Abstract: An electrical connector having a terminal crossing over two adjacent terminal slots includes a base formed with terminal slots, and terminals disposed in the terminal slots. Each terminal has a fixing portion, an elastic arm and a pin. The fixing portion is clamped and positioned by the slot. The elastic arm has a lower arm and an upper arm. A bottom of the lower arm is connected to a bottom of the fixing portion. The lower arm extends from bottom to top. A top of the lower arm and the fixing portion define a gap. The upper arm extends, from the top of the lower arm, slantingly upwards through a top of the fixing portion to the adjacent terminal slot. A connection point is disposed near a distal end of the upper arm. The pin is positioned under the fixing portion and extends over a bottom of the base.

Abstract: A land grid array connector (10) for electrically connecting a CPU package to a printed circuit board includes a housing (30) having a top surface (320) and a number of terminals received in passageways (31) of the housing. Each of the terminals has a retention portion (52), a spring arm (54) extending from the retention portion beyond the top surface. A contacting portion (58) is formed on a topmost part of the spring arm for electrically mating with a corresponding pad formed on a bottom of the CPU package. A plurality of protrusions (324) is formed on the top surface for protect the terminals from being accidental damaged, A common supporting surface (326) is formed cooperatively by the protrusions, above the contacting portion in a direction perpendicular to the top surface. This can protect the contacting portion of the terminal from being collided. As a result reliable electrical connection between the package and contacts of the land grid array connector is secured.

Abstract: A socket mounted on a printed circuit board (PCB), which includes a plurality of pads and at least two soldering areas, includes an insulative housing, a plurality of contacts corresponding to the pads and received in the slots respectively, at least two screw nuts and at least two screws mating with the screw nuts. The insulative housing has a plurality of slots and a border projected therefrom and around the slots for orientating an electronic component. The contacts have an end exposed out of the slots and are bent, and a topmost portion of the contacts is lower than a top surface of the border. The screw nuts are adjacent to the border of the insulative housing and are relative to the soldering area, so as to connect the insulative housing to the PCB via the screw nuts. The screws force the electronic component downward to electrically connect the PCB.

Abstract: A system for using an electrical adapter to test an electrical device is provided. The system includes a tester, an electrical device, and the electrical adapter. The electrical adapter includes a board having first and second planar surfaces, a first electrical socket coupled to the first planar surface of the printed circuit board and a second electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the first and second electrical sockets to each other. The first electrical socket of the adapter is suitable for temporary connection to an electrical interface of the tester, and the second electrical socket is suitable for temporary connection to an electrical interface of the electrical device. The electrical device can be one of a plurality of electrical devices and the tester can be one of a plurality of testers.

Abstract: A chip socket scale package. The package presents combined compatibility with two different chip scale package types with solder balls in same position, thereby using only one chip socket scale package.

Abstract: The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact.

Abstract: A socket connector contact (10) comprises a resilient portion (16) having a helical body (16a) with an axis. A mating portion (16b) extends upwardly from the body, for electrically engaging a mating conductive member (32). When the contact engages the conductive member, the mating portion elastically deflects downwardly at an angle relative to the axis of the body so as to wipe oxidization films that have grown on the mating portion and the conductive member. Furthermore, the body doest not deflect relative to the axis thereof. Rather, the body is compressed along the axis thereof to supply sufficient normal contact force, thereby assuring engagement between the mating portion and the conductive member. Thus, the mating portion and the resilient portion of the contact are used to optimize wiping characteristics and contact force of the contact, respectively.

Abstract: The present invention relates to interchangeable module sockets and socket assemblies for accommodating modules of different form factors.

Abstract: An adapter assembly is provided for adapting an LGA packaged IC to a PGA socket. The adapter assembly comprises a package body with a plurality of through holes, and a plurality of pins received in the through holes and each having a spring end and an insertion end. The spring end of the pin abuts against an electric contact land of the LGA packaged IC and the insertion end of the pin is inserted into the PGA socket, whereby the LGA packaged IC is in electrical connection to the PGA socket.

Abstract: A multi-portion socket, related components, and systems having such socket/components are described herein.

Abstract: A land grid array connector assembly (10) of the present invention includes an LGA connector (12) and a pick up cap (13) attached thereon. The LGA connector includes an insulative housing (20), a plurality of electrical contacts (28) received in the housing, a metal clip (24) pivotably mounted to an end of the housing, and a lever (26) pivotably mounted to an opposite end of the housing for engaging with the clip. The clip has a generally rectangular window (240) with a plurality of inner edges (241). The pick up cap includes a flat plate (32) for being sucked by a vacuum suction device and a plurality of peripheral latches (324, 325) depending from the flat plate for snappingly engaging with the inner side edges of the window of the clip.

Abstract: An electronic part-mounting socket includes a socket housing, and contacts The socket housing has contact receiving grooves formed at a bottom plate portion of an electronic part-receiving portion. The contact of an integral construction includes a fixing piece portion, a terminal piece portion laterally bent at a lower end of the fixing piece portion, a first bent-back portion formed by bending back a distal end portion of the terminal piece portion into a U-shape, an intermediate spring piece portion extending laterally from the first bent-back portion, a second bent-back portion formed by bending back a distal end portion of the intermediate spring piece portion into a U-shape, and a resilient contact piece portion extending continuously from the second bent-back portion in an upwardly-slanting manner. The fixing piece portions are inserted respectively in contact fixing holes, formed in the socket housing in an upward-downward direction, and are fixed thereto.

Abstract: A matrix connector includes a first electrically insulative housing and a second electrically insulative housing arranged in a stack with the respective terminal slots respectively aligned, and terminals sets each formed of a movable terminal axially slidably mounted in the terminal slots of the first electrically insulative housing and a terminal holder mounted in the terminal slots of the second electrically insulative housing and clamped on the respective movable terminal for enabling the respective movable terminal to be moved axially relative to the respective terminal holder when maintained in contact with the respective terminal holder.

Abstract: An IC socket includes an insulating housing having a plurality of wall blocks defining a plurality of slanting passageways penetrating inclined therethrough and a limit portion downwardly extending therefrom, a plurality of contacts received correspondingly in the slanting passageways respectively, and at least two orientation posts disposed downwardly from the limit portion. Each of the contacts is resilient and in an U shape, and has fist and second abutting portions exposing out of opposing sides of the bottom wall of the insulating housing respectively. The IC module accommodates with the insulating housing, the PCB and the IC modules include a plurality of conductive patterns and pads disposed thereon respectively, so as to correspond to the contacts relatively, the first abutting portion consequently retains against each of the conductive patterns and the second abutting portion retains against each of the pads.

Abstract: A built-in electronic component-mounted wiring board includes an electronic component having a connecting terminal and being mounted on a support; an insulating layer provided on the support so as to cover at least a portion of the electronic component; an opening provided in the insulating layer so as to expose the connecting terminal of the electronic component; and a connecting portion provided in the opening.

Abstract: The present invention provides a redistribution package having an upper surface that includes contacts with reduced pitch that correspond, for example, to that of a Controlled Collapse Chip Connection (“C4”) structure formed on a chip, and a lower surface having contacts with increased pitch that correspond, for example, to a printed circuit board employing ball grid array (“BGA”) pads. A series of power, signal and ground conductors extend through the body of the redistribution package and interconnect the circuit board contacts to the chip contacts.

Abstract: A contact (1) used in an electrical connector (3) appears C-like shape and includes a first arm (10) connecting to an IC module (4), a second arm (12) connecting to a PCB (5), and a medial portion (14) connecting therebetween. The medial portion defines two symmetrical fastening blocks (141) on both sides thereof. In addition, the fastening block defines a plurality of protruding portions (1412) extending along a direction perpendicular to a main surface on which the fastening block locates. Accordingly, the contact is fastened in the connector firmly and reliably.

Abstract: A electrical contact, which is secured in a slot of a housing used to electrically connect a printed circuit board with a chip module comprises a tail portion mounted on the printed circuit board, a contact portion with a torsion portion based on the axis of the slot of the housing at least partly extending out of the slot contacting to the chip module and a base portion connected the tail portion with the contact portion. Thus, the space between the adjacent contacts will be improved to avoid the short circuit. Furthermore, even if the contacts are secured imprecisely, there will not be apt to form a short circuit between the adjacent contacts.

Abstract: An electrical contact is provided that includes a body configured to be held on a circuit board. The body of the contact is movable relative to the circuit board along at least a first axis of motion. The contact includes a contact portion joined with the body that is configured to engage an electrical component. The contact portion may include one or more contact beams. The contact further includes a termination lead joined to the body and having an outer end that is configured to be soldered to the circuit board. The termination lead extends from the body at an acute or right angle to the first axis of motion. The termination lead flexes about an arcuate path as the body of the contact shifts along the first axis of motion with respect to the circuit board.

Abstract: A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

Abstract: A socket, such as a Land Grid Array (LGA) socket, for forming electrical connections between a first surface having a first contact array and a second surface having a second contact array. The socket includes a plurality of compliant contacts, each contact inserted into one of a plurality of passages that extend through a plate. Each contact has a first contact surface for electrically engaging the first contact array, and a second contact surface for electrically engaging the second contact array. At least one of the contacts is a low current contact, and at least one of the contacts is a high current contact capable of passing more current than the low current contact.

Abstract: Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in an aperture disposed from the first surface to the second surface. To contact the electrical devices, the contact includes a center portion from which extends two diverging, cantilevered spring arms that project beyond either surface of the electrical connector. To shorten the path that current must travel through the contact, one spring arm terminates in a bellows leg that extends proximate to the second spring arm. When placed between the electrical devices, the spring arms are deflected together causing the bellows leg to press against the second spring arm. For retaining the contact within the aperture, the contact also includes retention members extending from the center portion that engage the insulative housing.

Abstract: The computer motherboard-mounted card such as a dual-head graphics card has two I/O connectors and two footprints positioned one behind the other for accommodating two different output types. A right-angle, vertical edge, I/O connector mounted in a selected one of the two footprints. The I/O connector can be selectively connected to a farther one of the two footprints from a vertical edge of the computer card and be provided with a correspondingly horizontally elongated body.

Abstract: An electronic assembly includes one or more discrete capacitors (506, 804, 1204), which are vertically connected to a housing, such as an integrated circuit package (1704). Surface mounted capacitors (506) are vertically connected to pads (602) on a top or bottom surface of the package. Embedded capacitors (804, 1204) are vertically connected to vias (808, 816, 1210, and/or 1212) or other conductive structures within the package. Vertically connecting a surface mounted or embedded capacitor involves aligning (1604) side segments (416) of some of the capacitor's terminals with the conductive structures (e.g., pads, vias or other structures) so that the side of the capacitor upon which the side segments reside is substantially parallel with the top or bottom surface of the package. Where a capacitor includes extended terminals (1208), the capacitor can be embedded so that the extended terminals provide additional current shunts through the package.

Abstract: A contact is provided for use in a land grid array (LGA) socket. The contact includes a support body defining a support body plane. The support body is configured to be held in a hole in an LGA socket and has opposed side edges. The contact also includes a contact beam having a base portion projecting from one of the side edges. The base portion extends along a base axis and has an upper end joined at a deflectable bend with an outer portion of the contact beam. The outer portion is configured to have surface mounted thereon an adjoining contact, and the outer portion projects from the bend at a first angle with respect to the base axis and at a second angle with respect to the support body plane.

Abstract: A contact assembly including an insert molded contact block, a plurality of dual beam signal contact terminals extending through the contact block and a plurality of dual beam ground contact terminals extending through the contact block wherein a portion of each ground contact terminals has an encapsulated formed area within the contact block. The contact block includes a core disposed between the beams of each of the second plurality of dual beam contact terminals.

Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.

Abstract: An electrical adapter is provided including a board having first and second planar surfaces, a male electrical socket coupled to the first planar surface of the printed circuit board and a female electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the male and female electrical sockets. The male electrical socket of the adapter is suitable for temporary connection to a female electrical interface of a first electrical device, and the female electrical socket is suitable for temporary connection to a male electrical interface of a second electrical device. The opposing socket is suitable for temporary connection to a printed circuit board. In one embodiment, the electrical device is an optoelectronic device.

Abstract: A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.

Abstract: Disclosed is an interposer assembly that can be located between an integrated circuit package and a circuit carrying element for establishing communication there between. The interposer assembly includes a frame defining a window that holds together a plurality of panels having apertures for accommodating electrical contacts. Each panel includes an interlocking edge for engaging an opposing interlocking edge of an adjacent panel and a frame edge for engaging the frame. The apertures can be arranged across the panels to extend from the frame edge to a location near the interlocking edges. In various embodiments, the interlocking edges can be formed as a tongue and groove design or as a pair of interlocking claws. In an embodiment, the frame edge can include a flange that is set within a step formed on the frame. The panel and frame may be permanently joined by heat staking.

Abstract: A matrix socket includes a first insulating housing, a second insulating housing and a plurality of terminal assemblies. Each terminal assembly has a movable terminal and terminal seat. The first insulating housing and the second insulating housing are corresponding to each other, and have accommodating channels for placing the terminal assemblies therein, so as to enable the movable terminals and the terminal seats become electrically connected in a slidable manner.

Abstract: An improved and more flexible connector assembly and method are provided for connecting an electrical component to a substrate, such as a printed circuit board (PCB), by attaching an electrical component having ball or column grid array solder portions to corresponding electrical contact surfaces of a second connector half, mating first and second connector halves and attaching the first connector half having ball or column grid array solder portions to corresponding electrical contact surfaces of the substrate. The first and second connector halves may be electrically connected to each other via conventional mating techniques. When mated, electrical communication is achieved between corresponding portions of the first and second connector halves. Effects of CTE mismatch are minimized by providing the first and second connector halves between the electrical component and substrate.

Abstract: A semiconductor socket is provided which includes a stage used for positioning of a semiconductor device. The semiconductor device has a plurality of external input/output terminals mounted at a bottom thereof. The semiconductor socket also has a plurality of probes used to come into contact with the plurality of external input/output terminals when the semiconductor device has been positioned, by moving the stage towards the probes. The semiconductor socket has a socket base in which a major portion of each of the probes is housed, and from which a minor portion of each of the probes projects from an upper face thereof. The upper face of the socket base faces the stage. The probes are disposed in a manner so as to be inserted in or pulled out from the upper face. The semiconductor socket has a probe retaining cap removably mounted to the upper face of the socket base, for preventing the probes from being removed. A method of replacing the probes is also proposed.

Abstract: An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.

Abstract: An electrical connector (10) includes an insulative housing (11), and a multiplicity of electrical contacts (12) received in the housing. Each contact comprises a retaining body (13) engagingly received in a corresponding passageway (110) of the housing, a soldering portion (14) extending from a bottom end of the retaining body for soldering to a PCB (40), and a resilient arm (16) extending from a lateral side of the retaining body. The resilient arm has a curved beam (162) extending slantingly upwardly and protrudes out from a top surface of the housing. An enlarged contact portion (164) is defined at a distal end of the curved beam. A width of the contact portion is substantially three times a width of the distal end of curved beam. The contact portion resiliently electrically contacts a metal contact pad of a CPU, thereby electrically connecting the CPU with the PCB.

Abstract: A connector is provided for reducing the effects of differential coefficient of thermal expansion of the connector and the underlying circuit board. The connector exhibits high coplanarity along the mounting interface by providing an insulative connector housing in which stress buildup is avoided. The connector housing incorporates compliant sections corresponding to the areas where the greatest deformation in the substrate is expected. The housing has notches or slots at locations furthest from the neutral point (NP) of the connector (i.e., around the corners). By means of this arrangement, stress buildup is avoided, so as to minimize warping and twisting of the housing.

Abstract: The invention includes an interposer, BGA connector, or other connection device that provides electrical contact with a ball grid array connector. The inventive interposer includes a housing with contacts. The contacts have a first end and a second end. The interposer also includes a first body and a second body of reflowable, electrically conductive material disposed on the first end of at least one of the contacts. The first body and the second body provide an electrical contact between the interposer and a single body of reflowable, electrically conductive material of the ball grid array connector.

Abstract: A connector for mounting to a circuit board, includes a housing and a plurality of terminals arranged side by side at the predetermined pitch. Each terminal includes a flat base portion, a pair of contact members formed from a continuous folded-back portion that is folded back to one side of the flat base portion, and a carrier coupling section that is bent at substantially right angle to the opposite side of the flat base portion. The housing holds the terminals by an over-molding of the housing around the flat base portions of the terminals to form a generally flat plate-like housing. The pair of contact members of the terminal extends toward one surface of the dielectric housing and the carrier coupling section extends toward the other surface of the housing.

Abstract: A connector assembly for providing electrical continuity between an array of contacts on an electrical component and a corresponding array of contacts on a printed circuit board. The connector assembly includes a plurality of floating pins. Floatation of the pin within a receptacle of the component body provides a first mode of compliance for electrical components, connector assemblies and printed circuit boards that are not coplanar. For a second mode of compliance to account for non-planarity, each pin includes an elongated, elastically deformable cantilever beam. Each pin is adapted and configured to accommodate the deformed cantilever beam of an adjacent pin without mechanical or electrical contact or interference.

Abstract: An electrical connector (1) includes a housing (6), and terminals (2) received in passageways (60) of the housing. Each passageway includes a retention space (602) that is bounded by a forward wall (6022), two side walls (6021) and two rearward walls. Each terminal includes a vertical retention portion (24) having a first main face (242), a second main face (244) and a pair of side faces (243). A retention protrusion (26) extends outwardly from each of opposite sides of the retention portion, and then bends perpendicularly. In one embodiment, the protrusions protrude beyond both the side faces and the second main face. Each protrusion includes a first interference portion (260) interferentially engaging with the respective side walls of a corresponding passageway, and a second interference portion (262) interferentially engaging with the forward wall. Each protrusion has a reinforced structure, and the terminal is securely and reliably retained in the passageway.

Abstract: The present invention includes an interconnect contact and system. The contact generally includes a first contact element, a second contact element, and a biasing member. The first contact element has a contacting surface and an engagement surface. The second contact element has a contacting surface and an engagement surface. The engagement surfaces of the elements are generally constructed to contact each other. The biasing member provides a mechanism to move at least one element of the contact.

Abstract: Solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured, and signal paths are shortened in a ball grid array IC socket. Contacts fixed to contact hosing apertures of a housing include base portions, contact arms, and terminal portions that extend from the lower ends of the base portions toward a circuit board. The contact arms protrude so as to extend upward and then are bent unidirectionally. The terminal portions are constituted by transition portions that link solder ball pads to the base portions, while offsetting the solder ball pads in the same direction as the contact arms. The transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads. The vertical or inclined portions prevent movement of the solder balls, thereby preventing positional misalignment and deformation thereof.

Abstract: An electrical socket is provided for receiving processors requiring only vertical mounting actuation. The socket includes a housing having an array of contacts, and a frame having a bottom surface and a contacting surface. The contacts have a loaded position and an unloaded position. The loaded position corresponds to the placement of a desired vertical load. The housing is slidably mounted to the frame. The contacting surface is located such that a processor abuts the contacting surface when the contacts are in the loaded position due to the placement of a processor and the bottom surface of the frame abuts a flat surface, such as a circuit board to which the socket is mounted.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (110) received in passageways (101) of the housing. The housing has a base (100) and sidewalls (102, 104), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. Two sidewalls each define recesses (1021), thereby forming projections (1020). When terminals are installed near the projections, a carrier strip (11) connecting the terminals is bent so that connecting sections (111) of the carrier strip are received in corresponding recesses. The connecting sections are cut off, and the carrier strip is removed. The recesses enable the carrier strip to be manipulated so that sufficient space is made available for cutting off of the connecting sections without interfering with the sidewall. The projections provide precise fitting positioning of the LGA chip in the space.

Abstract: A low-profile receptacle connector for use in making a required electric connection between an integrated circuit package and a printed circuit board includes a terminal housing part that is sandwiched between the integrated circuit package and the printed circuit board, and the terminal housing part has terminals embedded therein. Each terminal includes a flat trunk and at least one cantilever-like contact arm integrally connected to its flat trunk. The terminals are arranged with their flat trunks parallel to the plane of the terminal housing part, and are supported by the terminal housing part by allowing the mold to overhang the opposite lateral and longitudinal edges of the trunk of each terminal.

Abstract: A socket may comprise an array of first contacts and a set of second contacts having a greater conductive cross-sectional area than the first contacts. The set of second contacts may also have a greater conductive area efficiency than the array of first contacts, with conductive area efficiency defined as a total conductive cross-sectional area divided by a total occupied area. The array of first contacts may electrically couple signal pads of a land grid array (LGA) component with a plurality of signal lines in a printed circuit board (PCB). The set of second contacts may electrically couple power delivery land pads of the LGA component with power and ground planes of the PCB.

Abstract: An electrical contact (30) received in a socket connector (1) for connecting a CPU (6) to a PCB (5) includes a retention plate (31) and a spring arm (33) and a connecting arm (32) connecting the spring arm to the retention plate. The retention plate engages with the socket connector for securely retaining the electrical contact in the socket connector. The spring arm includes a first curved arm (331) bent from the connecting arm toward the retention plate, a second curved arm (332) bent from the first curved arm opposite to the retention plate and a third curved arm (333) bent from the second curved arm toward the retention plate. The first curved arm has a bottom contacting end (330) for contacting with the PCB. Similarly, the third curved arm has a top contacting end (334) for contacting with the CPU.

Abstract: An electrical connector (1) includes a housing (6), and terminals (2) received in passageways (60) of the housing. Each passageway includes a retention space (602) that is bounded by a forward wall (6022), two side walls (6021) and two rearward walls. Each terminal includes a vertical retention portion (24) having a first main face (242), a second main face (244) and a pair of side faces (243). A retention protrusion (26) extends outwardly from each of opposite sides of the retention portion, and then bends perpendicularly. In one embodiment, the protrusions protrude beyond both the side faces and the second main face. Each protrusion includes a first interference portion (260) interferentially engaging with the respective side walls of a corresponding passageway, and a second interference portion (262) interferentially engaging with the forward wall. Each protrusion has a reinforced structure, and the terminal is securely and reliably retained in the passageway.

Abstract: An electrical connector assembly (1) includes a base (10), a fixing member (11), and a clip (13). The base defines at least one installation portion (12, 15). The fixing member is pivotally engaged with the installation portion, and comprises an actuator (110) movably engaged in the at least one installation portion. The clip is attached to the base opposite from the at least one installation portion, and comprises a groove (130) defining a first corner (131) and a second corner (132) adapted to cooperate with the actuator. The actuator can slide from the first corner to the second corner when the fixing member engages with the clip, whereby no lateral movement of the clip relative to the base occurs. Thus, a LGA IC module (2) can be fixed on the electrical connector assembly reliably.

Abstract: An IC socket for an IC package as an electrical part has a socket body to which a number of contact pins are arranged so as to establish an electrical connection between a printed circuit board and a terminal of the IC package. The contact pin comprises a first contact piece disposed on an electrical part side so as to contact the terminal of the electrical part and a second contact piece disposed on a printed circuit board side so as to contact the printed circuit board. When the first contact piece contacts the terminal and is pressed, the first contact piece is inclined and a contact end portion of the first contact piece is moved so as to slide with respect to the electrical part.