Abstract: In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.

Abstract: A socket for an LGA or BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of the package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes elements for soldering or bonding the socket to a circuit board.

Abstract: A contact to electrically connect at least one pin of a pin grid array to a printed circuit board is described. The contact comprises a receiving portion having a pair of contact arms, with each contact arm having a curved portion and a straight portion. The contact arms are positioned so that the curved portions form a curved receiving area while the straight portions are substantially parallel to each other to form a contact area. The contact also includes a tail portion having a solder ball receiving portion. The contact further includes a center portion connecting the pin receiving portion to the tail portion.

Abstract: A module carrier includes a liftable upper cover of metal and a plastic seat for securing modules. The bottom portion of the plastic seat is provided with a pair of plastic elements for receiving a plurality of terminals. The contact ends of the terminals have top edges provided with three or four contact points. The rear edge of the upper cover, which has a generally inverted U-shaped cross section, has round posts projecting from the inner portions on both sides thereof. The front edge has slightly lower projecting plates provided on both sides thereof. The upper end of each projecting plate is provided with a boss. The middle portion of the front edge is bent to form an actuating rib. Additionally, the end face is provided with front, rear and middle openings. A pair of downwardly inclined elastic plates are provided above each of the front and rear openings. The plastic seat is provided with front, rear and middle hot air inlets.

Abstract: The present invention relates generally to a new structure and a method for reducing the cost of producing known good die (KGD). More particularly, the invention encompasses a structure and a method that uses a substrate having solder wettable pads, a chip with attached solder balls, and a thin non-conductive interposer that is assembled between the chip and the substrate. The interposer reduces the cross section of the solder connections from the chip to the substrate where the solder passes through (the holes in) the interposer. This reduced cross-sectional area of the solder connection creates a weak point which allows the chip to be easily sheared off of the substrate after a burn-in and test process. The preferred chips for this invention are flip chips.

Abstract: A self retained pressure connector is provided that includes a spring action contact surface at a first end and a compliant interference fit contact surface at a second end. The compliant interference fit contact is supported within a conductive hole in a printed circuit board and the spring action surface contact provides an electrical connection to a conductive element disposed on a second surface. The conductive element may, in alternate embodiments, be a surface pad on the second surface or a second self retained pressure connector rotated ninety degrees from the first self retained pressure connector. A differential self retained pressure connection is also described in which a dielectric material is used to electrically isolate a first half of the connector from a second half of the connector.

Abstract: The present invention relates to a BGA package IC socket that accommodates a BGA (ball grid array) package such that the BGA package IC socket has high reliability and can withstand long-term use. The socket is equipped with package receiving members 140. Package receiving parts 141 of members 140 receive the portions of the BGA package 10 located in the vicinity of the opposite edges of the undersurface of the BGA package 10. The parts 141 pivot downward with the insertion of the BGA package 10. The parts 141 have a shaft which are supported on the housing so that the package receiving members 140 are free to pivot. Springs 150 cooperate with the members 140, such that the springs 150 resist the insertion of the BGA package into the socket.

Abstract: A method for providing electrical contact to pads on a surface of a device involves steps of adding a first contact extension to individual ones of the pads, covering the pads and contact extensions with a layer of protective material, removing a portion of the layer of protective material such that a portion of each of the contact extensions is exposed, and applying a second contact extension to individual ones of the exposed first contact extensions. The first extensions may be any of several different kinds, including wires or solder balls, and the protective material layer provides both protection from environmental effects and added lateral strength for the connection of the first extensions to the contact pads.

Abstract: A multi-layered pin grid array interposer used in a test socket for testing and converting a package having a non-pin grid array footprint to a pin grid array footprint. The multi-layered pin grid array interposer test socket includes a multi-layered pin grid array interposer, a semiconductor device mounted on a package having a non-grid array footprint and a fastener. The multi-layered pin grid array interposer includes a top signal layer having bonding pads on an upper surface, a bottom signal layer having a pin grid array footprint on a bottom surface, at least one power layer between ground layers, the ground layers being between the top signal layer and bottom signal layer, and a links for connecting the plurality of bonding pads to the pins of the pin grid array footprint. The fastener presses the package against the multi-layered pin grid array interposer connecting the leads of the package with the bonding pads.

Abstract: A method for final testing die on a wafer is provided wherein wafers having die are first enhanced by adding contact extensions to contact pads of the die, adding a protective polymer layer covering the contact extensions and planarizing the polymer layer to expose the contact extensions. After this enhancement final testing may be done by probe in the wafer form.

Abstract: A system level test socket for testing semiconductor packages having non-pin grid array footprints. The test socket having solder pads positioned on the test socket to form electrical connections with corresponding leads on the bottom of the semiconductor package. The test socket has internal connections connecting each solder pad with a corresponding connection on the bottom of the test socket. The test socket is mounted on a burn-in board, thus allowing a semiconductor package having a non-pin grid array footprint to be tested without requiring an interposer for converting the non-pin grid array footprint of the semiconductor package. In addition, the test socket includes guide posts which align with guide slots on a hydraulic cylinder. The hydraulic cylinder compresses the semiconductor package to the test socket thereby ensuring solid connections between the semiconductor package and test socket.

Abstract: A connector assembly is provided for solderlessly connecting an integrated circuit package to a printed circuit board. In the first embodiment of the invention, a plurality of generally cylindrical resilient electrical contacts are disposed in through holes formed in a non-conductive substrate. The contacts are formed from a single conductor that is coiled in a helical fashion to form a contact which resembles a spring. Each spring-like contact is formed to begin with an annular rim defining a contact point. The conductor is then coiled in such a manner to form diametrically equal rings which are spaced equidistant apart. The spring-like contact is then concluded with a similar annular rim as to the beginning contact point. An intermediate portion equidistant from beginning and concluding rims is formed so that a small portion of coiled turns have a diameter which is larger than the other diameters defined by the annular rim.

Abstract: A method for providing electrical contact to pads on a surface of a device involves steps of adding a first contact extension to individual ones of the pads, covering the pads and contact extensions with a layer of protective material, removing a portion of the layer of protective material such that a portion of each of the contact extensions is exposed, and applying a second contact extension to individual ones of the exposed first contact extensions. The first extensions may be any of several different kinds, including wires or solder balls, and the protective material layer provides both protection from environmental effects and added lateral strength for the connection of the first extensions to the contact pads.

Abstract: An indicator module, suitable for a vehicle, has a holder engaging over an indicator element for fastening the indicator element to a carrier board such as a printed circuit board. The holder is connected by one leg to the carrier board by a catching of the leg into a recess of the carrier board. The recess of the carrier board has a projecting tongue, and the leg of the holder has a recess engaging over the tongue to accomplish a simplified mounting which retains the indicator element upon the carrier board.

Abstract: A method of electrically connecting protrusion electrodes formed on an IC package to contact pins of an IC contactor is provided, which method includes the steps of (a) receiving and holding the protrusion electrodes by the contact pins, and (b) applying pressing force from outside of the contact pins to the protrusion electrodes so that the protrusion electrodes are held more firmly by the contact pins than in the step (a).

Abstract: An arrangement of three plates where the top plate interfaces with the BGA device, the center plate has a structure of channels or openings which is matched with the size and ball pitch of the BGA device that is being handled while the bottom plate interfaces with the tester or target plate. A plurality of center plates is provided to match and equal the plurality of BGA devices that is handled in the BGA testing or BGA semiconductor-manufacturing environment.

Abstract: A compressible conductive interface provides electrical continuity between a first group of contacts and a second group of contacts in the presence of a compression force applied between the groups of contacts. An insulating housing in the compressible conductive interface has one or more channels and a matrix of apertures. Compressible bars in the compressible conductive interface each have a pair of opposing sides, a base and a nose and are positioned in the channels so that the nose of the compressible bar is at a bottom of the channel into which the compressible bar is positioned. A series of conductive elements, each having a conductive frame and a conductive slider, are also included in the compressible conductive interface. Each conductive element of the compressible conductive interface has a neutral state and a loaded state.

Abstract: An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.

Abstract: An LGP connector comprises an insulative housing and a plurality of contacts. The housing defines a plurality of passageway sections for receiving the contacts therein. Each contact includes a soldering base for soldering the contact to a printed circuit board and an upper contact beam for electrically connecting the contact with an LGP chip, thereby electrically connecting the chip with the printed circuit board. Each contact comprises a pair of anti-rotation tabs extending from an end of the soldering base, and each passageway section transversely defines an anti-rotation cavity in a bottom face thereof and at a first side wall thereof for retaining the anti-rotation tabs of the contact.

Abstract: The present invention proposes a modified structure for preventing EMI of a CPU. The proposed modified structure comprises a base, a shielding element, two first pins, and two second pins. A CPU can be mounted in the base. Two first pin sockets are installed at one side of the base, and two second pin sockets are installed at the other side of the base. Pin-receiving holes are disposed on each of the pin sockets. Pivot joints are installed at one side of the shielding element, and lapping parts are installed at the other side of the shielding element. Each first pin has a main body extending to form a plugging part. The plugging parts of the first pins are plugged in the pin-receiving holes of the first pin sockets of the base. Each second pin has a main body extending to form a plugging part. The plugging parts of the second pins are plugged in the pin-receiving holes of the second pin sockets of the base. The shielding element can be closed or unfolded.

Abstract: A contact sheet used with a socket for connecting an integrated circuit having spherical terminals to a board. The contact sheet has protruding contact springs in some or all of numerous through holes provided in a sheet composed of an insulative elastic material, wherein the contact springs are composed of a conductive material and constituted by two or more cantilevers fixed onto the sheet by bonding or sandwiching one end thereof. Each cantilever has a lower supporting portion and a spherical terminal holding portion, the lower supporting portion is composed of a linear portion or a planar portion formed adjacently to a portion fixed to the sheet, and the spherical terminal holding portion is formed by vertically bending the other end of the cantilever toward one of two openings of a through hole.

Abstract: A socket for an electrical part includes a socket body, an accommodation portion formed to the socket body and adapted to receive an electrical part to which a plurality of terminals are arranged with a predetermined pitch, a plurality of contact pins arranged to the socket body and adapted to contact to or separate from the terminals, respectively, and a positioning structure, comprising a plurality of projection members, formed to the accommodation portion of the socket body for positioning at least two terminals separated by a plurality of pitches on the accommodation.

Abstract: A socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame. The socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket.

Abstract: An interconnection device for connecting a plurality of LCD contacts with a plurality of base circuit contacts. The interconnection device includes a non-conductive body having a U-shaped notch located for self-aligning engagement with a LCD driver chip. In addition, the non-conductive body includes at least one conductive lead. The conductive lead includes a first contact and a second contact that emerge from the non-conductive body. The contacts of the non-conductive body engage corresponding contacts of the LCD and base circuit board when the non-conductive body is engaged in alignment with the LCD driver chip.

Abstract: In an IC socket for an electrical part, a contact pin electrically connecting a terminal of an electrical part and a printed circuit board is provided for a socket body of an IC socket. The contact pin comprises a sleeve having a space with one end opening, a plunger inserted into the sleeve through the end opening thereof to be vertically movable and an elastic member for urging downward the plunger. The sleeve is arranged to be vertically movable with respect to the socket body and is provided with a contact portion formed to an upper end thereof contacts a terminal of the electrical part to be electrically connected thereto and the plunger has a lower end contacting the printed circuit board to establish an electrical connection therebetween.

Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are loosely confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.

Abstract: A socket (1) includes a body (1a) and a cover (3). Body (1a) has a base (2) having a horizontally movable slide (4) thereon on which a BGA package can be mounted and a plurality of contact members (6) arranged on base (2) corresponding to a pattern of solder balls of the BGA package. Each of contact members (6) has a pair of spring arms (6a, 6b) which can be opened and closed in response to movement of slide (4). In one embodiment, a cover (3) is vertically movable relative to body (1a). The cover (3) has motion transfer portions (31) having a wedge shape which are engageable with tapered force receiving portions (43) of slide(4). As cover (3) is pushed down, engagement surfaces (31) of motion transfer portions (30) engage force receiving surfaces (43) of slide (4) and slide (4) moves so that arms (6a, 6b) of contact members (6) are opened. In another embodiment, the motion transfer parts (31) are provided on a head (11) which has an air suction holder for a BGA package.

Abstract: An IC or testing socket is provided, which ensures stable electrical connection of an IC or semiconductor device to be tested to the circuit board of a test apparatus. This socket comprises: (a) a socket body made of a rigid material; the body having penetrating openings; (b) anisotropically conductive members formed in the respective openings of the body; each of the anisotropically conductive members being made of an elastic, insulating material, first conductive particles dispersed in the material, and second conductive particles dispersed in the material; the first and second conductive particles being different in average diameter from each other; and (c) a guide for receiving a semiconductor device to be tested and guiding the device toward the conductive members in the body; the guide being fixed to the body in such a way that electrodes of the device are contacted with the corresponding conductive members in the body.

Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are a flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.

Abstract: Test and/or burn-in sockets for high frequency electronic device packages are formed using contact pins having parallel ends joined by a support beam supported so that one end of the pin extends through a guide into a cavity in the socket and the other end extends through a second guide displaced from the first guide. The outer ends of the contact pins are arranged to contact input/output lands of a external circuitry such as a burn-in board or the like and the inner ends arranged to contact input/output leads or lands on an electronic LGA package. The end portions of the contact pins are constrained in parallel guides which are arranged to precisely align the ends of the pins with the terminal lands and the length and size of the contact pins are minimized to minimize signal distortion.

Abstract: A socket for burn-in testing of an integrated circuit package having electrical leads. The socket includes an outer socket housing and an inner socket housing slidably moveable relative to the outer housing between an upper limit position and a lower limit position, the inner housing for supporting the integrated circuit package thereon and having a plurality of terminal-receiving cavities therein. The socket further includes a plurality of terminals disposed in the terminal-receiving cavities of said inner housing for contacting the leads of the integrated circuit package, a cam mechanism for raising and lowering the inner housing between the upper limit position and lower limit position relative to the outer housing, and a latch mechanism for holding and releasing the integrated circuit package relative to the inner housing.

Abstract: A handler socket has confronting surfaces to which an electrical part and a circuit substrate are connected for an electrical conduction between the electrical part and the circuit substrate. The handler socket comprises a socket body; a plurality of contact pins contacting with the electrical part and the circuit substrate so as to electrically connect the electrical part with the circuit substrate; and a holder holding the plurality of contact pins and adapted to be engaged with the socket body. Each of the contact pins has a contact portion and is held to the holder, whereby the contact portion projects from the confronting surfaces and the holder is removably mounted on a side of the socket body.

Abstract: A test socket for testing a vertical surface mount packaged semiconductor device, the test socket including a test substrate, a support member, and clamps. The test substrate includes terminals which are electrically connectable to a testing device. The shape of the support member is complementary to the shape of the bottom surface of leads extending from the vertical surface mount packaged semiconductor device. The shape of the clamps is complementary to the top surface of the leads. The test substrate may also define lead alignment notches around one or more of the terminals. Upon placement of a vertical surface mount packaged semiconductor device on the test substrate, the leads are aligned with their corresponding terminals, then placed against the terminals and the support member. The clamps are then placed against the leads, biasing each of the leads against the support member and its corresponding terminal.

Abstract: A connector assembly (10) includes a housing (12) defining a plurality of passageways (14) to receive a corresponding number of contacts (16) therein. Each contact (16) includes a pin type contact leg section (18) extending out of the undersurface (20) of the housing (12) with a substantial distance. An interposer plate (22) which is of the same or similar property as the PC board (100) on which the connector assembly (10) is mounted, is disposed on the undersurface (20) of the housing (12). A plurality of through holes (24) are provided within the interposer plate (22) in alignment with the corresponding passageways (14) so that the distal end portion (19) of the leg section (18) of each contact (16) can extend into and through the corresponding hole (24). A solder ball (26) is attachably implanted to the undersurface (28) of the interposer plate (22) beside each hole (24), and a trace (30) is provided between each solder ball (26) and the corresponding hole (24) for electrical interconnection therebetween.

Abstract: An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.

Abstract: A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors. The contactor has an intermediate portion which is inserted in the through hole provided on the contact substrate in a vertical direction, a contact portion which is connected to the intermediate portion and positioned at one end of the contactor to function as a contact point for electrical connection with a contact target, and a base portion which is provided at other end of the contactor, and a spring portion having a cantilever shape upwardly inclined relative to the surface of the contact substrate and provided between the base portion and the intermediate portion.

Abstract: The contact arrangement is a connector block for detachably fastening an electrical component, particularly an integrated circuit having a plurality of terminal contacts disposed in a ball grid array (BGA), in a column grid array (CGA), in a land grid array (LGA) or of the flip-chip type to a printed circuit board. In a support part, a number of contact pins are disposed in a grid in bores. The contact pins project from the bore on the side facing the printed circuit board and are surface-mounted together with contact areas of the printed circuit board. A free end region of each bore is intended for guiding the substantially dome-shaped terminal contacts. Between the end of a contact pin and a terminal contact there is a space bridged for establishing an electrical connection with a contact element, for example an axially compressible coil spring. By means of several holding-down elements disposed peripherally to the integrated circuit, the integrated circuit is pressed down upon the support part.

Abstract: A solderless connector with multiple modes of compliance providing an initial insertion force differing from the secondary insertion force. The connector has multiple compliant members that can be independently adjusted to accommodate a wide range of circuit members. The connector allows the contact members to be arranged with a fine pitch without shorting. The multiple compliant members accommodate a wide range of thermal and vibrational effects, and can be configured to accommodate a wide range of compression distances. An electrically insulative connector housing is positioned substantially between the first and second circuit members. A resilient contact member is positioned generally within the connector housing. The contact member has resilient first and second circuit interface portions. The resilient contact member comprises a first compliant member. At least one end stop is provided for engaging with the contact member in a second mode of compliance.

Abstract: An IC to be tested having solder bumps is mounted on an IC socket mounted on a test board. The IC socket is provided with a contact unit including a plurality of straight contact pins each having an lower end connected to the test board and an upper end connected to the solder bumps and also including an elastic member for supporting the plurality of contact pins. A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of the plurality of solder bumps piercing an associated one of the solder bumps.

Abstract: An interposer for connecting two circuit members. The interposer has two extending conductive ends, is “Z” shaped, and has a center of gravity positioned relative to one of the conductive ends such that the interposer is capable of standing upright upon that end without external support. The interposer may be composed of a plated metal, and at least one of the extending conductive ends may have deposited dendrites or a raised bump. The Z-shaped interposer prevents bowing or cracking of the connected structure which otherwise occurs during use due to the different thermal coefficients of expansion of the two circuit members.

Abstract: An I/C chip socket is provided with a separate docking platform having a seating surface with an array of locator openings for receiving and fixing the position of the I/O contacts of an I/C chip such as the solder balls of a BGA. The docking platform is depressibly mounted in the base portion of the socket over the tips of an array of pogo pins. The docking platform acts to precisely center the I/O contacts of the I/C chip seated thereon with the pogo pin tips.

Abstract: An electrical connector includes a first connector having a plurality of electric contacts and a second connector having a plurality of electric contact elements which are to be contacted with the electric contacts of the first connector when the first and second connectors are connected. A board of the second connector which supports its electric contact elements is formed with slits closely surrounding the respective electric contact elements. Preferably, the board consists of a first board formed with the slits described above and a second board formed with an opening having an area corresponding to the whole area of the first board provided with the electric contact elements.

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

Abstract: A contact comprises an engagement plate, a first curved neck and a second curved neck respectively extending from different positions of the engagement plate. A surface mount section is connected to the first curved neck and retained horizontal for mounting a solder ball thereon. A contacting section is connected to the second curved neck via a resilient arm. The resilient arm is deformable in response to an external urge to the contacting section, and a tension resulted from the deformed resilient arm is fully absorbed by the engagement plate.

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

Abstract: A connector comprises an insulative housing in which a plurality of passageways are defined. A plurality of contacts are received in the passageways. Each contact comprises an engagement plate loosely retained in the passageway, a positioning section connected to the engagement plate via a first flexible neck and mounted thereon a solder ball, a contacting section located above the positioning section and connected to the positioning section via a second flexible neck. When the solder ball is soldered on a printed circuit board and the housing and the contact is urged by an external electrical device, the housing is moved downward with respect to the engagement plate of the contact and the contacting section is pressed downward by the external electrical device, with the second flexible neck being deformed for providing a normal force facilitating the contacting section to abut against the external electrical device.

Abstract: An attachment structure between a semiconductor device socket and a test circuit substrate is provided. The semiconductor device socket includes a socket body and a contact film disposed therein. Extension conductive wires extended from a contact portion to be connected to a semiconductor device are formed on the contact film. The contact film is also provided with socket connectors connected to the extension conductive wires. The test circuit substrate is provided with circuit substrate connectors corresponding to the socket connectors. The socket connectors and the circuit substrate connectors are in a male-female connector relationship.

Abstract: In a socket for an electrical part, the electrical part is mounted on one surface of a socket body of the socket and a plurality of electrical conductive members are disposed to the socket body and are in contact with terminals of the electrical part mounted on the one surface so as to electrically be conducted therewith, respectively. A press member for pressing the electrical part is mounted to the socket body to be supported by a pivotally and movably support device disposed to the socket body to an open position located away from an upper side of the one surface of the socket body. The pivotally and movably support device makes the press member, which is positioned to the open position, pivot to a close position located in the upper side of the one surface thereof. The pivotally and movably support means makes the press member pivoted to the close position move on a parallel to a vertical direction toward the electrical part on the one surface of the socket body so as to press the electrical part thereto.

Abstract: A connector of which the terminals are staggering arranged so that each terminal is closely surrounded by another six terminals to enable an increased density of terminals in one unit area. Each of the terminals of the connector includes an upper and a lower elastic portion for respectively connecting to contacts of a working element and a printed circuit board assembled to the connector. Two forward pressures in opposite directions are applied by the working element and the printed circuit board on the connector to cause the upper and the lower elastic portions of the terminals to electrically connect to the contacts on the working element and the printed circuit board. No tin soldering is required in the assembling of the working element and the printed circuit board to the connector. And, the elastic portions of the terminal may be differently shaped.

Abstract: Detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit and comprising a support (7) traversed by openings (13). A metal pin (3) is inserted in each of the openings (13). One end of each pin is intended to be placed in electrical contact with at least one path (8) of the printed circuit, while the other end is intended to be placed in electrical contact with a connection finger (6) of the electric component mounted (1) or of the other printed circuit. The pins are held longitudinally only loosely within the openings (13), between two springs (4 and 40) permitting the pins to move slightly. The pins may be composed of a rod (3) or of a spring (3′). The springs (4 and 40) may be replaced by a rubber mat containing parallel electric wires. A radiator (35) holds the integrated circuit on the base.