Abstract: The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.

Abstract: An aspheric-surface processing method according to the present invention, uses a cuffing apparatus including at least one turning tool movable in the same direction as the rotating axis of the work and is also movable in a direction perpendicular to the rotating axis of the work. This method includes moving the turning tool at a predetermined feed pitch in a fixed direction over at least a part of the work region extending from the center of the rotating axis of the work to a peripheral portion of the work and also moving the turning tool in another direction perpendicular to the rotating axis of the work in order to process the work for forming an axis-asymmetric aspheric surface.

Abstract: The method of sucking water is capable of easily removing excess water included in a backing member adhered on a plate of a polishing apparatus. In the method, the excess water is removed from the backing member by the steps of: pressing a water absorbing member onto a holding surface of the backing member, on which the work piece is adhered and held, so as to absorb the excess water from the backing member; and sucking the excess water absorbed by the water absorbing member.

Abstract: A centerless grinding apparatus (10) includes an outer diameter surface grinding wheel (11) for grinding the outer diameter surface of a work (1) of a substantially cylindrical shape, a regulating wheel (12) for supporting the outer diameter surface of the work (1) in conjunction with the outer diameter surface grinding wheel (11) and an end surface grinding wheel (21) for grinding the end surface of the work (1). The end surface grinding wheel (21) grinds the end surface of the work (1) while the outer diameter surface grinding wheel (11) grinds the outer diameter surface of the work (1) in a state that the work (1) is disposed between the outer diameter surface grinding wheel (11) and the regulating wheel (12).

Abstract: A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface roughness produced by the electroerosion.

Abstract: The present invention discloses a workshop unit for use as a grinding center that includes a support frame having a drive motor and a multi-station tool mounted thereto. Particularly, the grinding center may be used for operations including but not limited to grinding, buffing, polishing, sanding, and cleaning. The multi-station tool includes a plurality of rotary tools, a power transfer system, and a rotary tool selecting system. The power transfer system operates through a plurality of pulleys each in communication with at least one rotary tool and the drive motor through a plurality of transmission links. The rotary tool selecting system, which includes one or more control shafts and a clutch system, allows each tool to be selectively and independently operated.

Abstract: A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pads so that an end surface of each of the plurality of fiber optic connectors is held in contact with a corresponding pad. A drive mechanism is coupled to the support system to move the fixture to polish the end surface of each of the plurality of fiber optic connectors. Each of the plurality of pads may travel independently in a vertical direction. The polishing sub-assembly may further include a web polishing film, a fluid injection module configured to direct water onto the film, and a rinsing module to rub against a face of each of the plurality of fiber optic connectors to remove debris.

Abstract: A method of restoring a discolored automobile headlight lens without removal of the lens from the automobile consistent with certain embodiments involves wet abrading an outer surface of the lens with successively finer grit wet sanding disks, using a low speed rotary or orbital tool having a flexible sanding holder holding the sanding disks, until a smooth surface is achieved exhibiting no discoloration, wherein the wet sanding disks comprise disks starting from approximately 220 to 400 grade down to approximately 2000 grade; polishing the outer surface of the lens with an aqueous paste abrasive polish containing aluminum oxide abrasive particles; cleaning any residue from the outer surface of the lens by wiping the lens with a lint free cloth; and spraying a film forming aqueous polymer dispersion containing an ultraviolet protectant to the outer surface of the lens, wherein the sealer comprises of acrylic urethane copolymers, Hindered Amine Light Stabilizers, benzotriazole UV light absorbers, 1-methyl-2-py

Abstract: A chemical/mechanical polishing method for polishing an object to be polished with an irregular surface, having a substrate with convexities and concavities, a stopper layer formed on the convexities of the substrate, and an embedded insulating layer formed to cover the concavities of the substrate and the stopper layer, wherein the method is characterized comprising a first polishing step of flattening the embedded insulating layer using a slurry (A) which can maintain the polishing speed at 500 ?/min or less and a second polishing step of further polishing the embedded insulating layer to cause the stopper layer on the convexities to be exposed using a slurry (B) which can maintain the polishing speed at 600 ?/min or more. The method is useful for flattening wafers during shallow trench isolation (STI) in manufacturing semiconductor devices.

Abstract: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept and discarded not to proceed with a follow-up process. Thus, a material waste is restrained and a yield can be improved. Meanwhile, in case of the multi-mode that liquid crystal display panels are fabricated with difference sizes on a large glass substrate, sub-models are kept, and then after completing the process for the main models, a follow-up process if performed on the sub-models. Thus, use efficiency of the glass substrate can be maximized to improve a productivity and a unit cost of the product can be reduced.

Abstract: The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a washing station, and a marking station.

Abstract: A method and a device for grinding a machine part that has two shaft elements, a machine part axis and a large diameter central element having a side surface which is embodied in the form of a flat truncated cone. The machine part is clamped between centers and is movable in a direction of the machine part axis. The side surface is ground by a cylindrical outer contour of a first grinding wheel such that the cutting speed is constant across the entire axial dimension of the first grinding wheel which is mounted on a grinding spindle along with a second, narrower grinding. The second grinding wheel is positioned to grind the shaft element by swiveling the spindle using two pivots that are located perpendicular to each other and by displacing the grinding spindle perpendicular to the machine part axis with the machine part remaining in the same clamped position.

Abstract: An apparatus for cylindrically grinding workpieces includes a first holding tool (100) for positioning pre-grinding workpieces (60) and a second holding tool (200) for positioning partially ground workpieces (i.e. workpieces which have been ground on one side only). The first holding tool defines a first groove (12) for containing the pre-grinding workpieces to be partially ground and the second bonding defines a second groove (22) for containing the partially ground workpieces. A stopping board (23) connects one side of the second groove, and the stopping board has a projection (231) for transferring the partially ground workpieces from the first groove to the second groove. The present invention also provides a process for cylindrically grinding workpieces.

Abstract: An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured such that panels are sequentially displaced in lateral alignment between the two other conveyor tables with a lateral edge first. A first tool is positioned between the two conveyor tables. A second tool is positioned between the two other conveyor tables.

Abstract: A manufacturing cell for the treatment of grinding of gear wheel flanks, in particular by bevel pinions, and suggested for the wheel set testing, which includes a grinding machine (1), an unreeling test equipment (2), a laser inscription unit (3) with a time band (5) and a robot-supported load system (4), which are concatenated with one another and controllable that the process of pinion loops/wheel set examining/marking and the correction of the grinding machine attitude as a function of the results of the unreeling examination is feasible.

Abstract: In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.

Abstract: A method of plasma assisted CO2 cleaning for dry removal of residual photoresist and sidewall polymer with an etch gas mixture comprising fluorine containing gas, oxygen and hydrogen in N2 or H2O. The process removes polymer residues present on a metal layer on a substrate and on the sidewalls of metal lines and inhibits chlorine-based corrosion while being very selective to exposed Ti, TiN, Al and SiO2. The invention is particularly suited for removing post metal etch polymer residue from top and sidewall of metal lines.

Abstract: A method for manufacturing a magnetic recording medium, including the steps of applying a magnetic coating containing ferromagnetic powder and a binder onto a nonmagnetic band-shaped flexible base material to be transferred to form a magnetic layer, and grinding the magnetic layer continuously with a grinding wheel on the downstream side of transfer, wherein a cleaning device which cleans a grindstone of the grinding wheel is additionally provided in close proximity of the grinding wheel to clean the grindstone during the grinding operation.

Abstract: A multi-platen, multi-slurry chemical mechanical polishing method comprises providing a substrate having a surface that includes at least one nitride structure and an oxide layer atop the nitride structure, performing a first CMP process on the substrate using a first platen with a silica based slurry to remove a bulk portion of the oxide layer without exposing the nitride structure, performing a second CMP process on the substrate using a second platen with a ceria based slurry to remove a residual portion of the oxide layer and to expose at least a portion of the nitride structure, and performing a third CMP process on the substrate using the first platen with a silica based slurry to remove at least one defect caused by the ceria based slurry.

Abstract: A method for processing a first optical face and a second optical face of a lens, where a lens blank is positioned and gripped by a gripping device relying on reference datum indications rendering it possible to obtain topographic orientation for processing both faces of the lens, and wherein not more then one reference datum indication extends on a face of the lens.

Abstract: A dual position sharpening device can be set up so that the abrasive wheel is either vertical or horizontal. A guard retains cooling water in either position.

Abstract: In a workpiece grinding method, a grinding allowance of a predetermined width (T) at at least an end surface portion 21 of a workpiece W is removed with a grinding wheel 10 (or 32) by rotating the workpiece W having a cylindrical portion 20 and the end surface portion 21 perpendicular thereto, by rotating the grinding wheel 10 (or 32) supported rotatably about an axis extending in parallel with the axis of the workpiece 10 (or 32), and by moving the grinding wheel 10 (or 32) relatively to the workpiece W.

Abstract: A method of manufacturing an optical element having an optical surface extending close to a periphery of a substrate comprises: providing a substrate having a main surface extending beyond a periphery of the optical surface and also performing a polishing of the optical surface in regions of the main surface extending beyond the optical surface. Thereafter, material of the substrate carrying a portion of the surface extending beyond the optical surface is removed.

Abstract: The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.

Abstract: In a grinding machine, a generally cylindrical workpiece having at least first and second grinding areas is ground by use of a grinding wheel supported by a wheel head. The first grinding area is first ground such that power consumed by the grinding machine is maintained at a first level. After completion of grinding for the first grinding area, the grinding wheel is indexed to the second grinding area by moving the wheel head such that the power consumed by the grinding machine is maintained at a second level higher than the first level. After completion of the indexing operation, the second grinding area is ground in the same manner as the first grinding area.

Abstract: The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

Abstract: A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.

Abstract: A method for manufacturing an article where the article has polymeric residue that is to be removed during the manufacture of the article. The article is introduced into a controlled environment of a processing tool that has at least first and second processing chambers. Free radicals are generated from one or more reactant gases and introduced into at least the first processing chamber where they react with the polymeric residue. A cryogenic cleaning medium is supplied into the second processing chamber where it removes the polymeric residue present after the free radicals react with the polymeric residue. The reactant gases are selected to facilitate removal of the polymeric residue with the cryogenic cleaning medium The first and second processing chambers may be dedicated to plasma processing or cryogenic processing or each may provide both plasma processing and cryogenic processing.

Abstract: Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly facing surface of each disk may be simultaneously subjected to texturing by equipment designed to texture one double-sided disk.

Abstract: A rotary trimmer includes a first trimming element having a first knife and a second trimming element having a second knife that operates jointly with the first knife. In order to sharpen one knife, the other knife is removed and is replaced with a sharpening disk. The sharpening disk or the knife to be sharpened is advanced during a sharpening operation.

Abstract: In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolution current density. This causes a reaction that provides a planarized surface on the metal wafers. Additives are included in the electrolyte solution (55) which adsorb onto the wafer surface urging a higher removal rate at higher spots and a lower removal rate at lower spots. Also, in another embodiment of the present invention is a pulsed-electrolytic process (260) in which positive and negative potentials are applied to the anodic and cathodic electrodes alternately, further encouraging surface planarization. AEP can be used either as a first step followed by a mechanical polish or a second step between initial CMP polish and a third step mechanical polish.

Abstract: According to one exemplary embodiment, a method of fabricating an array on a substrate includes forming a layer of a first material adjacent to and over a plurality of segments of a second material on the substrate. The method further includes performing a first CMP process step to form a plurality of segments of the first material, where the plurality of segments of the first material alternate with the plurality of segments of the second material. According to this exemplary embodiment, the method further includes performing a second CMP process step to achieve a target thickness of the plurality of segments of the first material. The first CMP process step comprises a first slurry having particles of a first particle size and the second CMP process step comprises a second slurry having particles of a second particle size, where the second particle size is smaller than the first particle size.

Abstract: A method and apparatus for polishing a workpiece are set forth which can polish the workpiece at a constant rate at a stable condition even when plural workpieces are continually polished. The method comprises dressing a polishing surface of a polishing table while supplying a dressing solution. After the dressing, the dressing solution remaining on the polishing surface is removed by rotating the polishing table at a dewatering rotation speed while stopping the supply of the dressing solution. Then, the workpiece is polished by making the workpiece slidingly contact with the polishing surface while supplying a polishing solution to the polishing surface.

Abstract: An abrasive cutting blade is provided to achieve high-quality surface finishes at high feed rates. The blade is fabricated by electroplating fine abrasive onto a steel cathode disc to form a first layer, followed by electroplating a second layer of coarser abrasive onto the first layer. A third layer of fine abrasive is then electroplated onto the second layer. The resulting composite is then removed from the cathode disc to form a multi-grit, multi-layer, hub-less blade.

Abstract: An aspheric-surface processing method according to the present invention, uses a cutting apparatus including at least one turning tool movable in the same direction as the rotating axis of the work and is also movable in a direction perpendicular to the rotating axis of the work. This method includes moving the turning tool at a predetermined feed pitch in a fixed direction over at least a part of the work region extending from the center of the rotating axis of the work to a peripheral portion of the work and also moving the turning tool in another direction perpendicular to the rotating axis of the work in order to process the work for forming an axis-asymmetric aspheric surface.

Abstract: A chemical mechanical polishing (CMP) method is disclosed in which a new polishing pad is broken-in and conditioned into a steady operating state while using a silica (SiO2) based CMP slurry and where the broken-in and conditioned pad is afterwards used for polishing patterned workpieces (e.g., semiconductor wafers) with a ceria (CeO2) based CMP slurry. The approach shortens break-in time and appears to eliminate a first wafer effect usually seen following break-in with ceria-based CMP slurries.

Abstract: A substrate for use as a disk substrate in a hard disk drive or the like, an information recording medium such as a magnetic disk, and a starting material glass plate which is a starting material of the substrate for information recording media. The forming conditions of the starting material glass plate are controlled such that the starting material glass plate has a long-wavelength waviness of not more than 6 nm. This starting material glass plate is polished so as to have a long-wavelength waviness of not more than 6 nm using CeO2 abrasive grains having a mean grain diameter of not less than 0.0l ?m and a 90% diameter of the volume grain size distribution of not less than 0.02 ?m. The resulting substrate for an information recording medium has an excellent planarity, can be obtained in a short time and with a low polishing amount, and the resulting information recording medium is able to cope with increased data zone recording density.

Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.

Abstract: Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.

Abstract: Generally, a method and apparatus for processing a substrate. In one embodiment, the method provides a first relative motion between at least a first substrate and a polishing material. A second relative motion is provided between at least a second substrate and the polishing material. The changing in direction of the relative motion extends the interval between conditioning procedures used to return the polishing material to a state that produces uniform polishing results.

Abstract: A method of chemical mechanical polishing that polishes a substrate by abrading a target material formed on the substrate with a polishing pad containing a slurry includes setting a polishing end time, at which time a predetermined thickness of the target material will have been removed from the substrate by polishing, polishing the substrate to remove the predetermined thickness of the target material, and increasing a level of byproduct contamination in the polishing pad to decrease a polishing rate, while polishing the substrate, so that the polishing rate decreases to approximately zero at the polishing end time.

Abstract: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept and discarded not to proceed with a follow-up process. Thus, a material waste is restrained and a yield can be improved. Meanwhile, in case of the multi-mode that liquid crystal display panels are fabricated with difference sizes on a large glass substrate, sub-models are kept, and then after completing the process for the main models, a follow-up process if performed on the sub-models. Thus, use efficiency of the glass substrate can be maximized to improve a productivity and a unit cost of the product can be reduced.

Abstract: An apparatus for grinding a magnetic member comprises a cutting blade having a cutting edge including heat resistant resin and abrasive grain. A magnetic member including a rare-earth alloy is ground by the cutting blade while grinding fluid primarily made of water is supplied to a grinding region. A magnet separator having a surface magnetic flux density not smaller than 0.25 T magnetically separates sludge from used grinding fluid. Further, the grinding fluid is introduced into a tank, where the sludge contained in the grinding fluid is allowed to coagulate and sediment. The grinding fluid separated from the sludge is used in circulation. The same separation process can be used for separation of sludge containing a rare-earth alloy from waste fluid.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: A grinding machine (10) for double-sided grinding of tooth flanks, in particular hard-metal tipped circular saw blades (14) is described. The grinding machine comprises two grinding units (16, 18) each with a grinding body, a first drive to move at least one of the two grinding units (16, 18) along a first axis (x1, x2) running perpendicular to a plane containing the saw blade (14) and also a second drive (36) to move at least one of the two grinding units (16, 18) along a second axis (z) running parallel to axes of rotation of the grinding bodies. Furthermore a third drive (38) is provided to move at least one of the two grinding units (16, 18) along a third axis (y) running parallel to the first (x1, x2) and the second (y) axis. A control method according to the invention for the grinding machine (10) provides that a tangential clearance angle of a tooth is varied along a tooth flank during the grinding of the tooth.

Abstract: Systems and methods for conditioning polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a polishing support configured to carry a microfeature workpiece polishing pad, and a conditioner positioned at least proximate to the support to condition a polishing pad carried by the support. The conditioner can include a first portion (e.g., an abrasive portion) having a first hardness and being positioned to contact a polishing pad carried by the support, and a second portion (e.g., a brush portion) having a second hardness less than the first hardness and being positioned proximate to the first portion.

Abstract: For the machining of a workpiece (18) rotating about a workpiece axis, a first abrasive tool (20), which rotates about a first tool axis, and the workpiece (18) are advanced towards one another, in order to machine a first workpiece face in a first abrasive operation. Further, a second abrasive tool (54), which rotates about a second tool axis (56), is advanced towards the workpiece (18), in order to machine a second workpiece face in a second abrasive operation. The two workpiece faces are designed rotationally symmetrically with respect to the workpiece axis and are arranged adjacently to one another in such a way that a sharp, burr-free, circular transition edge is formed between them. The two abrasive operations are controlled in such a way that they are terminated at the same time.

Abstract: A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

Abstract: A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

Abstract: A method and apparatus for a circular grinding of a workpiece having first and second workpiece faces which are rotationally symmetrical with respect to the workpiece axis and which form a circular transition edge between them are provided. The workpiece rotating about its axis and a grinding wheel rotating about a grinding-wheel axis are advanced towards one another. During grinding, an auxiliary abrasive tool, which rotates about an auxiliary-tool axis and has a plane abrasive surface arranged at right angles to the auxiliary-tool axis, is pressed against the workpiece in such a way that the abrasive surface is arranged in a tangential plane to the second workpiece face and touches the second workpiece face along a contact line. The plane abrasive surface projects in the direction of the contact line away from the second workpiece face beyond the transition edge.