Abstract: A replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The replaceable chip module includes a module housing has a plurality of device sites each capable of receiving at least one first circuit member. A first connector is located in each of the device sites. The first connector includes one or more first contact members having a first compliant member defining a first circuit interface engageable with the first circuit member, a resilient, dielectric encapsulating material defining a second compliant member surrounding a portion of the first contact member, the first and second compliant members providing a first mode of compliance, and at least one end stop positioned to engage with the first contact member in a second mode of compliance. A second connector is positioned to electrically connect the first connector to the second circuit member.

Abstract: A contact comprises a plate, a positioning section connected to the plate via a first flexible neck and adapted to be mounted by an external solder ball, a contacting section located above and connected to the positioning section via a second flexible neck. The first flexible neck is deformable to absorb a tension originated from the plate. The second flexible neck is deformable to force the contacting section to abut against an external electrical device when the external electrical device urges the contacting section to electrically connect to the solder ball via the contact.

Abstract: A method of securing an electronic package to a circuit board includes the step of providing a retainer having a locating cavity defined therein. The method further includes the step of positioning the electronic package within the locating cavity so that the electronic package is fixed in relationship to the retainer. Moreover, the method includes the step of securing the retainer in fixed relationship to the circuit board so as to sandwich the electronic package between the retainer and the circuit board. The securing step is performed after the positioning step. An apparatus for securing an electronic package to a circuit board is also disclosed.

Abstract: A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening.

Abstract: An IC socket is provided with an IC package which is to be connected to a printed circuit board. The IC socket includes a terminal socket, to be connected to the printed circuit board to establish an electrical connection therebetween, an intermediate connector, such as tab film, which is mounted on the terminal socket, and on which the IC package is to be mounted. The intermediate connector is provided with an IC package side surface, on which an electrode pattern adapted to be joined to a terminal arrangement of the IC package is formed, and another terminal socket side surface on which contact terminals to be connected to the terminal socket are formed. The intermediate connector is further provided with a circuit for connecting the electrode pattern and the contact terminals.

Abstract: A retention device for mounting a heat sink to a CPU socket comprises a pair of supporting members and a pair of pressing members. Each supporting member is pivotably assembled with one pressing member to form a subassembly. The subassemblies straddle opposite ends of the CPU socket, respectively. Each supporting member comprises a supporting portion defining a supporting face thereon and a pair of side portions. The side portions define a pair of through holes therethrough and a pair of side supporting face thereon. The supporting faces together with the side supporting faces support opposite sides of a heat sink having a pair of retention plates extending therefrom thereon. Each pressing member comprises an operating portion and a pressing portion defining an abutting portion to engage with a corresponding retention plate of the heat sink. Each pressing portion forms a pair of axles extending from two opposite outer surfaces thereof to engage with the through holes of the supporting member.

Abstract: In an apparatus for testing an electronic device, a life of a measurement board is significantly extended by interposing a plate member between the measurement board and a device mounting member for accommodating the electronic device. The plate member has a plurality of rear pads to be brought into contact with each of the pads of the measurement board on a back surface thereof and a plurality of front pads electrically connected to each of the rear pads through via holes on a front surface thereof. The plate member is places between the measurement board and the device mounting member on testing the electronic device and can be readily replaced by a new one when it is worn away.

Abstract: Disclosed is an improved integrated circuit socket having electrically conductive pads formed on a resilient circuitry component for contacting the terminals of an integrated circuit (IC) package which is positioned on the resilient circuitry. The electrically conductive pads are arranged around the center area of the resilient circuitry to be in one-to-one correspondence with the terminals of the IC package. The electrically conductive pads have individual circuit paths of substantially the same length and which are extending outwardly from the center area of the flexible circuitry, and additional electrically conductive pads are formed on the back side of the flexible circuitry in order to effect the required electrical connections to exterior circuits. These electrically conductive pads on the back side are connected to the conductor pattern on the front side by conductive through holes or vias. With this arrangement all conductors have the same, reduced inductance.

Abstract: A contact comprises a central torsion beam, two side plates integrally connected to two ends of the central torsion beam and each side plate is perpendicular to the torsion beam. Two curved spring arms extend oppositely from a center portion of the torsion beam so that when the side plates are fixed in position and the curved spring arms are exerted opposite forces by two contact pads sandwiching the contact, the torsion beam will be twisted for a predetermined angle to transmit reactive forces to the curved spring arms to abut against the contact pads.

Abstract: A socket connector includes an insulative body defining a number of chambers each retaining a contact element. The chambers receive solder balls of an integrated circuit (IC) module therein to form electrical engagement between each contact element and the corresponding solder ball of the IC module. The contact element has a trifurcated end including a central branch and two side branches which are bent in opposite directions thereby defining a space therebetween for receiving and securely retaining the solder ball. The side branches are spaced from each other for partially receiving the solder ball therebetween. Each side branch has a sharp edge that cuts through an oxidation layer formed on the solder ball thereby eliminating high impedance caused by the oxidation layer.

Abstract: There is provided an IC socket having a plurality of contact pins 1. The plural contact pins 1 are arranged in a matrix form so that the pitch thereof at one end agrees with the electrode pitch of a semiconductor device 13 to be mounted and the pitch at the other end agrees with the pitch of the electrical connection terminals of an external connection body to be connected.

Abstract: A leadless IC or other electronic circuit package socket is provided which is of simple construction providing low profile mounting of an IC package on a circuit board. The socket comprises a relative thin socket carrier having a plurality of resilient conductive columns extending between the top and bottom surfaces of the carrier and having alignment elements which are cooperative with elements on a circuit board on which the carrier is mounted to position the carrier on the circuit board such that the conductive columns are in registration and electrical contact with corresponding ones of contacts on the circuit board. An IC package or other circuit package has contacts on the bottom surface thereof in a pattern corresponding to the pattern of the resilient conductive columns of the socket carrier, and also has alignment elements cooperative with elements on the socket carrier to provide alignment of the package contacts and the conductive columns when the package is mounted on the socket carrier.

Abstract: An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed through rigid segments and signals are routed through a thin film flexible connector that runs from the upper surface of the interposer substrate to the lower surface. Bypass capacitance is incorporated into the interposer substrate and connected to the power supply so that it is positioned very close to the integrated circuit chip. The interposer may be fabricated by forming a multilayered thin film structure including the signal paths over a rigid substrate having vias formed therein, removing the central portion of the substrate leaving the two end segments, and folding and joining the end segments such that the vias are connected.

Abstract: A board body constituting a characteristic evaluation board has a holding section for holding a semiconductor chip therein. The semiconductor chip has a plurality of bumps. The respective bumps of the semiconductor chip are set in contact with corresponding electrodes with the semiconductor chip held in the holding section in the board body. Clamping mechanisms are located on the surface of the board body in the neighborhood of the holding section. The clamping mechanisms press the semiconductor chip held in the holding section. The respective bumps on the semiconductor chip are pressure contacted with the corresponding electrodes. Since the respective bumps are pressure contacted with the corresponding electrodes without using a solder, the respective bumps can be formed of an eutectic solder. The semiconductor chip held in the holding section can readily be taken out of the holding section by opening the clamping mechanisms.

Abstract: A cover assembly for a socket suitable to accommodate modules of varying thicknesses which can be advantageously used for final test and burn-in test is described. The assembly is characterized by having a low profile and includes a hinged lid; a floating shaft coupled to two cams pivoting on the floating shaft; a locking member positioned between the two cams for locking the hinged lid when in a closed position, the locking member pivoting about the floating shaft; a pressure plate for forcing the module into the socket; and stiffening members integral to the hinged lid located on opposing sides of the hinged lid and below the surface of the pressure plate for providing added strength to the assembly. The assembly also includes a heatsink inserted through an aperture located in the pressure plate, to directly contact the chip which is mounted on the module. The force applied to the chip is independent of the force applied to the module.

Abstract: An IC socket includes a socket body (1) for supporting lower end sections of bow-shaped contact pins (3), a floating member (2) provided with holes (2a) for guiding upper end sections of the contact pins (3), and a cover member (4) for pressing the floating member. Borders of the guide holes (2a) act as stoppers for the upper end sections of the contact pins (3) for regulating height of projection thereof from the floating member (2) and contact positions thereof in reference to solder ball terminals to prevent damage to the solder ball terminals of the IC package even if the solder balls are softened under a heat-resistance test or the like. In one embodiment, the IC socket can effectively perform wiping of the solder balls when it is used at an ordinary temperature. The cover member (4) may be used and formed with a surface (4b) for first engaging the IC package and another surface (4a) for subsequently engaging the top surface of the floating member (2).

Abstract: An adapter for interfacing a tester with the leads of a dual-flatpack or quad-flatpack is disclosed herein. The adapter includes lengths of a conductive elastomer for making electrical contact with the rows of leads extending from the flatpack. The lengths of conductive elastomer are each located within a slot formed in a body of the adapter and are exposed within a depression in the adapter, where the width and length of the depression correspond to the width and length of the flatpack. The adapter is frictionally secured to the flatpack when the adapter is pressed onto the flatpack. The resilient conductive elastomer makes reliable contact to the leads of the flatpack.

Abstract: A socket for a semiconductor device having solder balls includes a circuit substrate, an interposing sheet and a holder. The circuit substrate has conductive bumps on one side thereof corresponding to the solder balls, respectively. The interposing sheet has interposing electrodes through the interposing sheet corresponding to the solder balls, respectively. The diameter of each interposing electrode is greater than that of each solder ball. The holder holds the semiconductor device on the circuit substrate through the interposing sheet under a load such that the interposing electrodes electrically connects the solder balls to the conductive bumps, respectively.

Abstract: An enhanced electrical arrangement for a computer includes a circuit board, and a module arranged essentially parallel to the circuit board. An array connector is positioned between the circuit board and the module. The array connector causes the circuit board to be in electrical communication with the module. A clamping arrangement is provided for urging the circuit board and the module toward each other, by exerting a constant force against the module to cause an electrical connection between the circuit board, array connector and the module. The clamping arrangement includes an alignment assembly that is mounted to the circuit board to help align the module, and a load assembly to provide the force on the module. The alignment assembly and the load assembly are removably engageable with one another. When the load assembly is engaged with the alignment assembly, the load assembly can apply the force on the module which urges the module toward the array connector and the circuit board.

Abstract: An improved device for mounting a semiconductor package when testing electrical characteristics of the semiconductor package is capable of reducing stress which is applied to the semiconductor package. The device includes a shaped body, a plurality of spaced-apart protrusions that vertically extend from a first pair of opposing upper sides of the body, a plurality of guide blocks that extend from a second pair of opposing upper sides of the body, and a plurality of leads that extend from the top surface of the body and down side surfaces of the body. The leads may include inner portions that extend inward from the first pair of opposing upper sides of the body, and outer portions that extend down the sides of the body. In addition, a plurality of guide hooks for holding a semiconductor package may be formed on upper surfaces of the protrusions and/or the guide blocks.

Abstract: A connector system (20) connects a leadless integrated circuit (IC) device (22) to a printed circuit (PC) board (24) by means of a contact array (26). The contact array (26) connects input-output (I/O) contacts on the IC device (22) to corresponding circuit contacts (28) on PC board (24). The contact array (26) is a generally thin, flexible and rectangular shaped element that is sandwiched between the PC board (24) and the IC device (22). The contact array (26) has a plurality of square cells (30) that are each a portion of the array (26) and are formed from a planar body (32) of a suitable conductive material, such as beryllium copper, sandwiched between suitable insulating films, formed from polyimide. Each cell is divided into a first pair (34) of contact elements (36) extending above the plane of the body (32) and a second pair (38) of contact elements (36) extending below the plane of the body (32).

Abstract: An electromechanical module with pressed electrical connections includes the following components: 1) a printed circuit board having a first array of I/O pads; 2) a substrate having a second array of I/O pads that are aligned with and face the first array of I/O pads; 3) compressible electrical contacts which lie between the first and second array of I/O pads; 4) a thin springy plate having a central section which presses against the printed circuit board in line with the first array of I/O pads, and having a springy periphery that extends in a quiescent state away; from the printed circuit board; and 5) a compressing means which compresses the electrical contacts by forcing the substrate towards the printed circuit board while bending the springy periphery of the thin-springy plate towards the substrate. When the plate is in a state where the electrical contacts are fully compressed, the thin-springy plate is relatively flat; and thus, the module has a low profile.

Abstract: A surgical power tool is disclosed including a power console and a handheld motor unit. The power console provides controlled power and to the handheld motor unit. Pressure sensitive switching elements on the handheld unit provide signals to the power console which are transformed into operating power to the motor unit including variable speed, speed range, forward/reverse, and safety. The handheld motor unit includes a chuck or tool receptacle and a Hall effect or other radiation field detector which response to the presence of a magnet or other radiation device as a part of the surgical tool, to identify the tool installed and provide a control signal to the motor, e.g., speed range limitation. The handheld motor unit housing is sealed and autoclavable.

Abstract: A socket (1) for removably receiving semiconductor devices (8) for testing purposes has film contacts (81) each having a continuous or discontinuous annulus (71, 73, 76, 78) that has been formed on a film substrate and with a recess (72, 74, 77, 79) formed within the annulus exposed at a bottom of a seating or accommodating portion (31). When a BGA type semiconductor device (8) is received in the accommodating part (31) and a cover (16) is closed, electrically conductive balls (9) on the bottom of the semiconductor device (8) are pressed against respective film annular contacts (81, 82, 83, 84) thereby effecting an electric connection. Since the bottom most portion of the electrically conductive balls (9) are located within the recesses of the annular contacts, they will not be deformed. Since the film contacts (81) are prepared by etching and plating, the pitch can be easily narrowed, or otherwise modified.

Abstract: An LGA type IC assembly is mounted on a PCB by means of a fastening means which sandwiches the LGA assembly and the PCB between two plates. Conductive contacts received in passageways defined through a socket of the assembly each have two engagement portions projecting beyond the outer surfaces of the socket to contact corresponding flat contact pads formed on an IC package and the PCB, a beveled edge on an upper portion of a main body thereof, and a C-shaped resilient beam extending from the main body and forming a slanted portion integrally formed with the upper engagement portion. The IC package delivers a normal force to each contact causing the upper engagement portion thereof to slide across a surface of a corresponding contact pad of the IC package thereby removing oxidation therefrom, while the slanted portion contacts the beveled edge thereby shortening the signal transmission path through each contact.

Abstract: Grid array device packages are mounted on a circuit board or other substrate with a socket having a base member, a retaining member and an array of bent contact pins. The ends of the contact pins are displaced by insertion of a device package and then respond with a small spring force to hold the device package in place against ledges on the retaining member. The contact ends of the pins make electrical connection with terminals on the device package. A sufficient portion of each pin is implanted within the base member to prevent stress from passing through the base member. The retaining member leaves a significant portion of the upper surface of the device package exposed so that packages with attached heat sinks may be mounted therein.

Abstract: A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.

Abstract: Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced by CTE mismatches between a chip and a substrate during thermal cycling of the chip. The connectors also accommodate deflections in the vertical direction (z direction--perpendicular to the plane of the connectors) which may be caused by connection to a substrate. Such substantially vertical leg features are formed using projection lithography, such as projected x-ray or ultra-violet ("UV") radiation, to selectively expose a photoresist layer such that the substantially vertical metal features may be formed by plating or etching. The sacrificial layer may be in the form of an array of posts, such that "stool-like" post connectors are created, or may be in the form of an array of apertures, such that "basket-like" receptacles or sockets are created.

Abstract: A ball grid array connector comprises an insulative housing having a mating face and a soldering face opposite to the mating face and a plurality of passageways defined between the mating face and the soldering face. A plurality of contacts are received in the passageways and each contact comprises a contacting portion and a soldering portion substantially perpendicular to the soldering portion. A solder ball is attached to the soldering portion of each contact and the solder ball has a diameter less than a width of the soldering portion of the contact.

Abstract: A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

Abstract: An electromechanical module is comprised of an electronic component that is attached to a substrate which is bendable. Multiple springy contacts touch respective I/O pads on the substrate. A compressing mechanism compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type, each of which exert a relatively small force against its respective I/O pad; and contacts of a second type, each of which exert a substantially larger force against its respective I/O pad.

Abstract: An electrical connector that uses an elastomeric element to provide a short path, high performance, electrical interconnection that is mechanically stable and reliable. In accordance with the present invention, lateral movement of the contacts is controlled by providing contact receiving slots formed in a rigid housing and/or an alignment plate. Movement of the contacts during actuation is controlled, at least in part, by specifying the compression properties of an elastomeric element, providing a contact stop portion in the housing, and/or providing a pre-load between the contacts and the corresponding printed circuit board terminals. Because the movement of the contacts is controlled, the wiping action between the contacts and the device leads and/or the printed circuit board pads is also controlled, resulting in a more reliable contacting system.

Abstract: A solderless connector with multiple modes of compliance providing an initial insertion force differing from the secondary insertion force. The connector has multiple compliant members that can be independently adjusted to accommodate a wide range of circuit members. The connector allows the contact members to be arranged with a fine pitch without shorting. The multiple compliant members accommodate a wide range of thermal and vibrational effects, and can be configured to accommodate a wide range of compression distances. An electrically insulative connector housing is positioned substantially between the first and second circuit members. A resilient contact member is positioned generally within the connector housing. The contact member has resilient first and second circuit interface portions. The resilient contact member comprises a first compliant member. At least one end stop is provided for engaging with the contact member in a second mode of compliance.

Abstract: An electrical connector for coupling two circuitized substrates (e.g., a ball grid array module and a printed circuit board) wherein the connector includes a base member fixedly secured (e.g., soldered) to the printed circuit board and having one substrate oriented therein. The connector further includes a 2-part retention member including one part movably oriented in the base and a second part for directly engaging the retained substrate to cause it to move downwardly (and thus in a completely different direction than the direction of rotation of the movable one part within the base) to thereby provide effective connection between substrates. An interposer may be used if desired. An information handling system including a microprocessor and connector electrically coupled thereto is also disclosed.

Abstract: A socket connects electronic components such as integrated circuit modules with arrays of solder balls or columns, lands, pads of similar contacts to other components, typically substrates such as printed circuit boards. The socket has a polarization post and locator posts that extend through polarization and locator holes in the substrate and in a registration sheet that locates the module with respect to the substrate. The heads of the posts, which are all substantially the same size, extend through arcuate slots in a cam ring. Each of the slots has an inclined ramp that engages the heads of the post. When the cam ring is turned, the heads of the posts ride up the ramps, moving the cam ring towards the substrate and compressing a wave spring that presses against a pressure plate.

Abstract: A replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The replaceable chip module includes a module housing has a plurality of device sites each capable of receiving at least one first circuit member. A first connector is located in each of the device sites. The first connector includes one or more first contact members having a first compliant member defining a first circuit interface engageable with the first circuit member, a resilient, dielectric encapsulating material defining a second compliant member surrounding a portion of the first contact member, the first and second compliant members providing a first mode of compliance, and at least one end stop positioned to engage with the first contact member in a second mode of compliance. A second connector is positioned to electrically connect the first connector to the second circuit member.

Abstract: A carrier socket for receiving a component having a lead portion extending outwardly from the component, wherein the lead portion is a section of a lead remaining after another portion of the lead has been removed, the socket including: a housing having a cavity for receiving the component therein; a contact wheel positioned within the cavity so as to make electrical contact with the lead portion of the component when the component is inserted into the cavity; and a foot portion, extending outwardly from a surface of the housing so as to make electrical contact with an external contact, wherein the foot portion is electrically coupled to the contact wheel when the component is inserted into the cavity.

Abstract: A socket which compensates for non-planarities in a semiconductor device. The socket has a base with an aperture for receiving a semiconductor device and a plurality of bond pads within the aperture. The bond pads are typically electrically connected to external circuitry in some fashion. The socket also includes a lid which has a spring loaded portion for applying a force on a back surface of a semiconductor device when a major surface of the lid is in intimate contact with a major surface of the base such that contacts on the semiconductor device may make electrical contact to the bond pads while compensating for non-planarities in the semiconductor device. This compensation scheme is located in the spring loaded portion of the lid. This compensation scheme may also be aided through the use of a compliant, and perhaps compressible, interposer disposed between the semiconductor device's contacts and the bond pads.

Abstract: A backing plate facilitates electrical probing of VLSI IC signals in an array of signal via pads on the back side of a printed circuit board and which correspond to an LGA of socket pads on the front side of the printed circuit board. The backing plate is constructed of electrically non conductive mechanically stiff material that already has drilled therein a hole for each signal via pad that might be probed. Polyamide is a suitable material for such a backing plate. Special symbols, legends and suitable grid identification axes can be silk screened onto the side of the backing plate that remains visible when installed. The drilled insulative backing plate can be equipped with captive threaded studs, if desired. Alternatively, it may simply have holes to receive fasteners, or have captive female threaded fasteners in lieu of holes.

Abstract: An adapter for interfacing a tester with the leads of a dual-flatpack or quad-flatpack is disclosed herein. The adapter includes lengths of a conductive elastomer for making electrical contact with the rows of leads extending from the flatpack. The lengths of conductive elastomer are each located within a slot formed in a body of the adapter and are exposed within a depression in the adapter, where the width and length of the depression correspond to the width and length of the flatpack. The adapter is frictionally secured to the flatpack when the adapter is pressed onto the flatpack. The resilient conductive elastomer makes reliable contact to the leads of the flatpack.

Abstract: A semiconductor package socket comprises an insulating support substrate, pin contacts arranged in a constant-pitch lattice-array and which are attached in a manner that permits advance or retreat in a direction which is almost perpendicular to a main surface of the support substrate, a pin contact movement driving mechanism which advances or retreats the pin contacts en bloc, and a guide frame which has spaces to accommodate said pin contacts, which is freely detachable and which can cover areas other than those required by the pin contacts.

Abstract: An IC socket comprises a socket body including a plurality of contacts for interconnecting an IC and a wiring board. Each of the contacts comprises a contacting arm including an upper end contact portion for a lead of an IC to overlie and contact, and a lower end contact portion including a downwardly facing projection capable of abutting with a wiring portion of the wiring board, and a pressing element projecting backwardly of the contacting arm from an area in the vicinity of a connecting portion between the projection and the contacting arm. The projection forming the lower end contact portion is received in an upwardly and downwardly open through-hole formed in the socket body, so as to be subjected to abutment with the wiring portion.

Abstract: An IC socket has a guide onto at least one of opposite corners, and the guide is provided with a vertical face portion of such a height that it is capable or coming in contact with one of the leads of an IC package loaded and accurately restricting the position where the IC package is loaded. Instead or some of a plurality of contact pins arranged along the sides of a rectangular base member, a guide member removably mounted to the base member is provided. BY this guide member, a region smaller in size than a normal region can be defined on the base member, and the IC socket capable of loading IC packages or different sizes is provided.

Abstract: A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

Abstract: A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.

Abstract: A socket for connecting the contact pads (34) of an electrical circuit board (5) to the contact points (32) of an integrated circuit package (14). The socket has a socket body (7) including a first plurality of holes (27) and a floating guide plate (12) including a second plurality of holes (24). A plurality of contact springs (11) are supported between the socket body (7) and the floating guide plate (12). Each contact spring (11) has a first end (21) and a second end (22) with a resilient part (20) between the first end and the second end.

Abstract: An electronic-component ("EC") removing system including a supplying device which feeds an EC carrier tape in a feeding direction parallel to a length-wise direction of an adhesive tape of the carrier tape, a thrusting device including a thrust member and a first actuator which moves the thrust member between a thrusted and a retracted position through an opening of the adhesive tape in a thrusting direction perpendicular to the feeding direction, and a receiving device including a holder which holds each of ECs adhered to the adhesive tape, a movable member which supports the holder such that the holder is movable relative thereto, and a second actuator which moves the movable member between an EC removing position in which the holder is opposed via each EC to the thrust member and, when the thrust member is moved to the thrusted position through the opening of the adhesive tape to thrust each EC toward the holder, the holder is moved with each EC relative to the movable member in the thrusting direction to

Abstract: An emulator probe comprising a plurality of upper connectors fixed to the upper surface of a direction changing board, the upper connectors having terminals electrically connected to the terminals of a lower connector, the upper connectors being fixed to the upper surface with different fixing angles to each other, whereby an emulator can be mounted on a user target board without deforming an emulator cable.

Abstract: An active matrix electroluminescent device includes a plurality of layers including at least a transparent electrode layer, a circuit layer including a plurality of first electrical traces, and at least two layers including an electroluminescent layer and a dielectric layer. The at least two layers are disposed between the circuit layer and the transparent electrode layer so as to emit light upon the application of an electric field. The plurality of layers are supported by a support layer. An elongate cable includes a plurality of second electrical traces supported thereon. In a first aspect of the present invention the cable is supported by the support layer and a plurality of electrical conductors electrically interconnecting respective ones of the first traces with the second traces. The electrical signals transmitted from respective ones of the second traces to the first traces permit selection of individual pixels within the device.

Abstract: A socket connector (10) includes an housing (12) including a pair of side walls (14) and a pair of end walls (16) commonly defining a cavity (18) for receiving a chip carrier therein. A plurality of passageways (20) are disposed in two side walls (14) of the housing (12) for receiving a corresponding number of contacts (22) therein. A bottom surface (36) is provided with the housing (12) for supportably receiving the chip carrier in the cavity. A plurality of openings (38) are provided in the bottom surface (36) along two opposite sides thereof wherein each opening (38) corresponds to every two adjacent passageways (20). A dividing bar (40) of the bottom surface (36) is provided between every two adjacent openings (38).