By Means Loosely Confining Work Patents (Class 451/286)
  • Patent number: 9597771
    Abstract: A carrier head includes a housing configured to enclose a wafer, wherein the housing includes a retaining ring recess. The carrier head includes a retaining ring positioned in the retaining ring recess, the retaining ring configured to surround the wafer. The retaining ring has a hardness ranging from about 5 shore A to about 80 shore D. A method of using a polishing system includes securing a wafer in a carrier head. The carrier head includes a housing enclosing the wafer, wherein the housing includes a retaining ring recess. The carrier head includes a retaining ring in the retaining ring recess. The retaining ring has a hardness ranging from about 5 shore A to about 80 shore D. The method includes pressing the wafer against a polishing pad, and moving at least one of the carrier head or the polishing pad relative to the other.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: March 21, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Sheng Lin, Hsin-Hsien Lu
  • Patent number: 9566687
    Abstract: A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: February 14, 2017
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Peter Albrecht, Sumeet Bhagavat, Alex Chu, Ichiro Yoshimura, Yunbiao Xin, Roland Vandamme
  • Patent number: 9434047
    Abstract: A retainer ring for chemical-mechanical polishing or other processes includes an outside ring and an inside ring that is attached to the outside ring. The inside ring is softer than the outside ring in hardness.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: September 6, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Cheng Lien, Hsin-Hsien Lu
  • Patent number: 9343084
    Abstract: Systems and methods for correcting slider parallelism error using compensation lapping are described. One such system includes a lapping support including at least one mounting surface having a preselected mounting angle such that a line normal to the at least one mounting surface is not parallel to a centerline of the lapping support, a rowbar including a plurality of magnetic transducers spaced apart along a length of the rowbar, and a lapping plate configured to lap the rowbar, where the rowbar is mounted to the at least one mounting surface, and where the rowbar is configured to be brought into contact with the lapping plate.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: May 17, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Theera Yaemglin, Chakkrit Supavasuthi
  • Patent number: 8998677
    Abstract: Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The carrier rotor is also restrained by a rigid rotating housing to allow a limited lateral motion and also a limited angular motion. Air pressure within a sealed bellows chamber provides controlled abrading pressure for wafers or other workpieces. Vacuum can also be applied to the bellows chamber to quickly move the wafer away from the abrading surface. Wafers can be quickly attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: April 7, 2015
    Inventor: Wayne O. Duescher
  • Patent number: 8968055
    Abstract: The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.
    Type: Grant
    Filed: April 28, 2012
    Date of Patent: March 3, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hui Chen, Allen L. D'Ambra, Jim Atkinson, Hung Chen
  • Publication number: 20150017890
    Abstract: The present invention provides a polishing head including: an annular rigid ring; an elastic film bonded to the rigid ring; and an upward and downward movable mid-plate, the mid-plate defining a first sealed space together with the rigid ring and the elastic film; an incompressible fluid enclosed in a sealed space; and a mid-plate positioning device for adjusting vertical position of the mid-plate, to hold a back surface of a workpiece on a lower surface of the elastic film and polish a front surface by bringing the front surface into contact with a polishing pad attached to a turn table, wherein the mid-plate can adjust a shape of the lower surface of the elastic film by adjusting the vertical position of the mid-plate. The polishing head polishes a workpiece without generating surface defects on the workpiece surface and easy detachment of the workpiece from a polishing pad after polishing.
    Type: Application
    Filed: January 28, 2013
    Publication date: January 15, 2015
    Inventor: Hisashi Masumura
  • Patent number: 8870626
    Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: October 28, 2014
    Assignee: IV Technologies Co., Ltd.
    Inventor: Yu-Piao Wang
  • Patent number: 8832921
    Abstract: A two-piece locking nut assembly for securing a mantle to a head assembly of a cone crusher. The two-piece locking nut assembly includes an inner nut and an outer nut. The inner nut includes a set of axial bores that each receive a jackscrew. Once the locking nut assembly is in position on the head assembly, the series of jackscrews are tightened to exert a force on the mantle that is counteracted by forces through the inner nut and into the head to create a locking force between the locking nut assembly and the head assembly. The outer nut is turned along the inner nut to hold the locking nut assembly in place. Once the outer nut is moved into position, the jackscrews are removed such that the outer nut continues to apply the locking force between the mantle and the head through the locking nut assembly.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: September 16, 2014
    Assignee: Metso Minerals Industries, Inc.
    Inventors: Walter R. Marks, Edward L. Snow
  • Publication number: 20140242886
    Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS., LTD.
    Inventors: Chang Gyu WOO, Sung Ho SHIN, Joo Yeop NAM, Ki Hong CHO
  • Patent number: 8734206
    Abstract: A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: May 27, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: One-Moon Chang, Jae-Phil Boo, Soo-Young Tak, Jong-Sun Ahn, Shin Kim, Kyoung-Moon Kang
  • Publication number: 20140134929
    Abstract: A retainer ring for chemical-mechanical polishing or other processes includes an outside ring and an inside ring that is attached to the outside ring. The inside ring is softer than the outside ring in hardness.
    Type: Application
    Filed: December 14, 2012
    Publication date: May 15, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
  • Patent number: 8702473
    Abstract: A polishing system for polishing a flat face of a rock comprises a polishing surface, a fence system, and a drive system. The polishing surface is supported for rotation about a primary rotation axis. The fence system is supported above the polishing surface. The drive system causes the polishing surface to rotate about the primary rotation axis and displace a driven portion of the fence system along a path relative to the primary rotation axis. The fence system engages the rock to prevent the polishing surface from causing the rock to move about the primary rotation axis and to cause the rock to move towards and away from the primary rotation axis.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: April 22, 2014
    Inventor: Gordon Lyons
  • Publication number: 20130316620
    Abstract: A retainer ring is provided for use in conjunction with Chemical Mechanical Polishing apparatus which polishing is used to polish a substrate. Particularly, the retainer ring includes an inner surface defining a retainer area, an outer surface, a front surface extending between the inner and outer surface, the front surface being in contact with the polishing pad during polishing and a transition region between the outer surface and the front surface. A CMP apparatus which includes at least a ring having the above features is also provided for.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: André Loebmann, Norman Nagel
  • Patent number: 8591286
    Abstract: Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 26, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Denis M. Koosau
  • Patent number: 8574033
    Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: November 5, 2013
    Assignee: LG Siltron Inc.
    Inventor: Jae Chel Sung
  • Patent number: 8556684
    Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: October 15, 2013
    Assignee: SPM Technology, Inc.
    Inventors: William B. Sather, Adam W. Manzonie
  • Patent number: 8535121
    Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: September 17, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Doyle E. Bennett, Andrew J. Nagengast, Hung Chih Chen
  • Patent number: 8517803
    Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: August 27, 2013
    Assignee: SPM Technology, Inc.
    Inventors: William B. Sather, Adam W. Manzonie
  • Patent number: 8414361
    Abstract: A template for polishing Silicon Carbide, Sapphire, Germanium, Silicon and pattern wafers having a slurry inlet, channels, outlets and pockets for holding said wafers terminating in peripheral vacuum ports in order to facilitate an efficient flow of slurry over the semiconductor wafers during a polishing process.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: April 9, 2013
    Inventors: Phuong Van Nguyen, Thang Van Tran
  • Patent number: 8398456
    Abstract: A method of polishing a substrate includes rotating a polishing table having a polishing surface, holding the substrate by a top ring, bringing the substrate into contact with the polishing surface while swinging and rotating the top ring to polish the substrate, and monitoring a surface condition of the substrate by a monitoring sensor. A rotational speed of the polishing table and conditions of swing motion of the top ring are determined such that a position of the monitoring sensor, a position of a center of rotation of the top ring, and a direction of the swing motion of the top ring at a point of time when a predetermined period of time has elapsed after polishing of the substrate is started approximately coincide with their previous values at a point of time before the predetermined period of time has elapsed.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: March 19, 2013
    Assignee: Ebara Corporation
    Inventors: Yoichi Kobayashi, Yasumasa Hiroo
  • Patent number: 8357029
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: January 22, 2013
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Tetsuji Togawa, Hozumi Yasuda, Koji Saito, Osamu Nabeya, Tomoshi Inoue
  • Patent number: 8298046
    Abstract: Retaining rings are presented with specially designed inserts that increase rigidity and improve heat dissipation. Inserts that are more rigid, and that have better ability to conduct heat, are inserted into pockets positioned along the outer portion of the rings. The pockets do not compromise the upper, lower or inner portion of the rings. Because the inserts are more rigid than the material used in the body of the ring, they absorb the deforming forces resulting from fastening the ring to the carrier head. Because they are better conductors than the material used in the body of the ring, the ring is better able to dissipate heat generated during polishing. Moreover, because the inserts are positioned in the outer portion of the ring, the inserts are not exposed to the polishing surface during polishing and therefore are less likely to react undesirably with the chemicals used during polishing.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: October 30, 2012
    Assignee: SPM Technology, Inc.
    Inventors: George J. Frank, Jr., Adam W. Manzonie, William B. Sather
  • Patent number: 8128458
    Abstract: A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: March 6, 2012
    Assignee: Ebara Corporation
    Inventors: Kenichiro Saito, Akihiro Yazawa, Masanori Sasaki, Takashi Mitsuya
  • Patent number: 8100743
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: January 24, 2012
    Assignee: Ebara Corporation
    Inventors: Osamu Nabeya, Tetsuji Togawa, Hozumi Yasuda, Koji Saito, Makoto Fukushima
  • Patent number: 8070560
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: December 6, 2011
    Assignee: Ebara Corporation
    Inventors: Hozumi Yasuda, Makoto Fukushima, Tetsuji Togawa
  • Patent number: 8033895
    Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: October 11, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
  • Patent number: 8029640
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: October 4, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Thomas H. Osterheld
  • Publication number: 20110151755
    Abstract: An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The base portion can be generally defined by a flat pad-contacting surface, an outer surface, and an inner surface. The base portion can additionally include channels extending from the outer surface to the inner surface to facilitate transfer of slurry to and from the substrate to be polished during the process. One or both of the base portion or backbone portion further includes a plurality of circular ribs that serve to create additional bonding surface with the overmolded material. The retaining ring may additionally includes a plurality of bosses with threaded insert holes by which the retaining ring is attached to a chemical mechanical polishing system.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 23, 2011
    Applicant: ENTEGRIS, INC.
    Inventors: John BURNS, Matthew A. FULLER, Martin L. FORBES, Jeffery J. KING, Mark V. SMITH
  • Patent number: 7857683
    Abstract: An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The base portion can be generally defined by a flat pad-contacting surface, an outer surface, and an inner surface. The base portion can additionally include channels extending from the outer surface to the inner surface to facilitate transfer of slurry to and from the substrate to be polished during the process. One or both of the base portion or backbone portion further includes a plurality of circular ribs that serve to create additional bonding surface with the overmolded material. The retaining ring may additionally includes a plurality of bosses with threaded insert holes by which the retaining ring is attached to a chemical mechanical polishing system.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: December 28, 2010
    Assignee: Entegris, Inc.
    Inventors: John Burns, Martin L. Forbes, Matthew A. Fuller, Jeffery J. King, Mark V. Smith
  • Publication number: 20100062694
    Abstract: One embodiment provides a retaining ring assembly. The retaining ring assembly comprises a retaining ring configured to circumferentially surround and retain the substrate within an inner surface of the retaining ring, and a flexure coupled to the retaining ring. The flexure is configured to maintain a gap between an inner surface of a carrier ring and an outer surface of the retaining ring, and the carrier ring is circumferentially surrounding the retaining ring.
    Type: Application
    Filed: September 8, 2008
    Publication date: March 11, 2010
    Inventors: Jin Yi, Jeonghoon Oh, Hung Chih Chen, Samuel Chu-Chiang Hsu
  • Patent number: 7674154
    Abstract: An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for maintenance.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: March 9, 2010
    Assignee: KoMiCo Technology, Inc.
    Inventor: In Kwon Jeong
  • Patent number: 7654883
    Abstract: A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 2, 2010
    Assignee: Sumco Techxiv Corporation
    Inventors: Masamitsu Kitahashi, Toshiyuki Kamei, Hidetoshi Takeda, Hiroyuki Tokunaga, Tamoaki Tajiri
  • Patent number: 7559825
    Abstract: Semiconductor wafers have a front surface, a back surface, a notch, and an edge. A method of polishing a wafer includes polishing at least one of the surfaces and the notch of the wafer using a polishing pad and slurry. At least one surface of the wafer is cleaned of residual slurry. The cleaned surface is grasped by applying a vacuum to the cleaned surface of the wafer using a vacuum chuck. Edge of the wafer is polished using a pad and slurry while the wafer is grasped by the vacuum chuck.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: July 14, 2009
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry Frank Erk, Judith Ann Schmit, Roland Vandamme
  • Publication number: 20090124176
    Abstract: The present invention offers a device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon the platen of a CMP polishing apparatus comprising two sheets, the upper sheet attached to the said CMP polishing pad and the lower attached to the said platen, the said two sheets held together by pegs, pins or protrusions fitted to matching holes in the upper surface of the lower sheet and the lower surface of the upper sheet, said pegs or pins attached to either the upper or lower sheet and able to enter the hold on the adjoining sheet when the sheets are brought together and hold the sheets together by means of the sliding friction attendant upon a tight fit with the said holes. The device allows far easier metrology and storage of CMP polishing pads at different stages of use with no damage to the CMP pad, which may be put back into service at any time.
    Type: Application
    Filed: November 9, 2007
    Publication date: May 14, 2009
    Applicant: ARACA INCORPORATED
    Inventor: Leonard J. Borucki
  • Patent number: 7520955
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: April 21, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Thomas H. Osterheld
  • Patent number: 7507148
    Abstract: A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: March 24, 2009
    Assignee: Sumco Techxiv Corporation
    Inventors: Masamitsu Kitahashi, Toshiyuki Kamei, Hidetoshi Takeda, Hiroyuki Tokunaga, Tamoaki Tajiri
  • Patent number: 7503838
    Abstract: A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetween. The belt sander may include a motor operationally coupled to the sanding assembly and opposite the sanding surface, the motor being configured to rotate at least the first roller and thereby rotate the sanding belt around the first roller and the second roller, as well as a handgrip formed around at least a portion of the motor and substantially encasing the motor.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: March 17, 2009
    Assignee: Black & Decker Inc.
    Inventors: Daniel P. Wall, Craig A. Carroll
  • Publication number: 20080160885
    Abstract: A retaining ring for a chemical mechanical polishing tool comprises a pad side surface. The pad side surface has an edge portion adjacent its outer circumference. A surface normal of the edge portion and a surface normal of the pad side surface include an acute angle. Additionally, or alternatively, the retaining ring may comprise at least one groove extending from an inner circumference of the pad side surface to the outer circumference of the pad side surface. The groove comprises at least one edge portion adjacent the pad side surface. A surface normal of the at least one edge portion and a surface normal of the pad side surface include an acute angle.
    Type: Application
    Filed: July 13, 2007
    Publication date: July 3, 2008
    Inventors: Sven Winterlich, Alexander Ulrich
  • Patent number: 7364497
    Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: April 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-yong Park, Tae-hoon Lee, Jae-eung Koo
  • Patent number: 7361076
    Abstract: A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: April 22, 2008
    Assignee: Ebara Corporation
    Inventors: Kunihiko Sakurai, Tetsuji Togawa, Yoshihiro Mochizuki, Akira Fukuda, Hirokuni Hiyama, Kazuto Hirokawa, Manabu Tsujimura
  • Publication number: 20080090497
    Abstract: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include structuring the retaining ring such that the width between inner and outer surfaces varies by an amount sufficient to compensate for polishing edge profile variation. Embodiments also include structuring the retaining ring such that the distance from the outer surface to the geometric inner surface varies. Embodiments further include structuring the retaining ring such that the distance between the outer surface to the perimeter of the substrate retained by the inner surface of the retaining ring varies.
    Type: Application
    Filed: October 12, 2006
    Publication date: April 17, 2008
    Inventor: Yu-Piao Wang
  • Patent number: 7354332
    Abstract: A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing, one or more qualification characteristics required to properly qualify the tool are measured using an in situ sensor or metrology device. Subsequently, the manufacturing tool is qualified by adjusting one or more parameters of a recipe in accordance with the qualification characteristics measured from the wafer to target one or more manufacturing tool specifications. In some embodiments, the tool to be qualified includes a bulk removal polishing platen, a copper clearing platen and a barrier removal polishing platen.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: April 8, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Rahul Surana, Ajoy Zutshi
  • Patent number: 7294040
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate support. A bearing liquid, such as a planarizing liquid, is directed toward the second surface of the microelectronic substrate to form a liquid bearing between the substrate and substrate support. The microelectronic substrate can precess relative the substrate support as the substrate support moves relative to the planarizing pad. The substrate support can include a sensor to determine a characteristic, such as a thickness, of the liquid bearing. In another embodiment, a portion of the liquid bearing can be removed from the second surface of the microelectronic substrate to control the thickness of the liquid bearing and/or to remove particulate matter from the liquid bearing.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: November 13, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 7255637
    Abstract: A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substrate from moving along the surface, and a dampening material secured between the retainer and the base.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: August 14, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Doyle E. Bennett, Andrew J. Nagengast, Hung Chih Chen
  • Patent number: 7244168
    Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 17, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Yufei Chen, Lizhong Sun, Doohan Lee, Wei-Yung Hsu
  • Patent number: 7201640
    Abstract: The method of sucking water is capable of easily removing excess water included in a backing member adhered on a plate of a polishing apparatus. In the method, the excess water is removed from the backing member by the steps of: pressing a water absorbing member onto a holding surface of the backing member, on which the work piece is adhered and held, so as to absorb the excess water from the backing member; and sucking the excess water absorbed by the water absorbing member.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: April 10, 2007
    Assignee: Fujikoshi Machinery Corp.
    Inventors: Yoshio Nakamura, Mitsue Ogawa, Kenji Hashizume
  • Patent number: 7198548
    Abstract: A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: April 3, 2007
    Assignee: Applied Materials, Inc.
    Inventor: Hung Chih Chen
  • Patent number: 7189139
    Abstract: A polishing apparatus can detect completion of initialization of a polishing pad quantitatively. The polishing apparatus has a polishing table having a polishing pad attached thereto and a substrate holder configured to bring a surface of a substrate into contact with the polishing pad and press the substrate against the polishing pad. The polishing apparatus also has a drive mechanism operable to drive at least one of the polishing table and the substrate holder so as to provide a relative movement between the polishing pad and the substrate. The polishing apparatus includes a current sensor operable to detect a drive current supplied to the driving mechanism. The polishing apparatus also includes a polishing pad condition detector operable to detect a condition of the polishing pad based on the drive current detected by the current sensor when the dummy substrate is polished by a relative movement between the polishing pad and a dummy substrate held by the substrate holder.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: March 13, 2007
    Assignee: Ebara Corporation
    Inventor: Katsutoshi Ono
  • Patent number: 7175510
    Abstract: A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess material from the wafer, allowing an efficient polishing of the surface of the wafer. The polishing pad smoothes out due to the polishing of the wafer and must be conditioned to restore effectiveness. A conditioning assembly with a plurality of diamonds is provided. The diamonds have predetermined angles that provide strength to the diamond. This allows for an optimal rotation speed and downward force in effective conditioning of the polishing pad, while reducing diamond fracture rate.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: February 13, 2007
    Assignee: Intel Corporation
    Inventors: Randy S. Skocypec, Adam P. La Bell, Wade R. Whisler