Abstract: A connector for mounting to a circuit board, includes a housing and a plurality of terminals arranged side by side at the predetermined pitch. Each terminal includes a flat base portion, a pair of contact members formed from a continuous folded-back portion that is folded back to one side of the flat base portion, and a carrier coupling section that is bent at substantially right angle to the opposite side of the flat base portion. The housing holds the terminals by an over-molding of the housing around the flat base portions of the terminals to form a generally flat plate-like housing. The pair of contact members of the terminal extends toward one surface of the dielectric housing and the carrier coupling section extends toward the other surface of the housing.

Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball gid array connector.

Abstract: A chip test device is provided for using a printed circuit board to perform a test process. The printed circuit board includes a pin probe socket having a plurality of pin probe holes. A chip to be tested includes a plurality of protruding electrodes. The chip test device comprises a test base for electrically coupled to the chip to be tested, a plurality of elastic first pin probes, and a test converting board having a first layer with a plurality of pin probe holes coupled to a corresponding one of the protruding electrodes and a second layer with a plurality of second pin probes coupled to a corresponding one of pin probes on the printed circuit board.

Abstract: A socket is shown for interconnecting a chip to a printed circuit board, where the socket is comprised of a housing and a substrate. The substrate is of the type comprising a plurality of wire leads extending upwardly from the substrate, and which are interconnected to solder balls on the opposite side of the substrate. The housing has a plurality of slots therethrough, such that the substrate can be positioned on the lower side of the housing with the resilient leads extending upwardly in the slots. A chip receiving face is positioned on the opposite side of the housing for contacting the resilient leads of the substrate. The housing includes resilient arms on opposite sides of the housing, which grip the substrate and which maintain the housing in a resiliently biased position above the substrate, such that the leads remain in their respective slots.

Abstract: A connector assembly for providing electrical continuity between an array of contacts on an electrical component and a corresponding array of contacts on a printed circuit board. The connector assembly includes a plurality of floating pins. Floatation of the pin within a receptacle of the component body provides a first mode of compliance for electrical components, connector assemblies and printed circuit boards that are not coplanar. For a second mode of compliance to account for non-planarity, each pin includes an elongated, elastically deformable cantilever beam. Each pin is adapted and configured to accommodate the deformed cantilever beam of an adjacent pin without mechanical or electrical contact or interference.

Abstract: The present invention is directed to an improved electrical connector for electrically connecting a first component to a second component. The connector includes a plurality of electrical conductors partially embedded in a dielectric frame. The frame is formed with a first side and a second side opposed to the first side. Each conductor includes a first finger, a second finger and a midsection connecting the first finger to the second finger. The midsection of each conductor is molded in place within the frame. The first finger of each conductor extends away from the first side of the frame while the second finger of each conductor extends away from the second side of the frame. The midsections of adjacent conductors can be spaced apart within the frame at distances of less than 1.5 mm.

Abstract: An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device.

Abstract: A contact pin assembly for a socket for electrical parts comprises a plurality of contact pins provided for a socket body of a socket for electrical parts and a connection member, formed separately, connecting all the contact pins with a predetermined distance between adjacent ones. The predetermined distance is made substantially equal to a distance between adjacent ones of terminals provided for an electrical part which is held in the socket body.

Abstract: The present invention relates to a socket for testing an integrated circuit utilizing an improved contact pin structure. In the test socket of the present invention, the length of the electrical path between the leads of tested IC and terminals of PCB is minimized and the contact pin may maintain wiping action in a wide area of contact portions. Further, as the contact pin may accommodate the pressure applied by the IC leads with great elasticity and provides sufficient floating suspension when the pressure is removed, the invention may efficiently prevent damages to the leads of IC being tested and extend the life of the contact pin.

Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.

Abstract: The present invention relates to a wafer formed with a CSP device and a test socket of a BGA device in which a test socket has a contact member to perform a wiping action for increasing an electric conductivity between a wafer formed with a CSP device and a solder ball formed at a BGA device and a test socket. The present invention provides a test socket including: a contact member block having a slanting face to apply an uniform pressing force to the surface of a solder ball when a BGA device is contacted with the solder ball, formed with a two-dimensionally arranged long hole, the long hole being formed at its central portion with a through hole, the slanting face of the long hole and the surface of the through hole being coated with a conductive material; and a housing formed with a contact member block groove for mounting the contact member block and formed at the upper portion of the groove with a mounting portion for receiving a BGA device.

Abstract: An electrical socket (1) includes a housing (10) and a plurality of terminals (30) received in the housing. Each terminal includes a securing portion (34) secured in the housing, a mating portion (33), and a spring portion (32) connected between the securing portion and the mating portion. When the socket connects with a complementary electronic device (2), the spring portion is resiliently deformed to provide resilient force to the mating portion, and the mating portion therefore engages with the electronic device with minimal wiping relative to the electronic device.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: A socket is disclosed for connecting an electrical device to an external circuit such as a printed circuit board. The socket comprises a housing having a bottom surface and a top surface with a plurality of apertures therethrough, a plurality of contact terminals, each terminal disposed within one of the apertures of the housing and a compressible structure of electrical conductive material disposed within each of the plurality of contact terminals. Additionally, the socket may also include a loading device for securing the electrical device to the socket.

Abstract: A transceiver adapter is provided that includes a substrate, including electrical contacts on a first side thereof for electrically contacting a transceiver, and electrical contacts on a second side thereof for electrically contacting a printed wire assembly. A transceiver adapter is also provided that includes an adapter plate, including (a) tabs for positioning a transceiver, and (b) mounting pins for coupling the adapter plate with a printed wire assembly; and a substrate hole through which a transceiver may be electrically mated with a printed wire assembly. A transceiver is also provided that includes electrical contacts; and a mateable electrical connector, including (a) electrical contacts on a first side thereof for electrically contacting the electrical contacts of the transceiver, and (b) electrical contacts on a second side thereof for electrically contacting a printed wire assembly.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.

Abstract: A contact for use in an IC test socket having a body with a generally linear interface surface. The contact is adapted to be pivotally movable with respect to the socket.

Abstract: The present invention relates to a BGA package IC socket that accommodates a BGA (ball grid array) package such that the BGA package IC socket has high reliability and can withstand long-term use. The socket is equipped with package receiving members 140. Package receiving parts 141 of members 140 receive the portions of the BGA package 10 located in the vicinity of the opposite edges of the undersurface of the BGA package 10. The parts 141 pivot downward with the insertion of the BGA package 10. The parts 141 have a shaft which are supported on the housing so that the package receiving members 140 are free to pivot. Springs 150 cooperate with the members 140, such that the springs 150 resist the insertion of the BGA package into the socket.

Abstract: A socket (1) has a base (2) on which rows of contact pins 4 are arranged, the contact pins being elastically deformable in the vertical direction, an adaptor (5) having rows of contact holes (5d) arranged extending through a seating surface (5c) and which is capable of vertical movement relative to the base (2) so that contact tips (4a) of contact pins (4) can move in respective contact holes (5d). Latches (21) are arranged to be able to press the IC package on the seating surface (5c) of the adaptor (5) and a vertically movable regulator (7) is arranged at a selected position relative to adaptor (5) when stop surfaces (7e) of the regulator are engaged with a part (4e) of the contact pins (4) so as to regulate the position of the contact tips (4a) in the contact holes (5d).

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: An adapter apparatus is provided for receiving a packaged device having a plurality of contact elements disposed on a surface thereof. The adapter apparatus includes a perimeter wall member having a length along an adapter axis between a first end of the wall member and a second end of the wall member. A conductive element layer including arranged contact elements is positioned at the first end of the perimeter wall member orthogonal to the adapter axis. The perimeter wall member and the conductive element layer define a socket cavity to receive the packaged device with the contact elements thereof adjacent the arranged conductive elements of the conductive element layer. A cover member is positioned at the second end of the perimeter wall member to close the socket cavity. The cover member is movable to allow the packaged device to be removed from the socket cavity.

Abstract: The present invention provides an IC socket formed by attaching a socket frame to a test board via a contact sheet, wherein the contact sheet has a plurality of cantilever spring type contacts arranged on an insulation film and a spacer member, to tightly attach the socket frame to the test board via the contact sheet without any inclination.

Abstract: The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.

Abstract: A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape as viewed from a top thereof. The spiral probe is embedded in an insulating substrate in a manner that permits resilient deformation thereof in accordance with a shape of the solder ball, and an edge of the spiral probe is pressed to engage into the solder ball and slides along a periphery of the solder ball, thereby cutting oxide membrane thereon. The spiral contactor may be manufactured by combination of the photolithography technique and the plating process, and used for a semiconductor inspecting apparatus and an electronic part.

Abstract: In bonding bumps formed on a chip to electrodes formed on a substrate in a purge gas atmosphere, purge gas is supplied locally at least around the bumps, with the substrate and the chip separated from each other. According to the method and apparatus for chip mounting, the concentration of purge gas can be increased locally around the bumps where the isolation from the air is required, so that the bumps are protected effectively from secondary oxidation.

Abstract: A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

Abstract: An IC socket for an IC package as an electrical part has a socket body to which a number of contact pins are arranged so as to establish an electrical connection between a printed circuit board and a terminal of the IC package. The contact pin comprises a first contact piece disposed on an electrical part side so as to contact the terminal of the electrical part and a second contact piece disposed on a printed circuit board side so as to contact the printed circuit board. When the first contact piece contacts the terminal and is pressed, the second contact piece is inclined and a contact end portion of the second contact piece is moved so as to slide with respect to the electrical part.

Abstract: Land grid array (LGA) connectors are used to attach circuit modules to printed circuit boards that present an array of noble metal or semi-noble metal plated contacts to not only effect a reliable connection, but also enable circuit module release and replacement. During replacement, the connector is discarded and a replacement circuit module is used. Only the contact array on the printed circuit board is reused. An in situ gasket carried by the connector is compressed against the circuit board in the assembled condition to form a sealed enclosure about the contact array at the printed circuit board surface which excludes particulate and gaseous contaminants. Thus when the module is replaced, the contact array site on the printed circuit board does not require cleaning or processing to overcome degradation of the contact materials or surfaces.

Abstract: A connector housing includes a terminal chamber for accommodating a terminal to which an electric wire is connected. A rear holder is attached to a rear end portion of the connector housing. A waterproof rubber plug has a through hole through which the electric wire is inserted. One end of the rubber plug is configured as a cylindrical sealing portion. The other end of the rubber plug is configured as a proximal end portion integrally provided with a rear end wall of the rear holder. A plug chamber is formed in the rear end portion of the connector housing so as to communicate with the terminal chamber for accommodating the rubber plug therein when the rear holder is attached with the connector housing. The dimension of the plug chamber is determined such that the sealing portion of the rubber plug is accommodated while being compressed by an inner wall of the plug chamber during the attaching operation of the rear holder.

Abstract: A connector assembly for providing electrical continuity between an array of contacts on an electrical component and a corresponding array of contacts on a printed circuit board. The connector assembly includes a plurality of floating pins. Floatation of the pin within a receptacle of the component body provides a first mode of compliance for electrical components, connector assemblies and printed circuit boards that are not coplanar. For a second mode of compliance to account for non-planarity, each pin includes an elongated, elastically deformable cantilever beam. Each pin is adapted and configured to accommodate the deformed cantilever beam of an adjacent pin without mechanical or electrical contact or interference.

Abstract: A plurality of mounting feet securely attach a power inverter to a body. The tabs are to be adjustably or pivotally mounted on the under carriage of the power inverter such that they may be positioned by the user when mounting to a body. When mounted, the tabs absorb vibrations from the host body and prevent the power inverter from resulting damage. During shipping or storage the tabs are retracted to the underside of the power inverter to minimize space required by the power inverter. The tabs are made from elastomeric electrical insulator material in order to ensure a proper ground is maintainer as long as the power inverter is secured via the tabs.

Abstract: A connection structure comprises a first structure (1) includes a first window (9), a plurality of first circuit members (2) disposed in the first structure (1), the first circuit members (2) having first connection portions (3) exposed at the first window (9) of the first structure (1), a second structure (4) including a second window (11), a plurality of second circuit members (5) disposed in the second structure (4), the second circuit members (5) having second connection portions (6) exposed at the second window (11) of the second structure (4). An arrangement of the first connection portions (3) is different from an arrangement of the second connection portions (6). The connection structure further comprises a connector (7A) including a plurality of terminals (21) that electrically connect the first connection portions (3) with the second connection portions (6) and have first contact portions (30) and second contact portions (31).

Abstract: A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A plurality of resilient legs extend inward from the sides of the retaining device. Retaining edges are also formed on two sides of the retaining device. The resilient legs fall into the gaps between the fins when the retaining device is positioned on the heat dissipater to secure a CPU assembly. In an orientation, the legs are placed on the pads or recesses of the heat dissipater and in an orthogonal orientation, the legs are placed directly on the top surface of the heat dissipater. Therefore, CPU assemblies of different thickness can be accommodated by rotating the retaining device or the heat dissipater 90 degrees.

Abstract: An IC socket has a socket body with a plurality of terminal mounting holes, and terminals of electrical connector mounted in the terminal mounting holes and each of the terminals of electrical connector having a contact portion, a spring portion and a tail portion for performing a burn-in test of an IC package by mounting the IC package on the socket body so as to place a solder ball as a contact of the IC package corresponding to the contact portion and contacting the contact portion with the solder ball. The spring portion of each of the terminals of electrical connector is formed into meandering shape as a whole by stacking a plurality of r-shaped portions in series with alternately orienting each r-surface thereof in the opposite direction from the contact portion toward the tail portion.

Abstract: A method of fabricating a package for a micro-electromechanical systems (MEMS) device. A flex circuit interconnect subassembly for the package is made by placing a flex circuit on a pad insert, attaching a carrier insert to the pad insert to deflect the lead portions of the flex circuit, and applying a cover insert to the pad insert, after the attachment of the carrier insert, to re-deflect the lead portions of the flex circuit toward the device bond sites. The flex circuit interconnect subassembly may be combined with an electronic device die/carrier subassembly to form a completed electronic device package. The flex circuit interconnect subassembly and the die/carrier subassembly are joined using mechanical interlocking layers. The invention is particularly suited for making such an electronic device die/carrier subassembly which has a MEMS die permanently affixed to a carrier.

Abstract: A testing system is used for diagnosing a semiconductor device, and includes a testing apparatus for supplying an input test signal and receiving an output signal, a socket having plural pairs of contact leaves for nipping solder balls of the semiconductor device therein and a wiring board connected between the testing apparatus and the plural pairs of contact leaves, wherein the contact leaves of each pair are electrically isolated from each other so that a transmission line for the input test signal is only short circuited with a transmission line for the output signal at associated one of the solder balls, thereby permitting the solder balls to serve as neutral points in the dual transmission lines.

Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Abstract: An electrical connector connects an electric component having a grid array of electrical contacts. The connector comprises a connector base, a plurality of contact pads attached to a surface of the connector base, a plurality of lotus spring contacts attached to a corresponding contact pad in the grid array, and an organic film through which each of the lotus spring contacts protrudes. The organic film provides structural integrity and ease of handling during assembly and subsequent use of the connector. A method of mounting a connector to an electrical component having a grid array of electrical contacts on a surface thereof. The method comprises positioning the electrical component in close proximity to the connector so that each of a plurality of lotus spring contacts on the connector touch a corresponding contact in the grid array of electrical contacts on the connector.

Abstract: A socket for an electrical part comprises a socket body having an accommodation portion in which an electrical part having a number of terminals is accommodated, a number of contact pins arranged to the socket body so as to be contacted to or separated from the terminals of the electrical part, a pressure cover mounted to the socket body to be pivotal through a shaft member at one end portion thereof in a manner that, when the pressure cover is pivoted in a cover closed direction, the electrical part is pressed and held so that the terminals of the electrical part are contacted to the contact pins, respectively, an arm member attached to another end portion of the pressure cover to be rotatable, a latch member attached to the arm member to be rotatable so as to be engaged with or separated from the socket body, and a link member connecting the latch member and the pressure cover.

Abstract: A socket that includes: a housing, one or more power conductors, and one or more ground conductors. The power conductors and ground conductors are conductive bars imbedded in one or more walls of the housing in a checkerboard pattern providing a low inductance and low resistance current path. The housing may contain an opening in the center and has a top side and a bottom side. The power conductors and the ground conductors are electrically connectable to an electronic package on the top side of the housing and a printed circuit board on the bottom side of the housing. The socket is pin-free and compatible with electronic packages that transfer information over optical interconnects on a printed circuit board.

Abstract: A socket (1) has a base (10) which forms a recess (10d) for receiving a support member (12). The support member (12) has a recessed surface (12a) for carrying a contact film (14) and has bores for mounting spring contact elements (15). The spring contact elements engage contact members (14b) of contact film (14) from below the film. An adapter (13) has a seat (13b) for a BGA package (2) for exposing solder balls (2a) to contact members (14b) from a location above the film. Socket terminal pins (11b) are electrically connected to spring contact elements (15) through circuit paths (13c) on a pitch expansion substrate (11). A cover (20) and a compression member (30) apply a force to the package.

Abstract: A grid array interconnect structure and method for interconnecting and removing a high density multichip interconnect decal, or grid array package, to and from a printed wiring board. The interconnect structure comprises conductive epoxy interconnects and nonconductive transfer tape that has adhesive disposed on both sides thereof. The transfer tape is applied to the back of the high density multichip interconnect decal or package. Conductive epoxy is disposed in pre-formed holes of the two-sided transfer tape and is partially cured to a semi-rigid condition to form the conductive epoxy interconnects. A mylar film may be applied to the exposed surface of the transfer tape. With the mylar film removed from the surface of the transfer tape, the decal or package is secured to the printed wiring board and a slight force is applied. This assembly is then cured.

Abstract: Disclosed is a low-profile receptacle connector for use in making a required electric connection between an integrated circuit package and a printed circuit board. The receptacle connector includes a terminal housing part to be sandwiched between the integrated circuit package and the printed circuit board, and the terminal housing part has terminals embedded therein. Each terminal comprises a flat trunk and at least one cantilever-like contact arm integrally connected to its flat trunk. The terminals are arranged with their flat trunks parallel to the plane of the terminal housing part, and is supported by the terminal housing part by allowing the mold to overhang the opposite lateral and longitudinal edges of the trunk of each terminal.

Abstract: An IC or testing socket is provided, which ensures stable electrical connection of an IC or semiconductor device to be tested to the circuit board of a test apparatus. This socket comprises: (a) a socket body made of a rigid material; the body having penetrating openings; (b) anisotropically conductive members formed in the respective openings of the body; each of the anisotropically conductive members being made of an elastic, insulating material, first conductive particles dispersed in the material, and second conductive particles dispersed in the material; the first and second conductive particles being different in average diameter from each other; and (c) a guide for receiving a semiconductor device to be tested and guiding the device toward the conductive members in the body; the guide being fixed to the body in such a way that electrodes of the device are contacted with the corresponding conductive members in the body.

Abstract: A socket structure for grid array (GA) Packages, mainly comprises the assembly of flexible chassis, the frame, the first hinge cover lid and the second hinge cover lid. The assembly of flexible chassis comprises the silicon rubber pad, the inner base plate and the flex-board, in which the flex-board, encompassing the silicon rubber pad and the inner base plate, is used for electrical contacts. By pressing the first hinge cover lid and the second hinge cover lid downward, the hinge pads thereon contact with the substrate of the package and snap the package firm in place. In this invention, the package with pre-attached heat sink can be easily placed into the socket.

Abstract: An intermediate portion between groups of contact pins in a lead frame of a contact pin module is supported by a supporting plate.

Abstract: A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.

Abstract: A method for forming an extended solder column on a contact pad of an electronic device comprises steps of (a) applying a solder seed to the contact pad; (b) contacting the seed with a surface substantially parallel to and opposite the contact pad, with the seed between the surface and the pad; (c) melting the seed to wet the contact pad and the surface; (d) extending the relative separation of the surface and the contact pad, drawing the molten seed into a column; and (e) solidifying the resultant column. Further in the invention an integrated circuit (IC) assembly for mounting to a surface of a device board comprises a plurality of planar ICs interspersed with individual interposers or a or continuous interposer and conductive bars for constraining the stack and providing conductive paths to the device board.

Abstract: A detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit is presented. The base comprises an electrically insulating elastic mat in which a large quantity of fine electrically conductive wires, placed at a short distance from one another, are incorporated. The elastic mat is held between the first electric component and the second electric component. The base also includes means for selectively pressing the second electric component against the electrically insulating elastic mat so as to establish an electric contact between the electric components over the elastic mat.