Abstract: There is provided a pressure sensitive adhesive composition and a pressure sensitive adhesive. A pressure sensitive adhesive composition example of the present application can provide a pressure sensitive adhesive having, for example, a high shear resistance together with an excellent peeling property or tacking property with respect to an attachment target surface.

Abstract: A PIB derivative suitable for use as a fuel additive or lubricant additive prepared from a reactive low molecular weight polyisobutylene composition comprising at least 50 mol percent alpha vinylidene terminated polyisobutylene molecules, the composition having a polydispersity of no more than 1.5 and a number average molecular weight of at least 500 Daltons and no more than 1000 Daltons. The derivative is selected from the group consisting of: alkyl hydroxyaromatic compounds; alkyl alkoxy aromatic compounds; polyisobutenylsuccinic anhydrides; polyisobutenylsuccinimides; PIB-amine compounds; sulfurized PIB compounds; and Mannich condensation products of an alkylated hydroxyaromatic compound.

Abstract: A thermoplastic composition comprising from 60 percent to 99 percent by weight of one or more thermoplastic polymers; and from 40 percent to 1 percent by weight of an additive comprising a crosslinked (meth)acrylate polymer, wherein the crosslinked methylmethacrylate polymer comprises at least 99.5 percent by weight derived from methyl methacrylate units, and from greater than zero to less than 0.5 percent by weight derived from one or more multifunctional crosslinking monomers; wherein the crosslinked (meth)acrylate polymer has a volume average particle size of equal to or less than 1.0 micron; and wherein an article produced from the scratch-resistant thermoplastic composition has a hardness of greater than F is provided. Also provided are a method of making the thermoplastic composition, articles made from the polycarbonate composition, and a method of making the articles.

Abstract: Provided herein are vinyl ether end-functionalized polyolefins and methods for producing the same.

Abstract: A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed.

Abstract: To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (?1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (?1) aromatic diamine represented by general formula (2), the diamine includes an (?2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (?1) tetracarboxylic acid dianhydride and the (?1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Phosphorus free polycarbonate compositions having flame retardant properties and a desirable balance of flow, impact resistance, and heat deflection properties are disclosed.

Abstract: [Problem to be Solved] The present invention has an object to provide an automotive lamp extension molding comprising a resin composition having a low specific gravity, being excellent in the balance of heat resistance and fluidity, and being excellent in gloss and brightness feeling of the surface of the molded article. [Solution] The automotive lamp extension molding according to the present invention comprises a resin composition comprising 50 to 95 mass % of a polyphenylene ether (A), and having a specific gravity in the range of 1.00 to 1.12. The reduced viscosity (measured at 30° C. using a chloroform solvent) of the (A) component is preferably 0.25 to 0.45 dl/g, and more preferably 0.25 to 0.38 dl/g.

Abstract: The present invention provides a powder coating composition free from hexavalent chromium to serve as a binder component but having an adhesion comparable to that of the primer based on chromium phosphate even if baked at elevated temperature for a long time. The present invention is a powder coating composition which contains a macromolecule compound (A) having amide group and/or imide group, an anti-oxidizing material (B) and a fluororesin (C), wherein an average particle size of the macromolecule compound (A) is smaller than 50 ?m.

Abstract: Disclosed herein is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a low molecular weight compound that exists in the form of a second crystalline phase; wherein the second crystalline phase is dispersed within the first organic polymer phase. Disclosed herein too is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a second phase that comprises a crystalline organic polymer, wherein the crystalline organic polymer has a different molecular structure from the first organic polymer; wherein the second phase is not covalently bonded to the first organic polymer phase and wherein the second phase has an average particle size of about 1 to about 20 micrometers.

Abstract: A thermoplastic composition is prepared by melt blending a poly(arylene ether) and an other resin, where the poly(arylene ether) has a particular molecular weight distribution. The thermoplastic composition exhibits significantly increased melt flow compared to compositions containing poly(arylene ether)s with similar intrinsic viscosities but different molecular weight distributions. The increased melt flow facilitates preparation of the thermoplastic composition and subsequent article fabrication procedures.

Abstract: The present invention provides a flame-retardant and scratch-resistant polycarbonate resin composition including a (meth)acrylic flame-retardant copolymer.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; a Relative Thermal Index that is greater than or equal to 170° C.; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed.

Abstract: The present invention provides: a resin composition for a heat-resistant electric wire, containing from 25 to 60 parts by weight of a polyphenylene ether, from 15 to 42 parts by weight of a polypropylene-based resin, from 8 to 27 parts by weight of a styrene-based elastomer, from 5 to 15 parts by weight of a polyamide, and from 1 to 10 parts by weight of an acid-modified polyolefin, in which the polyamide has a melting point of 201° C. or more; and a heat-resistant electric wire using the composition.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: There is provided automotive lamp peripheral parts excellent in heat resistance, rigidity and fogging property. The lamp peripheral part according to the invention is obtained from a resin composition containing 70% by mass or more of a polyphenylene ether (A) and a styrene-based resin (B), and has a haze value of a glass plate of 1.0% or less after the glass plate is subjected to a fogging test using an apparatus according to ISO 6452.

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: The present invention relates to novolak resins prepared with, inter alia, one or more alkylphenols. The invention further relates to compositions comprising the novolak resins, such as vulcanizable rubber compositions, and to products obtained therewith.

Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.

Abstract: Rosin modified phenolic resins are prepared by reacting together resin acid, fatty acid, tri- or higher-functional phenolic compound and aldehyde. The fatty acid may be Monomer (derived from the fatty acid dimerization process). The reaction mixture may optionally include a,l3-olefinically unsaturated carbonyl compounds and/or polyol. The resin may be dissolved in a solvent to form a varnish. The resin may be used as a component of printing inks, e.g., inks for lithographic or gravure printing.

Abstract: Provided herein are graft copolymers of polyfarnesenes with condensation polymers; and methods of making and using the graft copolymers disclosed herein. The graft copolymers are obtained from the reaction of a polycondensation polymer with a modified polyfarnesene obtained from reaction of a polyfarnesene with a modifier in the presence of a grafting initiator. In certain embodiments, the condensation polymers include polyesters, polycarbonates, polyamides, polyethers, phenol-formaldehyde resins, urea-formaldehyde resins, melamine-formaldehyde resins and combinations thereof. In some embodiments, the polyfarnesenes include farnesene homopolymers derived from a farnesene, and farnesene interpolymers derived from a farnesene and at least a vinyl monomer. In certain embodiments, the farnesene is prepared from a sugar by using a microorganism.

Abstract: The present invention relates to a crosslinked lignin comprising a lignin structure having methylene or ethylene linking groups therein crosslinking between phenyl ring carbon atoms, wherein said crosslinked lignin is crosslinked to an extent that it has a number-average molecular weight of at least 10,000 g/mol, is melt-processible, and has either a glass transition temperature of at least 100° C., or is substantially soluble in a polar organic solvent or aqueous alkaline solution. Thermoplastic copolymers containing the crosslinked lignin are also described. Methods for producing the crosslinked lignin and thermoplastic copolymers are also described.

Abstract: The present invention relates to conjugates of biologically active compounds, preferably therapeutically active compounds, with polymeric moieties having low polydispersity, as well as controlled polymerisation processes for producing the conjugates. An initiation for a controlled radical polymerisation process comprises a biologically active, usually therapeutically active, moiety and the monomer includes zwitterionic monomer for instance 2-methacryloyloxyethyl-2?-trimethylammonium ethyl phosphate inner salt. The process allows close control of the molecular weight and polydispersity of the polymeric moiety and the possibility of optimising the delivery characteristics of the active agent.

Abstract: Described are polyesters comprising (a) a dicarboxylic acid component comprising 2,5-furandicarboxylic acid residues; optionally, aromatic dicarboxylic acid residues and/or modifying aliphatic dicarboxylic acid residues, 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues and ethylene glycol. The polyesters may be manufactured into articles such as fibers, films, bottles, coatings, or sheets.

Abstract: [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) an acid-modified photosensitive epoxy resin, (B) a non-photosensitive carboxylic acid resin and (C) a liquid bifunctional epoxy resin. It is preferred that the above-described (B) non-photosensitive carboxylic acid resin have a weight-average molecular weight of 10,000 to 30,000.

Abstract: The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.

Abstract: This disclosure relates generally to polycarbonate compositions whose hydrolysis products and residual monomer content, if any, exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polycarbonates and articles of manufacture comprising the disclosed polycarbonates.

Abstract: There is disclosed a method for producing a thermoplastic elastomer composition, the method involving subjecting an ethylene-?-olefin-based copolymer rubber (A) and a polyolefin-based resin (B) in the presence of an alkylphenol resin (C) and a metal halide (D) to dynamic thermal treatment within a melt-kneading apparatus, wherein the metal halide (D) is a powder, and a mixture of a powder of the metal halide (D) and a particle having a volume-average particle diameter of 0.1 ?m to 3 mm is continuously fed to the melt-kneading apparatus.

Abstract: An objective of the present invention is to provide a golf ball striking a balance between the flight distance on the driver shots and the approach performance on the approach shots and having the excellent shot feeling and durability.

Abstract: There are provided a thermoplastic resin composition excellent in a balance between fluidity and low outgassing, and a molded product and a sheet including the thermoplastic resin composition. The thermoplastic resin composition may include from 70 to 99% by mass of (A) a polyphenylene ether, from 1 to 30% by mass of (B) a copolymer including an aromatic vinyl compound and an unsaturated dicarboximide derivative as constituent monomers, and from 0 to 20% by mass of (C) a copolymer including an aromatic vinyl compound and a cyanided vinyl compound as constituent monomers, based on 100% by mass of the total of the (A) component, the (B) component and the (C) component, wherein the (B) component has a weight-average molecular weight of from 70,000 to 250,000.

Abstract: Disclosed are star polymers comprising a polymeric body having a core with a site-isolated chromophore and a plurality of polymer chains emanating from the core; and at least one chelating moiety bonded to at least one polymer chain. Also disclosed are bimodal contrast agents derived from star polymers and further comprising at least one metal chelated by the at least one chelating moiety. Also disclosed are methods of making and using same. Also disclosed are imaging methods employing the disclosed star polymers and/or bimodal contrast agents. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition containing a compound (A) which contains at least one phenolic hydroxyl group and at least one group where a hydrogen atom in a phenolic hydroxyl group is substituted by a group represented by the following General Formula (1).

Abstract: The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition that can form independent line patterns with high resolution and excellent shapes and shows excellent resist performances including roughness characteristics, and to provide an actinic ray-sensitive or radiation-sensitive film and a pattern forming method using the composition. The actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group is substituted with a group represented by the following General Formula (1) (the respective symbols in the formula represent the same definitions as in the claims and the specification).

Abstract: Provided herein are telechelic polymers and methods for producing the same. In some embodiments, provided herein are compounds having the formula and methods for producing the same.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit represented by the following formula (1), a resist film using the composition, and a pattern forming method.

Abstract: A composition comprising (A) a fluorinated polymer having k=0.01-0.4 and n=1.4-2.1 and (B) an aromatic ring-bearing polymer having k=0.3-1.2 is used to form an antireflective coating. The ARC-forming composition can be deposited by the same process as prior art ARCs. The resulting ARC is effective in preventing reflection of exposure light in photolithography and has an acceptable dry etching rate.

Abstract: There is provided an antistatic agent that preserves its antistatic property for a long period of time and has the appearance and the transparency that are not impaired when kneaded into a resin, and a resin composition containing the antistatic agent. An antistatic agent including a block copolymer which is obtained from a reaction product of a polyolefin (a) having one end being acid-modified and a diol and/or a diamine (b) having a polyoxyalkylene chain, and in which a part or all of acid groups remaining in the reaction product is neutralized with an alkaline substance. A thermoplastic resin composition including the antistatic resin. A film or sheet including the thermoplastic resin composition.

Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: This invention provides a pellet derived from recycled waste products in particular from a mixture of two or more of cellulose fibers, recyclable plastic, glass and ceramics and other recyclable products such as tetra paks. The pellets can be used to make a variety of extruded or injection molded products including household trim and moldings, decking, shutters, etc.

Abstract: This invention pertains to a method of modifying biocides obtained from biological sources, namely polyphenols. The modified biocide may have protective groups to reduce or prevent the oxidation of these phenols. The protective groups may also control the rate of hydrolyzation with regards to biocide efficacy. This invention also includes a method wherein the modified biocide may be incorporated and stabilized into a substrate like plastic.

Abstract: A resin composition comprises (a) 100 parts by weight of at least one compound selected from the group consisting of phenol resins and brominated phenol resins, (b) 20 to 500 parts by weight of a crystalline olefin resin, provides that copolymers of ethylene with unsaturated carboxylic acid ester or vinyl acetate are precluded, and (c) 0 to 300 parts by weight of a non-aromatic softening agent for rubber. The resin composition is easy to handle in dynamic cross-linking of rubber or a thermoplastic elastomer to give uniform cross-linking. A cross-linked rubber composition or thermoplastic elastomer composition has improved compression set and moldability.

Abstract: Certain brominated polymers compounds are effective FR additives for combustible organic polymers. These FR additives include: i) a copolymer having styrene and 2,3-dibromopropylmaleimide repeating units; ii) a brominated polyester having aliphatically bound bromine; iii) an allyl ether of a ring-brominated novolac resin; iv) a 3-bromo-2-hydroxypropyl ether of a novolac resin; v) a 2,3-dibromopropyl ether of a cresol novolac resin; and vi) a brominated ROMP polymer or copolymer.

Abstract: The present invention provides polymer blends comprising the components (a) from 40% to 95% by weight of at least one polyaryl ether copolymer constructed of (a1) from 50% to 99.9% by weight of building units of the general formula I and from 0% to 40% by weight of further building units II selected from segments of one or more thermoplastic polymers, and (a2) from 0.

Abstract: A multicomponent system is provided, composed of a thermoplastic component and of a rubber component, which comprises at least two different peroxidic crosslinking agents with specific decomposition temperatures, as also is a process for production of rubber-thermoplastic composite mouldings using the multicomponent system, and also the resultant rubber-thermoplastic composite mouldings.

Abstract: A method of preparing a capped poly(arylene ether) resin includes reacting a capping agent with a blend of two or more poly(arylene ether) resins having different intrinsic viscosities. Cured compositions prepared from these capped poly(arylene ether) resins exhibit improved balances of stiffness, toughness, and dielectric properties compared to compositions with two or more separately capped and isolated poly(arylene ether) resins.

Abstract: An object of the present invention is to provide a golf ball having excellent durability and flight distance. The present invention provides a golf ball comprising: a core consisting of a center and one or more intermediate layers covering the center; and a cover covering the core, wherein, at least one piece or one layer of said intermediate layers is formed from a highly elastic intermediate layer composition that contains a highly elastic resin (A) having a flexural modulus in a range from 700 MPa to 5000 MPa and an ionomer resin (B) having a flexural modulus in a range from 150 MPa to 1000 MPa in an amount ratio ((A)/(B)) of the highly elastic resin (A) to the ionomer resin (B) being (20 mass % to 80 mass %)/(80 mass % to 20 mass %) (the total is 100 mass %).