Abstract: A photovoltaic cell includes a photovoltaic cell element configured to convert sunlight into electricity, a columnar optical member including an incident surface that the sunlight enters, a side surface by which the sunlight is reflected, and an irradiation surface through which the sunlight is brought to the photovoltaic cell element, and a holder configured to hold the columnar optical member. The holder includes an abutting portion configured to face and abut the columnar optical member, and a non-abutting portion located away from the columnar optical member.

Abstract: A solid-state imaging device including a semiconductor substrate, a photoelectric conversion portion interposed between a lower electrode and an upper electrode, a contact plug formed so as to connect the lower electrode and the semiconductor substrate in order to read signal charges generated in the photoelectric conversion portion to the semiconductor substrate side, a vertical type transmitting path configured by sequentially laminating a connection portion for electrically connecting the contact plug to the semiconductor substrate, a charge accumulation layer for accumulating the signal charges read to the connection portion, and a potential barrier layer configuring a potential barrier between the connection portion and the charge accumulation layer in a vertical direction of the semiconductor substrate, and a charge reading portion configured to read the signal charges accumulated in the charge accumulation layer to the circuit forming surface side of the semiconductor substrate.

Abstract: A solar cell receiver for use in a concentrating solar system which concentrates the solar energy onto a solar cell for converting solar energy to electricity. The solar cell receiver may include a solar cell mounted on a support and with one or more III-V compound semiconductor layers. An optical element may be positioned over the solar cell and have an optical channel with an inlet that faces away from the solar cell and an outlet that faces towards the solar cell. A frame may be positioned over the support and extend around the solar cell with the frame having an inner side that extends above the support and faces towards the optical element. An encapsulant may be positioned over the support and contained between the optical element and the frame. The encapsulant may have enlarged heights at contact points with the optical element and the frame and a reduced height between the contact points away from the optical element and the frame. The solar cell receiver may be used in a solar cell module.

Abstract: An optical device includes a semiconductor device, a light receiving part formed on the main surface of the semiconductor device, and a transparent board laminated above the main surface of the semiconductor device, with an adhesive material interposed between the transparent board and the main surface of the semiconductor device. A serrated part is formed on at least one of (i) the main surface that is of the transparent board and faces the semiconductor device and (ii) the back surface of the transparent board.

Abstract: A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites.

Abstract: A semiconductor device which has controlled optical absorption includes a substrate, and a semiconductor layer supported by the substrate. The semiconductor has variable optical absorption at a predetermined optical frequency in relationship to a bandgap of the semiconductor layer. Also included is a strain application structure coupled to the semiconductor layer to create a strain in the semiconductor layer to change the semiconductor bandgap.

Abstract: A method for manufacturing a micro-module for capturing images having an imager and at least one lens, includes manufacturing at least one imager on a first plate of a semiconductor material, producing at least one optical zone to form a lens in at least one second plate of a transparent material, and of assembling the first and second plates so that the imager can receive light through the optical zone.

Abstract: A solid-state image pickup device is provided in which a pixel forming region 4 and a peripheral circuit forming region 20 are formed on the same semiconductor substrate, a first element isolation portion is formed by an element isolation layer 21 in which an insulating layer is buried into a semiconductor substrate 10 in the peripheral circuit forming region 20, a second element isolation portion is composed of an element isolation region 11 formed within the semiconductor substrate 10 and an element isolation layer 12 projected in the upper direction from the semiconductor substrate 10 in the pixel forming region 4 and an element isolation layer 21 of the first element isolation portion and the element isolation layer 12 of the second element isolation portion contain the same insulating layers 17, 18 and 19. This solid-state image pickup device has a structure capable of suppressing a noise relative to a pixel signal and which can be microminiaturized in the peripheral circuit forming region.

Abstract: Various embodiments of a solar module design are disclosed. In some embodiments, a solar module comprises an optic having a sloped waveguide profile. The optic of the solar module is directly coupled to a receiver comprising a solar cell. The receiver is also coupled to a backplane of the module.

Abstract: An image pickup device and a manufacturing method thereof are disclosed. The image pickup device includes a printed circuit board (PCB), an image sensor module, an optical lens module, a fluidic lens module, and a shutter module. The image sensor module is disposed over the printed circuit board and electrically connected to interconnection pads on the PCB. The optical lens module is disposed over the image sensor module and includes one or more lenses. The fluidic lens module is disposed over the optical lens module, has a variable focus and is electrically connected to interconnection pads on the PCB. The shutter module is disposed over the fluidic lens module, and is electrically connected to remaining interconnection pads on the PCB. The fluidic lens module and the shutter module may be connected to the interconnection pads through bumped plate springs.

Abstract: The present invention relates to a reflective and/or refractive secondary lens system for focusing sunlight onto semiconductor elements, the secondary lens system being characterised according to the invention by a projection which is disposed around the basic body forming the secondary lens system. Furthermore, the present invention relates to a semiconductor assembly which includes the secondary lens system according to the invention, and also to a method for the production of this semiconductor assembly. In particular, this semiconductor assembly represents a concentrating solar cell module.

Abstract: A photoelectric conversion device in accordance with an aspect of the present invention includes a thin-film transistor formed on a substrate, and a photo diode electrically connected to the thin-film transistor, wherein the photo diode includes a lower electrode connected to a drain electrode of the thin-film transistor, a photoelectric conversion layer formed on the lower electrode, an upper electrode formed from a transparent conductive film on the photoelectric conversion layer, the upper electrode being formed so as to be contained within an upper surface of the photoelectric conversion layer as viewed from a top, and a protective film (compound layer or the like) formed so as to protect a part of an upper surface of the photoelectric conversion layer located outside the upper electrode.

Abstract: This invention relates to a method for producing solar cells, and photovoltaic panels thereof. The method for producing solar panels comprises employing a number of semiconductor wafers and/or semiconductor sheets of films prefabricated to prepare them for back side metallization, which are placed and attached adjacent to each other and with their front side facing downwards onto the back side of the front glass, before subsequent processing that includes depositing at least one metal layer covering the entire front glass including the back side of the attached wafers/sheets of films. The metallic layer is then patterned/divided into electrically isolated contacts for each solar cell and into interconnections between adjacent solar cells.

Abstract: A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

Abstract: The present invention relates to a photodiode of an image sensor using a three-dimensional multi-layer substrate, and more particularly, to a method of implementing a buried type photodiode and a structure thereof, and a trench contact method for connecting a photodiode in a multi-layer substrate and a transistor for signal detection.

Abstract: A solar cell having high heat resistance, reliability and weather resistance that prevents extraneous matter (rain water, dust and the like) from entering, a concentrating solar power generation module and a solar cell manufacturing method are provided. A solar cell 21 includes an optical member 40 that allows concentrated sunlight Ls to pass therethrough, a solar cell element 23 that converts the sunlight Ls that has passed through the optical member 40 into electricity, and a receiver substrate 22 on which the solar cell element 23 is placed.

Abstract: Gold bumps are located over electrode pads of a solid imaging device and an adhesive is formed over the gold bumps. A transparent plate is supported by the gold bumps and is made to adhere over the solid imaging device by the adhesive. The gold bumps and an electrode and wiring pattern formed over a circuit board are connected by gold wires. At this time the gold wires are approximately parallel to the circuit board near portions where the gold wires and the gold bumps are connected. As a result, it is easy to locate the transparent plate over the portions where the gold wires and the gold bumps are connected. By locating the adhesive over the portions where the gold wires and the gold bumps are connected, the solid imaging device can be made small and light. As a result, a smaller lighter semiconductor device is fabricated.

Abstract: A compact camera module (CCM) includes an image sensor, a lens unit and a specific filter glass unit. The image sensor is used for sensing an image. The lens unit is used for guiding light beams toward the image sensor. The specific filter glass unit is implemented external to the lens unit and has the image sensor and the lens unit disposed on opposite sides of the specific filter glass unit, for filtering out a specific light of the light beams.

Abstract: An image sensor package includes a substrate, an image sensor chip, a plurality of metal wires and an encapsulant. The substrate has an upper face, a lower face and a plurality of connecting pads arranged on the upper face. The image sensor chip has an active surface, a back surface opposite to the active surface and a plurality of bonding pads arranged on the active surface. The metal wires electrically connect the bonding pads of the image sensor chip to the connecting pads of the substrate. The transparent cover is arranged above the image sensor chip. A gap is formed between the transparent cover and the image sensor chip. The encapsulant is disposed around the transparent cover and the metal wires, and is used for sealing the metal wires and fixing the transparent cover above the image sensor chip.

Abstract: A method of digitally processing light waves passing through a planar structure having given functions ƒin(x, y, ?) and ƒout(x, y, ?) and consisting of a light-propagating and distributing layer is provided. This layer contains a plurality of interconnecting pattern elements of a holographic pattern and a plurality of planar optical elements arranged in a predetermined pattern on the aforementioned light-propagating and distributing layer. The method consists of calculating positions and shapes of the interconnecting pattern elements of the holographic pattern based on the aforementioned given functions by solving an inverse problem. The interconnecting pattern elements have refractive indices different from the refractive indices of the light-propagating and distributing layer and are manufactured on the basis of the results of the calculations.

Abstract: A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support to a substrate including the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components, c) achieving thinning of the substrate and making electric connections through the substrate, and d) making an aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.

Abstract: An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.

Abstract: Methods for processing photoimagers include forming one or more protective layers over the image sensing elements of a photoimager. Protective layers may facilitate thinning of the substrates of photoimagers, as well as prevent contamination of the image sensing elements and associated optical features during back side processing of the photoimagers. Blind vias, which extend from the back side of a photoimager to bond pads carried by an active surface of the photoimager, may be formed through the back side. The vias may be filled with conductive material and, optionally, redistribution circuitry may be fabricated over the back side of the photoimager. Photoimagers including features at result from such processes are also disclosed.

Abstract: An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the front surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.

Abstract: There is provided a camera module package. A camera module package according to an aspect of the invention includes a bonding unit at an inner surface of a housing including an optical system and a filter adhered to the bonding unit by an adhesive. Here, the bonding unit corresponding to the filter has a longitudinal central region corresponding to a gate and an overflow unit of a runner hardening unit provided when the housing is injection molded, and left and right regions while the longitudinal central region has a smaller surface height than each of the left and right regions, and the adhesive provided between the bonding unit and the filter has a predetermined thickness so that maximum thermal stress generated in the housing has a relatively smaller value than adhesive strength of the adhesive.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate having a first surface and a second surface at an opposite side thereof. The first surface has an active layer with a light-receiving part. The semiconductor device also includes an adhesive layer provided to surround the light-receiving part on the first surface of the semiconductor substrate; a light-transmissive protective member disposed above the light-receiving part of the semiconductor substrate with a predetermined gap and adhered via the adhesive layer; and plural external connection terminals arranged in a predetermined array on the second surface of the semiconductor substrate are included. Each center point of the external connection terminals forming two facing edges is positioned inside of an area of the adhesive layer projected on the second surface among the outermost external connection terminals.

Abstract: There is disclosed a method for making solar cells with sensitized quantum dots in the form of nanometer metal crystals. Firstly, a first substrate is provided. Then, a silicon-based film is grown on a side of the first substrate. A pattern mask process is executed to etch areas of the silicon-based film. Nanometer metal particles are provided on areas of the first substrate exposed from the silicon-based film. A metal electrode is attached to an opposite side of the first substrate. A second substrate is provided. A transparent conductive film is grown on the second substrate. A metal catalytic film is grown on the transparent conductive film. The second substrate, the transparent conductive film and the metal catalytic film together form a laminate. The laminate is inverted and provided on the first substrate. Finally, electrolyte is provided between the first substrate and the metal catalytic film.

Abstract: An optical sensor package may include a chip carrier including a surface having edges defining corners. An optical sensor may be connected to the surface of the chip carrier and be positioned closer to one of the corners than any of the other corners.

Abstract: Method and system for assembling a solar cell package. According to an embodiment, the present invention provides a method for fabricating solar cells for a solar panel. The method includes providing a first substrate member comprising a plurality of photovoltaic strips thereon. The method also includes providing an optical elastomer material overlying a portion of the first substrate member. The method further includes aligning a second substrate member comprising a plurality of optical concentrating elements thereon such that at least one of the optical concentrating elements being operably coupled to at least one of the plurality of photovoltaic strips, the second substrate member comprising an aperture surface region and an exit surface region. In addition, the method includes coupling the first substrate member to the second substrate member to form an interface region along a first peripheral region of the first substrate member and along a second peripheral region of the second substrate member.

Abstract: To a transparent substrate (20) on which a plurality of spacers (5) are formed, an infrared cut filter (IRCF) substrate (27) is attached. The IRCF substrate (27) has a coefficient of thermal expansion smaller than the transparent substrate (20) and approximately equal to a wafer (31). Next, the transparent substrate (20) is diced into plural pieces to form a plurality of cover glasses (6). Then heat cure adhesive (32) is coated on each spacer (5) and the spacers (5) are attached on the wafer (31) on which a plurality of light receiving section (3) and pads (10) are previously formed. Finally, the heat cure adhesive (32) is heated to be cured.

Abstract: Provided is a method of manufacturing a camera module, the camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly.

Abstract: A solar cell receiver subassembly for use in a concentrating solar system which concentrates the solar energy onto a solar cell by a factor of 1000 or more for converting solar energy to electricity, including an optical element defining an optical channel, a solar cell receiver having a support; a solar cell mounted on the support adjacent to the optical element and in the optical path of the optical channel, the solar cell comprising one or more III-V compound semiconductor layers and capable of generating in excess of 20 watts of peak DC power; a diode mounted on the support and coupled in parallel with the solar cell; and first and second electrical contacts mounted on the support and coupled in parallel with the solar cell and the diode; and an encapsulant covering the support, the solar cell, the diode, and at least a portion of the exterior sides of the optical element.

Abstract: A fabricating method and structure form a wafer level module with a solid adhesive film. A first solid adhesive film includes a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film. Openings are patterned through the first solid adhesive film. After removing parts of the first release film to expose the first surface of the first solid adhesive film, the exposed first surface of the first solid adhesive film is aligned and adhered to a first substrate.

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.

Abstract: A method of forming an image sensor having a sensor, a cover, and a filter, that may include applying a filter layer to a cover layer by masking the cover layer with a predetermined pattern and applying the filter layer by a deposition process. The method may also include bonding the cover layer to a sensor layer including a plurality of sensors. The predetermined pattern may result in a filter layer which is aligned with each sensor. There may be gaps in the filter layer around each sensor.

Abstract: A backside illuminated image sensor comprises a sensor layer having a plurality of photosensitive elements of a pixel array, an oxide layer adjacent a backside surface of the sensor layer, and at least one dielectric layer adjacent a frontside surface of the sensor layer. A color filter array is formed on a backside surface of the oxide layer, and a transparent cover is attached to the backside surface of the oxide layer overlying the color filter array. Redistribution metal conductors are in electrical contact with respective bond pad conductors through respective openings in the dielectric layer. A redistribution passivation layer is formed over the redistribution metal conductors, and contact metallizations are in electrical contact with respective ones of the respective redistribution metal conductors through respective openings in the redistribution passivation layer. The image sensor may be implemented in a digital camera or other type of digital imaging device.

Abstract: A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies.

Abstract: A fabricating method of a microelectronic device including the following steps is provided. First, a substrate is provided. Second, a semi-conductor element is formed in a CMOS circuit region of the substrate. Next, a plurality of metallic layer, a plurality of contact plugs and a plurality of oxide layer are formed on the substrate. The metallic layers and the oxide layers are interlaced with each other and the contact plugs are formed in the oxide layers and connected with the metallic layers correspondingly so as to form a micro electromechanical system (MEMS) structure within a MEMS region and an interconnecting structure within the CMOS circuit region. Then, a first protective layer is formed on at least one of the oxide layers and a second protective layer is formed on the interconnecting structure. Predetermined portions of the oxide layers located within the MEMS region are removed and thereby the MEMS structure is partially suspended above the substrate.

Abstract: A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved.

Abstract: For producing a photovoltaic module (1), the front electrode layer (3), the semi-conductor layer (4) and the back electrode layer (5) are patterned by separating lines (6, 7, 8) to form series-connected cells (C1, C2, . . . Cn, Cn+1) with a laser (14) emitting infrared radiation. During patterning of the semiconductor layer (4) and the back electrode layer (5) the power of the laser (14) is so reduced that the front electrode layer (3) is not damaged.

Abstract: A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.

Abstract: There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact.

Abstract: A method of digitally processing light waves passing through a planar structure having given functions fin(x, y, ?) and fout(x, y, ?) and consisting of a light-propagating and distributing layer. This layer contains a plurality of interconnecting pattern elements of a holographic pattern and a plurality of planar optical elements arranged in a predetermined pattern on the aforementioned light-propagating and distributing layer. The method consists of calculating positions and shapes of the interconnecting pattern elements of the holographic pattern based on the aforementioned given functions by solving an inverse problem. The interconnecting pattern elements have refractive indices different from the refractive indices of the light-propagating and distributing layer and are manufactured on the basis of the results of the calculations.

Abstract: A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

Abstract: A small and thin surface-mount type optical semiconductor device having high air tightness, which can be manufactured at a reduced cost includes: a base 2 formed of a glass substrate; a recess 5 formed on a first main surface 3 of the base; a through hole 7 extending from a bottom portion 4 of the recess to a second main surface 6 of the base; an inner wall conductive film formed on an inner wall surface of the through hole; a wiring pattern 9 made of a conductive film formed around an opening of the through hole on the bottom portion of the recess so as to be connected electrically to the inner wall conductive film; an optical semiconductor element 8 bonded to the wiring pattern via a conductive bonding material 14; a terminal portion 10 made of a conductive film formed around an opening of the through hole on the second main surface such that it is connected electrically to the inner wall conductive film; and a metal portion 13 bonded to the inner wall conductive film to clog the through hole.

Abstract: According to the present invention, protrusions 4 are formed on electrodes 3 of semiconductor elements 6, and an optical member 7 is secured on the semiconductor element 6 with an adhesive 8 so as to be pressed onto the protrusions 4.

Abstract: A photovoltaic module comprises electrically interconnected and mutually spaced photovoltaic cells that are encapsulated by a light-transmitting encapsulant between a light-transparent front cover and a back cover, with the back cover sheet being an ionomer/nylon alloy embossed with V-shaped grooves running in at least two directions and coated with a light reflecting medium so as to provide light-reflecting facets that are aligned with the spaces between adjacent cells and oriented so as to reflect light falling in those spaces back toward said transparent front cover for further internal reflection onto the solar cells, whereby substantially all of the reflected light will be internally reflected from said cover sheet back to the photovoltaic cells, thereby increasing the current output of the module. The internal reflector improves power output by as much as 67%.

Abstract: A solar cell according to one embodiment of the present invention includes a solar cell element that photoelectrically converts sunlight Ls, and a columnar optical member having an incidence surface on which sunlight Ls concentrated by a concentrating lens is incident and an irradiation surface that irradiates sunlight Ls to the solar cell element, a side surface of the columnar optical member being inclined relative to a perpendicular direction such that sunlight Ls incident from the incidence surface is reflected in a direction of the irradiation surface. In the solar cell, a minimum concentrated light beam region FLRs where a concentrated light beam region FLR formed by the concentrated sunlight Ls is minimized is configured to be located inside the columnar optical member.

Abstract: A method for creating graded or tapered dopant profiles in a semiconductor layer or layers. Preferably, a sub-micron horizontal tip feature is used to control the doping of the layer beneath the feature.

Abstract: Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.