Abstract: In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44).

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, an information receiver receives information while the lapping plate is being used to lap a slider. The information indicates the quality of a lapping plate. A quality determiner that evaluates the quality of the lapping plate based on the information while the lapping plate is being used to lap the slider.

Abstract: In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

Abstract: An eyeglass lens processing apparatus includes: an edge position detector which detects front and rear edge positions of an eyeglass lens based on target lens shape data; a bevel locus setting unit which includes: a) a provisional bevel locus calculator which obtains a provisional bevel locus by obtaining a bevel curve substantially equal to a frame curve; b) a nose-side bevel position determining unit which determines a corrected bevel apex position at a nose-side edge position; c) an ear-side bevel position determining unit which determines a corrected bevel apex position at an ear-side edge position; and d) a corrected bevel locus calculator which obtains a corrected bevel locus which has a curve value equal to the bevel curve; and a processing controller which obtains beveling information based on the corrected bevel locus and controls an operation of the apparatus according to the beveling data.

Abstract: Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table.

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract: In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the internal gear, an upper polishing plate and a lower polishing plate; measuring rotation torque of a driving motor of at least one of the sun gear and the internal gear; detecting the minimum rotation torque measured in the measuring step; and adjusting the rotational speed of at least one of the sun gear, the internal gear, the upper polishing plate and the lower polishing plate so as to make the rotation torque thereof equal to the minimum rotation torque or running rotation torque, the running rotation torque being greater by a prescribed value than the minimum rotation torque.

Abstract: A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicative of a work input to a cutter that performed the cut is acquired and used to determine the cutting depth that will be used for performing a subsequent cut to remove an additional layer. In this way, subsequent cuts are performed until the target outer dimension is achieved.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method provides for accurate definition of a device feature such as a write pole flare point. A functional lapping guide is formed to determine when a lapping operation should be terminated to define an air bearing surface of a slider. In order to provide accurate compensation for manufacturing variations in the functional lapping guide, a dummy lapping guide is provided. An amount of variation of a front edge of the dummy lapping guide, which is defined by the same process step as a writer pole flare point, can be calculated by measuring the width (stripe height) of the dummy lapping guide based on its electrical resistance.

Abstract: An apparatus includes: a first layer having a near field transducer positioned in a waveguide cladding; a second layer having a magnetic pole piece; a third layer including a solid immersion mirror; a first lapping guide positioned in the first layer; a second lapping guide positioned in the second layer; and a third lapping guide positioned in the third layer.

Abstract: A step portion for mounting a row bar is provided at a table stepping down from the face of the table, and by lowering a pair of hooks crossing over the step portion in its width direction, a row bar held by the hooks is mounted on the step portion. While interposing the row bar mounted on the step portion between a pair of hooks and a side face of the step portion, the side in longitudinal direction of the row bar and the bottom face thereof are butted to the bottom face and the standing up side face of the step portion to position two axes of the row bar among XYZ directions, successively, positioning of the row bar in one remaining direction along longitudinal direction of the row bar mounted on the step portion is performed by moving the table in the one remaining axial direction.

Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.

Abstract: In a grinding device, first, an eddy-current-sensor detects a distance from the eddy-current-sensor to an outer peripheral surface of a belt layer while a tire to be retreaded held by a pair of half rims is caused to rotate. Thus, an eccentricity amount and an eccentricity direction of the tire to be retreaded with respect to a device axial center, corresponding to the phase of the tire to be retreaded, can be respectively determined, so position control signals corresponding to the phase, eccentricity amount and eccentricity direction of the tire to be retreaded can be generated. Next, on the basis of the position control signal, a carriage causes a rasp to be moved in a radial direction with respect to the tire to be retreaded along the radial direction whose center is a device axial center, and the rasp grinds a tread surface of the rotating tire to be retreaded.

Abstract: A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic direction of the single crystal body and a projection of the crystallographic direction along a plane of a first exterior major surface of the single crystal body. The method further includes removing material from at least a portion of the first exterior major surface to change the misorientation angle.

Abstract: Planarizing systems and methods of planarizing microelectronic workpieces using mechanical and/or chemical-mechanical planarization are disclosed herein. In one embodiment, a planarizing system includes a platen having a support surface carrying a planarizing pad. The planarizing pad includes an optically transmissive window extending through the planarizing pad that forms a continuous segment of the planarizing pad. The system also includes a workpiece carrier configured to move the workpiece relative to the planarizing pad and an optical monitor positioned proximate to the platen. The optical monitor emits light through the window and detects reflected light from the workpiece through the window.

Abstract: A numerical controller capable of moving a tool end point position to an accurate position in a five-axis machining apparatus. Compensation amounts are set, which correspond to respective ones of a linear axis-dependent translational error, a rotary axis-dependent translational error, a linear axis-dependent rotational error, and a rotary axis-dependent rotational error, which are produced in the five-axis machining apparatus. A translational/rotational compensation amount ?3D is determined from these compensation amounts and added to a command linear axis position Pm. As the compensation amounts, there is used a corresponding one of six-dimensional lattice point compensation vectors, which are determined in advance as errors due to the use of a mechanical system and measured at lattice points of lattices into which the entire machine movable region is divided.

Abstract: A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arranged in the gap, which accommodate workpieces in recesses and which can be brought into rotation by means of a roll-off device, wherein the workpieces move along a cycloid path, wherein plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, the sensor elements are each one coupled to an active or passive RFID chip and a reading device is assigned to the upper machining disc for reading out the RFID chips.

Abstract: The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy current test to detect material buildup on the grinding wheel which could cause grind burn. In addition, the method includes collecting swarf from the gear during the grinding operation and inspecting the swarf for an indication of grind burn.

Abstract: A lapping device comprises a mounting surface for coupling at least one non-parted slider row. At least one lever arm is coupled to at least one distal end of the mounting surface. The lever arm comprises a coupling feature at an end of the lever arm for receiving a force-vectoring device. The lever arm also comprises a pivot point opposite the coupling feature of the lever arm wherein the pivot point is beyond a distal end of the non-parted slider row.

Abstract: A tile cutting machine includes a tub for receiving water and a tile to be cut therein. A cutting head assembly having a motor driven blade is positioned above a tile supporting surface located in the tub and is movable with respect thereto. A laser projects a line of light from the cutting head assembly down onto the tile supporting surface to provide a visual representation of a cutting path of the blade. A scale permits measurement of a tile to be cut. The laser may be used with the scale to allow a user to quickly determine cutting widths without the need to manually mark the object to be cut. A light source, such as an LED, may be incorporated in the cutting head to illuminate an interior of the tub during operation of the tile cutting machine.

Abstract: A method is provided for forming a plurality of regions of magnetic material in a substrate having a first approximately planar surface. The method comprises the steps of fabricating projections in the first surface of the substrate, depositing onto the first surface a magnetic material in such a way that the tops of the projections are covered with magnetic material, and depositing filler material atop the substrate so produced. The filler material may then be planarized, for example by chemical-mechanical polishing. In an alternative embodiment magnetic material is deposited on a substrate and portions of it are removed, leaving islands of material. Filler material is then deposited, which may be planarized.

Abstract: Control device and method for controlling the impingement of the workpiece by a water jet or an abrasive water jet in a cutting unit. Control device includes a feeder composed of at least two flow-through areas positionable between a high-pressure water supply and a jet nozzle of the cutting unit. At least one of the flow-through areas includes a high pressure area, and at least one of the flow-through areas includes a pressure-reducing area. At least one switchable valve is arranged in the high-pressure area, a pressure-reducing mechanism is arranged in the pressure reducing area, and an impingement line is coupled to the at least two flow-through areas and coupleable to the jet nozzle.

Abstract: A method for shot peening wherein the work is processed by being hit by shot materials that are shot by compressed air, and a machine for carrying out the method are provided. By the present invention the status of a work can be measured while the work is being processed. The requirements for maintaining and calibrating the sensor that is used for the measurement are reduced because the wear of the sensor is prevented. The method for shot peening is to process a work by shooting the shot materials with compressed air from a shooting nozzle against the work. The shooting nozzle is equipped with a transducer that detects elastic waves and transduces them to high-frequency electrical signals. The elastic waves are generated when the shot materials pass through the shooting nozzle. The characteristic values of the shot materials, which pass through the shooting nozzle, are measured and monitored based on the signals.

Abstract: In a grinding machine, a retraction grinding is performed after a first advance grinding. Within a rotational range for a cylindrical workpiece to rotate from a present rotational phase to a target rotational phase in the retraction grinding, target grinding resistances in respective rotational phases are generated based on residual grinding amounts in the respective rotational phases of the cylindrical workpiece. Then, the retraction grinding is performed and controlled to make a grinding resistance detected by a force sensor agree with the target grinding resistances in respective rotational phases.

Abstract: A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monitoring module located in the cavity, the monitoring module including a light source and a detector, an optical head removably mounted in the recess in the top surface platen, and an optical fiber having a proximate end coupled to the monitoring module and a distal end held by the optical head holding the distal end of the optical fiber in a position to direct light through a window in the polishing pad to the surface of the substrate and receive reflected light from the surface of the substrate.

Abstract: Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having a matrix and abrasive particles attached to the matrix, and sensing a parameter indicative of frictional force at an interface between the workpiece and the surface of the fixed-abrasive medium. This method continues by moving at least one of the workpiece and the fixed-abrasive medium relative to each other in a direction transverse to the interface based on the parameter. For example, the workpiece and/or the fixed-abrasive medium can be vibrated or oscillated to reduce the frictional force and/or maintain a desired relative velocity between the workpiece and the fixed-abrasive medium.

Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer.

Abstract: A system for providing quantitative process control of a finesse polishing based upon feedback to the operator as to whether he/she is meeting the one or more predetermined key control characteristics (KCCs). One or more sensors provide data to a controller, wherein the controller provides the operator feedback regarding his/her operational compliance with respect to the KCCs, and disables operation in the event of operator noncompliance, with the intention to promote proper operator procedure and prevent operator error when polishing a flawed painted surface.

Abstract: The present invention is a method for obtaining data easily, accurately and effectively that may be used in determination of Sommerfeld Numbers and COF for CMP polishing. Using the Sommerfeld Numbers and COF values thus obtained the lubrication mechanism of CMP polishing with particular materials and under particular conditions can easily and reliably be studied. The method of the present invention is accomplished by use of CMP polishing tools capable of simultaneously measuring shear force and normal force, and rendering a value for the COF while simultaneously enabling the operator to change pressure on and relative velocity of the CMP wafer and CMP polishing pad in real time. Using the said CMP tool, the pressure and relative velocity may be varied separately or together for the desired length of time according to the needs of the operator so that within one CMP process multiple measurements may be taken under the same process conditions.

Abstract: Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.

Abstract: An eyeglass lens processing apparatus for processing a peripheral edge of an eyeglass lens, includes: a processing unit including a plurality of processing tools that process the peripheral edge of the eyeglass lens held by a lens chuck shaft; a calibrating lens; a mode selector that selects a calibration mode; a memory that stores calibration processing data for processing the calibrating lens to a predetermined shape; a detecting unit that includes a tracing stylus that contacts a surface of the calibrating lens which is processed by the processing unit based on the calibration processing data to detect the shape of the processed calibrating lens in the calibration mode; and a calculating unit that obtain calibration data by comparing a detected result by the detecting unit with the calibration processing data in the calibration mode.

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the lapping plate is being used to lap a slider, and the information is used to evaluate the quality of the lapping plate while the lapping plate is being used to lap the slider.

Abstract: Measuring apparatus (50) of geometrical parameters of cylinders, rolls and similar elements (11), used for the rolling of flat products operating on a machine for the grinding of said cylinders with an autonomous movement, i.e. with a movement independent of the translation movement of the grinding wheel or other parts, characterized in that it comprises at least four sensors (54, 55), situated on a surface orthogonal to the cylinder (11) or roll and in that at least two of said sensors are situated in opposite positions.

Abstract: A parallel mechanism adapted to control at least one of pivotal movement and linear movement of a link head having three degrees of freedom. The parallel mechanism has four actuators for driving the link head, and link groups which have four links connected to the four actuators, respectively, and each of which is connected to the link head. A rotation joint interposed between each of the link groups and the link head is made a linear joint which is connected to the link head so as to be relatively movable in one axis direction with respect to the link head.

Abstract: A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.

Abstract: A platen assembly is provided for supporting a polish pad of the type utilized to planarize a wafer. The platen assembly comprises a sensor system and a polish platen having a first surface for supporting the polish pad. The sensor system comprises a flexible sensor and a flexible circuit operatively coupled to the sensor controller. The flexible circuit includes a first flexible sensor disposed proximate the first surface.

Abstract: An apparatus for planarizing is disclosed. A methods of planarizing are disclosed. The methods and apparatus, can help improve yield and lower the cost of manufacture for planarizing of workpieces having extremely close tolerances such as semiconductor wafers. Cost of manufacture information are used for control. Methods to determine preferred changes to process control parameters are disclosed. Cost of manufacture models can be used and are disclosed. Process models can be used and are disclosed. A method to use business calculations combined with physical measurements to improve control is discussed. Use of business calculations to change the cost of planarizing and finishing semiconductor wafers is discussed. Activity based accounting can be used for some applications. Electro-planarizing and electro-processing for adding and removing material is disclosed.

Abstract: An abrasive article with a backing having a first major surface and a second major surface opposed to the first major surface. A three-dimensional abrasive layer attached to the first major surface, the three-dimensional abrasive layer comprising a plurality of shaped abrasive composites spaced apart by a plurality of land areas between the shaped abrasive composites, each of the shaped abrasive composites comprising a top surface and a sidewall, and the plurality of shaped abrasive composites and the plurality of land areas both formed from abrasive particles dispersed within an organic binder. A preconditioning indicator located on the top surface of at least some of the plurality of shaped abrasive composites and a persistent indicator located on at least some of the plurality of land areas.

Abstract: A thin film magnetic head integrated structure is provided. A plurality of thin film magnetic head bars include a plurality of thin film magnetic head precursors, a plurality of RLG sensors for read head core, and a plurality of RLG sensors for write head core, the read head core including a magnetoresistive element that performs a read process and the write head core including a magnetic pole layer that performs a write process.

Abstract: A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge.

Abstract: An electrical lap guide having a first layer, the first layer including a material having a first resistivity, the first layer having first and second contact regions for electrically connecting the electrical lap guide to electrical leads; a second layer, the second layer including a material having a second resistivity, wherein the electrical lapping guide has a lapping axis and a layered axis, the layered axis being perpendicular to the lapping axis, the electrical lapping guide has an air bearing plane, the air bearing plane being perpendicular to the lapping axis, the second layer is disposed adjacent to a portion of the first layer in the direction of the layered axis, and the first layer extends farther in the lapping axis than does the second layer.

Abstract: A substructure in which a plurality of pre-head portions are aligned in rows is to be cut later so that the pre-head portions are separated from one another. A surface formed by cutting the substructure is lapped to form medium facing surfaces. The substructure includes a plurality of sensors that respectively show individual sensor values corresponding to values of a plurality of different parameters each of which has an influence on characteristics relating to the pole layer and each of which depends on the position of the medium facing surface. The individual sensor values are resistance values each of which varies according to the position of the medium facing surface. The plurality of sensors are electrically connected to each other to form a composite sensor that shows a composite sensor value, which is a resistance value that depends on the resistance values of the plurality of sensors.

Abstract: The method includes: automatic measurement of the marking characteristics of the lens in a measurement position in order to produce a marking reference of the ophthalmic lens; transfer of the lens in a second transfer movement from the measurement position to an intermediate position which is distinct from the measurement position; transfer of the lens in a third transfer movement from the intermediate position to a trimming position which is distinct from the intermediate position; locking of the ophthalmic lens on trimming elements (6); trimming the lens. The third transfer is carried out by third transfer elements that make up a sub-unit which is distinct and independent from other units or includes elements carrying out the second transfer, and trimming elements, wherein full blocking of the lens on the trimming elements is only completed after the third transfer.

Abstract: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against the polishing platen, a load cell senses how much of the weight of the jig shaft, wafer mount and wafer continues to be supported by the jig. The vertical displacement of the wafer is controlled using a linear actuator responsive to a signal from the load cell. Vertical actuation of the wafer serves to increase or decrease this amount of supported weight, in turn decreasing or increasing the amount of applied downforce exerted between the wafer and the platen. A compression spring is used to increase the resolution of the pressure control. Finally, system components exposed to the work environment are encapsulated by chemically resistive components to prevent corrosion of system components.