Abstract: A transceiver adapter is provided that includes a substrate, including electrical contacts on a first side thereof for electrically contacting a transceiver, and electrical contacts on a second side thereof for electrically contacting a printed wire assembly. A transceiver adapter is also provided that includes an adapter plate, including (a) tabs for positioning a transceiver, and (b) mounting pins for coupling the adapter plate with a, printed wire assembly; and a substrate hole through which a transceiver may be electrically mated with a printed wire assembly. A transceiver is also provided that includes electrical contacts; and a mateable electrical connector, including (a) electrical contacts on a first side thereof for electrically contacting the electrical contacts of the transceiver, and (b) electrical contacts on a second side thereof for electrically contacting a printed wire assembly.

Abstract: A fluted signal pin provides expanded surface area for high frequency operation which minimizes inductive and capacitive effects. The signal pin may be mounted to a circuit board via a support stanchion or membrane during assembly or repair. The membrane may be permanent or removable by heat, water, and/ or detergent. A pin cap optionally is provided to ensure attachment to an overlying integrated circuit package.

Abstract: A socket is shown for interconnecting a chip to a printed circuit board, where the socket is comprised of a housing and a substrate. The substrate is of the type comprising a plurality of wire leads extending upwardly from the substrate, and which are interconnected to solder balls on the opposite side of the substrate. The housing has a plurality of slots therethrough, such that the substrate can be positioned on the lower side of the housing with the resilient leads extending upwardly in the slots. A chip receiving face is positioned on the opposite side of the housing for contacting the resilient leads of the substrate. The housing includes resilient arms on opposite sides of the housing, which grip the substrate and which maintain the housing in a resiliently biased position above the substrate, such that the leads remain in their respective slots.

Abstract: A connector assembly for providing electrical continuity between an array of contacts on an electrical component and a corresponding array of contacts on a printed circuit board. The connector assembly includes a plurality of floating pins. Floatation of the pin within a receptacle of the component body provides a first mode of compliance for electrical components, connector assemblies and printed circuit boards that are not coplanar. For a second mode of compliance to account for non-planarity, each pin includes an elongated, elastically deformable cantilever beam. Each pin is adapted and configured to accommodate the deformed cantilever beam of an adjacent pin without mechanical or electrical contact or interference.

Abstract: A conventional land grid array (LGA) socket assembly uses the same socket contact in the power delivery area and the signal delivery area. Using low current socket contacts in the power delivery area may create self-heating and limit power delivery from a printed circuit board (PCB) to an IC package mounted in the socket. Embodiments of the present invention are directed to an LGA socket assembly that has a separate power delivery contact, which includes contact pins and contacts pads that are ganged using a cross beam to form a comb-shaped contact. In an alternative embodiment of the present invention, an LGA socket assembly has a shorter channel in the power delivery area than in known LGA socket assemblies. In still another embodiment, an LGA socket assembly has a shorter channel in the power delivery area in the signal delivery area.

Abstract: A socket (10) has a base member (20), a cover member (30) which is mounted for alternating motion toward and away from base member (20), a plurality of contacts (40) having an end fixed to the base member (20), a contact regulating member (50) that regulates the position of the movable ends (42, 92) of the contact and an adaptor (60) having a seating surface, the adaptor which is mounted for alternating motion toward and away from the contact regulating member (50). When adaptor (60) is removed from the contact regulating member, the movable ends of the contacts do not protrude through the seating surface and when adaptor (60) has been moved toward the contact regulating member (50), the movable ends of the contacts protrude from each through-hole (65) of adaptor (60) for engagement with the solder balls of a BGA device (11), placed on the adaptor (60). The cover member is linked to the base member and latches (70) having a BGA device pressing tip (72) are rotatable with movement of the cover.

Abstract: An LGA socket connector (1) comprises a rectangular base (2), a plurality of terminals (5) received in the base, and two reinforcing members (4) attached to the base. Tow side walls (23) are formed on opposite ends of the base. Each reinforcing member has an elongate base plate (40), a first side plate (42) bent perpendicularly inwardly from a top edge portion of the base plate and a second side plate (44) bent perpendicularly inwardly from a bottom edge portion of the base plate. With this configuration, the reinforcing member is formed from a sheet of metal with very little wastage. Further, the reinforcing members each have a “C”-shaped cross-section. Thus the reinforcing members each can attain a good rigidness along a length thereof. The two reinforcing members are respectively attached to the side walls of the base, thereby the base is effectively reinforced.

Abstract: A socket for an IC package avoids deformation or damage of an IC package body. The socket includes a socket body having a receptacle portion of the IC package and a plurality of contacts arranged on a bottom surface of the receptacle portion and resiliently displaceable in up and down directions. Latches are pivotably provided in the socket body and being biased toward the receptacle portion by springs. The socket further includes connecting metals provided for relative motion with respect to the socket body and for moving the latches away from the receptacle portion against the springs, slots and projections restricting motion magnitude toward the bottom surface of the receptacle portion at a predetermined value.

Abstract: A land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts. A lever is pivotally mounted on a second end of the insulative housing. The lever has a locking portion for locking the cover member in the closed position. A metallic reinforcing plate is positioned on a bottom surface of the housing. The metallic reinforcing plate extends between the first end and the second end of the insulative housing.

Abstract: An electrical connector assembly (1) includes a base (2), and a frame (3) assembled with the base. The base includes two solid cylindrical fixing posts (231) at two diagonally opposite corners thereof. Each fixing post includes a fixing portion (2312) at a top thereof. The frame defines two fixing holes (32), corresponding to the fixing posts. Each fixing hole is surrounded by a step (321) thereat. When the base and the frame are assembled together, the fixing posts are deformably received through the fixing holes, and the fixing portions hook on the steps. Thus the frame and the base are combined together firmly. Because the fixing posts are solid and generally cylindrical, during assembly, the fixing posts can fasten the frame on the base firmly and securely with minimal risk of breakage.

Abstract: An LGA connector (1) includes a housing (2), and a number of contacts (3) received in the housing. The housing defines a cavity (23) in a middle thereof for receiving a CPU (7) and a multiplicity of passageways (231) in a portion thereof under the cavity, and has a number of stand-offs (220) at a bottom surface thereof. Each passageway includes a slot (2312). Each contact comprises an engaging portion (33) movably engaging in the corresponding slot, a long arm (31) accommodated within the passageway, and a solder portion (32) engaging a PCB (5). In use, the CPU is pressed downwardly to press the housing downwardly. The engaging portion of each contact slides upwardly in the slot. The stand-offs of the housing attach on the PCB, and the long arm of each contact deforms elastically to contact the CPU. The LGA connector thus electrically connects the CPU with the PCB.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Abstract: A processor actuation system for engaging electrical contacts of a processor with mating elements of a socket. The processor actuation system comprises a socket, a processor, a heat sink and a cam actuator. The socket includes a base, an actuator-receiving member and a sliding cover. The processor includes electrical contacts extending from a surface of the processor. The processor is mounted on a processor-interface surface of the sliding cover. The heat sink mounts on at least one of the processor and the socket. The cam actuator connects to the actuator-receiving member. The cam actuator moves the sliding cover in a longitudinal direction with respect to the base, such that movement of the sliding cover along the longitudinal direction moves the processor and the heat sink along the longitudinal direction to lock the processor.

Abstract: The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.

Abstract: A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.

Abstract: An intermediate portion between groups of contact pins in a lead frame of a contact pin module is supported by a supporting plate.

Abstract: An electrical connector assembly (1) includes a base (11) receiving a number of electrical contacts, and a frame (12) assembled on the base. The frame defines an opening (121) in a middle thereof for receiving a CPU (3) therein, two fixing holes (123) at diagonally opposite corners thereof, and two semi-circular orientation holes (122) at two opposite sides thereof. The base includes a planar portion (111) having a top surface (115) and a bottom surface (114). Two orientation projections (119) are formed at the top surface, for interferentially engaging with the orientation holes. Two forked fixing posts (116) are formed at the top surface, for snappingly engaging in the fixing holes of the frame to mount the frame on the base. Two protrusions (117) are formed at the bottom surface, for interferentially engaging in corresponding bores (21) of a PCB (2) to mount the electrical connector assembly on the PCB.

Abstract: An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first elongated side and a second opposed and generally parallel elongated side. The first and second sides extend in the longitudinal direction. Each of the first and second sides have at least one portion formed by a series of depressions in the respective first and second sides. The depressions extend inwardly from a first outer surface of the first side and a second outer surface of the second side. The depressions are metallized to form leads. A circuit assembly is also provided comprising a multi-chip module having a plurality of electronic elements; a circuit substrate supporting thereon a conductive circuit pattern adapted for connection to the multi-chip module and at least one the interconnects for attaching the multi-chip module to the circuit pattern on the circuit substrate.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip (2) with a printed circuit board includes an insulative housing (12), a frame (11) engaged with the housing, and a plurality of terminals (13) received in the housing. The housing defines two adjacent sides (122, 123). A plurality of arcuate protrusions (1220, 1230) is formed on said sides. The frame has four sidewalls (110, 113, 114, 115) defining a central cavity (111) therebetween for receiving the LGA chip therein. Two adjacent of the sidewalls define a plurality of cutouts (1110, 1130) in respective inner faces thereof, corresponding to the protrusions respectively. The frame is mounted on the housing, with the protrusions being engagingly received in the corresponding cutouts. When the LGA chip is engaged with the connector, the protrusions elastically deform to accurately guide and securely fix the LGA chip in the connector.

Abstract: An adapter assembly is provided for adapting an LGA packaged IC to a PGA socket. The adapter assembly comprises a package body with a plurality of through holes, and a plurality of pins received in the through holes and each having a spring end and an insertion end. The spring end of the pin abuts against an electric contact land of the LGA packaged IC and the insertion end of the pin is inserted into the PGA socket, whereby the LGA packaged IC is in electrical connection to the PGA socket.

Abstract: An electrical connector includes a base (4) defining a surface (42) and a number of passageways (41), and a number of contacts (1). Each contact comprises an engaging portion (11) for engaging in the passageway, a medial portion (13) extending upwardly from an end of the engaging portion, a solder portion (12) extending perpendicularly from an opposite end of the engaging portion, an inclined portion (14) extending aslant from the medial portion, and a cantilever (15) extending from the inclined portion. The inclined portion and the medial portion form therebetween a connecting portion having a first line. The first line forms an angle relative to the surface of the base. The inclined portion and the cantilever form a connecting portion therebetween having a second line, the second line forming an angle relative to the surface of the base. A contact portion (17) is defined on an upper end of the cantilever.

Abstract: An apparatus for mounting a semiconductor device to a circuit board for testing is disclosed. The semiconductor device includes semiconductor circuitry and leads to connect the semiconductor circuitry to the circuit board. Additionally, the semiconductor device is decapped so that at least a portion of the semiconductor circuitry is exposed. The apparatus includes a frame and a fastener. The frame is adapted to mate with the semiconductor device, and forms an opening for accessing the semiconductor circuitry and an edge surface for receiving the semiconductor device. The fastener is connected with the frame for removably connecting the frame to the circuit board. By using a frame instead of a socket, the distance to the semiconductor device once the device is mounted to the circuit board, and particularly the top side of the semiconductor device, can be reduced so that the device may be tested using a probe.

Abstract: An electrical connector for electrically connecting an electronic package (91) with a circuit substrate. The electrical connector includes an insulative housing (3), and a multiplicity of conductive terminals (1). The housing includes a top face (32) and a bottom face (33), and a plurality of passageways (30) defined between the top face and the bottom face. The terminals are received in the passageways, respectively. Each terminal includes a soldering base (10) for electrically connecting to the circuit substrate, and an upper contact beam (21) extending upwardly and forwardly from the soldering base. The upper contact beam includes a curved contact portion (22), and a distal end (24) extending downwardly and rearwardly from the curved contact portion. The curved contact portion is exposed above the top face of the housing for electrically connecting to the electronic package, and the distal end is located below the top face of the housing.

Abstract: The present invention provides a land grid array (LGA) connector that is formed from a plurality of sections. Specifically, each LGA section includes at least one set of fingers. Each set of fingers interconnects with a set of fingers of another section to form the LGA connector. By forming the LGA connector in this manner a maximum quantity of input/output (I/O) contacts can be provided.

Abstract: An IC socket of the present invention has a socket body on which a contact pin is provided. The contact pin has an elastically deformable spring portion between an upper end portion and a lower end portion. An elastic deformation portion having an engaging portion at its endmost portion. The socket body has an upper through hole into which the upper end portion of the contact pin is inserted, and a lower through hole into which the lower end portion of the contact pin is inserted.

Abstract: A socket is disclosed for connecting an electrical device to an external circuit such as a printed circuit board. The socket comprises a housing having a bottom surface and a top surface with a plurality of apertures therethrough, a plurality of contact terminals, each terminal disposed within one of the apertures of the housing and a compressible structure of electrical conductive material disposed within each of the plurality of contact terminals. Additionally, the socket may also include a loading device for securing the electrical device to the socket.

Abstract: A socket structure for grid array (GA) packages, mainly comprises the flexible chassis assembly, the frame, the first hinge cover lid and the second hinge cover lid. The flexible chassis assembly comprises the silicon rubber pad, the inner base plate, the flex-board, two solder mask layers, bumps and solder balls. The flex-board, encompassing the silicon rubber pad and the inner base plate, is used for electrical contacts. By pressing the first hinge cover lid and the second hinge cover lid downward, the hinge pads thereon contact with the substrate of the package and snap the package firm in place. In this invention, the package with pre-attached heat sink can be easily placed into the socket.

Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.

Abstract: Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact structures are disposed along the bottom of the support substrate in electrical contact with the ends of the resilient contact structures. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In an embodiment intended to receive an LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate.

Abstract: An assembly for mounting elongated electrical contact elements to an integrated circuit package or printed circuit board. The assembly comprises a a base plate having a first surface and a multiplicity of recesses aligned with each other in the first surface. Each of the recesses is sized and configured to receive a respective one of the contact elements. The assembly also comprises first and second spaced apart supports extending from the base plate. The assembly also comprises first and second rods received by the first and second supports and supported parallel to each other. The first and second rods define an intervening slot aligned with the recesses. The assembly also comprises a multiplicity of the contact elements. One end of each of the contact elements is received in a respective one of the recesses. The contact elements are engaged by the first and second rods, whereby the contact elements are held in their respective recesses.

Abstract: A connector for an electronic or an optoelectronic component which is plug-in connected to a connecting part of an electrical device, comprising a supporting body which has a receiving recess for receiving the connecting part, the recess being open toward the outside. Further, the connector comprises an electronic or an optoelectronic component which is arranged on the supporting body, and at least one lead which is connected to the electronic or the optoelectronic component and extending therefrom into the recess, wherein an end section of the lead extends into the recess and forms a terminal for being connected to a corresponding terminal of the connecting part received within the recess. Further, a circuit board system comprises a circuit board having an edge on which a terminal is arranged to which the connector is connected.

Abstract: A socket (1) has a base (2) on which rows of contact pins 4 are arranged, the contact pins being elastically deformable in the vertical direction, an adaptor (5) having rows of contact holes (5d) arranged extending through a seating surface (5c) and which is capable of vertical movement relative to the base (2) so that contact tips (4a) of contact pins (4) can move in respective contact holes (5d). Latches (21) are arranged to be able to press the IC package on the seating surface (5c) of the adaptor (5) and a vertically movable regulator (7) is arranged at a selected position relative to adaptor (5) when stop surfaces (7e) of the regulator are engaged with a part (4e) of the contact pins (4) so as to regulate the position of the contact tips (4a) in the contact holes (5d).

Abstract: A connector-transport assembly for holding and transporting a electronic component includes a socket connector having a receptacle sized to receive the component therein and a transport carrier member. The socket receptacle includes two engagement arms formed therewith which are deflectable between first and second operative positions. In the first operative position, the engagement arms extend into the receptacle for contacting opposing exterior surfaces of the component, and in the second position the engagement arms are deflected away from the receptacle so as to not engage exterior surfaces of the component. The engagement arms have cam portions disposed thereon, and the carrier member includes actuating members disposed thereon in opposition to the socket connector engagement arm cam portions so that movement of either the socket connector or the carrier member will move the engagement arms between their first and second operative positions to release or engage the electronic component.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: An electrical connector is used to connect first an second electrical elements together. A body of the connector is formed from an elastomer with a top surface and a bottom surface. Elastomeric bumps extend from the top and bottom surfaces and holes extend through the pairs of bumps and body. The bumps and holes arc metalized. To install the connector, the connector is compressed and held between the First and second elements. The compression of the connector causes the bumps to force the metalized layer of the connector against the first and second elements.

Abstract: A center bond flip chip device carrier and a method for making and using it are described. The method includes forming a seat with a cut out portion in at least one trace on a substrate and providing an elastomeric material over the substrate. The seat is sized and configured to receive a conductive connecting structure. The elastomeric material has a gap at the seat to allow electrical connection of the conductive connecting structure with a semiconductor die.

Abstract: An LGA socket (1) for electrically connecting an LGA package (3) to a PCB (4) includes a low-profile insulative housing (10) defining a plurality of passageways (13) that receive a plurality of terminals (20) therein. A pair of slots (14) is defined in opposite sides of the housing, each slot accommodating a flexible supporting member (15). Each supporting member includes a base portion (16) connecting with the housing, a pair of cantilever arms (17) extending from the base portion, and a deflectable supporting block (18) formed at a free end of each arm. Each supporting block has a first supporting portion (181) protruding beyond a top surface (11) of the housing, and a second supporting portion (182) extending toward a bottom surface (12) of the housing. The supporting block can deflect in the slot relative to the base portion of the housing, and thereby support the socket on the PCB.

Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

Abstract: A socket for an electrical part is provided with a socket body for accommodating an electrical part and a guide member is provided for the socket body so as to guide side surfaces of a body of the electrical part at the time of the accommodation thereof. The socket body is formed with a number of contact pins so as to be contacted to or separated from an electrode as a terminal of the electrical part. The guide member includes a plurality of guide portions, at least one of the guide portions being disposed so as to correspond to each of all the side surfaces of the electrical part body, respectively, and each of the guide portions has an elastic portion for elastically pressing inward the side surfaces.

Abstract: A socket may comprise an array of first contacts and a set of second contacts having a greater conductive cross-sectional area than the first contacts. The set of second contacts may also have a greater conductive area efficiency than the array of first contacts, with conductive area efficiency defined as a total conductive cross-sectional area divided by a total occupied area. The array of first contacts may electrically couple signal pads of a land grid array (LGA) component with a plurality of signal lines in a printed circuit board (PCB). The set of second contacts may electrically couple power delivery land pads of the LGA component with power and ground planes of the PCB.

Abstract: A connector assembly for providing electrical continuity between an array of contacts on an electrical component and a corresponding array of contacts on a printed circuit board. The connector assembly includes a plurality of floating pins. Floatation of the pin within a receptacle of the component body provides a first mode of compliance for electrical components, connector assemblies and printed circuit boards that are not coplanar. For a second mode of compliance to account for non-planarity, each pin includes an elongated, elastically deformable cantilever beam. Each pin is adapted and configured to accommodate the deformed cantilever beam of an adjacent pin without mechanical or electrical contact or interference.

Abstract: A test fixture for semiconductor packages and a test method of using the test fixture are proposed. The test fixture is composed of a first circuit board, a second circuit board, an interposer and a covering member. The first and second circuit boards are used to accommodate semiconductor packages and electrically connect the semiconductor packages to a test device, in a manner that the second circuit board is interposed between the semiconductor packages and the first circuit board. The interposer is mounted on the second circuit board, and formed with through holes for receiving the semiconductor packages therein. The covering member is attached onto the interposer, and provided with elastic mechanisms for holding the semiconductor packages in position. By using the test fixture, semiconductor packages can be firmly coupled to the test device where functional tests are performed.

Abstract: A component mounting structure including a metal base; a first substrate bonded to the upper surface of the metal base; a first wiring pattern formed on the upper surface of the first substrate; a second substrate horizontally mounted on the upper surface of the first substrate so that the lower surface of the second substrate is in contact with the upper surface of the first substrate; a second wiring pattern formed on the second substrate so as to be connected to the first wiring pattern; and a component mounted on the second substrate so as to be connected to the second wiring pattern.

Abstract: A socket may comprise an array of first contacts and a set of second contacts having a greater conductive cross-sectional area than the first contacts. The set of second contacts may also have a greater conductive area efficiency than the array of first contacts, with conductive area efficiency defined as a total conductive cross-sectional area divided by a total occupied area. The array of first contacts may electrically couple signal pads of a land grid array (LGA) component with a plurality of signal lines in a printed circuit board (PCB). The set of second contacts may electrically couple power delivery land pads of the LGA component with power and ground planes of the PCB.

Abstract: An integrated circuit device socket is spring-loaded to accept and capture a semiconductor device. As the frame springs relax, a device nest and capture arms lower the device down onto a grid of pogo-pins that probe the contacts underneath. Such pogo-pins pass through a dielectric grate, and are self-cleaning. The capture arms lock as they slide into constraint channels. Such prevents the device from escaping when a large aggregate force is applied from beneath by the pogo-pins. Each pogo-pin can generate 20-grams of contact force, and combine to as many as six pounds of force. To release the device, cams are used to force the frame springs open. The constraint channels clear the capture arms. The device releases when the capture arms move apart fully open.

Abstract: An electrical connector (1) includes a dielectric housing (2) having a mounting surface (202) and a number of passageways (22) extending through the mounting surface and a number of contacts (3, 3′) received in the passageways of the housing. Each passageway receives dual contacts therein. The dual contacts have mating portions (32) for engagement with a complementary connector (5) and angled tail portions (34, 34′) extending opposing to each other to form a recess (36) therebetween. A solder ball (4) is positioned in the recess of the corresponding dual contacts and attached to the tail portions of the corresponding dual contacts for soldering to a circuit substrate (8) on which the connector is seated.

Abstract: A connector for mounting to a circuit board, includes a housing and a plurality of terminals arranged side by side at the predetermined pitch. Each terminal includes a flat base portion, a pair of contact members formed from a continuous folded-back portion that is folded back to one side of the flat base portion, and a carrier coupling section that is bent at substantially right angle to the opposite side of the flat base portion. The housing holds the terminals by an over-molding of the housing around the flat base portions of the terminals to form a generally flat plate-like housing. The pair of contact members of the terminal extends toward one surface of the dielectric housing and the carrier coupling section extends toward the other surface of the housing.

Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball gid array connector.