or receiving device and the manufacturing method thereof are provided. The photoelectric transmitting device comprises a substrate, a first conductive layer, a second conductive layer and a photoelectric transducing chip. The substrate has an upper surface and a recess and is made of a composite material. The recess is defined by a bottom surface and an inner lateral wall extended upwardly from the bottom surface to the upper surface. The first conductive layer and the second conductive layer are formed by using laser to activate the composite material of the substrate. The first conductive layer is disposed on the bottom surface of the recess, and is extended outwardly along the inner lateral wall of the recess and the upper surface of the substrate. The second conductive layer is electrically insulated from the first conductive layer and is extended outwardly along the upper surface of the substrate.

Abstract: A manufacturing method of a solar cell module includes a rear-surface-side protection member having a metal layer sandwiched between a plurality of resin layers, the method comprising the steps of: forming a pair of first slits and a second slit in the rear-surface-side protection member to form a pair of movable portions on both sides of the second slit, the second slit extending between and communicating with the pair of the first slits; opening each of the pair of movable portions; performing an insulating treatment on at least a part of the metal layer exposed to the surface of each of the pair of movable portions; and sealing a solar cell between a light-receiving-surface-side protection member and the rear-surface-side protection member, wherein one end portion of an output lead is drawn out from between the pair of movable portions, the output lead being configured to draw electric power from the solar cell.

Abstract: According to an embodiment, a method of manufacturing a solar cell includes depositing a sequence of layers of semiconductor material forming at least one solar cell on a first substrate; temporarily bonding a flexible film to a support second substrate; permanently bonding the sequence of layers of semiconductor material to the flexible film so that the flexible film is interposed between the first and second substrates; thinning the first substrate while bonded to the support substrate to expose the sequence of layers of semiconductor material; and subsequently removing the support substrate from the flexible film.