Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

Abstract: A constant force finishing system used to finish a surface of a workpiece includes at least a first movement device arranged to apply a first movement to a finishing tool, the first movement having a range of distance D1. The finishing system also includes a constant force device (CFD) in mechanical communication with the finishing tool, the CFD arranged to apply a second movement in conjunction with the first movement to the finishing tool, the second movement having a range of ?1, where D1>>?1.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film.

Abstract: A distance monitoring device is provided. The device is suitable for a chemical mechanical polishing (CMP) apparatus. A polishing head of the CMP apparatus includes a frame and a membrane. The membrane is mounted on the frame, and a plurality of air bags is formed by the membrane and the frame in the polishing head. The distance monitoring device includes a plurality of distance detectors disposed on the frame corresponding to the air bags respectively to set a location of each of the distance detectors on the frame as a reference point, wherein each of the distance detectors is configured to measure a distance between each of the reference points and the membrane.

Abstract: It is provided a feeler (1) for workpieces (40) being machined comprising a rocking arm (20) adapted to feel the workpiece (40), a first sensor (31) adapted to measure the position of the rocking arm (20) and at least one additional sensor (32) operatively connected to the rocking arm (20) and adapted to detect external perturbations acting on the feeler (1).

Abstract: A system comprising a system comprising a valve; a controller adapted to actuate the valve; a pressurized source connected to the valve; a hose and nozzle assembly connected to the pressurized source through the valve; and a switch connected to the nozzle assembly; wherein a flow from the pressurized source to the nozzle may be interrupted by the valve and by the nozzle.

Abstract: A method for manufacturing an externally circular precursor lens that is processed into a rim-shaped lens includes inputting processing data to specify the shape of the rim-shaped lens, and processing a material block based on the processing data so as to manufacture a precursor lens. An elliptical virtual rim surrounding the precursor lens manufactured at that time is imaginarily set, and is processed based on the processing data up to that range, and, outside the virtual rim, an amount of sag is changed to secure the edge thickness of the precursor lens. This method for manufacturing a precursor lens for a rim-shaped lens reduces an excessive load imposed on a processing tool during processing, allows the precursor lens to be processed into a rim-shaped lens while satisfactorily maintaining its edge thickness without the lack of the edge of the precursor lens, and results in a thin lens.

Abstract: Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to cut the material sheet when suspended.

Abstract: In a grinding machine, a retraction grinding is performed after a first advance grinding. Within a rotational range for a cylindrical workpiece to rotate from a present rotational phase to a target rotational phase in the retraction grinding, target grinding resistances in respective rotational phases are generated based on residual grinding amounts in the respective rotational phases of the cylindrical workpiece. Then, the retraction grinding is performed and controlled to make a grinding resistance detected by a force sensor agree with the target grinding resistances in respective rotational phases.

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

Abstract: According to a method for the fine machining of internal surfaces of bore holes in tools by fine boring and subsequent honing, the following steps are executed: Fine boring of at least one bore hole (131) in a tool (130) by means of a fine boring tool (128) of a fine boring device (120) for the creation of a fine bored hole; Transfer of the tool to a machining position of a honing device (140) for the machining of the fine bored bore hole by means of a honing tool (148A) of the honing device; Measurement of the fine bored bore hole with one of the measurement devices (160) allocated to the honing device in the machining position for the creation of at least one bore hole measurement signal representing the properties of the fine bored bore hole. The fine boring device is controlled subject to the bore hole measuring signal.

Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.

Abstract: An eyeglass lens processing apparatus includes: a processing chamber; a pair of lens chuck shafts which chucks an eyeglass lens; a lens rotating unit including a motor for rotating the lens chuck shafts; a processing tool which processes a periphery of the lens; an axis-to-axis distance changing unit for changing an axis-to-axis distance between a rotating shaft attached to the processing tool and the lens chuck shafts; a data input unit for inputting processing condition data including a target lens shape; a processing controller which controls the lens rotating unit and the axis-to-axis changing unit to process the lens based on the input processing condition data a camera which is disposed in the processing chamber and takes a video picture of the processing of the lens; and a memory which stores video pictures and the processing condition data.

Abstract: An eyeglass lens processing apparatus for processing a peripheral edge of an eyeglass lens, includes: a processing unit including a plurality of processing tools that process the peripheral edge of the eyeglass lens held by a lens chuck shaft; a calibrating lens; a mode selector that selects a calibration mode; a memory that stores calibration processing data for processing the calibrating lens to a predetermined shape; a detecting unit that includes a tracing stylus that contacts a surface of the calibrating lens which is processed by the processing unit based on the calibration processing data to detect the shape of the processed calibrating lens in the calibration mode; and a calculating unit that obtain calibration data by comparing a detected result by the detecting unit with the calibration processing data in the calibration mode.

Abstract: A system and method are provided for in-situ inspection optical inspection during a parallel polishing process. The method provides a polishing device with a spindle bit for holding a metallurgical sample, and a rotatable wheel having an inner diameter with a top surface for accepting a polishing compound and a transparent outer diameter. An optical system underlies the wheel outer diameter for recording images of the metallurgical sample. The method polishes the metallurgical sample against the wheel inner diameter. Without releasing the metallurgical sample from the spindle bit, the metallurgical sample is moved to a first position overlying the wheel outer diameter, and the metallurgical sample is optically inspected. In one aspect, the polishing device has a cleaning system overlying the wheel outer diameter, and the method sprays the wheel outer diameter with cleaning solution to support an in-situ inspection.

Abstract: A cutting apparatus includes a frame with a first and a second conveyor operatively attached thereto. The conveyors are configured to carry a workpiece from a first end a second end of the frame. The first conveyor is disposed at an angle of about 45 degrees to a ground surface supporting the cutting apparatus. The second conveyor is disposed at an angle of about 45 degrees to the ground surface, wherein the second conveyor is positioned perpendicularly to the first conveyor so as to form a V-shaped channel therewith. A first cutting blade is operatively attached to the frame and is positioned generally parallel to the first conveyor and a second cutting blade is operatively attached to the frame and is positioned generally parallel to the second conveyor.

Abstract: A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool body. A first platen having a first attachment hub can be selectively coupled with the retaining member in an installed position. The first platen can have a first rotatable member that selectively attaches to the output member in a first mode of operation. A second platen having a second attachment hub can selectively couple with the retaining member in an installed position. The second platen can have a second rotatable member that selectively attaches to the output member in a second mode of operation.

Abstract: Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material and a plurality of abrasive elements fixedly distributed in the matrix material. The polishing liquid can include a plurality of particles that are at least approximately chemically inert with respect to the abrasive elements. In a particular embodiment, the particles can have a polymeric, non-ceramic composition. The method can further include moving at least one of the polishing pad and the plurality of particles relative to the other to remove deposits from the polishing pad. This operation can be performed serially or simultaneously with using the polishing pad to remove material from a microfeature workpiece.

Abstract: A method is provided for forming a plurality of regions of magnetic material in a substrate having a first approximately planar surface. The method comprises the steps of fabricating projections in the first surface of the substrate, depositing onto the first surface a magnetic material in such a way that the tops of the projections are covered with magnetic material, and depositing filler material atop the substrate so produced. The filler material may then be planarized, for example by chemical-mechanical polishing. In an alternative embodiment magnetic material is deposited on a substrate and portions of it are removed, leaving islands of material. Filler material is then deposited, which may be planarized.

Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.

Abstract: The shaper device for shaping an ophthalmic lens comprises a blocking support on a blocking axis, a shaper tool, an electronic or computer unit for controlling the position of said shaper tool, and a man/machine interface connected to said electronic or computer unit, and comprising a display screen (253) and input means for inputting numerical values.

Abstract: Methods of fabricating magnetic write heads and electrical lapping guides (ELG's) using a split gap deposition process is described. A removal process is performed on a magnetic material to define a main write pole and to define a corresponding ELG for the main write pole. A first non-magnetic gap layer is deposited. A mask and liftoff process is performed to deposit an electrically conductive material on the first gap layer disposed along a front edge of the ELG. A second non-magnetic gap layer is then deposited and a shield is fabricated for the write pole.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: In a machining method of supporting a workpiece having a cylindrical machined portion such that the workpiece is rotatable and feeding a grinding wheel in a radial direction, a start diameter that is a diameter including a measurement start point on a surface of the machined portion is measured, and, after the measurement start point passes through a machining application portion, an end diameter that is a diameter including a measurement end point is measured. An actual grinding depth at the time when the measurement start point is machined is computed by the equation, U=|D0?D1|, a runout of the machined portion is computed from a relative difference in the actual grinding depth (U) between positions of the machined portion in a rotational direction, and infeed control of the grinding wheel is executed such that the runout is removed.

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract: Provided is a gear grinding method wherein an initial cutting position by a grindstone is appropriately set, resulting in an improvement being able to be made in machining accuracy. For this purpose, the gear grinding method is such that rotation of a workpiece (W) about a workpiece rotation axis (C), cutting by a grindstone (15) in the X-axis direction, and feeding of the grindstone (15) in the Z-axis direction are controlled, resulting in the workpiece (W) being ground by the grindstone (15).

Abstract: A translocation-simulating loading apparatus for gear grinding machine with shaped grinding wheel is provided. The apparatus comprises a load-receiving test piece (25) disposed on the gear grinding machine with shaped grinding wheel and a load-exerting component for use in loading simulation. The gear grinding machine with shaped grinding wheel enables a linear movement along the X axis, a linear movement forward and backward along the Y axis, a linear movement along the Z axis, a rotary movement n around the Y axis, a rotary movement C around the Z axis, and a rotary movement A around the X axis. An angle ? is formed between the axis L of a ball seat (17) of the load-exerting component and the X axis direction of a Y axis component (6); an angle formed between the normal line of a load receiving face a and the X direction of the coordinate system of the machine tool is ?. A detection method for static stiffness distribution is provided.

Abstract: A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.

Abstract: A method and apparatus for quickly moving workpieces from having abrading contact with abrasive-surfaced rotatable platens using a dynamic-action workholder apparatus frame moving device that is activated by a sensor. Flat-surfaced workpieces are attached to flat-surfaced workholders to abrade one surface of the workpieces by abrasive coated platens. The force moving device can be a spring, an air cylinder, a screw-jack, an electric solenoid or a piezo-electric device. The sensor can be a vibration, shock, motion, force or sound sensor that can to sense abrading process events that could make it desirable to quickly activate moving of the workpieces away from the abrasive disk. The workpiece abrading event can be quickly interrupted by use of this device to avoid damage to workpieces, the abrasive disks or the platen or to quickly change an abrading process. After the workpieces are moved they can be returned to their original abrading position.

Abstract: A procedure for polishing slit blades to ensure proper flatness and blade angle. This task is incredibly difficult. The number of strokes, series of and type of abrasive papers used, direction of polishing lapping strokes, as well as other practices to promote flatness and minimize human and manufacturing error in the final slit blade product have all been experimentally determined by ADC personnel over years of experience and study. A fixture for holding blades while polishing the blade angle side has been developed to accommodate precise blade angle polishing.

Abstract: A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished by the polishing unit; and an image processing section configured to inspect a polished state of the substrate based on the image taken by the imaging module. The imaging module is configured to take the image of the periphery of the substrate when the polishing unit is not polishing the periphery of the substrate.

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for calibrating a polishing process in which a precise amount of material can be removed. Accurate measurement of such a polishing process can be especially helpful in accurately determining material removal rates and pad wear occurring across curved surfaces and edges where such parameters tend to be difficult to predict.

Abstract: Systems and methods for evaluating whether a display panel is of specified dimensions are provided. Such a system, for example, may include resistance detection circuitry that detects a resistance of at least one resistive trace disposed around a display panel or other patterned device. Data processing circuitry may determine, based at least in part on the detected resistance, whether the display panel is of a specified size or whether the display panel has specified dimensions, or a combination thereof. Additionally or alternatively, the system may determine whether a touch sensor panel (e.g., a single-sided indium tin oxide (SITO) or double-sided indium tin oxide (DITO) touch sensor panel), a flexible printed circuit (FPC), a printed circuit board (PCB), or any other suitable patterned device, is of a specified size or has specified dimensions.

Abstract: According to one embodiment, a method for manufacturing a thin film magnetic head includes forming on a substrate magnetic head portions having a magnetoresistive element and resistance detection elements for measuring an amount of polishing; slicing the substrate to form at least one row bar; polishing the ABS of each row bar; forming rails on the polished ABS; and cutting each row bar to separate each magnetic head portion. The step of polishing the ABS includes measuring a resistance of each resistance detection element and a resistance of each magnetoresistive element; calculating an offset value between the resistance detection element and the magnetoresistive element; and calculating a final resistance of the resistance detection element by using the calculated offset value. When the resistance of the resistance detection element reaches the final resistance, polishing of the ABS of the row bar is terminated. Other methods are presented as well.

Abstract: A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the surface by abrasion, measuring the abraded surface with a profile determination device, optionally measuring the amount of material abraded from the surface and the gloss of the abraded surface, polishing a portion of the abraded surface with a polishing device at a controlled load for a pre-determined time and measuring the roughness and/or gloss of the polished surface followed by comparison thereof to the corresponding measurements of the unpolished, conditioned portion of the specimen surface. Polishing materials and devices may also be tested using the apparatus and method for polishing a standardized material.

Abstract: A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool body. A first platen having a first attachment hub can be selectively coupled with the retaining member in an installed position. The first platen can have a first rotatable member that selectively attaches to the output member in a first mode of operation. A second platen having a second attachment hub can selectively couple with the retaining member in an installed position. The second platen can have a second rotatable member that selectively attaches to the output member in a second mode of operation.

Abstract: The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the depth of the first cavity (2) being smaller than the depth of the second cavity (3) operating the polishing process considering the element (1), in order to check that the first cavity (2) is suppressed and that the second cavity (3) is present.

Abstract: A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber.

Abstract: A method, according to one embodiment, includes forming a lubricant film on a magnetic disk having at least a magnetic recording film above a substrate, and a protective film above the magnetic recording film, and wiping the lubricant film while rotating the substrate, e.g., at about 3.0 m/s to about 3.5 m/s by pressing a pad against a wiping cloth e.g., at a loading speed of about 12 mm/min to about 36 mm/min e.g., under a pressure of about 3 gf/mm2 to about 9 gf/mm2. The pad has a convexly curved surface in contact with the wiping cloth, and the wiping cloth is disposed so as to oppose the lubricant film. The method also includes pressing a cleaning tape which includes abrasive grains against the substrate on which the protective film and lubricant film are formed while rotating the substrate to remove protrusions. Apparatuses and forming the layers are also described.

Abstract: A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.

Abstract: A carrier configured for use in a lapping machine includes a body having a first opening for carrying a work piece during operation of the lapping machine. A device is arranged and disposed in the body. The device is configured to retain information readable by a reading device for identifying the body.

Abstract: A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus.

Abstract: Provided are a substrate polishing apparatus and a method of polishing a substrate using the same. The substrate polishing apparatus includes a substrate supporting member, a polishing unit, and a control unit. The substrate is seated on the rotatable substrate supporting member. The polishing unit includes a rotatable and swingable polishing pad to polish a top surface of the substrate. The control unit controls the substrate supporting member and the polishing unit during a polishing process to adjust a value of a polishing variable adjusting a polishing amount of the substrate according to a horizontal position of the polishing pad with respect to the substrate. Therefore, the substrate polishing apparatus may locally adjust the polishing amount of the substrate to improve polishing uniformity and product yield.

Abstract: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against the polishing platen, a load cell senses how much of the weight of the jig shaft, wafer mount and wafer continues to be supported by the jig. The vertical displacement of the wafer is controlled using a linear actuator responsive to a signal from the load cell. Vertical actuation of the wafer serves to increase or decrease this amount of supported weight, in turn decreasing or increasing the amount of applied down-force exerted between the wafer and the platen. A compression spring is used to increase the resolution of the pressure control. Finally, system components exposed to the work environment are encapsulated by chemically resistive components to prevent corrosion of system components.

Abstract: Methods of using in situ finishing information for finishing workpieces and semiconductor wafers are described. Methods of using yield information at least in part related to cost of manufacture for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tracked current in-process cost of manufacture information, or current cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve feedforward and feedback control are discussed.

Abstract: The present invention relates to a method for producing an optical member base material for EUVL, comprising performing the following in this order to obtain an optical member base material for EUVL: a preliminary-polishing step of preliminarily polishing a film forming surface and a back surface of the film forming surface of a glass substrate; a measuring step of measuring a total thickness distribution and a flatness of the glass substrate; and a corrective-polishing step of locally polishing only the back surface of the glass substrate depending on the measurement result of the measuring step.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: Systems and methods for performing one or more measurements of a substrate at one or more radii along the substrate are described. Thickness measurements taken at various radii along the substrate can be averaged together to obtain an average value that reflects an overall substrate thickness. A more accurate measurement of the overall substrate thickness can be obtained by performing multiple measurements and averaging the measurements together. Using the average value, polishing can be adjusted to ensure that the substrate achieves a desired planarized thickness profile.

Abstract: An eyeglass lens processing apparatus includes a processing control unit (50) which in the soft processing mode, roughs the lens such that the torque threshold value is set to a value T?s lower than the threshold value T?N of a normal processing mode, and when torque detected by a sensor unit does not exceed the threshold value T?s, a axis-to-axis distance varying unit or a lens rotating unit is controlled so that a cutting amount per rotation of the lens reaches a threshold cutting amount, and when the detected torque exceeds the threshold value T?s, the axis-to-axis distance varying unit or the lens rotating unit is controlled so that the torque becomes lower than the threshold value T?s to decrease the threshold cutting amount.