Having Pressure Plate Patents (Class 451/288)
  • Patent number: 11304290
    Abstract: A method includes attaching a substrate to a carrier, aligning external connectors on a first surface of a first semiconductor package to first conductive pads on a first surface of the substrate facing away from the carrier, and performing a reflow process, where a difference in coefficients of thermal expansion (CTEs) between the substrate and the carrier causes a first shape for the first surface of the substrate during the reflow process, where differences among CTEs of materials of the first semiconductor package causes a second shape for the first surface of the first semiconductor package during the reflow process, and wherein the first shape substantially matches the second shape. The method further includes removing the carrier from the substrate after the reflow process.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: April 12, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Yung-Chi Lin, Wen-Chih Chiou
  • Patent number: 11260500
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: March 1, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 11222809
    Abstract: Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus. In one embodiment, a first plurality of ports are formed in a chucking surface of the body and extend to a bottom surface of the body. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 11, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Joseph Yudovsky, Visweswaren Sivaramakrishnan, Ludovic Godet, Rutger Meyer Timmerman Thijssen
  • Patent number: 11154961
    Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: October 26, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Mayu Felicia Yamamura, Jason Garcheung Fung, Daniel Redfield, Rajeev Bajaj, Hou T. Ng
  • Patent number: 11059144
    Abstract: A polishing apparatus capable of preventing wear of rollers which are to transmit a load to a retainer ring and capable of preventing wear particles from escaping outside is disclosed. The polishing apparatus includes: a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together with a head body; a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring; a stationary ring disposed on the rotary ring; and a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the stationary ring. The rotary ring has rollers which are in contact with the stationary ring.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: July 13, 2021
    Assignee: EBARA CORPORATION
    Inventor: Osamu Nabeya
  • Patent number: 11027394
    Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: June 8, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jieun Yang, Dong-il Yoon, Taemin Earmme, Gui Hyun Cho, Seok Heo, Jong Hwi Seo, Yong Won Choi
  • Patent number: 10981250
    Abstract: A SiC wafer is produced from a single crystal SiC ingot. Wafer producing apparatus includes a holding unit for holding the ingot, a flattening unit for grinding the upper surface of the ingot, thereby flattening the upper surface, a laser applying unit for setting the focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from the upper surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the laser beam to the ingot to thereby form a separation layer for separating the wafer from the ingot, a wafer separating unit for holding the upper surface of the ingot to separate the wafer from the ingot along the separation layer, and a wafer storing unit for storing the wafer separated from the ingot.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 20, 2021
    Assignee: DISCO CORPORATION
    Inventors: Kentaro Iizuka, Naoki Omiya, Takashi Mori, Satoshi Yamanaka, Kazuya Hirata
  • Patent number: 10953514
    Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: March 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
  • Patent number: 10916460
    Abstract: A wafer producing apparatus for producing an SiC wafer from a single-crystal SiC ingot includes an ingot grinding unit, a laser applying unit that applies a pulsed laser beam having a wavelength that is transmittable through the single-crystal SiC ingot while positioning a focal point of the pulsed laser beam in the single-crystal SiC ingot at a depth corresponding to the thickness of the SiC wafer to be produced from an upper surface of the single-crystal SiC ingot, thereby forming a peel-off layer in the single-crystal SiC ingot, a wafer peeling unit that peels the SiC wafer off the peel-off layer in the single-crystal SiC ingot, and a delivery unit assembly that delivers the single-crystal SiC ingot between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: February 9, 2021
    Assignee: DISCO CORPORATION
    Inventors: Kentaro Iizuka, Naoki Omiya, Takashi Mori, Motomi Kitano, Kazuya Hirata, Hiroshi Kitamura
  • Patent number: 10857647
    Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: December 8, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 10861702
    Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: December 8, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 10744616
    Abstract: A wafer polishing method of polishing one surface of a wafer by rotating a rotating platen to which a polishing pad is affixed and a pressurizing head while supplying slurry onto the rotating platen and pressurizing/holding the wafer on the polishing pad with the pressurizing head, the method including: calculating an F/T value by monitoring a load current value F of a motor for rotating the rotating platen and a surface temperature T of the polishing pad during the wafer polishing; and controlling at least one of the rotation speed of the rotating platen and the polishing pressure of the pressurizing head based on the calculated F/T value.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: August 18, 2020
    Assignee: SUMCO CORPORATION
    Inventors: Tomonori Kawasaki, Ryoya Terakawa
  • Patent number: 10710208
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: July 14, 2020
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Patent number: 10710209
    Abstract: A wafer polishing apparatus is provided with a rotating platen to which a polishing pad is affixed and a polishing head that holds a wafer placed on the polishing pad while pressing the wafer. The polishing head has a membrane that contacts the upper surface of the wafer and applying a pressing force thereto and a support plate that supports the membrane. The membrane has a main surface part facing the bottom surface of the support plate and a side surface part facing the outer peripheral edge surface of the support plate. The vertical tension due to the side surface part of the membrane is larger than the lateral tension due to the main surface part of the membrane.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: July 14, 2020
    Assignee: SUMCO CORPORATION
    Inventors: Ryoya Terakawa, Ryuichi Tanimoto, Hironori Kaneko
  • Patent number: 10612664
    Abstract: System including a rotary seal created by a dual-wiper gasket. In exemplary embodiments, the system may comprise a mounting portion and a gimbal assembly. The gimbal assembly may include a first gimbal pivotably connected to and supported by the mounting portion for rotation of the first gimbal about a first axis, and a second gimbal pivotably connected to and supported by the first gimbal for rotation of the second gimbal about a second axis transverse to the first axis. The system also may comprise a gasket encircling the first axis and creating a rotary seal between the mounting portion and the first gimbal. The gasket may have an inner wiper encircled by an outer wiper, with both wipers disposed in circumferentially sealed engagement with the mounting portion or the first gimbal.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: April 7, 2020
    Assignee: FLIR Systems, Inc.
    Inventors: James H. Weaver, Bruce Ellison, Chris L. Watkins
  • Patent number: 10562147
    Abstract: A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
  • Patent number: 10537972
    Abstract: A polishing method including rubbing a wafer held by holding means against a polishing pad attached to a turntable while cooling the turntable by supplying a refrigerant to a refrigerant flow path provided in the turntable which is driven to rotate by a motor, thereby performing polishing, the polishing method being characterized in that, during standby after end of the polishing of the wafer and before performing the polishing of a next wafer, a flow volume of the refrigerant is controlled to be less than a flow volume of the refrigerant during the polishing where the wafer is polished, the turntable is rotated by the motor, and a water retaining liquid having a temperature adjusted to a room temperature or more is supplied to the polishing pad.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: January 21, 2020
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Junichi Ueno, Michito Sato, Kaoru Ishii
  • Patent number: 10529612
    Abstract: In various embodiments, a method for processing a semiconductor wafer is provided. The semiconductor wafer includes a first main processing side and a second main processing side, which is arranged opposite the first main processing side, and at least one circuit region having at least one electronic circuit on the first main processing side. The method includes forming a stiffening structure, which at least partly surrounds the at least one circuit region and which stiffens the semiconductor wafer, wherein the stiffening structure has a cutout at least above part of the at least one circuit region, and thinning the semiconductor wafer, including the stiffening structure, from the second main processing side.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: January 7, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Francisco Javier Santos Rodriguez, Roland Rupp
  • Patent number: 10513006
    Abstract: A chemical-mechanical polishing system has a first polishing apparatus configured to perform a first chemical-mechanical polish on a workpiece and a second polishing apparatus configured to perform a second chemical-mechanical polish on the workpiece. A rework polishing apparatus comprising a rework platen and a rework CMP head is configured to perform an auxiliary chemical-mechanical polish on the workpiece when the workpiece is positioned on the rework platen. A measurement apparatus measures one or more parameters of the workpiece, and a transport apparatus transports the workpiece between the first polishing apparatus, second polishing apparatus, rework polishing apparatus, and measurement apparatus. A controller determines a selective transport of the workpiece to the rework polishing apparatus by the transport apparatus only when the one or more parameters are unsatisfactory.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jiann Lih Wu, Jason Shen, Soon-Kang Huang, James Jeng-Jyi Hwang, Chi-Ming Yang
  • Patent number: 10500691
    Abstract: A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: December 10, 2019
    Assignee: EBARA CORPORATION
    Inventors: Masayoshi Imai, Katsuhiko Tokushige, Suguru Ogura, Katsuhide Watanabe, Junji Kunisawa, Takeshi Iizumi, Mitsuru Miyazaki
  • Patent number: 10493592
    Abstract: A semiconductor manufacturing apparatus according to the present embodiment has a polisher polishing a substrate. A holder holds the substrate and rotates the substrate with respect to the polisher while pressing the substrate toward the polisher. A supplier supplies a polishing solution onto the polisher. A first annular part is attached to the holder. The first annular part is located around the substrate and between the holder and the polisher, when polishing the substrate. A second annular part is attached to the holder. The second annular part is located around the first annular part and between the holder and the polisher, when polishing the substrate. The first annular part is movable relative to the second annular part or the second annular part is movable relative to the first annular part, in a rotation direction of the substrate or the holder.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: December 3, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Masayoshi Adachi, Jun Takagi
  • Patent number: 10486284
    Abstract: Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: November 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Shingo Togashi, Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya
  • Patent number: 10414016
    Abstract: According to one embodiment of the present disclosure, provided is a method of calibrating a relationship among a pressure command value, a pressure in an air-bag, and a pressure read value of the air-bag in a substrate polishing apparatus, the substrate polishing apparatus including: a polishing table; the air-bag configured to press a substrate against the polishing table, the pressure for pressing the substrate being variable; and a pressure control unit configured to control the pressure in the air-bag in accordance with the pressure command value inputted to the pressure control unit, and read the pressure in the air-bag.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: September 17, 2019
    Assignee: Ebara Corporation
    Inventor: Koichi Takeda
  • Patent number: 10399202
    Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (?in).
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 3, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Yongqi Hu, Simon Yavelberg, Gangadhar Sheelavant, Kadthala R. Narendrnath
  • Patent number: 10350723
    Abstract: During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top surface of an underlying dielectric layer of the substrate exposed and determine based on the first signal. An initial value of the second signal at the determined clearance time is determined. An offset is added to the initial value to generate a threshold value, and a polishing endpoint is triggered when the second signal crosses the threshold value.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: July 16, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Shih-Haur Shen, Jianshe Tang, Jimin Zhang, David Maxwell Gage
  • Patent number: 10300578
    Abstract: In some embodiments, the present disclosure relates to a method of performing a planarization process. The method may be performed by placing a wafer between a carrier head and an upper surface of a polishing pad. The carrier head has a retainer ring configured to surround the wafer, and the retainer ring has an abrasive structure configured to contact the upper surface of the polishing pad. Pressures within one or more chambers surrounded by the carrier head are independently regulated. The one or more chambers have one or more interior surfaces having a flexible membrane. The flexible membrane has a lower surface configured to contact the wafer. At least one of the carrier head or the polishing pad are moved relative to the other, and a roughness of the upper surface of the polishing pad is maintained within a predetermined range by using the abrasive structure of the retainer ring.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: May 28, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chang-Sheng Lin
  • Patent number: 10252397
    Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: April 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: David Masayuki Ishikawa, Jeonghoon Oh, Garrett Ho Yee Sin, Charles C. Garretson, Huanbo Zhang, Chia-Ling Pai, Niraj Prasad, Julio David Muzquiz
  • Patent number: 10226853
    Abstract: A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: March 12, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Rajeev Bajaj, Hung Chih Chen
  • Patent number: 10213896
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 10195712
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: February 5, 2019
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Patent number: 10131031
    Abstract: Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: November 20, 2018
    Assignee: TSC Inc.
    Inventors: Oh Su Kim, Byung Ho Kwon
  • Patent number: 10035238
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: July 31, 2018
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Patent number: 10029346
    Abstract: An external clamp ring for a chemical mechanical polishing (CMP) carrier head having a hydrophobic coating, and a carrier head having the same are described herein. In one embodiment, an external clamp ring is provided that includes a cylindrical body having an outer cylindrical wall and an inner cylindrical wall. A hydrophobic layer disposed is on the outer cylindrical wall.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: July 24, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Patrick Ala, Bo B. Ding, Yongqi Hu, Simon Yavelberg, Mats Larsson
  • Patent number: 10022837
    Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: July 17, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
  • Patent number: 9999956
    Abstract: A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: June 19, 2018
    Assignee: Ebara Corporation
    Inventors: Keisuke Namiki, Hozumi Yasuda, Osamu Nabeya, Makoto Fukushima, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 9987718
    Abstract: A chemical mechanical polishing system includes a carrier head having a flexible membrane and a chamber to apply pressure to the flexible membrane, a pressure control unit, a pressure supply line connecting the pressure control unit to the chamber, and a sensor located along the pressure supply line to detect a contaminant in the pressure supply line.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: June 5, 2018
    Assignee: Applied Materials, Inc.
    Inventor: Ronald Vern Schauer
  • Patent number: 9884401
    Abstract: An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 6, 2018
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Osamu Nabeya, Shingo Togashi
  • Patent number: 9818619
    Abstract: Provided is a carrier head. The carrier head includes: a body having a ring shape, wherein a first locking part is formed on an external surface of the body; a support unit surrounding lateral and lower parts of the body to be elevatably coupled to the body, wherein a second locking part vertically facing the first locking part is formed on an internal surface of the support unit; a regulating member located in a space between the first locking part and the second locking part; a retainer ring having a ring shape and located at the external bottom of the support unit; and an elevating unit coupling the retainer ring to the support unit to enable a height to be regulated relative to the support unit.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: November 14, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongbok Kim, Junho Ban, Sangseon Lee
  • Patent number: 9815171
    Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: November 14, 2017
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Makoto Fukushima, Shingo Togashi
  • Patent number: 9782870
    Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: October 10, 2017
    Assignee: EBARA CORPORATION
    Inventors: Toru Maruyama, Hisanori Matsuo, Yasuyuki Motoshima
  • Patent number: 9724800
    Abstract: Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: August 8, 2017
    Assignee: LG Siltron Incorporated
    Inventors: Kee Yun Han, Eun Suck Choi
  • Patent number: 9662761
    Abstract: A polishing apparatus capable of stably controlling a pressure in a pressure chamber of a top ring is disclosed. The polishing apparatus includes: a rotatable polishing table for supporting a polishing pad; a rotatable top ring having a pressure chamber for pressing a substrate against the polishing pad; a pressure regulator configured to regulate a pressure of a gas in the pressure chamber; and a buffer tank provided between the pressure chamber and the pressure regulator. The pressure regulator includes a pressure-regulating valve, a pressure gauge configured to measure the pressure of the gas at a downstream side of the pressure-regulating valve, and a valve controller configured to control an operation of the pressure-regulating valve so as to minimize a difference between a target value of the pressure in the pressure chamber and a pressure value measured by the pressure gauge.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: May 30, 2017
    Assignee: Ebara Corporation
    Inventors: Hiroyuki Shinozaki, Nobuyuki Takahashi, Toru Maruyama, Suguru Sakugawa, Osamu Nabeya
  • Patent number: 9662764
    Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: May 30, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: 9610672
    Abstract: A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: April 4, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jeonghoon Oh, Steven M. Zuniga, Andrew Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
  • Patent number: 9573244
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: February 21, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 9539696
    Abstract: A retainer ring configured to be attachable, at a first side thereof, to a polish head of a polish apparatus configured to polish a polish object by depressing the polish object against a polish pad is disclosed. The retainer ring is configured to depress the polish pad at a second side thereof. The retainer ring includes a contact surface contacting the polish pad. The contact surface applies depressing force on the polish pad. The depressing force is directed from a polish head side and is applied so as to be centered on an imaginary circle of pressure center having a radius falling substantially in a middle of an inner radius of the retainer ring and an outer radius of the retainer ring. An area of the contact surface is greater in a first region inside the circle of pressure center than in a second region outside the circle of pressure center.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: January 10, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Dai Fukushima, Takashi Watanabe, Jun Takayasu
  • Patent number: 9511470
    Abstract: A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table, a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes a retaining ring, a sensor for sensing the depth of grooves on the retaining ring and a controller for determining an update pressure to apply to the retaining ring based on the depth of the grooves and applying the updated pressure to the retaining ring during processing.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: December 6, 2016
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Benfu Lin, Lei Wang, Xuesong Rao, Wei Lu, Alex See
  • Patent number: 9393668
    Abstract: Among other things, one or more techniques and/or systems are provided for driving a body of a polishing head using an alignment gear. That is, an alignment gear, coupled to a housing of the polishing head, can transfer rotational force from the housing to the body responsive to the alignment gear being mated with a channel associated with the body. For example, the housing can supply pressure to the body, resulting in the body and the housing moving towards one another into a mated state. When the body and the housing are in the mated state, the alignment gear can mate with the channel (e.g., the alignment gear can fit within the channel). In this way, the alignment gear can drive the body by transferring rotational force to the body, resulting in the body rotating a semiconductor wafer against a polishing pad to polish the semiconductor wafer, for example.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: July 19, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Pei Tang, Kun-Tai Wu
  • Patent number: 9321144
    Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: April 26, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Gyu Woo, Sung Ho Shin, Joo Yeop Nam, Ki Hong Cho
  • Patent number: 9186773
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: November 17, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong