Abstract: A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus may include a contact engagable by the lead and further engagable by the spaced terminal. An elastomeric element is provided to bias the contact in an original position. As the contact is engaged by the lead, the elastomeric element may deform to permit movement of the contact. It is contemplated that the elastomeric element may be shaped, relative to the contact, to provide at least one spatial relief region between the elastomeric element and the contact. Further, it is contemplated that the elastomeric element may have one or more cavities formed therein to provide at least one spatial relief region. Finally, it is contemplated that the contact housing may be designed to provide at least one spatial relief region adjacent the elastomeric element.

Abstract: An emulator probe accelerates the efficiency of program debugging work with an emulator. The emulator probe includes an emulator coupling device in which lead terminals are soldered on string-like cut-out sections provided on the sides of a board having the same dimensions as a package molding portion of a microcomputer. As required, the emulator coupling device or a microcomputer is mounted on an IC socket provided on a target board.

Abstract: In an electronic component connector, terminals are formed on a measurement circuit board. Support members are provided on the measurement circuit board to correspond to the terminals. The support members respectively have free end portions arranged in a row to correspond to a plurality of lead terminals extending from an electrical component and proximal end portions cantilevered by the measurement circuit board. Contacts are insulated from each other and provided to the free end portions of the support members to normally oppose the terminals through a predetermined gap. The contacts respectively have first contact portions to come into contact with the lead terminals of the electrical component and second contact portions to come into contact with the terminals at positions, in a longitudinal direction of the support members, different from positions where the first contact portions come into contact with the terminals.

Abstract: A self-aligning low profile socket for connecting a ball grid array type device through a dendritic interposer to a printed circuit board, the socket providing resources for attaching a heat sink to the electronic device with minimum thermal impedance. Compressive forces are evenly distributed over the pattern of the interposer array, and thermal conductivity is provided between the top of the electronic device and a heat sink, through the use of complementary concave and convex surfaces engaged by a flat screw mechanism. The socket exhibits a low profile while providing the flexibility of a dendritic interposer and effective heat sink attachment.

Abstract: Electrical components such as IC modules and printed circuit boards, at least one of which has an array of solder balls or other protruding conductors, are connected quickly, precisely and economically with a component locator having openings adapted to capture the protruding conductors. The locator is aligned with one of the components, and the other component is pressed against the locator. The protruding conductors enter the capture openings and complete electrical circuits with contacts on the other conductor.

Abstract: A socket for electronic components for electrically connecting an electronic component with an electronic circuit substrate. The socket has a frame for engaging the electronic component; a film-shaped connector which is retained by the frame and which has a first terminal to be connected to the terminal of the electronic component, a second terminal to be connected to the terminal of the electronic circuit substrate, and a wiring for electrically connecting the first terminal with the second terminal corresponding to the first terminal; and a cover mounted on the frame, for covering the electronic component, to make the terminal of the electronic component come into contact with the first terminal.

Abstract: Injection molded insulating strips receive a plurality of contacts. The strips are stacked together to create a multiple row, multiple column contact array. The contact array is adapted for use in an IC socket to separably connect an IC having either an LGA or BGA package lead styles. A cover plate, locator, array frame, and contact array together comprise a manufacturable and low cost separable IC socket.

Abstract: A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies.

Abstract: A socket for coupling one of a first integrated circuit module having a first footprint and a first terminal array, or a second integrated circuit module having a second larger footprint to a printed circuit board. A socket base has a top surface for receiving one of the first and second integrated circuit modules and a bottom surface adapted to be mounted on a printed circuit board. A first array of contacts extends transversely through the base from the top surface to the bottom surface for electrically coupling the first terminal array to the printed circuit board. An alignment feature coupled to the base, is configured to align one of the first or second integrated circuit modules within the socket base such that the terminals of either the first or second integrated circuit modules engage the contact array, the second integrated circuit module extending beyond the alignment feature when aligned in the socket.

Abstract: A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact.

Abstract: The present invention relates to a universal contactor system for testing multiple size BGA devices on multiple types of testing equipment. The universal contactor system is comprised of a plurality of pogo pin which provide a connection between the BGA device to be tested and a DUT (Device Under Test) board. A contactor block having a plurality of apertures therethrough is used for holding the plurality of pogo pins. A guide plate having a center opening is coupled to the contactor block. The center opening in the guide plate is used for aligning the BGA device to be tested on the contactor block. The guide plate may be replaced with guide plates having a larger or smaller opening to align BGA devices of a larger or smaller size on the contactor block.

Abstract: An IC socket is equipped with a plurality of elastic contact pins which are brought into contact with spherical bumps of an IC package. Each of the contact pins has at a foremost end thereof a contacting portion disposed opposite to a lower spherical surface of the spherical bump. The contacting portion has a relief portion which is kept in a non-contacting condition relative to a lower dead point portion on the lower spherical surface of the spherical bump, and a contacting end is brought into press contact at an area thereof around the relief portion with that area of the spherical surface of the spherical bump outwardly adjacent to the lower dead point.

Abstract: A connector (1) for connecting a substrate (2) with an electronic circuit to a printed circuit board (4) comprises a a housing (5) of insulating material with a zone (6) for receiving said substrate. A main surface of the substrate is provided with contact pads or the like arranged in a given grid pattern with a predetermined pitch in column and row directions and the substrate has side edges located at a predetermined location with respect to the contact pads and the printed circuit board has contact pads (3) arranged in the grid pattern. Through-holes (7) are provided in the zone in the grid pattern and contact members (8) are provided in at least a part of the through-holes. Further the connector comprises positioning means for locating the substrate with respect to the housing in such a manner that the through-holes of the housing are aligned with the contact pads of the substrate.

Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.

Abstract: A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die.

Abstract: A connector for electrically interconnecting a lead of a device to a terminal spaced at a distance from the lead. The apparatus includes a housing which has a slot to receive one of each of the one or more contacts. The contact-receiving slot extends substantially parallel to an axis which extends between a corresponding lead and spaced terminal. The housing has a first trough formed therein proximate the lead and a second trough formed therein proximate the spaced terminal. A first elastomeric element is received in the first trough formed in the housing, and a second elastomeric element is received in the second trough formed in the housing. The first and second elastomeric elements have a measure of compressibility and tensile extendibility. A contact is received within each slot. Each contact provided has a protrusion which extends outward from the surface of the housing to be engaged by the lead to which it corresponds.

Abstract: An input/output connector module for connecting input and output devices to a multi-wire bus having a first stage. The first stage electrically connects directly to the multi-wire bus, and a second stage is supported on the first stage and carries an IC chip. The second stage includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second stage further includes a substrate having positioning cavities for locating the second stage with respect to the first stage in a horizontal direction and the surface of the substrate includes cutout portions for locating the second stage with respect to the first stage in a vertical direction. The cutout portions are elongated strips along opposite sides of the substrate with one positioning cavity being semi-circular and disposed essentially in the middle of one of the elongated strips.

Abstract: An interface connector device having two assemblies for interconnecting a plurality of input/output devices to a multi-wire bus. The first assembly is electrically connected directly to the multi-wire bus and the second is carried on the first assembly and supports an IC chip. The second assembly includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second assembly incorporates a single molded piece including a molded socket for receiving the IC chip, a set of molded pins adapted to receive conductive coatings for electrically connecting the input and output devices to the IC chip, and molded positioning elements for orienting the second assembly with respect to the first assembly.

Abstract: A new approach to providing thousands of contacts between electronic packages and their next package level by use of small formed spring contact elements (SCE) retained within a interposer structure or soldered directly into a printed circuit board or onto the module is disclosed. Each contact element can be either a signal or power line and, for improved electrical performance, alternate both horizontally and vertically in an orthogonal grid such that no signalling is adjacent to another signal. The spring contact elements (SCE) have multiple cross-sectional shapes and are pre-formed for improved mechanical performance. A retainer contains the multiplicity of SCE while providing a air plenum for improved thermal performance.

Abstract: A surface mounting IC socket includes an IC receiving section defined in a frame, and a plurality of contacts spaced apart in side-by-side relation along the frame. Leads of an IC received in the IC receiving section are brought into electrical connection with the contacts within the IC receiving section. Each contact includes a press-in plate portion which is to be pressed into the frame from a lower surface of the frame adapted to confront a wiring board, a contacting arm to be contacted with one of the IC leads extending toward the IC receiving section from a lower end of the press-in plate portion, and a surface mounting arm extending from a lower end of the press-in plate portion toward the IC receiving portion so as to be soldered to a pattern formed on the wiring board.

Abstract: A chip carrier mounting system of the present invention includes a chip carrier socket which is mounted (e.g., by soldering) on a printed circuit board. The chip carrier socket has a frame and a plurality of spaced-apart, inwardly projecting contact members constructed of electrically conductive material. The system further includes a chip carrier constructed and arranged for receiving and securing a chip thereto. The chip carrier includes a frame having a plurality of spaced-apart receiving slots in registry with and capable of receiving the contact members therein for securing the chip carrier to the chip carrier socket. Each receiving slot has an electrically conductive surface mount for providing electrical connection between the chip, chip carrier, chip carrier socket and printed circuit board. The system also includes a retaining clip releasably securable to the chip carrier socket for maintaining the chip carrier and chip carrier socket in assembled relation.

Abstract: An electrical socket is disclosed for interfacing between a printed circuit board having contact pads and an electronic module having external leads, such as an integrated circuit. The electrical socket includes a base frame, containing an opening generally conforming to the body shape and size of the electronic module, and a plurality of spaced, parallel conductive members, such as electrical wires, arrayed on a resilient strip coextensive with at least part of the surface of the opening. Each conductive member includes both a lead portion in adjacent parallel relationship with one of the electronic module external leads and a contact portion in electrical engagement with a contact pad, and may also include a retaining portion for securing the conductive member to the resilient strip. The electrical socket may include a cover, with thermal vent holes, to secure the electronic module within the base frame opening.

Abstract: A connector for protecting an IC comprising a connector body, a closed plate, and an annular air-tight sealing material. An air-tight chamber is formed centrally of the annular air-tight sealing material by compressing the annular air-tight sealing material between the connector main body and the closed plate. The IC is received in the air-tight chamber so as to be electrically contacted with the connector body.

Abstract: An IC measuring and testing device and measuring and testing method comprising a measurement handler socket provided with mold-receiving base having guiding members corresponding to the shape of a mold body of an IC to be tested around its periphery and probes for contacting outer leads of the IC, and a suction arm for suction-supporting the IC and transferring it to the mold-receiving base, the IC measuring and testing device performing measuring and testing on the IC mounted in the mold-receiving base by means of the suction arm, the guide members corresponding to and separated from the outer leads of the IC, and terminal portions of the probes being arranged inserted into these separation portions. As a result, when the IC is set, the guide members and the like of the socket can be prevented from striking against the outer leads of the IC and deforming them.

Abstract: An emulator probe comprising a direction changing board 10 having a first connector 11 to be coupled to a relaying connector 9 set on one surface thereof and a second connector 12 set on the other surface thereof such that the direction of setting of the same is different from the direction of setting of the first connector 11 and adapted such that soldering to a microcomputer mounting foot pattern 3 is achieved not through a pin terminal but through a semicircular edge portion of a semicircular through hole 8a formed in the peripheral surface of a semicircular through-hole board 8, and therefore, the emulator can be mounted on a user target board 1 easily without the need to deform the emulator cable and, further, the area occupied by the microcomputer mounting foot pattern can be decreased.

Abstract: The present invention relates to a spring probe contactor for testing BGA devices. The spring probe contactor is comprised of a plurality of spring probes for providing a connection between a BGA device to be tested and a DUT board. The plurality of spring probes are held within a contactor block having a plurality of apertures therethrough. The apertures are wide enough to hold a single spring probe within the contactor block without the spring probe coming into contact with the contactor block. A retaining plate is coupled to the contactor block for holding the plurality of spring probes within the contactor block. The retaining plate has a raised portion thereon which limits the compression of the plurality of spring probes when a BGA device is placed in the spring probe contactor.

Abstract: A contact pin device for IC sockets includes a socket body having a plurality of contact pins; a floating plate which is sustained above socket body, always urged upward, and has contact receivers formed therein for receiving the contact pins; and a pressing member which is mounted on the floating plate and is used to press down a BGA type IC package having a plurality of downward protruding spherical connecting terminals. The floating plate allows the spherical connecting terminals of the IC package to be brought into contact with the contact pins in the contact receivers thereof. Further, the top ends of the contact pins are provided with contact sections for receiving and electrically connecting lower spherical sections other than spherical tips of the spherical connecting terminals. The contact pin device for IC sockets has a relatively simple configuration, but assures secure electrical connection between the connecting terminals and the contact members.

Abstract: A reusable carrier (10) for temporarily holding an integrated circuit (12) during burn-in and electrical test includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A flexible substrate (19) is attached to the base (14) with a suitable adhesive. Alignment posts (20) have tapered surfaces (22) that engage corners (24) of the integrated circuit (12) to position the integrated circuit (12) precisely on upper surface (26) of the substrate (19). A spring-loaded latch (28) engages projection (30) in aperture (32) of the base (14) to hold the lid (16) closed over the integrated circuit (12). Electrically conductive traces (34) on the surface (26) have contact bumps which engage contact pads on the underside of the circuit (12) to connect the integrated circuit (12) to peripheral contact pads (38) around edges (40) of the substrate (19).

Abstract: A pivoting beam or lever is used to open and close burn-in and test sockets which employ laterally moving cammed plates to form electrical contact between electrical contact fingers within the socket and terminals depending from an electronic device package. The pivoting beam is oriented and adapted for operation by vertically applied forces so that opening and closing the socket is easily automatible using the pick and place equipment conventionally used to insert and remove electronic device packages from open top sockets.

Abstract: A testing contactor is provided for testing small-size semiconductor devices with large currents at high frequencies. Each semiconductor device to be tested has a plurality of leads. The testing contactor includes a plurality of first electric contact elements. A first Kelvin contact for a lead is formed of a first electric contact element in contact with the lead. The testing contactor further includes a plurality of second electric contact elements and a plurality of electric connection elements. An electric connection element in contact with the lead effectively extends the lead. A second Kelvin contact is formed of a second electric contact element and an electric connection element, the second electric contact element in contact with the electric connection element and the electric connection element in contact with the lead.

Abstract: A connector for mounting an LGA device on a circuit board comprises a film contact having electrode bumps on inner ends of respective conductive paths at predetermined spaced apart locations corresponding to respective locations of the individual electrode lands on the LGA device and is clamped extending across a central cavity defined between housing base and frame members. A flat elastomeric biassing pad having a series of upstanding, closely spaced resilient projections is retained by the base member in the cavity with the projections supporting spaced apart locations of one surface of the film contact while a cover member retains the device in the cavity in the frame member with the respective lands thereof pressed against respective electrode bumps, compressing the biassing pad to assure sufficient contact pressure. The cover member has a camming detent which progressively engages the device during closing, moving the device across the film contact with a wiping action.

Abstract: A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.

Abstract: This disclosure relates to testing apparatus (10), preferably an LGA burn-in test socket, for an integrated chip (28). The apparatus (10), arranged for mounting on a planar electronic device (46), such as a printed circuit board, includes a frame member (12) for mounting to the planar electronic device (46), where the frame member (12) includes a central opening (22) extending between first and second surfaces, and dimensionally sized to receive the chip (28). Recesses (35) are provided for receiving an electronic interface member (18) mounting plural flexible electrical connectors (106), such as an elastomeric connector, as known in the art, for engaging the traces or pads of the chip to the planar device during testing. Further, plural recesses (40) extend from at least the first surface, where each recess includes a compression spring (41). Positioned over and for engagement with the frame member is a floatably mounted force applying member (14) having first and second parallel surfaces.

Abstract: A printed circuit board modular assembly is disclosed. The disclosed invention comprises a first printed circuit board having an electronic terminal portion for providing electrical connection to the first printed circuit board; a second printed circuit board having an electrical terminal portion for providing electrical connection to the second printed circuit board; a spacing member disposed between the first and second printed circuit boards; and electrical signal transmission contacts situated on the spacing member for providing electrical connection between the first printed circuit board and the second printed circuit board.

Abstract: An interconnect system (8) for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) with retractable contact portions (14) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b), a plurality of contact bumps (24) containing oxide-penetrating particles on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21), a fence (30) attached to the top surface of the compliant membrane (20b) for positioning the semiconductor device (21) so that the bond pads on the semiconductor device (21) are aligned with the contact bumps (24). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20).

Abstract: An electrical connector arrangement for connecting the exposed conductors of a mating end of a printed circuit member in which an interior mating area for the printed circuit member is defined between left and right side walls of a housing. The top wall has an opening communicating with the interior mating area. Latch members are mounted in the left and right side walls, respectively. The latch members are outwardly displaced to accommodate the downward movement of the mating end of the printed circuit member. The mating end of the printed circuit member is held in position, after the completion of the downward movement, by the force exerted on one surface of the circuit member from terminal conductor engaging ends contacting the exposed conductors and by the opposite force exerted on the opposite surface of the circuit member by resilient top ends of the latch members, thereby assuring the electrical connection.

Abstract: A temporary package used to test and burn-in a bare die that will fit in a board mounted socket. The package comprises a base having contacts to engage the die and provide contact to the outer periphery, a lid for pressing the die into electrical contact and a protective cover to restrict the die from damage due to external pressures to the sides or top of the package. The die, lid and protective cover can be assembled onto the base and removed by automated equipment.

Abstract: An intermediate connector is for mounting on a printed circuit card so that a first face of the connector bears against the card, and so that a second face thereof receives a substrate of an electronic circuit. It interconnects contact areas provided on the substrate and tracks on the card. The connector has an insulating support having regularly spaced apart through-passages that receive respective electrical signal contacts, each of which connects one contact area to a track. Each contact is a cut out piece of metal sheet and has a rigid branch for fastening it to the support, and a flexible branch that is S-shaped. Each passage is defined by partitions and slidably receives a corresponding rigid branch and it has abutment shoulders that are spaced apart by an interval eo, The abutment closest to the first face is at a predetermined height ho relative thereto.

Abstract: A system for directly connecting one integrated circuit to another achieved by depositing gold onto the bonding pads of both integrated circuits, aligning the respective bonding pads and biasing both circuits into gas-tight, electrically conductive relation through the use of an initial compression force and a spring assembly. The gold bumps deposited on the bonding pads include ridges to ensure an optimal gas-tight seal. Alignment posts are also inserted through the host integrated circuit, which match notches cut into the periphery of the target integrated circuit, to ensure proper polarization and mating of the bonding pads of each integrated circuit. The integrated circuits and spring assembly are housed, and thus held together by, a carrier assembly. The carrier assembly also serves to dissipate heat generated by the integrated circuits, adapts for mounting on a printed circuit board, and includes a ferrule over an optical sensing area provided on the host integrated circuit.

Abstract: A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof.

Abstract: An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of the various integrated circuit chips (20) in the module to circuitry (42) on a thin film multilayer membrane (22). The module assembly includes a heat sink (16) with the back surfaces of the chips (20) in thermal engagement therewith. Contacts (40) of the bond pads of the chips (20) are in electrical engagement with the circuitry (42) on the membrane (22) and are accurately positioned by means of nests (28) formed on the surface of the membrane (22). A contact pressure equalizer (12) engages only selected areas (98) of the membrane (22) opposite the contacts (40) of the chips (20) to urge the contact surfaces (44) on the membrane (22) into electrical engagement with raised contacts (40). The contact pressure equalizer (12) includes a relatively large pressure plate (70) having a layer (74) of relatively soft rubber thereon.

Abstract: A contact retention module for a test socket includes mating gear-like teeth formed of alternating projections and valleys. The projections of one module half close the valleys of another module half to produce pockets which retain and guide contact terminal ends within the pockets.

Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grid array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.

Abstract: An integrated circuit package for demountable attachment to a printed circuit board or like device is formed from an integrated assembly of an IC chip and socket, The IC chip is permanently mounted to a chip carrier which spreads the contact area from a first area to a larger second area. The chip carrier or spreader is contained in a plastic socket formed of a cover and a base. The base has an array of apertures therethrough each of which is equipped with wadded wire/plunger contacts for conformal contact with both pads on the bottom of the chip carrier and pads on a circuit board.

Abstract: An improved connector for an electronic module of the type that has a number of leads positioned on an underside adjacent to at least one edge thereof includes a housing having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals has a first leg portion that includes a cam surface that is constructed and arranged to be engaged by an edge of an electronic module during insertion to control insertion force and distance, and a second leg portion that is connected to the first leg portion and has a contact surface for contacting at least one lead on an underside of the electronic module. An elastomeric absorber is positioned between the second leg portion and the housing for biasing the second leg portion upwardly against the underside of the electronic module when the electronic module is fully inserted into said connector.

Abstract: An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21).

Abstract: An IC socket comprising a floating plate having a plurality of through holes and attached to a main body of the IC socket so as to be vertically movable, an adaptor plate having a plurality of through holes corresponding to the through holes of the floating plate and removably attached to the floating plate, intermediate contact members disposed in the through holes of the adaptor plate, and wire-like contact pins fixed to the main body and having free ends inserted into the through holes of the floating plate.This IC socket is capable of mounting two types of IC packages selectively by attaching and removing the adaptor plate and the intermediate contact members to and from the floating plate.

Abstract: A retainer system for holding a board (14) with active electrical components in an electrical connector assembly includes a boss (50,66) secured to the housing (48,64,84) of the connector assembly, with the boss having an elongated slot (52,68) open toward the other end of the housing. The slot is sized so that one end of the board is receivable therein with sufficient clearance to allow pivoting motion of the board toward and away from the housing about that one end within the slot. At the other end of the connector assembly housing is a retainer (54,72,82,100). After the one end of the board is inserted into the slot and the board is pivoted toward the housing, the retainer overlies the opposed end of the board.

Abstract: An IC carrier has an IC body and a flexible wiring sheet superimposed on and contacted with the IC body. The carrier is loaded in a socket so that the wiring sheet may contact the socket. The socket comprises an elastic backup member for elastically pressing the superimposed portion of the wiring sheet so as to contact with the IC body. An operating device deflects the elastic backup member between the pressing position and a press-releasing position.

Abstract: An IC carrier for loading ICs of different sizes thereon includes a spiral disk provided in a box-shaped frame member and a plurality of IC support members engaged with a spiral grove of the disk. Rotation of the spiral disc causes the IC support members to shift in position to accommodate ICs of different sizes.