Planar Surface Abrading Patents (Class 451/287)
  • Patent number: 10688620
    Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: June 23, 2020
    Assignee: EBARA CORPORATION
    Inventors: Hiroyuki Shinozaki, Yuta Suzuki, Taro Takahashi, Seiji Katsuoka, Masahiro Hatakeyama
  • Patent number: 10625395
    Abstract: According to an aspect of the present disclosure, a substrate polishing apparatus is provided. The substrate polishing apparatus includes a turntable for supporting a polishing pad, a dresser that dresses the polishing pad, a dresser drive module that presses the dresser against the polishing pad and rotates the dresser, a support member that supports the dresser drive module, and a plurality of force sensors which are provided between the dresser drive module and the support member and each of which outputs information related to each of forces in three axis directions.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: April 21, 2020
    Assignee: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Patent number: 10586708
    Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center and outer walls closer to the outer edge. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: March 10, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 10569383
    Abstract: The present invention provides a chemical mechanical (CMP) polishing pad with a top surface, one or more apertures adapted to receive an endpoint detection window, an underside having a recessed portion and having one or more flanged endpoint detection windows (windows), each window having a flange adapted to fit snugly into the recessed portion of the underside of the polishing layer, the flange having a thickness slightly less than the depth of the recessed portion of the polishing layer (to allow for adhesive), having a detection area that fits snugly into an aperture in the polishing layer so that its top surface that lies substantially flush with the top surface of the polishing layer.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: February 25, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Stephen G. Pisklak, Jeffrey James Hendron
  • Patent number: 10510563
    Abstract: A wafer carrier assembly includes a wafer carrier and a fluid passage. The wafer carrier comprises a retainer ring confining a wafer accommodation space. The fluid passage is inside the wafer carrier. The fluid passage includes an inlet and at least an outlet to dispense fluid into the wafer accommodation space.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: December 17, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ming-Tung Wu, Hsun-Chung Kuang
  • Patent number: 10478938
    Abstract: A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 19, 2019
    Assignee: Ebara Corporation
    Inventor: Tsuneo Torikoshi
  • Patent number: 10449651
    Abstract: For use with a power trowel, an abrasive assembly attachable to a rotatable arm of the power trowel that comprises a circular, rigid plate having a central hub projecting out from a first major surface and affixed to its second major surface is a ring of a resilient material. Adjacent the resilient ring is a molded plastic ring in which a plurality of permanent magnet members are imbedded at regularly spaced intervals. The plastic ring further includes at least, one boss projecting outward from a surface thereof and designed to fit within an aperture disposed in an outermost ring, which is entirely or partially of a ferrous metal and which carries a plurality of abrasive members on its outer surface. The resilient ring is fastened to the rigid plate by internally threaded tubular pins and the plastic ring is secured by screws that pass through the plastic ring into the lumens of the internally threaded tubular pins.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: October 22, 2019
    Assignee: DIAMOND PRODUCTIONS LTD.
    Inventors: Harvey Stark, Pavel Ikonomov
  • Patent number: 10376929
    Abstract: An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: August 13, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Masayuki Nakanishi, Keisuke Uchiyama
  • Patent number: 10293455
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: May 21, 2019
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Patent number: 10269662
    Abstract: A method of processing a reconstituted wafer that supports IC chips includes operably disposing the reconstituted wafer in a lithography tool that has a depth of focus and a focus plane and that defines exposure fields on the reconstituted wafer, wherein each exposure field includes at least one of the IC chips. The method also includes scanning the reconstituted wafer with a line scanner to measure a surface topography of the reconstituted wafer as defined by the IC chips. The method also includes, for each exposure field: i) adjusting a position and/or an orientation of the reconstituted wafer so that a photoresist layers of the IC chips within the given exposure field fall within the depth of focus; and ii) performing an exposure with the lithography tool to pattern the photoresist layers of the IC chips in the given exposure field.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: April 23, 2019
    Assignee: Ultratech, Inc.
    Inventors: Paul M. Bischoff, Emily M. True, Raymond Ellis, A. J. Crespin
  • Patent number: 10239182
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: March 26, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
  • Patent number: 10239183
    Abstract: A chemical mechanical polishing pad includes a base portion and a polishing portion. The base portion has opposite first and second side surfaces. The polishing portion extends from the first side surface away from the second side surface, has a polishing surface facing away from the base portion, and has at least one trench formed in the polishing surface. Each of the trenches has an opening defined by the polishing surface. A horizontal width of the opening of each of the trenches is equal to or smaller than that of the remaining portion of the trench. The chemical mechanical polishing pad is made by laminating a plurality of polymer layers.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: March 26, 2019
    Assignee: SLH TECHNOLOGY CO., LTD.
    Inventors: Chien-Hung Sung, Kuan-Ting Lin
  • Patent number: 10201886
    Abstract: Provided is a polishing pad capable of sufficiently reducing minute defects to be generated after polishing on a workpiece which are detected in measurement for a particle size of 26 nm or smaller and capable of providing the workpiece with excellent surface flatness. The polishing pad includes a polishing layer having a polishing surface to polish a workpiece, and includes, in the side opposite to the polishing surface of the polishing layer, an intermediate layer having an amount of deformation C larger than that of the polishing layer, a hard layer having an amount of deformation C smaller than that of the polishing layer, and a cushion layer having an amount of deformation C larger than that of the intermediate layer, in which each of the amounts of deformations C is defined as an amount of deformation in the case of compression in a thickness direction, and the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side of the polishing layer.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: February 12, 2019
    Assignees: FUJIBO HOLDINGS, INC., SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Michito Sato, Junichi Ueno, Kaoru Ishii, Yoshihide Kawamura, Hiroshi Yoshida, Masataka Takagi
  • Patent number: 10138548
    Abstract: Eddy current formable in a polishing target is detected as an impedance by an eddy current sensor. A resistance component and a reactance component of the impedance are associated with respective axes of a coordinate system having orthogonal axes, respectively. An angle calculator calculates the tangent of an intersection angle between a first straight line connecting a first point corresponding to an impedance for a zero film thickness, and a second point corresponding to an impedance for a non-zero film thickness, and a diameter of a circle passing through the first point. A film thickness calculator determines the film thickness from the tangent.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: November 27, 2018
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Patent number: 10099340
    Abstract: Disclosed is a polishing apparatus that polishes a substrate by causing the substrate to be in slide contact with a polishing pad. The polishing apparatus includes a pad temperature control mechanism configured to control a surface temperature of the polishing pad, which includes a pad contact member that comes in contact with the surface of the polishing pad and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact member. The pad contact member includes a liquid flow path therein, and the liquid flow path communicates with a liquid inlet and a liquid outlet connected to the liquid supply system. At least one planar baffle is disposed in the liquid flow path, and the baffle has a space therein.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: October 16, 2018
    Assignee: Ebara Corporation
    Inventor: Yasuyuki Motoshima
  • Patent number: 10040168
    Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: August 7, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Shaun Van Der Veen, Steven M. Zuniga
  • Patent number: 9982193
    Abstract: Process and dosing station (1) for the preparation of a solution of a non-caking agent, wherein a concentrate of the non-caking agent is circulated in a loop (6) and wherein the concentrate is subsequently diluted by water to obtain the solution. A flow of the concentrate can be drawn from the circulation loop (6) and mixed with a flow of water. The obtained solution can subsequently be fed into a second recirculation loop (12). A flow of solution can be drawn off from the second recirculation loop for being dosed into an amount of salt.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: May 29, 2018
    Assignee: AKZO NOBEL CHEMICALS INTERNATIONAL B.V.
    Inventors: Hendrikus Wilhelmus Bakkenes, Willem Ferdinand Heezen
  • Patent number: 9878421
    Abstract: A retaining ring for a chemical mechanical polishing carrier head having a mounting surface for a substrate is provided herein. In some embodiments, the retaining ring may include an annular body have a central opening, a channel formed in the body, wherein a first end of the channel is proximate the central opening, and a sensor disposed within the channel and proximate the first end, wherein the sensor is configured to detect acoustic and/or vibration emissions from processes performed on the substrate.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: January 30, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Simon Yavelberg
  • Patent number: 9855638
    Abstract: A dressing apparatus capable of bringing an overall dressing surface of a dresser into uniform sliding contact with a polishing surface of a polishing pad and capable of uniformly dressing the overall polishing surface of the polishing pad is disclosed. The dressing apparatus includes a dresser configured to rub against a polishing surface to dress the polishing surface that is used for polishing a substrate, a dresser shaft that applies a load to the dresser, at least one load-applying device configured to apply a downward load to a part of a peripheral portion of the dresser, and an operation controller configured to control operation of the load-applying device.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: January 2, 2018
    Assignee: Ebara Corporation
    Inventors: Satoshi Nagai, Suguru Ogura, Kaoru Hamaura
  • Patent number: 9827647
    Abstract: A retainer ring for a chemical-mechanical polishing device. The ring prevents damage that occur during polishing work and being usable in stable fashion up until a predetermined lifespan has elapsed, by ensuring that a first ring body mounted on the chemical-mechanical polishing device and a second ring body making contact with a polishing pad are firmly coupled together by means of securing bodies which pass through coupling holes in the first ring body and are coupled to recessed coupling parts in the second ring body, and also by means of adhesive parts which are provided in the coupling holes or the recessed coupling parts and adhere and secure the securing bodies.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: November 28, 2017
    Assignee: WILL BE S & T CO., LTD.
    Inventors: Jae-Bok Lee, Jun-Je Lee
  • Patent number: 9821429
    Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: November 21, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Shozo Takahashi, Mika Suzuki
  • Patent number: 9818618
    Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: November 14, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Brian Mrzyglod, Jayakrishnan Nair, Garrett Blake
  • Patent number: 9802293
    Abstract: The present invention provides methods for making a pre-conditioned chemical mechanical (CMP) polishing pad having a pad surface microtexture effective for polishing comprising grinding the surface of the CMP polishing pad having a radius with a rotary grinder while it is held in place on a flat bed platen surface, the rotary grinder having a grinding surface disposed parallel to or substantially parallel to the surface of the flat bed platen and made of a porous abrasive material, wherein the resulting CMP polishing pad has a surface roughness of from 0.01 ?m to 25 ?m, Sq. The present invention also provides a CMP polishing pad having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 31, 2017
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 9744640
    Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 29, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Gangadhar Sheelavant, Simon Yavelberg, Yongqi Hu
  • Patent number: 9737972
    Abstract: The purpose of the present invention is to provide a polishing pad that hardly generates scratches on a surface of a subject to be polished. This polishing pad is characterized in that: the polishing pad is provided with a polishing layer having a polishing region and a light-transmitting region; the light-transmitting region includes a surface layer positioned on the pad surface side, and at least one soft layer laminated under the surface layer, and the soft layer has a hardness lower than that of the surface layer.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: August 22, 2017
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
    Inventor: Kenji Nakamura
  • Patent number: 9737973
    Abstract: A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: August 22, 2017
    Assignee: Ebara Corporation
    Inventors: Mitsunori Sugiyama, Kunimasa Matsushita
  • Patent number: 9721801
    Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: August 1, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hongjin Kim, Kyoungseob Kim, Sungho Shin, Kuntack Lee, Kihong Cho
  • Patent number: 9630200
    Abstract: A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a substrate rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; a treatment liquid supplying unit which supplies a treatment liquid to an upper surface of the substrate held by the substrate holding unit; an opposing member to be located in opposed spaced relation to the upper surface of the substrate held by the substrate holding unit in contact with a film of the treatment liquid formed on the upper surface of the substrate so as to receive a lift force from the liquid film; a support member which supports the opposing member; and an opposing member holding mechanism which causes the support member to hold the opposing member in a vertically relatively movable manner.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: April 25, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Koji Hashimoto
  • Patent number: 9550269
    Abstract: The polishing device includes an edge chamber that presses the surface to be polished against the polishing pad by pressing a back side of the surface to be polished of the wafer, a thickness measuring unit that estimates a remaining film profile of the surface to be polished of the wafer in realtime during polishing, and a closed loop control device that controls a pressing force on the back side of the surface to be polished by the edge chamber in accordance with a measurement result by the thickness measuring unit during polishing. The closed loop control device controls not only the pressing by the edge chamber during polishing, but also the pressure of a retainer ring as a periphery of the edge chamber affecting the pressing of the surface to be polished against the polishing pad.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: January 24, 2017
    Assignee: Ebara Corporation
    Inventors: Yoichi Shiokawa, Keita Yagi, Yoichi Kobayashi
  • Patent number: 9517544
    Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: December 13, 2016
    Assignee: EBARA CORPORATION
    Inventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
  • Patent number: 9481069
    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing head, a magnetizable polishing pad, and an electromagnetic component. The magnetizable polishing pad is disposed between the polishing head and the platen. The electromagnetic component is configured for fastening the magnetizable polishing pad on the platen.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: November 1, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yuan-Hsuan Chen, Sheng-Chen Wang, Feng-Inn Wu
  • Patent number: 9446497
    Abstract: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block comprising, comprises an olefin copolymer; wherein the window block exhibits a uniform chemical composition across its thickness; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the window block is disposed within the counterbore opening.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: September 20, 2016
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Angus Repper, Mary A. Leugers, David B. James, Marty W. DeGroot
  • Patent number: 9409277
    Abstract: A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: August 9, 2016
    Assignee: Ebara Corporation
    Inventors: Masao Umemoto, Tadakazu Sone, Hideo Aizawa, Ryuichi Kosuge, Masaaki Eriguchi
  • Patent number: 9409276
    Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 9, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Ching-Ming Tsai, Shi-Wei Cheng, Jia-Cheng Hsu, Kun-Shu Yang, Hui-Feng Chen, Gregory Gaudet, Sheng-Huan Liu
  • Patent number: 9362129
    Abstract: A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: June 7, 2016
    Assignee: EBARA CORPORATION
    Inventors: Mitsuru Miyazaki, Kenichi Kobayashi, Teruaki Hombo, Akira Imamura, Boyu Dong, Hiroyuki Shinozaki
  • Patent number: 9067297
    Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: June 30, 2015
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson
  • Patent number: 9061394
    Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.
    Type: Grant
    Filed: April 28, 2012
    Date of Patent: June 23, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Shou-Sung Chang, Hung Chih Chen, Lakshmanan Karuppiah, Paul D. Butterfield, Erik S. Rondum
  • Patent number: 9039488
    Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a lug-pin device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: May 26, 2015
    Inventor: Wayne O. Duescher
  • Publication number: 20150133038
    Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
    Type: Application
    Filed: November 10, 2014
    Publication date: May 14, 2015
    Inventors: Satoru YAMAKI, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI
  • Publication number: 20150126095
    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing head, a magnetizable polishing pad, and an electromagnetic component. The magnetizable polishing pad is disposed between the polishing head and the platen. The electromagnetic component is configured for fastening the magnetizable polishing pad on the platen.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 7, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yuan-Hsuan CHEN, Sheng-Chen WANG, Feng-Inn WU
  • Publication number: 20150118944
    Abstract: The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108. By interposing the silicone layer 111, it is possible to easily detach and attach the polishing pad 108. In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.
    Type: Application
    Filed: January 29, 2014
    Publication date: April 30, 2015
    Inventors: Ryuichi Kosuge, Tadakazu Sone, Soichi Isobe, Takeshi Sakurai, Eiji Hirai, Kaoru Hamaura, Suguru Ogura
  • Patent number: 9017138
    Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 28, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Thomas H. Osterheld, Charles C. Garretson, Jason Garcheung Fung
  • Publication number: 20150104999
    Abstract: A substrate processing apparatus capable of accurately aligning a center of a substrate, such as a wafer, with an axis of a substrate stage and capable of processing the substrate without bending the substrate is disclosed. The substrate processing apparatus includes a first substrate stage having a first substrate-holding surface configured to hold a first region in a lower surface of the substrate, a second substrate stage having a second substrate-holding surface configured to hold a second region in the lower surface of the substrate, a stage elevator configured to move the first substrate-holding surface between an elevated position higher than the second substrate-holding surface and a lowered position lower than the second substrate-holding surface, and an aligner configured to measure an amount of eccentricity of a center of the substrate from the axis of the second substrate stage and align the center of the substrate with the axis of the second substrate stage.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 16, 2015
    Inventors: Masaya SEKI, Tetsuji TOGAWA, Masayuki NAKANISHI, Kenya ITO
  • Patent number: 8998678
    Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: April 7, 2015
    Inventor: Wayne O. Duescher
  • Patent number: 8998676
    Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: April 7, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
  • Publication number: 20150093971
    Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 2, 2015
    Inventors: Makoto FUKUSHIMA, Katsuhide WATANABE, Hozumi YASUDA, Satoru YAMAKI
  • Patent number: 8992286
    Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: March 31, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Benjamin Cherian, Jeffrey Drue David, Boguslaw A. Swedek, Dominic J. Benvegnu, Jun Qian, Thomas H. Osterheld
  • Patent number: 8986071
    Abstract: A parts carrier assembly for a grinding machine includes an annular parts carrier and a bearing insert. The annular parts carrier includes an upper surface, a lower surface, an inner edge, an outer edge, and a plurality of loading apertures. The inner edge is configured to engage a driving wheel of the grinding machine. The driving wheel rotates about a central axis resulting in rotation of the parts carrier about an offset axis, which is offset from the central axis. The loading apertures are configured to receive parts to be ground by the grinding machine. The bearing insert includes an inner bearing surface complementary in shape to the outer edge of the parts carrier. The outer surface the parts carrier bears against the inner bearing surface of the bearing insert as the parts carrier rotates about the offset axis.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 24, 2015
    Assignee: White Drive Products, Inc.
    Inventor: Hollis N. White, Jr.
  • Publication number: 20150050866
    Abstract: The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 19, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEN-CHIEH WU
  • Publication number: 20150050863
    Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 19, 2015
    Inventors: Mitsuru MIYAZAKI, Seiji KATSUOKA, Naoki MATSUDA, Junji KUNISAWA, Kenichi KOBAYASHI, Hiroshi SOTOZAKI, Hiroyuki SHINOZAKI, Osamu NABEYA, Shinya MORISAWA, Takahiro OGAWA, Natsuki MAKINO