Abstract: A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove in the resin layer so as to surround the light receiving region; and subsequently mold-sealing the photodiode by loading the substrate into a mold and filling the mold with a molding resin.

Abstract: A new process of edge sealing for solar cell modules is described. The process comprises coating a waterproof material on the edge of the solar cell module to form a U-like shaped edge sealing which can achieve the function of shock absorber.

Abstract: A process of manufacturing a solar cell module, the process comprising: (i) providing a solar cell pre-laminate assembly comprising a solar cell component comprising one or a plurality of solar cells and an encapsulant film or sheet consisting essentially of a non-neutralized acid copolymer composition prepared from (a) non-neutralized acid copolymer of an alpha olefin and about 15 to about 23 wt % of alpha,beta-ethylenically unsaturated carboxylic acid having 3 to 8 carbons, based on the total weight of the acid copolymer, wherein the acid copolymer has a Melt Index of greater than 100 to about 600 g/10 min, and (b) about 0.01 to about 10 wt %, based upon the total weight of the acid copolymer composition, of organic peroxide; and (ii) laminating the pre-laminate assembly to form the solar cell module by subjecting the assembly to heat and, optionally, vacuum.

Abstract: An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [?0] thereof is in a range of from 1×102 to 1×106 mPa·sec, and satisfies the following equation (1): 1<[?1]/[?0]?3??(1) where in the equation (1), [?0] represents the minimum melt viscosity of the anisotropic conductive material, and [?1] represents a melt viscosity at a temperature T1 which is 30° C. lower than a temperature T0 at which the minimum melt viscosity is exhibited.

Abstract: Methods for fabricating a photovoltaic module, and the resulting photovoltaic module, are provided and include selecting a photovoltaic cell operable to convert photons to electrons, selecting a light transparent superstrate material having a superstrate absorption coefficient and a superstrate refractive index, and selecting an encapsulant having an encapsulant absorption coefficient and an encapsulant refractive index, wherein an absorption coefficient relationship between the superstrate absorption coefficient and the encapsulant absorption coefficient and a refractive index relationship between the superstrate refractive index and the encapsulant refractive index are selected such that there is a gain in efficiency, and assembling the photovoltaic module using the selected materials.

Abstract: A package for storing or transporting a solar cell sealing film includes: the solar cell sealing film containing a silane compound and/or a silane-modified resin; and a package bag packaging the solar cell sealing film. The absolute humidity inside the package is 1 to 15 g/m3. The package can store or transport the solar cell sealing film while adhesive force thereof with a substrate, solar cells, etc. is kept at a practicable level or higher. Furthermore, the package can reduce the breakage of the solar cells caused by an external shock while a solar cell module operates and the corrosion of electrodes caused by water etc. from the atmosphere.

Abstract: A device, system, and method for solar cell construction and layer transfer are disclosed herein. An exemplary method of solar cell construction involves providing a silicon donor substrate. A porous layer is formed on the donor substrate. A first portion of a solar cell is constructed on the porous layer of the donor substrate. The solar cell and donor substrate are bonded to a flexible substrate. The flexible substrate and the first portion of a solar cell are then separated from the donor substrate at the porous layer. A second portion of a solar cell may then be constructed on the first portion of a solar cell providing a single completed solar cell.

Abstract: The present invention provides an intermediate structure for use in manufacturing a dye-sensitized solar cell (DSSC) and a method for manufacturing a DSSC with the intermediate structure. The intermediate structure comprises a first electrode coated with a nano-particle oxide and a second electrode laminated with the first electrode by a layer formed of a sealant. The sealant layer has openings in predetermined positions such that at least a portion of the internal space formed by the first electrode, the second electrode, and the sealant layer can communicate with the outside. With the intermediate structure, a superior quality of a DSSC can be manufactured in a simpler and more cost-effective way.

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.

Abstract: The invention relates to a protective film for a solar cell module, to a process for manufacturing said protective film and to a solar cell module comprising said protecting and to a method for protecting a solar cell module comprising using of such protective film.

Abstract: The present invention provides a solar cell laminate comprising a preformed bi-layer sheet having a poly(vinyl butyral) sub-layer.

Abstract: According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.

Abstract: The invention provides a semiconductor device module package structure and a series connection method thereof. The semiconductor device module package structure includes a wafer having a plurality through holes. A doped layer covers a top surface of the first electrode, and inner sidewalls extending to a bottom surface of the first electrode. At least two first electrodes are disposed adjacent to each other and on opposite sides of the through holes. A second electrode covers the doped layer and the through holes. At least two insulating layer patterns overlap with the first and second electrodes. A second electrode conductive pattern is disposed on the second electrode. The second electrode conductive pattern is disposed between the insulating layer patterns, electrically connecting to the second electrode.

Abstract: A sealing material for a solar cell and a solar cell including the same, and the sealing material includes a polymer resin having a vicat softening point at 100° C. or 130° C. or between 100° C. and 130° C.

Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Abstract: The present invention provides a thin film photovoltaic module that has a protective substrate, such as glass, that has been contoured to define a space that allows air to avoid entrapment by a bus bar on the thin film photovoltaic device. The contouring of the protective substrate greatly facilitates the deairing and lamination of the module because it reduces or eliminates the amount of trapped air during lamination. Photovoltaic modules of the present invention can be processed with a minimum of waste caused by deairing and related lamination problems.

Abstract: Various die crack deflection structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a semiconductor chip including an outer edge, a first side and a second side opposite to the first side. A deflection structure is fabricated in the semiconductor chip. The deflection structure includes a sloped profile to deflect a crack propagating in the semiconductor chip toward the first side or the second side of the semiconductor chip.

Abstract: The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

Abstract: An optical device of the present invention comprises a light-emitting element or a light-receiving element mounted on a support and a cured silicone material unified into a single article onto the support by the sealing of the element with a hydrosilylation reaction curable silicone composition, and is characterized in that the surface of the cured silicone material has been treated with an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule. The optical device is resistant to the adherence of dust and dirt due to an inhibition of the stickiness of the surface of a cured silicone material that seals a light-emitting element or a light-receiving element mounted on a support and has thereby been unified into a single body onto the support.

Abstract: Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell.

Abstract: There is provided a wiring sheet (10) provided with a wiring (16) on an insulating base material (11) for electrically connecting a plurality of back electrode type solar cells (20), the wiring sheet (10) having a plurality of cell mounting portions (10a) provided with the back electrode type solar cells (20), the wiring sheet (10) being provided with an insulation layer (101) on a cell mounting side between adjacent cell mounting portions (10a). There is provided a wiring sheet (10) for a back electrode type solar cell, a solar cell with the wiring sheet, a solar cell module, and a method for fabricating the solar cell with the wiring sheet, that can reduce/prevent unwanted contact between the back electrode type solar cell (20) disposed on the wiring sheet (10) and the wiring (16) of the wiring sheet (10).

Abstract: A method for manufacturing TF-PV material by providing a TF-PV material layer having a degree of crystallinity, and irradiating a surface region of the TF-PV material layer using a laser source having irradiation parameter selected such that the degree of crystallinity is increased at least at a top layer of the surface region.

Abstract: Solar cells attached to a contact lens are provided, as well as methods for making the solar cells and contact lenses. The solar cells have electrodes on only one side of the device, which facilitates attachment of the solar cell to a contact lens. In one embodiment, the solar cells are made using a “two sided” process. By using the two-sided process, solar cells of only a few microns in thickness can be fabricated. Such relatively thin solar cells can be incorporated into a contact lens without discomfort to the wearer. By providing an infinitely renewable power source on a contact lens, the solar cells enable the use of electronic components on the contact lens while eliminating the recharging or replacing issues that arise with batteries.

Abstract: A method of producing a dye solar cell photovoltaic device. The method comprises the steps of providing a transparent envelope, with at least a portion of the envelope having a curved profile; and forming a dye solar cell voltaic element by depositing a plurality of layers of film on an inside surface of the envelope and thereby defining a space within the photovoltaic element.

Abstract: Photovoltaic devices including an insulating layer and an intra-laminate disk layer on a plurality of thin film layers are provided. A first conductive strip, defining a first lead, is positioned on the insulating layer and connected to a first bus bar. A second conductive strip is positioned on the insulating layer and connected to a second bus bar. An adhesive layer is over the device and defines an adhesive gap through which the first lead and the second lead extend. An encapsulating substrate is on the adhesive layer, and defines a connection aperture through which the first lead and the second lead extend. The intra-laminate disk layer is positioned under the adhesive gap defined by the adhesive layer and the connection aperture defined by the encapsulating substrate. Methods of manufacturing photovoltaic devices are also provided.

Abstract: Proposed is the method for forming selective emitters, field-induced emitters, back-surface field regions, and contacts to the functional regions of a solar cell by essentially electrical means and without conventional thermal diffusion and masking processes. The process includes forming conductive layers on both sides of an intermediate solar-cell structure, performing electrical and thermal treatment by passing electrical current independently through the front-side conductive layer and the back-side conductive layer, thus forming the selective emitters, the selective BSF regions, selective emitter contact regions, and contacts to the selective BSF regions. The obtained structure is then subjected to pulse electrical treatment by applying a voltage pulse or pulses between the front and back conductive layers to form the field-induced emitter and the field-induced BSF region. After the conductive layers are removed, a final solar cell is obtained.

Abstract: An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically connected to the plurality of lead terminals and a molding compound encapsulates the leadframe and die together so as to form the ultra-thin QFN package. Accordingly, the substantially aligned contact areas are exposed on both the top and bottom surfaces of the package. The present disclosure also provides an ultra-thin Optical Quad Flat No-Lead (OQFN) semiconductor chip package, a stacked semiconductor module comprising at least two QFN semiconductor chip packages, and a method for manufacturing an ultra-thin Quad Flat No-Lead (QFN) semiconductor packages.

Abstract: Systems and methods that provide a barrier for protection of active layers associated with a vertical multi junction (VMJ) photovoltaic cell. Buffer zone(s) in form of an inactive layer(s) arrangement safe guard the active layers against induced stress or strain resulting from external forces/thermal factors (e.g., welding). The buffer zone can be in form of a rim on a surface of an end layer of a cell unit, to act as a protective boundary for such active layer, and to further partially frame the VMJ cell for ease of handling and transportation.

Abstract: A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part of a boundary part of the sealing resin and the wiring board. In the above-mentioned semiconductor device, the reinforcing resin may be provided along a perimeter of the boundary part of the sealing resin and the wiring board. The reinforcing resin may be provided at a boundary part of the sealing resin and the wiring board in a vicinity of a corner part of the sealing resin.

Abstract: A carrying structure of semiconductor includes a carrier made of a plastic material with a heat conduction region, each surface of the carrier has an interface layer formed on, and an electrically insulation circuit and a metal layer are defined on the interface layer. The insulation circuit is located on the surface of the heat conduction region and on an encircling annular region extended from two surfaces of the heat conduction region, and at the same time exposing parts of the carrier surface thereby splitting the metal layer on the interface layer into at least two electrodes. A thermal conductor formed in the heat conduction region has a LED chip adhered on it which has at least a contact point connected with the corresponding metal layer with a metal wiring so as to dissipate the heat generated by the chip rapidly with the thermal conductor.

Abstract: A CCD containing circuit and method for making the same. The circuit includes a CCD array and a protection circuit. The CCD array is constructed on an integrated circuit substrate and includes a plurality of gate electrodes that are insulated from the substrate by an insulating layer. The gate electrodes are connected to a conductor bonded to the substrate. The protection circuit is also constructed on the substrate. The protection circuit is connected to the conductor and to the substrate and protects the CCD array from both negative and positive voltage swings generated by electrostatic discharge events and the like. The protection circuit and the CCD can be constructed in the same integrated circuit fabrication process.

Abstract: The present invention provides an optical image stabilizer including: a substrate; a table which faces the substrate and has an image sensor mounted on its upper surface to be horizontally actuated on the substrate; supporting members for supporting the table on the substrate; and a scratch drive actuator for actuating the table, and a method for manufacturing thereof.

Abstract: A solar battery module (1) serving includes a first plate-like member (11) having translucency and serving as a light receiving face, a second plate-like member (12) having translucency, a solar battery (13), and a translucent sealing resin portion (14) provided for sealing the solar battery (13) between the first plate-like member (11) and the second plate-like member (12). The second plate-like member (12) has a lead-wire lead-out hole (12h) through which a lead wire (17) connected to the solar battery (13) is led out, and the translucent sealing resin portion (14) is formed extending between the lead wire (17) and the lead-wire lead-out hole (12h).

Abstract: In one aspect of the present invention, a solar receiver with an improved heat sink design will be described. The solar receiver includes a photovoltaic cell and a heat spreader plate having a frontside and an opposing backside. The photovoltaic cell is positioned on the frontside of the heat spreader plate. Multiple front and rear heat sink fins are attached to and extend out of the frontside and the backside of the heat spreader plate, respectively. In various implementations, the front heat sink fins are positioned adjacent to, above and below the photovoltaic cell.

Abstract: Disclosed are a protective sheet for a solar battery module including a base material sheet and a heat-fusible sheet made of a heat-fusible resin having a melting point measured by differential scanning calorimetry (a DSC method) of 80° C. or higher and lower than 130° C., laminated on one surface of the base material sheet, and including an air-flow path on a surface of the heat-fusible sheet; and a solar battery module using the same.

Abstract: Disclosed is a connection sheet for a solar battery cell electrode, which is a polymer sheet for use in the connection between an electrode for extracting an electric power from a solar battery cell and a wiring member through an electrically conductive adhesive material by heating and pressurizing, and which is intercalated between a heating/pressurizing member and the wiring member upon use.

Abstract: Provided is a back electrode type solar cell in which at least one of the first conductivity type electrode and the second conductivity type electrode is provided with a shape through which a liquid material can flow; a connecting sheet in which at least one of the first conductivity type wire and the second conductivity type wire is provided with a shape through which a liquid material can flow; a solar cell with a connecting sheet using the above-described back electrode type solar cell and/or the connecting sheet; a solar cell module; a method of manufacturing the solar cell with a connecting sheet; and a method of manufacturing the solar cell module.

Abstract: A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method including the steps of successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by means of dry etching, and the rest of the plurality of the color filter pattern is formed by means of photolithography.

Abstract: A method of manufacturing a solar cell receiver includes providing an insulative substrate having a metallized surface with a first conductive region separated from a second conductive region. The first conductive region forms a first terminal of the solar cell receiver and the second conductive region forms a second terminal of the solar cell receiver. The metallized surface has receptacles positioned around attachment regions with each attachment region corresponding to a different portion of the metallized surface. The method further includes positioning a material within the receptacles, placing a solar cell on the first conductive region and on a first one of the attachment regions, placing a second component on a second one of the attachment regions, placing a third component on a third one of the attachment regions and attaching the solar cell, the second component, and the third component to the metallized surface.

Abstract: The invention relates to a method of producing a solar module by laminating a layer body consisting of a first carrier, to which at least one solar cell unit is applied, and a second carrier by at least one intermediate film based on a plasticizer-containing polyvinyl acetal by guiding the layer body between at least one pair of rollers at a temperature of 50 to 150° C.

Abstract: A integrated solar roof tile includes a curved substrate, a silicon-nitride (SiN) film, a first electrode, an amorphous silicon film, a second electrode, a conducting wire layer and a protecting film. The curved substrate includes a top surface and a cross-sectional surface. The SiN film covers the top surface of the curved substrate. The first electrode is disposed on the SiN film. The amorphous silicon film covers the SiN film and the first electrode. The second electrode is disposed on the amorphous silicon film and electrically insulating from the first electrode. The conducting wire layer covers the amorphous silicon film and is electrically connected to the second electrode. The protecting film covers on the conducting wire layer.

Abstract: The present disclosure is directed toward a thin film photovoltaic cell including a support substrate; a contact layer disposed adjacent a first side of the substrate; a p-type semiconductor layer disposed on the first side of the substrate; an n-type semiconductor layer disposed on the first side of the substrate; and a protective back side layer structure disposed adjacent a second side of the substrate, wherein the protective back side layer structure may include a corrosion resistant material. In some embodiments, the back side layer includes at least a first layer and a second layer. Additionally and/or alternatively, the back side layer may include a molybdenum alloy, wherein the molybdenum alloy may include an alloy partner selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Al, and Si.

Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.

Abstract: A solar cell includes: a substrate; a photoelectric conversion cell which has a first electrode layer provided with permeability, a photoelectric conversion layer, and a second electrode layer, and is arranged on the substrate; and a protection layer which covers at least the second electrode layer. The protection layer includes a silicon nitride compound.

Abstract: An RTP heating system and an RTP heating method, which can heat a photovoltaic-device intermediate product having a glass substrate, a Mo layer, and a light absorption layer in formation. The RTP heating system is composed of a chamber; a support member located in the chamber; a heating element mounted in the chamber for emitting infrared rays for heating; and a plurality of temperature sensors and a temperature control device for sensing and controlling thermal sources from the heating element and the support member. The infrared rays can be mostly reflected off the Mo layer to apply less direct heating to the glass substrate. Accordingly, the upper and lower surfaces of the photovoltaic-device intermediate product can be heated under different temperatures separately to prevent the glass substrate below the photovoltaic-device intermediate product from softening and deformation and to allow production of the light absorption layer on the Mo layer.

Abstract: The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the present invention provides a method for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates, each of the substrates having a copper and indium composite structure. The method also includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5. The method further includes introducing a gaseous species including a selenide species and a carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature, the second temperature ranging from about 350° C. to about 450° C.

Abstract: A frameless solar cell panel includes: a stacked body (10) that has an end portion (10a) and in which a first substrate (2), a power generating section (3), a sealing layer (4), and a back sheet (5) or a second substrate (6) are sequentially stacked; and a silicone sealant member (11) that is disposed in the end portion (10a) of the stacked body (10).

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell and a transparent and abrasion resistant film which includes an organic-inorganic hybrid material formed over the glass layer.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell, and a transparent planarizing hardcoat formed on the glass layer. The planarizing hardcoat may be in compressive stress and the glass layer may be in tension.

Abstract: A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including the wiring interconnect and encapsulate material, as the conductive elements make contact with the FBGA positioned below or above to form a stack. The IC device, such as a memory chip, is mounted upon a first surface of a printed circuit board substrate forming part of the FBGA. Lead wires are used to attach the IC device to the printed board substrate and encapsulant is used to contain the IC device and wires within and below the matrix and profile of the conductive elements.