Abstract: A lapping machine that polishes a head block in which plural head devices are connected in a row includes a jig that has a bottom surface that opposes to a grinding plane, and fixes the head block onto the bottom surface, a pressure mechanism that applies a pressure to the head block against the grinding plane, a detector that is connected to the head block and detects a grinding amount of the head block, and a dummy block fixed onto the bottom surface adjacent to the head block.

Abstract: According to one exemplary embodiment, a method includes a step of forming a polysilicon layer over a substrate by using a deposition process, where the deposition process causes polysilicon nodule defects to form on a top surface of the polysilicon layer. The method further includes performing a polysilicon CMP process on the polysilicon layer, where the polysilicon CMP process removes a substantial percentage of the polysilicon nodule defects from the top surface of the polysilicon layer. The CMP process removes at least 95.0 percent of the polysilicon nodule defects from the top surface of the polysilicon layer. According to this embodiment, the polysilicon CMP process utilizes a polishing pressure that is less than 1.5 psi. The polysilicon CMP process also utilizes a table speed of between 20.0 rpm and 40.0 rpm. The polysilicon CMP process further utilizes a colloidal silica slurry.

Abstract: Difference between a lens edge circumference and an edged lens circumference is controlled to be always within a prescribed range so that a spectacle lens of a properly finished circumference size can always be supplied.

Abstract: It is possible to execute a one-step polishing or a plural-step polishing at a high throughput, and it is possible to achieve a reduction of an occupied area on the basis of a compact structure of a whole apparatus. Two platens are respectively provided with a first wafer retention head and a second wafer retention head, and a wafer transfer apparatus on which a wafer is mounted is arranged between two platens. The two wafer retention heads are moved between two platens and the wafer transfer apparatus respectively by a first moving means and a second moving means. Further, a two-step polishing is executed by whirl moving two wafer retention heads from one platen to the other platen at 180 degree respectively by a whirl moving means supporting two moving means.

Abstract: Methods for cleaning an electrode assembly, which can be used for etching a dielectric material in a plasma etching chamber after the cleaning, comprise polishing a silicon surface of the electrode assembly, preferably to remove black silicon contamination therefrom.

Abstract: A polishing method enables to initiate a second polishing step of a workpiece with an optimal thickness of an uppermost-layer film to be polished. The polishing method comprises: measuring a thickness of an uppermost-layer film, and then carrying out a first polishing step to polish the uppermost-layer film partway and a second polishing step to polish the remaining uppermost-layer film and a next-layer film; determining the polishing rates of the uppermost-layer film in the first and second polishing steps; and measuring a thickness of an uppermost-layer film of a predetermined nth workpiece and setting a processing time for the first polishing step of the nth workpiece or a next predetermined nth workpiece.

Abstract: An information recording medium glass substrate manufactured by polishing the surface of a raw material glass plate. The polishing is divided into two steps, a step for performing a first polishing process to roughly polish the surface of the raw material glass plate to be smooth and a step for performing a second polishing process to finely polish the surface of the roughly polished raw material glass plate to be smoother. The second polishing process, using a polishing pad made of foam, is divided into two stages, pre-polishing with a polishing agent including abrasive grains of cerium oxide and post-polishing with a polishing agent including abrasive grains of silicon oxide. A rinsing process is performed between the pre-polishing and the post-polishing to rinse the raw material glass plate after the pre-polishing with a washing liquid to wash away the abrasive grains collected in the polishing pad in pre-polishing during the rinsing process.

Abstract: In effecting two-sided surface grinding for surface-grinding the opposite surfaces of a workpiece simultaneously by a pair of oppositely disposed grinding wheels, infeed grinding is performed by oscillating the workpiece within the range where the surfaces to be ground of the workpiece do not protrude from the inner and outer peripheries of the grinding wheel surfaces of the grinding wheels, and then through-grinding is performed by feeding the workpiece to allow the surfaces to be ground to pass along the inner and outer peripheries of the grinding wheel surfaces. As an effect, worn wheel edges or the like can be prevented from being formed in the inner and outer peripheral edges, that grinding wheel surfaces can be maintained in proper shape for a prolonged time, that the grinding accuracy is better, and that dress interval can be prolonged, thus improving the life of grinding wheels.

Abstract: A multifiber (MF) ferrule produced using a ferrule molding insert that is jig ground in order to improve the tolerance on the bumper height of a molded ferrule and the surface finish on the region of interest (ROI), thus improving manufacturing yields.

Abstract: Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed.

Abstract: A method for manufacturing a substrate for a magnetic disk, including the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 ?m, and an oxidizing agent, and (b) polishing the substrate with a polishing composition B containing silica particles having an average particle size of from 0.005 to 0.1 ?m; a substrate for a magnetic disk, obtainable by the method for manufacturing a substrate for a magnetic disk; and a substrate for a magnetic disk having the following surface properties of a long-wavelength waviness of 0.05 nm or more and 0.3 nm or less, and an AFM surface roughness of 0.03 nm or more and 0.2 nm or less. The substrate for a magnetic disk may be suitably used in the manufacture of a hard disk having a high recording density. Especially, a hard disk having a recording density of 50 G bits or more per square inch may be industrially manufactured.

Abstract: A method and apparatus for grinding a brake pad forms inclined faces at both ends of the brake pad through a single route of movement and no grinding limit quantity is involved whether boundary lines are parallel with each other or not. The apparatus includes: a fixing portion 11 for fixing a brake pad 3; a rotary whetstone 21 having a rotation axis parallel to a friction face 3a of the brake pad 3, a grinding face of which a distance to the rotation axis increases gradually or in a plurality of steps in one direction of the rotation axis, and another grinding face of which a distance to the rotation axis decreases gradually or in a plurality of steps in the one direction of the rotation axis; and a transporter 10 for moving one of the brake pad and the rotary whetstone in relation to each other in a intersecting direction to the rotation axis.

Abstract: There are disclosed a method and device for polishing a metal ring, which is capable of polishing a side edge of the metal ring without performing barrel polishing or polishing by grinding stones. Subsequently to a projecting step of projecting a metal ring W by clearing means 6, a first brush polishing step of polishing one edge of the metal ring W by a polishing brush 60 is performed. Subsequently, an inverting step of inverting the metal ring W whose one edge is polished by the first brush polishing step is inverted by the inverting means 10 is performed. Subsequently, a second brush polishing step of polishing the other edge of the metal ring W which is inverted by the inverting step by the polishing brush 60 is performed. Moreover, a clearing step of clearing the metal ring whose other edge is polished by the second brush polishing step by clearing means 7 is performed.

Abstract: A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical elements, semiconductor elements, or both.

Abstract: A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising a protective film forming step for forming a protective film by coating the front surface of the wafer with a liquid resin; a flattening step for scraping the front surface of the protective film formed on the front surface of the wafer to flatten the protective film; and a rear surface grinding step for placing the protective film side of the wafer on the holding surface of a chuck table for holding a wafer and grinding the rear surface of the wafer by a grinding means to a predetermined thickness.

Abstract: A grown single crystal diamond is polished using a non contact polishing technique, which leaves a residue on the diamond surface. In one embodiment, a wet chemical etch is performed to remove the residue, leaving a highly polished single crystal diamond surface. In a further embodiment, a colloidal silica solution is used in combination with rotating polishing pads to remove the residue. Both residue removing techniques may be used in further embodiments.

Abstract: The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely projecting end area of the round rod, and two backrests are then placed on the round rod in directions. The resulting secure support of the end area enables a front cone to be ground with a high level of precision with regard to the concentricity at the end of the round rod facing the quill of a tailstock. A multiple grinding wheel, which is comprised of two differently designed individual wheels that directly rest against one another in an axial manner, serves to grind the front cone and is advanced toward the round rod in the X-direction. The multiple grinding wheel is mounted in a grinding spindle. The individual wheels have different grinding areas.

Abstract: The invention is directed to large LCD image masks having a final flatness of less than 40 nm and a method of making such LCD image masks by utilizing subaperture deterministic grinding/lapping/polishing. In one preferred embodiment the final flatness is <20 ?m. In another the final flatness is <10 nm. The LCD image masks have a length and width that are each, independently of the other, greater than 400 mm and a thickness that is less than 20 mm. In at least one preferred embodiment the ICD image masks have a length and width that are each, independently, greater than 100 mm and the thickness is <15 mm. The glass LCD image masks can be of any glass materials suitable for LCD image masks. The method of the invention can be used with all such glasses. Exemplary LCD image mask glasses include fused silica, high purity fused silica and silica-titania containing 5-10 wt. % titania.

Abstract: Disclosed is a chemical mechanical polishing aqueous dispersion comprising (A1) first fumed silica having a specific surface area of not less than 10 m2/g and less than 160 m2/g and an average secondary particle diameter of not less than 170 nm and not more than 250 nm and (A2) second fumed silica having a specific surface area of not less than 160 m2/g and an average secondary particle diameter of not less than 50 nm and less than 170 nm. Also disclosed is a chemical mechanical polishing method using the chemical mechanical polishing aqueous dispersion. According to the chemical mechanical polishing aqueous dispersion and the chemical mechanical polishing method, a chemical mechanical polishing process wherein a barrier metal layer and a cap layer can be efficiently removed by polishing and damage to an insulating film material of a low dielectric constant present in the underlying layer is reduced can be carried out.

Abstract: A method and apparatus for performing first and second polishings on a workpiece wherein the first and second polishings are performed using different operating parameters.

Abstract: A method of using ultrasonic cutting technology to make a decorative stone includes cutting a stone or other decorative materials into certain positive pieces having various shape by the ultrasonic cutting technology; cutting another stone to certain depth but not through according to the shape of the positive piece to make a negative piece by the ultrasonic cutting technology; taking out cut-off pieces from the stone; inlaying the positive pieces into the negative piece to form an integrated piece; and polishing a surface of the positive pieces and the negative piece. This ultrasonic technology can bring high manufacture efficiency and the inlay can be industrialized easily. It also increases the decorative effect due to having different pattern and specificity of stones.

Abstract: A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (12) corresponding to the first working groove therein. The driving component is able to slide in the first working groove, and the driving component cooperates with the first base and the second base to releasably hold workpieces.

Abstract: An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The method also comprises reconditioning each of the digital discs transferred to the workstation with at least one worktool operable to remove a portion of the protective coating of each of the digital discs without removal of the data underlying the protective coating. The method further comprises transferring each of the digital discs from the workstation to an unload area with the disc transfer mechanism, and then holding the digital discs in the unload area for manual retrieval. Advantageously, the digital discs may be automatically reconditioned within the reconditioning apparatus without manual manipulation of the digital discs during the reconditioning process.

Abstract: A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least one honing operation on a workpiece. The honing installation also comprises a conveyor system for conveying workpieces to and from work stations. There is also a control device for controlling the honing installation. Each of the work stations is directly connected to the conveyor system. This configuration allows a flexible control of the honing process.

Abstract: A method of manufacturing a semiconductor device, includes: (a) obtaining a surface of a polishing target, wherein an insulating film and a metal film are exposed; and (b) polishing the surface having the exposed insulating film and the exposed metal film. The step (b) includes; (b1) polishing the surface in a condition with high frictional force, and (b2) polishing the surface in a condition with usual frictional force lower than the high frictional force after the step (b1).

Abstract: An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.

Abstract: An apparatus for holding a plurality of lenses, including: a block having a mounting surface; a cavity defined in the block at the mounting surface; and a through hole defined in the block, the through hole being in communication with the cavity, wherein the mounting surface is configured for mounting of the lenses thereon whereby the lenses cooperatively substantially close the cavity at the mounting surface. Because of the cavity has a vacuum therein, the lenses can be retainable attached on the mounting surface by means of the vacuum.

Abstract: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, unit liquid crystal display panels are kept and discarded not to proceed with a follow-up process. Thus, a material waste is restrained and a yield can be improved. Meanwhile, in case of the multi-mode that liquid crystal display panels are fabricated with difference sizes on a large glass substrate, sub-models are kept, and then after completing the process for the main models, a follow-up process if performed on the sub-models. Thus, use efficiency of the glass substrate can be maximized to improve a productivity and a unit cost of the product can be reduced.

Abstract: A method of manufacturing a honeycomb structure of the present invention is a method of obtaining a honeycomb structure 10 having a predetermined shape by processing a peripheral portion of a crude honeycomb structure 2, the method being characterized in that the peripheral portion of the crude honeycomb structure 2 is processed by a cutter having linear cut-off device. It is possible to effectively manufacture a honeycomb structure suitably used in a carrier for a catalyst having a catalytic action, for use in internal combustion engine, boiler, chemical reactor, reformer for fuel cell, etc., or as a filter for trapping particulate matter present in an exhaust gas by the method at low cost.

Abstract: A method for machining a rotor having a disc and a plurality of integral airfoils projecting outwardly from the disc, according to one aspect of the invention, comprises a step of machining each airfoil with a disc tool having a grinding periphery thereof adapted for removing material from the airfoils. The grinding periphery has a thickness greater than a thickness of an adjacent supporting portion of the disc to permit the grinding periphery to pass a surface of an airfoil in a multi-axis simultaneous motion, thereby matching the grinding periphery with a predetermined geometry of a portion of the airfoil.

Abstract: A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electrochemical mechanical processing (Ecmp) of a substrate face. In one embodiment, a power source applies a bias between the substrate and at least two electrodes. The electrodes form a first electrode zone proximate the substrate edge at a sufficient potential to electro polish the substrate edge, thereby removing the conductive layer from the substrate edge. A second electrode zone with a lower potential than the first electrode zone is aligned proximate the substrate face during processing to enable Ecmp of the substrate face.

Abstract: A method of producing a complex shape in a workpiece includes the steps of: i) grinding a workpiece at a maximum specific cutting energy of about 10 Hp/in3·min with at least one bonded abrasive tool, thereby forming a slot in the workpiece; and ii) grinding the slot with at least one mounted point tool, thereby producing the complex shape in the slot. The bonded abrasive tool includes at least about 3 volume % of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1 or an agglomerate thereof. A method of producing a slot in a metallic workpiece having a maximum hardness value of equal to, or less than, about 65 Rc includes the step of grinding the workpiece with a bonded abrasive tool at a material removal rate in a range of between about 0.25 in3/min·in and about 60 in3/min·in and at a maximum specific cutting energy of about 10 Hp/in3·min.

Abstract: A polishing pad is used when a surface of a glass workpiece is polished for manufacturing a glass substrate of information recording medium. The polishing pad has a nap layer. The nap layer includes an inner layer that contains a plurality of closed cells, and an outer layer. A plurality of pores are formed on the surface of the outer layer. The sizes of the pores are minute compared to those of the closed cells.

Abstract: The depth of cut and the headstock velocity of a grinding machine are controlled during the last rotation of finish grinding to maintain a substantially constant load on the grinding wheel spindle drive motor. The depth of cut is kept constant and the component speed of rotation is altered in order to maintain the constant power requirement. If the component profile alters the spindle loading during a single revolution, the component speed is altered from one point to another during each revolution so as to maintain the constant load. Headstock acceleration, deceleration, and velocity are controlled to take into account any variation in contact length between the wheel and component during the rotation of the latter, so that although the metal removal rate may vary slightly around the circumference of the component the power demand on the spindle motor is maintained substantially constant during the whole of the grinding of the component.

Abstract: An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at least one slot in the wiping device to prevent contaminants resulting from the edge processing from settling on and/or adhering to surfaces of the glass sheet. The wiping device may include a jet of washing fluid directed at the glass sheet to further wash the surfaces and the processed edge of the glass sheet.

Abstract: The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus which comprises a rotatable table having a polishing cloth adhered thereon and a polishing head equipped with a wafer holding plate opposing to the table and in which the back surface of the wafer is held by a holding surface of the wafer holding plate and the front surface of the wafer is pressed to and polished by the polishing pad, comprising a polishing step of polishing the front surface of the wafer to a predetermined total polishing stock removal without changing the polishing apparatus, wherein the polishing step is divided into plural sub-steps and a holding position of the wafer in a subsequent sub-step is different from a holding position of the wafer in a previous sub-step.

Abstract: Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming asperities on the working surface with a polycrystalline diamond dresser, where the asperities have a height to distance ratio of from about 1:5 to about 5:1 and where the average asperity diameter is less than about 175 ?m.

Abstract: Aspects of the invention can provide a manufacturing method of a sub-mirror that can readily enhance manufacturing yield. The manufacturing method of a sub-mirror used for a light source lamp provided with an arc tube, an ellipsoidal reflector to reflect lights emitted from the arc tube to be emitted toward an illuminated region, and a sub-mirror having a reflection concave surface to reflect the lights emitted from the arc tube to the ellipsoidal reflector and a through-hole used for attachment to the arc tube.

Abstract: An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured such that panels are sequentially displaced in lateral alignment between the two other conveyor tables with a lateral edge first. A first tool is positioned between the two conveyor tables. A second tool is positioned between the two other conveyor tables.

Abstract: A process is disclosed for forming a spherical component using a centrifugal processing machine. The process includes the steps of providing a component having an initial shape with at least a portion that is non-spherical, placing the component into a container in the centrifugal processor, adding a first stage abrasive media into the container, and rotating the container so as to produce centrifugal and rotational motion of the abrasive within the container. The motion of the abrasive causes the component shape to change from the initial shape to a substantially spherical shape through the repeated contacting of the component's surface by the abrasive. In one embodiment, the components are further processed in a second stage using a different media to polish the surface of the component.

Abstract: In accordance with the present invention, a method for manufacturing tungsten carbide components is provided. The method includes forming a composite material out of tungsten carbide powder and binder powder, pressing the composite material into a plurality of components, heating the plurality of components, optionally under pressure, to liquefy the binder, cooling the plurality of components until the binder solidifies, optionally grinding each of the plurality of components to a desired size, and cascading the plurality of components in a cascading machine under high energy conditions.

Abstract: A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.

Abstract: A method of polishing workpieces in a magnetic float polishing chamber comprising a lower chamber piece and an upper chamber piece which is removably receivable in the lower chamber piece and is connected to a powered spindle for rotating the upper chamber piece in the polishing operation. The method preferably comprises one or more of the steps of (a) geometrically aligning the upper chamber piece with the powered spindle by machining the upper chamber piece in-situ, (b) machining the contact surface of the upper chamber piece in-situ between various polishing runs, and (c) mounting the lower chamber piece in a manner effective for causing the lower piece to automatically self-align coaxially with the upper chamber piece.

Abstract: A pre-planarization module configured to perform a long range planarization operation is provided. The pre-planarization module includes a semiconductor substrate support configured to rotate about a first axis. The pre-planarization module also includes an annular ring having a first side with a compliant layer affixed thereto. The second side of the compliant layer is affixed to a planarizing surface. The annular ring is configured to move perpendicular and parallel to a plane associated with the substrate support. Additionally, the annular ring is configured to rotate about a second axis, where the second axis is offset from the first axis. The substrate support and the annular ring rotate in the same direction. A method for performing a planarization process and a substrate grinding device are also provided.

Abstract: Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a narrow conductor directly above the free layer. The resistivity of the latter is made to be relatively high so the sensing current diverges very little as it passes through it. This makes it possible to use abutted hard magnets for longitudinal bias with virtually no loss of sensing current due to shunting by the magnets.

Abstract: A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is selected to be resistant to the CMP process can be rhodium (Rh), platinum (Pt), chromium (Cr), vanadium (V), etc. The additional CMP resistance of the refill layer structure provides a much larger processing window which results in higher yields. A CPP head according to the invention has a metal layer according to the invention above the hard bias structures on the sides of the sensor which define the track width.

Abstract: A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment platform, a movable transfer pad, a grinding process stage in which substrate holders that compose three stages of a substrate loading/unloading stage, a rough grinding stage, a finish grinding stage are arranged in a concentric pattern on the first index rotary table, and a polishing process stage that has a substrate holder table composing a substrate loading/unloading/finish polishing stage as well as a substrate holder table composing a rough polishing stage arranged in a concentric pattern on the second index rotary table.

Abstract: A grown single crystal diamond is polished using a non contact polishing technique, which leaves a residue on the diamond surface. In one embodiment, a wet chemical etch is performed to remove the residue, leaving a highly polished single crystal diamond surface. In a further embodiment, a colloidal silica solution is used in combination with rotating polishing pads to remove the residue. Both residue removing techniques may be used in further embodiments.

Abstract: An object of the present invention is to provide a polishing method for producing, in a relatively short period of time, a tubular brittle material having an inner surface of high surface precision with a maximum roughness Rmax of 0.1 ?m or smaller and a center line average roughness Ra of 0.01 ?m or smaller, and to provide a tubular brittle material with high precision using said polishing method. The polishing method according to the invention is characterized by that the inner surface of the tubular material being pre-cut into a tubular shape using a honing machine is further polished with a sheet material having diamond abrasives attached thereon. Also claimed is a tubular brittle material obtained by said polishing method.

Abstract: Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.