Abstract: An apparatus and method for polishing a workpiece including a polishing pad, and at least one polishing arm for holding a workpiece to be polished on the polishing pad. The polishing arm includes at least one plastic bearing. The plastic bearing prevents lock up of a vacuum chuck coupled to the polishing arm because it is impervious to slurry which often becomes lodged in conventional ball bearings.

Abstract: A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which are removed at a similar rate as those layers which comprise the semiconductor die. A die is placed into the opening and a circuit side of the die is aligned with a front side of the holder, for example using a generally planar surface, and is secured to the holder with an adhesive material. Using a holder reduces uneven layer removal which is known to occur in conventional processing, for example excessive removal at the edges of the die. A potting jig which aids in aligning and securing the die to the holder is also described.

Abstract: Defects in semiconductor wafers caused by a wafer clamp ring are reduced by polishing the surfaces of the clamp ring that engage and apply clamping force to the wafer. A polishing tool includes a circular plate supported on the stationary base. A layer or pad of polishing material, such as silicon carbide diamond, is deposited over the plate. The clamp ring is placed on the plate such that clamping surfaces of the ring engage the polishing material on the plate, and the ring is rotated to effect polishing of the clamping surfaces.

Abstract: A method and apparatus for facilitating the removal and replacement of polishing pads utilized in the process of polishing and planarizing workpieces such as semiconductors where the polishing machine employed includes a rotatable platen. The apparatus for facilitating the removal and replacement of polishing pads includes a top plate for securing a polishing pad thereto and means for removably mounting the top plate to the rotatable platen in the polishing machine. Means for removably mounting the top plate to the rotatable platen preferably includes a plurality of electromagnetic elements embedded within the top surface of the rotatable platen and means for activating and deactivating the electromagnetic elements.

Abstract: An abrasive shaped article composed of at least 90% by weight, based on the weight of the abrasive shaped article, of silica and having a bulk density of 0.2 g/cm3 to 1.5 g/cm3, a BET specific surface area of 10 m2/g to 400 m2/g and an average particle diameter of 0.001 &mgr;m to 0.5 &mgr;m. An abrasive disc having fitted thereto at least one of the abrasive shaped article is advantageously used for polishing a material such as substrate. Preferably at least two kinds of abrasive shaped articles are fitted to the supporting auxiliary, at least one kind of which has a bulk density of 0.7 g/cm3 to 1.5 g/cm3 and at least one kind of which has a bulk density of at least 0.2 g/cm3 but smaller than 0.7 g/cm3.

Abstract: A chemical-mechanical-polishing system having a slurry distribution system, a polisher, a deionized water supply, and a drain, includes a slurry filtration system. The filtration system has two filters for alternately filtering particles in slurry and being backflushed with deionized water. Two input valves have input ports connected to the slurry distribution system and output ports respectively connected to the filters for filtering. Two output valves have input ports respectively connected to the filters for receiving filtered slurry and output ports connected to the polisher. Two backflush valves have input ports connected to the deionized water supply and output ports respectively connected to backflush with deionized water; the output ports are also respectively connected to the input ports of the two output valves. Two drain valves have input ports respectively connected to the filters for receiving backflushed fluid and output ports connected to the drain.

Abstract: In one embodiment, a polishing apparatus (10) includes a retaining ring (12), a pressure ring (16), a first seal (18), and a second seal (20). The retaining ring (12) is movably attached to the pressure ring (16) to create a uniform pressure distribution across the retaining ring (12). In addition a positive fluid pressure is applied to the first seal (18) and the second seal (20) to create the uniform pressure distribution across the retaining ring (12). The uniform pressure distribution across the retaining ring (16) allows a semiconductor substrate (51), polished with the polishing apparatus (10), to have a reduced edge exclusion, and thus increased die yield.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has a pusher for transferring the workpiece between a top ring of a polishing apparatus and the pusher. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a pusher for transferring the workpiece between the top ring and the pusher. The pusher comprises a workpiece support for supporting the workpiece, an actuating unit for moving the workpiece support in a vertical direction, a sliding mechanism movable within a horizontal plane, and a positioning mechanism for positioning the workpiece support and the top ring with respect to each other in association with the sliding mechanism when the workpiece is transferred between the workpiece support and the top ring.

Abstract: A chemical mechanical polishing apparatus has a first polishing sheet movable in a first linear direction, and a second polishing sheet movable in a second linear direction. The first and second polishing sheets are positioned in a parallel and coplanar arrangement to contact a surface of a substrate during polishing.

Abstract: The present invention is a polishing compound comprising a colloidal solution of silicon oxide to which an alkaline component and an acid component are added in order to have a buffering action, wherein said alkali component is a quaternary ammonium whose carbon number per one molecular is smaller than 12, and said acid component is at least one selected from the group composed by carbonic acid, boric acid and silicic acid.

Abstract: A polishing fixture, and method, comprising a base. A shaft joined with the base. A platform joined with the shaft and located remote from the base. A sample holder joined with the shaft, wherein the platform moves relative to the base and the sample holder. In operation, the invention comprises affixing a device to the sample holder of the fixture and then placing the fixture on a polishing surface in a polishing position wherein the device is automatically positioned adjacent to the polishing surface. Thereafter, the fixture can be removed from the polishing surface and the fixture inverted to assume a position for inspecting the device.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.

Abstract: An apparatus for removing material from a substrate including a plurality of polishing cells. A first polishing cell detects the material on the substrate and performs a first polishing operation for removing material from the substrate. The first polishing cell includes at least one sensor for characterizing the material on the substrate and at least one polishing tool for removing material from the substrate. A second polishing cell includes at least one polishing tool for completing the polishing process.

Abstract: A rotary joint for fluids that provides a completely sealed path for the flow of polishing solution and which permits the supply of electricity to a polished surface detector. The rotary joint of the present invention is essentially made up of a joint block (1) and a rotator assembly (2). To the rotator assembly (2) rotatably held in the joint block (1) is attached a polishing pad shaft (104). Between the joint block (1) and the rotator assembly (2) is formed a seal space closed by a pair of seal units (5, 5), each comprising sealing rings (51, 52) which rotate in relation to each other. A fluid passage (7) continuous via a seal space (50) and running through the joint block (1) and the rotator assembly (2) is formed, and a wiring conduit running from an electric source unit (3) to the polished surface detector on the polishing pad (104) is also formed.

Abstract: The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms.

Abstract: A polishing apparatus and method capable of polishing stably regardless of variation between polishing objects, change of a polishing means with lapse of time etc. The apparatus includes polishing pad 1, polishing table 3 with the polishing pad 1 adhered thereto, table motor 8 for driving the polishing table 3, conditioning means 5 for conditioning the polishing pad 1 at the same time of polishing and conditioning control system 12 for setting a conditioning condition during polishing. According to a polishing method of the present invention, a conditioning condition of the polishing pad 1 can be set so as to make a torque current 10, which is proportional to a friction force exerted between the polishing pad 1 and the wafer 2, constant, and thereby polishing speed can be stabilized.

Abstract: A polishing apparatus includes a top ring for holding a workpiece to be polished on a lower surface thereof, a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring, and a dressing tool for dressing the polishing surface of the turntable. The top ring is movable to a first maintenance position therefor, and the dressing tool is movable to a second maintenance position therefor. The top ring, the turntable, and the dressing tool are housed in a single chamber having a plurality of side faces. The polishing surface, the first maintenance position, and the second maintenance position are positioned closely to one of the side faces of the chamber. Such one side face serves as a maintenance face for approaching the polishing surface, the first maintenance position, and the second maintenance position for maintenance of the polishing surface, the top ring and the dressing tool.

Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.

Abstract: A pad cleaning brush and method for making the same is used in conjunction with spray rinse water to thoroughly clean a polishing pad of a chemical-mechanical polishing apparatus after a wafer has been polished. The bristles of the brush are securely retained within the brush by a welding process. This prevents the bristles from remaining on the polishing pad after the cleaning operation, thereby preventing the remaining bristles from damaging a subsequently polished wafer.

Abstract: The present invention provides a surface grinding method and apparatus for achieving a thin plate work such as a semiconductor wafer with high flatness, high accuracy and certainty and the apparatus comprises: a surface grinder in which a grinding wheel support member 3 by which a rotary shaft 5 of a grinding wheel 6 is supported is held by a pivotal shaft portion 4 and a grinding wheel shaft inclination control motor 9 which displaces the grinding wheel support member 3 by activating the pivotal shaft portion 4 is provided; a corrective angle storage device 15 which stores a corrective angle of an inclination angle of a rotary shaft 5 of the grinding wheel 6 to a rotary shaft 13 of a wafer 12; and a shaft inclination control apparatus 14 which sends out a signal to control the grinding wheel shaft inclination control motor 9 while reading a corrective angle of the corrective angle storage device 15, wherein a relative inclination angle of the grinding wheel to the thin plate work, in a more concrete manner a

Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

Abstract: A wafer polishing head for planarizing a wafer. The wafer polishing head comprises a carrier, a retaining ring, a first pressure chamber, a second pressure chamber and an automatic control system. The retaining ring is surrounding the carrier. The first pressure chamber having a first inner pressure is disposed above the retaining ring. The second pressure chamber having a second inner pressure is disposed on the carrier. The automatic control system is respectively coupled to the first pressure chamber and the second pressure chamber.

Abstract: The invention teaches an in-site roller dresser that allows for the profile of the polishing pad to be monitored while the roller is dressed or refurbished. This eliminates the need for destructive testing of the polishing pad. The in-site roller dresser at the same time eliminates the need for machine downtime for polishing pad profile determination since the polishing pad profile is dynamically tested and monitored during polishing operations. In conventional arrangements, the dresser is a disk, in the arrangement of the present invention the dresser is a roller type that can rotate around its axis in either direction. A sensor is provided with the diamond dresser that monitors the surface or profile of the polishing pad. Based on the data obtained by the sensor, the diamond dresser can be adjusted which directly controls the polishing pad refurbishing action provided by the dresser.

Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

Abstract: A chemical-mechanical polishing apparatus includes a polishing table having a top surface and an annular trench formed in the top surface and defining an annular configured polishing area in the polishing table. A drive mechanism rotates the polishing table. An annular diaphragm is positioned within the annular configured polishing area and has a top surface and bottom surface. An annular configured polishing pad is positioned on the diaphragm. A fluid actuated pressure mechanism is associated with the annular configured polishing area for exerting pressure upward onto the bottom surface of the annular diaphragm as a polishing table rotates for exerting an upward biasing pressure onto the polishing pad and imparting a desired counter force against any downward pressure exerted against a semiconductor wafer during chemical-mechanical polishing.

Abstract: A method of manufacturing a semiconductor device using a polishing apparatus is provided. A top ring holding a wafer is arranged on a pad. A polishing chemical liquid supply line for supplying a polishing chemical liquid is arranged above the pad in a direction ahead of rotation with respect to the top ring. Around the center of rotation of the pad, a partition plate having a columnar side surface is arranged. Above the pad on a side which goes away from the top ring when the pad is rotated, a polishing chemical liquid draining mechanism is arranged extending continuously from the partition plate to the outer periphery of the pad. Accordingly, a polishing apparatus is obtained by which the amount of polishing of the surface to be polished of the semiconductor substrate is stabilized and generation of microscratches on the surface to be polished can be suppressed.

Abstract: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

Abstract: Improved chemical mechanical polishing methods for removing material from a surface of a workpiece are disclosed. The workpiece is polished for a predetermined amount of time, the wafer is then moved to the perimeter of a polishing surface and film thickness measurements are obtained. The results from the film thickness measurements are used to adjust parameters for a subsequent polishing process.

Abstract: A method is provided for detecting the endpoint of a film removal process such as chemical-mechanical polishing (CMP). The process uses a device having a shaft, and friction in the film removal causes torque on the shaft. Two axially displaced reflecting portions are provided on the shaft. Light reflected from these portions generates first and second reflected signals, respectively. A phase difference between the reflected signals is detected, and an output signal is generated in accordance therewith. A change in the output signal indicates a change in deformation of the shaft resulting from change in the torque, thereby indicating the endpoint of the film removal process.

Abstract: A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine. The method includes adding an extra pad between a retaining ring and a carrier so that the retaining ring is prevented from slippage and pressure on wafer can be evenly spread over the polishing pad of a polishing machine. Therefore, the rate at which a retaining ring wears out in chemical-mechanical polishing operation can be greatly reduced, and the working life of a retaining ring can be doubled.

Abstract: A carrier head is provided that improves the pressure uniformity of a semiconductor wafer against the polishing pad in chemical mechanical polishing (CMP). The carrier head includes a carrier, a carrier film, and a guide ring. The objective of CMP is to provide planarization of the surface of a semiconductor wafer by uniformly removing material. One embodiment of the invention uses independent adjusting screws threaded in the carrier to provide uniform wafer pressure and lengthen guide ring life. The adjusting screws are threaded internally to accept holding screws attached to the guide ring using a backing. This facilitates variation in the spacing between the carrier and guide ring at each adjusting screw. A locking nut on each adjusting screw is used to maintain each gap setting. This embodiment eliminates the need for shims and the associated trial-and-error set-up time in selecting shims. In addition, compensating for guide ring wear can be easily performed without disassembling the carrier head.

Abstract: Conditioning systems and methods for conditioning polishing pads used in mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies. In one aspect of the invention, a conditioning system includes a conditioning element or conditioning member having a conditioning face configured to engage a polishing pad. The conditioning face preferably includes a bonding medium covering at least a portion of the conditioning face and a plurality of conditioning particles attached to the bonding medium. The conditioning system also includes a corrosion-inhibiting unit that can be coupled to the conditioning element or a liquid on the polishing pad. The corrosion-inhibiting unit retards corrosion of the bonding medium in the presence of chemicals on the polishing pad that would otherwise corrode the bonding medium.

Abstract: A new method of chemical mechanical polishing using a submerged polishing table is described. A polishing table is provided having a polishing pad thereon wherein the polishing table is fixed within a container. A channel exists between an outer edge of the polishing table and an inner edge of the container. Outlets lie in a bottom surface of the channel. A wafer carrier presses a wafer onto the polishing pad. Slurry is dispensed onto the polishing pad at a high rate wherein the slurry polishes the wafer and wherein the slurry flushes away particles from a surface of the polishing pad into the container and out through the outlets. Even heavy particles such as diamond bits from a diamond-embedded dresser on the polishing pad can be flushed away using the method and polishing table of the invention.

Abstract: A semiconductor processing system, such as a system for buffing or scrubbing both sides of a wafer at the same time, that includes a processing box for use with chemical solutions, a positioning device to position a semiconductor substrate, or other similar semiconductor material or device, and a placement device to place a buffing pad or scrubbing brush.

Abstract: The present invention relates to a dressing apparatus for conditioning and regenerating a chemical mechanical polishing (CMP) pad. More specifically, the invention relates to a diamond disc dresser that employs an air spraying assembly and radially arranged dressing tools to clean, flatten, and roughen the polishing pad. Each of the dressing tools points at a same radial angle but are not necessarily equidistantly separated. Furthermore, a debris collector is used to collect the micro-particles and other types of contamination after they are swept off the working surface of the polishing pad.

Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.

Abstract: The present invention is an ultrasonic transducer slurry dispensing device and method for efficiently distributing slurry. The present invention utilizes ultrasonic energy to facilitate efficient slurry application in a IC wafer fabrication process to permits reduced manufacturing times and slurry consumption during IC wafer fabrication. In one embodiment a chemical mechanical polishing (CMP) ultrasonic transducer slurry dispenser device includes a slurry dispensing slot, a slurry chamber coupled and an ultrasonic transducer. The slurry chamber receives the slurry and transports it to the slurry dispensing slots that apply slurry to a polishing pad. The ultrasonic transducer transmits ultrasonic energy to the slurry.

Abstract: A rubber sheet is arranged between a head body and a retainer ring of a wafer holding head. Two O-rings air-tightly close a space between the periphery of the rubber sheet, which is located above the retainer ring, and the head body. When a pump supplies the compressed air to the space, the periphery of the rubber sheet is elastically deformed to press the retainer ring under uniform pressure.

Abstract: A workpiece carrier has a top ring body for holding a workpiece, a drive shaft for rotating the top ring body and moving the top ring body toward a turntable to press the workpiece against a polishing surface, and a universal joint for transmitting a pressing force from the drive shaft to the top ring body while allowing the drive shaft and the top ring body to be tilted relatively to each other. The universal joint includes two members having curved surfaces formed along arcs having a predetermined radius of curvature from a center positioned on a surface of the workpiece which is held in contact with the polishing surface on the turntable, and four rollers held in rolling contact with the curved surfaces. Two of the rollers are held in rolling contact with each respective two of the curved surfaces to allow the top ring body to be tilted relatively to the drive shaft about a point positioned on the surface which is held in contact with the polishing surface on the turntable.

Abstract: An apparatus and a method for cleaning a polishing pad used in a chemical mechanical polishing apparatus are disclosed. In the apparatus, a plurality of brush means is mounted to the bottom surface of either a conditioning head, a slurry delivery arm, or both for operating in-situ or ex-situ in a chemical mechanical polishing process. Each of the plurality of brush means may be formed of a multiplicity of bristles made of a polymeric material that is acid resistant and base resistant. A suitable material is nylon that has sufficient hardness for efficient cleaning of surface grooves in a top surface of the polishing pad. The present invention novel apparatus is efficient in removing particles from the surface grooves before the particles present a serious scratching hazard or otherwise damaging the wafer surface during a CMP polishing process.

Abstract: An abrasive polishing pad for planarizing a substrate. In one embodiment, the abrasive polishing pad has a planarizing surface with a first planarizing region and a second planarizing region. The first planarizing region has a first abrasiveness and the second planarizing region has a second abrasiveness different than the first abrasiveness of the first region. The polishing pad preferably has a plurality of abrasive elements at the planarizing surface in at least one of the first or second planarizing regions. The abrasive elements may be abrasive particles fixedly suspended in a suspension medium, contact/non-contact regions on the pad, or other elements that mechanically remove material from the wafer.

Abstract: An annular ring assembly is provided in which mechanical elements of the retaining ring assembly maintain strict planar flatness, rigidity, high tolerances and surface stability control. Additionally, glues, adhesives, and epoxies are eliminated from the construction of the plastic retaining and backing ring assembly. Further, adverse chemical reaction and contamination from adhesives that are typically in direct contact with chemical slurry and substrate layers undergoing polishing are eliminated. As a result, the present invention provides a low cost alternative to suppliers and manufacturers of retaining rings and facilitates a method to exchange, recondition and recycle the retaining ring for an infinite period, thus reducing consumable waste materials. Further, the ring assembly maintains uniform mechanical properties and strict tolerances after post reconditioning, thus reducing the variability and maintaining process consistency.

Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

Abstract: In order to efficiently polish a large-area member to be polished to a desired shape, a polishing apparatus includes a first polishing station including a first holding unit for holding a member to be polished in a state in which a surface to be polished thereof is upwardly placed, and a first polishing head for holding and rotating a polishing pad whose polishing surface is larger than the surface to be polished in a state of contacting the surface to be polished, a detection station for detecting a polished state of the surface to be polished in a state in which the surface to be polished is upwardly placed, and a second polishing station including a second holding unit for holding the member to be polished in a state in which the surface to be polished thereof is upwardly placed, and a second polishing head for holding and rotating a polishing pad whose polishing surface is smaller than the surface to be polished in a state of contacting the surface to be polished.

Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A chemical mechanical polishing apparatus and method can polish a surface of an object very precisely at a high speed irrespective of the presence of a local defect on the surface to be polished. By using a multiplex ring-shaped polishing pad, an effective surface to be polished is increased, and very precise and uniform polishing can be performed at a high speed. By using a plurality of polishing pads, having different diameters smaller than the diameter of the surface to be polished, provided with an interval on the same revolution radius on a revolution table, or by using a plurality of polishing pads, having the same diameter smaller than the diameter of the surface to be polished, provided at positions having different revolution radii on a revolution table, very precise and uniform polishing can be performed.

Abstract: Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect, a polishing chuck includes a body dimensioned to hold a work piece, and a multi-positionable, force-bearing surface is positioned on the body. The surface has an undeflected position, and is bi-directionally deflectable away from the undeflected position. A deformable work piece-engaging member is disposed adjacent the force-bearing surface for receiving a work piece thereagainst. The work piece-engaging member is positioned for movement with the force-bearing surface. In another aspect, a yieldable surface is provided on the body and has a central area and a peripheral area outward of the central area. One of the central and peripheral areas is movable, relative to the other of the areas to provide both inwardly and outwardly flexed surface configurations.